KR102259322B1 - Rapid heat-radiating sheet structure for electronic equipment and electronic equipment with the same - Google Patents

Abstract

The present invention relates to a rapid heat dissipation sheet structure for an electronic device and an electronic device having the same, and to effectively dissipate heat generated from a heat source in various electronic devices such as smartphones.
The present invention is characterized in that a plurality of microholes are formed in at least one of the cover window and the back cover to dissipate heat generated from the heat source to the outside in the thickness direction.

Description

RAPID HEAT-RADIATING SHEET STRUCTURE FOR ELECTRONIC EQUIPMENT AND ELECTRONIC EQUIPMENT WITH THE SAME

The present invention relates to a heat dissipation sheet structure for an electronic device, and more particularly, to a rapid heat dissipation sheet structure for an electronic device for effectively dissipating heat generated from a heat source in various electronic devices such as a smart phone, and an electronic device having the same.

In recent years, the market demand for high performance and miniaturization in the field of electronic devices such as smartphones, displays, and portable computers has led to technology development of electronic components such as CPUs (central processing units) and ICs (integrated circuits). This resulted in an increase in power consumption density and calorific value by accelerating the Current technology development is in a situation where low power consumption cannot catch up with high performance, and accordingly, high heat dissipation materials, low power devices, and thermal fluid analysis software for electronic devices are becoming an issue as the main countermeasures against thermal problems.

When heat accumulates in an electronic component, the processing performance of an electronic component decreases, and an electronic component becomes easy to damage. In the high-pressure generator, problems such as an electric short may occur and the lifespan of the product may be shortened, and the product may malfunction or malfunction, thereby reducing the reliability of the product. In severe cases, it can cause explosions and fires. In addition, the rise in the temperature of the surface of the product gives discomfort to the user of the electronic device.

As for the heat source in electronic devices such as smartphones, the AP chip, camera module, and battery are the three biggest heat sources, and the heat generated from these heat sources is connected to a metal material such as a heat-reactive film or heat-dissipating tape and a copper plate to form a flat surface. Diffusion was the conventional heat dissipation structure.

However, this conventional heat dissipation structure was a method of lowering the heat temperature in the heat source by spreading the heat generated in a small area like a heat source more widely. This method was okay when the temperature of the heat source was about 30°C to 40°C, but there was a limit to lowering the heat temperature when the temperature of the heat source exceeded 40°C.

Korean Patent Publication No. 1958471 (2019.03.08.)

Accordingly, the present invention has been proposed to solve the problems of the related art as described above, and an object of the present invention is to provide a rapid heat dissipation sheet structure for electronic devices for effectively dissipating heat generated from heat sources in various electronic devices such as smart phones and the same. To provide equipped electronic devices.

In order to achieve the above object, the heat dissipation sheet structure for an electronic device according to the technical idea of the present invention has a built-in heat source and a display panel, and the front and rear surfaces are packaged by a cover window and a back cover, It is characterized in that a plurality of microholes are formed in at least one of the cover window and the back cover in a thickness direction for dissipating heat generated from the heat source to the outside.

Here, the micro-holes formed in the back cover are formed in a form in which the inner diameter is gradually widened toward the rear side, thereby enhancing the accessibility of external air to the micro-holes.

In addition, microholes are formed in both the flat portion of the back cover and the edge portion formed in a bent shape at the periphery of the flat portion, and the microhole formed in the flat portion of the back cover is an area near the heat source compared to other areas. is formed relatively more densely, and the microholes formed in the edge portion are formed more densely than the microholes formed in the flat portion, so that the heat dissipation function to the side of the back cover is strengthened.

In addition, the micro-hole of the cover window may be characterized in that the inner diameter is gradually expanded toward the front side to enhance the accessibility of external air to the micro-hole.

In addition, the inner diameter of the microhole is formed from 1um to 1000um, and the inner peripheral surface of the microhole is water-repellent treated by fluorine coating to allow air in and out through the microhole while blocking the ingress of water and oil. can do.

In addition, a heat dissipation tape that is adhered to the front and rear surfaces of the heat source, respectively, to radiate heat generated from the heat source; a heat transfer film made of copper or aluminum laminated on the outer surface of the heat dissipation tape to transfer heat radiated by the heat dissipation tape; and a graphite film of a graphite material laminated on the outer surface of the heat transfer film to lower the thermal temperature by absorbing some of the heat transferred by the heat transfer film.

In addition, it is installed between the graphite film located in front of the heat source among the graphite film and the display panel, and spreads the heat generated and transferred from the heat source so that the heat is not concentrated in only a part of the internal space so that the heat temperature of each layer is uniform. It may be characterized by further comprising a plurality of porous polyamide films formed by horizontally and vertically rows of microholes that allow.

In addition, a cooling pipe passing through the heat source in a form in close contact with the surface of the heat source, through which a heat transfer fluid for cooling the heat source is transferred, may be further installed.

In addition, the heat dissipation sheet structure for electronic devices of the present invention, a heat dissipation tape adhered to the front surface of the heat source to radiate heat generated from the heat source; a heat transfer film made of copper or aluminum laminated on the front surface of the heat dissipation tape to transfer heat radiated by the heat dissipation tape; and microholes installed between the heat transfer film and the display panel to spread the heat generated and transferred from the heat source to uniform the heat temperature of each layer so that heat is not concentrated in only a portion of the internal space. It is characterized in terms of technical configuration to include a porous polyamide film formed in large numbers.

Here, between the heat transfer film and the porous polyamide film, a composite comprising a heat dissipation layer that partially dissipates the heat transferred by the heat transfer film to lower the heat temperature and a heat dissipation layer that radiates the heat partially dissipated by the heat dissipation layer It may be characterized in that it further comprises a layer.

In addition, between the heat transfer film and the porous polyamide film, a heat dissipation layer that partially dissipates the heat transferred by the heat transfer film to lower the heat temperature, a heat dissipation layer that radiates the heat partially dissipated by the heat dissipation layer, and the heat dissipation layer It may be characterized by further comprising a composite layer of a heat dissipation layer that lowers the heat temperature by partially dissipating the remaining heat after being radiated by the layer.

In addition, the heat dissipation layer may be a ceramic film made of SiC or a porous polymer film made of polysiloxane, and the heat dissipation layer may be a film made of graphite or carbon nanotubes.

The heat dissipation sheet structure for electronic devices according to the present invention is composed of heat dissipation, heat dissipation, external heat dissipation from the front, rear, and side surfaces, and circulating heat dissipation by a heat transfer fluid. There is no problem of concentration, and the thermal temperature is greatly reduced while reaching the display panel, so the screen output through the display panel and the functions of the internal components are performed normally without any problems.

1 is a perspective view of a smartphone to which a heat dissipation sheet structure for electronic devices according to a first embodiment of the present invention is applied;
Figure 2 is a configuration diagram for explaining the structure of the heat dissipation sheet for electronic devices according to the first embodiment of the present invention
Figure 3a is a partial plan view for explaining the configuration of the heat dissipation tape in the heat dissipation sheet structure for electronic devices according to the first embodiment of the present invention;
3b and 3c are partial plan views for explaining the configuration of a first mask and a second mask for manufacturing a heat dissipation tape in the heat dissipation sheet structure for electronic devices according to the first embodiment of the present invention;
4A and 4B are a side view and a perspective view illustrating a cooling pipe in the heat dissipation sheet structure for an electronic device according to the first embodiment of the present invention;
6 is a configuration diagram for explaining the structure of a heat dissipation sheet for electronic devices according to a third embodiment of the present invention;
7 is a configuration diagram for explaining the structure of a heat dissipation sheet for electronic devices according to a fourth embodiment of the present invention;

With reference to the accompanying drawings will be described in detail with respect to @ according to the embodiments of the present invention. Since the present invention can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific form of disclosure, and it should be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention. In describing each drawing, similar reference numerals have been used for similar elements. In the accompanying drawings, the dimensions of the structures are enlarged than actual for clarity of the present invention, or shown reduced from reality in order to understand the schematic configuration.

Also, terms such as first and second may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Meanwhile, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in the present application. Does not.

<Example>

1 is a perspective view of a smartphone to which a heat dissipation sheet structure for an electronic device according to a first embodiment of the present invention is applied, and FIG. 2 is a configuration diagram for explaining the heat dissipation sheet structure for an electronic device according to a first embodiment of the present invention, 3A is a partial plan view for explaining the configuration of a heat dissipation tape in the heat dissipation sheet structure for an electronic device according to the first embodiment of the present invention, and FIGS. 3B and 3C are a heat dissipation sheet structure for an electronic device according to the first embodiment of the present invention. It is a partial plan view for explaining the configuration of the first mask and the second mask for manufacturing the heat dissipation tape. 4A and 4B are a side view and a perspective view for explaining a cooling pipe in the heat dissipation sheet structure for an electronic device according to the first embodiment of the present invention.

As shown, the heat dissipation sheet structure for an electronic device according to the first embodiment of the present invention rapidly diffuses heat generated from a heat source inside the electronic device by microholes (MH) formed at various positions to lower the heat temperature and radiate to the outside. Through the three-dimensional method, it is possible to quickly lower the heat temperature even when the temperature of the heat source exceeds 40℃.

To this end, as shown in FIG. 2 , a plurality of microholes MH are formed in the thickness direction in the cover window 120 and the back cover 110 so that heat generated from the heat source can be discharged to the outside.

It is to be noted here that the micro-holes MH formed in the back cover 110 are formed in a form in which the inner diameter is gradually expanded toward the rear side, as can be seen in the enlarged part of FIG. 2 , and the micro-holes formed in the cover window 120 The point is that the hole MH is formed in a form in which the inner diameter is gradually expanded toward the front side. This makes it possible to strengthen the accessibility of the outside air to the microhole (MH). That is, considering the distribution of air filled in the microhole MH, which has an inner diameter that is expanded toward the outside, the amount of external air having a low temperature in the microhole MH is higher than the amount of internal air having a high temperature. Because there are many, the heat flow within the microhole (MH) has a strong tendency to outward, making it possible to quickly dissipate heat.

In the case of the back cover 110, when it is formed in an edge shape according to the recent trend of smartphones, the flat portion 110a of the back cover 110 and the edge portion 110b formed in a bent shape at the periphery of the flat portion 110a ) all microholes MH may be formed. Furthermore, the microholes (MH) formed in the flat part of the back cover 110 are relatively denser than other areas, especially in the areas near the camera module, AP chip, and battery, so that the heat generated from the heat source is higher than in other areas. Let it be actively released to the outside. In addition, the microholes MH formed in the edge portion 110b are formed more densely (at twice the density) than the microholes MH formed in the flat portion 110a to increase the heat dissipation area rate, thereby increasing the back cover ( 110) is reinforced so that heat dissipation can occur actively. Accordingly, the flow of heat generated from the heat source is made in a three-dimensional form in both the vertical and horizontal directions. Such a configuration can be equally applied even when the cover window 120 is formed in an edge type.

In the case of the microholes MH formed in the back cover 110 and the cover window 120 , the inner diameter is formed to be in the range of 1 μm to 1000 μm. Such microholes (MH) can be formed through laser irradiation or plasma treatment. The inner circumferential surface of the micro-hole (MH) is water-repellent by fluorine coating to allow air in and out through the micro-hole (MH) while actively blocking the ingress of water and oil. Accordingly, even if microholes MH are formed in the back cover 110 and the cover window 120 to dissipate heat to the outside, contrary to a common misconception, moisture penetration can be almost completely blocked, and due to moisture penetration, heat sources or other There is no damage to the parts.

In the heat dissipation sheet structure for electronic devices according to the first embodiment of the present invention, the inner space surrounded by the back cover 110 and the cover window 120 includes a heat dissipation tape 130, a heat transfer film 140, and a heat dissipation tape 130 to effectively perform a heat dissipation function. A graphite film 150 , a porous polyamide film 160 , and a cooling pipe 170 are further included. Below, each of these components will be described.

The heat dissipation tape 130 is adhered to the front and rear surfaces of the heat source, respectively, and serves to radiate the heat generated from the heat source. It comprises a body film, a heat dissipating polymer layer formed by coating a heat dissipating polymer having a heat dissipation function on the surface of the body film to improve thermal conductivity, and an adhesive layer formed by applying an adhesive having adhesive properties to the surface of the body film to improve adhesion.

A point to note here is that the first region 131 in which a heat-dissipating polymer layer is formed by applying a heat-dissipating polymer to the surface of the body film and the second region 132 in which an adhesive is applied and an adhesive layer is formed are repeatedly formed in the same layer in a separated state. , that the heat dissipation polymer layer and the adhesive layer were not mixed with each other. According to FIG. 3A , in the case of the patterned heat dissipation tape 130 , the first area 131 and the second area 132 are formed of square unit areas having the same size as each other, and alternately in the horizontal and vertical directions to form a checkerboard shape. to form a check pattern of Such a checkerboard-type check pattern can be said to be the most basic pattern in the pattern-type heat dissipation tape according to the present invention. The square unit area may be formed to have a size of about 3 to 6 mm in width and length, and the size may be adjusted as necessary. Although the rectangular unit area, the first area 131 and the second area 132 are clearly identifiable in the drawings, they are not.

According to the configuration in which the heat-dissipating polymer and the adhesive are not mixed by separating and patterning the first region 131 and the second region 132 on the same layer as described above, the heat-dissipating polymer and the adhesive, which are in inverse proportion to each other, are mixed with each other. As the interference phenomenon that degrades the performance disappears, it is possible to realize high levels of both thermal conductivity and adhesion. Therefore, a clear heat dissipation effect can be expected when it is attached to a heat source with severe heat. In addition, since the interference phenomenon caused by the mixing of the heat-dissipating polymer and the adhesive has disappeared, it is much easier to precisely control the thermal conductivity by controlling the content of graphene particles added to the heat-dissipating polymer. Therefore, there is an advantage in that it is very easy to control and correct the thermal conductivity and adhesive force during the manufacture of the heat dissipation tape.

Such a patterned heat dissipation tape 130 may be manufactured using the first mask and the second mask shown in FIGS. 3B and 3C . This will be described in detail as follows.

First, a first mask having a first application hole M1 perforated corresponding to the first region 131 of the patterned heat dissipation tape 130 , and a first application hole corresponding to the second region 132 ( A step of preparing a second mask having a second application hole (M2) opposite to M1) is performed.

After that, the first mask shown in FIG. 3B is applied to the surface of the body film, and then a heat radiation polymer is applied to the first area 131 through the first application hole M1 to form a heat radiation polymer layer.

Finally, after the second mask shown in FIG. 3c is applied to the surface of the body film, an adhesive is applied to the second area 132 through the second application hole M2 to form an adhesive layer on the same layer as the heat dissipating polymer layer. proceed step by step Accordingly, the manufacturing of the patterned heat dissipation tape 130 can be simply completed.

The heat transfer film 140 is laminated on the outer surface of the heat radiation tape 130 to transfer heat radiated by the heat radiation tape 130 to the graphite film 150 .

The graphite film 150 is laminated on the outer surface of the heat transfer film 140 to absorb some heat transferred by the heat transfer film 140 to lower the thermal temperature.

The porous polyamide film 160 is installed between the graphite film 150 positioned in front of the heat source among the two graphite films 150 arranged around the heat source and the display panel. In the porous polyamide film 160 , a plurality of microholes (MH) for lowering the heat temperature by emitting heat generated and transferred from a heat source are formed horizontally and vertically. If the microholes MH formed in the cover window 120 and the back cover 110 are for heat dissipation, the microholes MH formed in the porous polyamide film 160 are the cover window 120 and the back cover 110 . In the middle of the inner space surrounded by ), the internal heat is uniformly diffused to each layer to induce the heat temperature not to rise in a specific area. Of course, the heat diffused inside by the porous polyamide film 160 is emitted to the outside through the microholes MH formed in the cover window 120 and the back cover 110 .

Here, the microholes MH formed in the porous polyamide film 160 are not formed in an asymmetrical shape in which the inner diameter is enlarged or are not water repellent, unlike the microholes MH formed in the cover window 120 and the back cover 110 . There is clearly a difference in

The cooling pipe 170 passes through the heat source in a form in close contact with the surface of the heat source, and a heat transfer fluid for cooling the heat source is transferred therein. The cooling pipe 170 contacts both the front and rear surfaces (the upper side is the front side of the electronic device and the lower side is the rear side of the electronic device in the drawing) around the heat source as shown in FIG. 4A, and as shown in FIG. 4B If possible, it is preferable to contact the cooling pipe 170 in a zigzag shape while passing through all of the main heat sources that generate heat, for example, the camera module, the AP chip, and the battery.

As described above, the heat dissipation sheet structure for electronic devices according to the first embodiment of the present invention uses a combination of heat radiation, heat dissipation, heat dissipation composed of the front, rear and side surfaces, and circulating heat dissipation by the cooling pipe 170 . , even though the temperature of the heat source is high at 50°C, the heat temperature was significantly reduced to 38°C±2°C at the display panel, and it was confirmed that the screen output through the display panel was normally performed for a long time without any problems.

5 is a configuration diagram for explaining the structure of a heat dissipation sheet for electronic devices according to a second embodiment of the present invention.

As shown, the heat dissipation sheet structure for electronic devices according to the second embodiment of the present invention includes a heat dissipation tape 130, a heat transfer film 140, a heat dissipation layer 180a and a heat dissipation layer 180b from the heat source to the display panel. And it is characterized in that the porous polyamide film 160 is sequentially laminated.

The heat dissipation tape 130 is adhered to the front surface of the heat source to radiate heat generated from the heat source while bonding the heat source and the heat transfer film 140 to the heat transfer film 140, and the heat transfer film 140 is a heat dissipation tape ( 130) to transfer heat radiated by the heat dissipation tape 130, and is made of copper or aluminum, which is a material with good heat transfer efficiency. These are not different from the heat dissipation tape 130 and the heat transfer film 140 included in the first embodiment.

The porous polyamide film 160 is installed between the heat transfer film 140 and the display panel. In the porous polyamide film 160 , a plurality of microholes (MH) for lowering the heat temperature by emitting heat generated and transferred from a heat source are formed horizontally and vertically. The microholes (MH) formed in the porous polyamide film 160 uniformly diffuse the internal heat to each layer in the middle of the inner space surrounded by the cover window 120 and the back cover 110 so that the heat temperature in a specific area is increased. It helps to keep it from rising.

The heat dissipation layer 180a and the heat dissipation layer 180b are provided between the heat transfer film 140 and the porous polyamide film 160 . The heat dissipation layer 180a serves to radiate the heat transferred from the heat transfer film 140 in the inner space to uniformly diffuse it to each layer, and the heat dissipation layer 180b is diffused through the heat dissipation layer 180a. Some of the remaining heat is dissipated to lower the heat temperature. According to the structure in which the heat dissipation layer 180a and the heat dissipation layer 180b are combined with each other, the amount of heat to be processed by the porous polyamide film 160 is significantly reduced by simultaneously performing heat diffusion and dissipation. This effectively spreads the heat generated from the heat source so that it does not act intensively in a part of the internal space of the electronic device.

Here, the heat dissipation layer 180b is made of a ceramic film made of SiC or a porous polymer film made of polysiloxane, and the heat dissipation layer 180a is made of a film made of graphite or carbon nanotubes.

6 is a configuration diagram for explaining the structure of a heat dissipation sheet for electronic devices according to a third embodiment of the present invention.

As shown, in the structure of the heat dissipation sheet for electronic devices according to the third embodiment of the present invention, the heat dissipation layer 180b is 1 in front of the composite layer composed of the heat dissipation layer 180a and the heat dissipation layer 180b, compared to the second embodiment. It is characterized in that it is further stacked. In this way, before the heat generated from the heat source reaches the porous polyamide film 160, it is composed of a heat dissipation layer 180b, a heat dissipation layer 180a, and a heat dissipation layer 180b to simultaneously perform the diffusion and dissipation of heat. After passing through, the amount of heat to be processed by the porous polyamide film 160 is further reduced, so that thermal diffusion is more effective inside the electronic device.

7 is a configuration diagram for explaining the structure of a heat dissipation sheet for electronic devices according to a fourth embodiment of the present invention.

As shown, the heat dissipation sheet structure for electronic devices according to the fourth embodiment of the present invention includes a heat dissipation tape 130 , a heat transfer film 140 , a graphite film 150 , and a porous polyamide film from the heat source to the display panel. 160 are sequentially stacked, and microholes MH are formed in the cover window 120 . The configuration of the fourth embodiment is different from that of the first embodiment in that the heat dissipation tape 130 , the heat transfer film 140 , and the graphite film 150 that were laminated toward the rear side of the heat source are omitted.

The heat dissipation sheet structure for electronic devices according to the fourth embodiment has a relatively small amount of heat generated from the heat source compared to the first embodiment, and is useful when trying to make the electronic device slimmer, and in the case of each of these components, Since it is substantially the same as that of the first embodiment, a detailed description thereof will be omitted.

Although the preferred embodiment of the present invention has been described above, the present invention can use various changes, modifications, and equivalents. It is clear that the present invention can be applied in the same manner by appropriately modifying the above embodiments. Therefore, the above description does not limit the scope of the present invention determined by the limits of the following claims.

110: back cover: 120: cover window
130: heat dissipation tape 140: heat transfer film
150: graphite film 160: porous polyamide film
170: cooling pipe 180a: heat dissipation layer
180b: heat dissipation layer MH: microhole

Claims (15)

In an electronic device that has a built-in heat source and a display panel that generate heat and the front and rear are packaged by a cover window and a back cover,
A plurality of microholes for dissipating heat generated from the heat source to the outside are formed in the cover window in a thickness direction,
The micro-holes of the cover window are formed in a form in which the inner diameter is gradually expanded toward the front side to enhance the accessibility of external air to the micro-holes,
The inner diameter of the microhole is formed in a range of 1um to 1000um, and the inner circumferential surface of the microhole is water-repellent, so that air through the microhole is allowed in and out while blocking the ingress of water and oil. The method of claim 1,
A plurality of microholes are formed in the back cover to dissipate heat generated from the heat source to the outside in the thickness direction, and the microholes formed in the back cover are formed in a form in which the inner diameter is gradually expanded toward the rear side to form the microholes. Heat dissipation sheet structure, characterized in that the accessibility of the outside air is strengthened. The method of claim 2,
Microholes are formed in both the flat portion of the back cover and the edge portion formed in a bent shape around the flat portion, wherein the microholes formed in the flat portion of the back cover are relative to an area near the heat source compared to other areas. The heat dissipation sheet structure, characterized in that the microhole formed in the edge portion is formed more densely than the microhole formed in the flat portion to strengthen the heat dissipation function to the side of the back cover. delete The method of claim 1,
Heat dissipation sheet structure, characterized in that the inner peripheral surface of the microhole is water-repellent by fluorine coating. The method of claim 1,
a heat dissipation tape attached to the front and rear surfaces of the heat source, respectively, to radiate heat generated from the heat source;
a heat transfer film made of copper or aluminum laminated on the outer surface of the heat dissipation tape to transfer heat radiated by the heat dissipation tape; and
and a graphite film of a graphite material laminated on the outer surface of the heat transfer film to absorb some heat transferred by the heat transfer film to lower the thermal temperature. The method of claim 6,
It is installed between the graphite film positioned in front of the heat source among the graphite film and the display panel, and spreads the heat generated and transferred from the heat source to make the heat temperature of each layer uniform so that the heat is not concentrated in only a part of the internal space Heat dissipation sheet structure, characterized in that it further comprises a porous polyamide film in which a plurality of microholes are arranged horizontally and vertically. The method of claim 6,
A heat dissipation sheet structure, characterized in that a cooling pipe through which a heat transfer fluid for cooling the heat source is transferred is further installed therein through the heat source in a form in close contact with the surface of the heat source. The method of claim 1,
Installed between the heat source and the display panel, the microholes that spread the heat generated and transferred from the heat source so that the heat is not concentrated in only a part of the interior space, are arranged horizontally and vertically to make the heat temperature of each layer uniform. a plurality of porous polyamide films formed;
a heat dissipation tape attached to the front surface of the heat source to radiate heat generated from the heat source; and
It further includes; a heat transfer film of copper or aluminum material laminated on the front surface of the heat dissipation tape to transfer the heat radiated by the heat dissipation tape to the porous polyamide film,
Between the heat transfer film and the porous polyamide film, a composite layer comprising a heat dissipation layer that partially dissipates the heat transferred by the heat transfer film to lower the heat temperature and a heat dissipation layer that radiates the remaining heat after being partially dissipated by the heat dissipation layer Heat dissipation sheet structure, characterized in that it further comprises. delete delete The method of claim 9,
Between the heat transfer film and the porous polyamide film, a heat dissipation layer is added to lower the heat temperature by partially dissipating the heat remaining after being radiated by the heat dissipation layer, so that the composite layer is a heat dissipation layer, a heat dissipation layer, and a heat dissipation layer are sequentially stacked. Heat dissipation sheet structure, characterized in that made in the form. The method of claim 9,
The heat dissipation layer is a ceramic membrane made of SiC or a porous polymer membrane made of polysiloxane,
The heat dissipation layer is a heat dissipation sheet structure, characterized in that the film made of graphite or carbon nanotubes. A display comprising the heat dissipation sheet structure of any one of claims 1 to 3, 5 to 9, and 12 to 13. An electronic device comprising the display of claim 14 .

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