KR102208503B1 - Patterned heat-radiating tape and smartphone with the same - Google Patents

Abstract

The present invention relates to patterned heat dissipation tape which prevents an interference effect that degrades the performance of a heat dissipation polymer and an adhesive, which are in opposite relation to each other, thereby achieving higher thermal conductivity and adhesion and easily controlling and correcting the thermal conductivity and the adhesion during manufacturing, and a smartphone having the same. The patterned heat dissipation tape comprises: a body film; a heat dissipation polymer layer formed by applying a heat dissipation polymer having a heat dissipation function to the surface of the body film to improve thermal conductivity; and an adhesive layer formed by applying an adhesive having adhesive properties to the surface of the body film to improve adhesive force. A first region where the heat dissipation polymer layer is formed by applying the heat dissipation polymer to the surface of the body film and a second region where the adhesive layer is formed by applying the adhesive, are repeatedly formed in a separated state in the same layer, and thus the heat dissipation polymer layer and the adhesive layer are not mixed with each other.

Description

Patterned heat-radiating tape and smartphone with the same}

The present invention relates to a heat-dissipating tape, and in particular, by preventing an interference phenomenon that deteriorates the performance of a heat-radiating polymer and an adhesive in an opposite relationship to each other, realizing both thermal conductivity and adhesion to a high level, and controlling thermal conductivity and adhesion during manufacture, and It relates to a pattern-type heat dissipation tape and a smartphone having the same to facilitate correction.

Recently, the market demand for high performance and miniaturization in the field of electronic devices such as smartphones, displays, and portable computers is the development of technology for electronic components such as CPUs (central processing units) and ICs (integrated circuits). By accelerating the power consumption density and increased heat generation. The current technology development is in a situation where the reduction of power consumption cannot catch up with the high performance, and accordingly, high heat dissipation materials, low power devices, thermal fluid analysis software for electronic devices, etc. are becoming an issue as a major measure against heat problems.

When heat accumulates in an electronic component, the processing performance of the electronic component decreases, and the electronic component is liable to be damaged. The high-voltage generator may cause problems such as an electric short, shorten the life of the product, and cause failure or malfunction of the product, thereby lowering the reliability of the product. In severe cases, it can also cause explosions and fires. In addition, an increase in the temperature of the product surface is unpleasant to users of electronic devices.

Accordingly, a heat dissipation sheet is used to reduce the heat temperature by radiating heat generated from a heat source, and a heat dissipation tape that performs both adhesiveness and heat transfer functions is adhered between the heat source and the heat dissipation sheet. Among them, the heat dissipation tape was made to perform adhesiveness and heat transfer functions by applying a mixture of a heat dissipating polymer and an adhesive on the surface of the body film.

However, there is a problem in that the heat dissipation tape according to the prior art does not have a high thermal conductivity. This is because the heat dissipating polymer for increasing the thermal conductivity and the adhesive for increasing the adhesive force are in inverse proportion to each other, so when they are mixed together, it was difficult to meet both high adhesion and thermal conductivity.

Korean Patent Application Publication No. 2012-0094380 (2012.08.24)

Accordingly, the present invention has been proposed to solve the problems of the prior art, and an object of the present invention is to prevent interference that degrades the performance between the heat dissipating polymer and the adhesive, which are in opposite relationship to each other, thereby reducing both thermal conductivity and adhesion. It is to provide a pattern-type heat-dissipating tape that is implemented at a high level and makes it easy to control and correct thermal conductivity and adhesion during manufacturing, and a smartphone having the same.

In order to achieve the above object, a patterned heat dissipating tape according to the technical idea of the present invention is a heat dissipating tape that can be used for attaching to a heat source in a device including a heat source that generates heat, comprising: a body film; A heat radiation polymer layer formed by coating a heat radiation polymer having a heat radiation function on the surface of the body film to improve thermal conductivity; Including; an adhesive layer formed by applying an adhesive having adhesiveness to improve adhesion to the surface of the body film, wherein the first region in which a heat dissipating polymer layer is formed by applying a heat dissipating polymer to the surface of the body film and the adhesive layer are applied The formed second region is repeatedly formed in a state separated by the same layer, so that the heat dissipating polymer layer and the adhesive layer are not mixed with each other, according to the technical configuration thereof.

Here, the first region and the second region may be formed of square unit regions having the same size and alternate in a horizontal direction and a vertical direction to form a check pattern in the form of a checkerboard.

In addition, the first region is a large square region formed by extending four square unit regions in a horizontal direction and two in a vertical direction, and a small square region formed by one square unit region extending in a diagonal direction at each corner of the square region. It consists of dogs, and the first region is continuously arranged without spaces in a diagonal direction, but is arranged in a form that shares a small square region, and the second region is a star while filling the remaining regions in which the first region is not formed. It may be characterized by forming a pattern.

In addition, the first region is formed of a rectangular region formed by two square unit regions extending in a horizontal direction, and the second region is constituted of a square region formed of one square unit region, and the first region and the second The regions may be characterized by forming a diagonal pattern in which rows are arranged in a diagonal direction while alternating in a horizontal direction and a vertical direction.

In addition, the second region consists of a square region formed by extending four square unit regions by two in a horizontal direction and a vertical direction, so that the second region is continuously arranged at intervals of square unit regions in the horizontal direction and the vertical direction, and the first region A cross pattern may be formed by surrounding the second area while filling the spaced area of the second area.

In addition, the square unit region may have a horizontal length and a vertical length of 3 to 6 mm.

On the other hand, the smart phone of the present invention has a built-in heat source and a display panel, and a plurality of microholes for discharging heat generated from the heat source to the outside in the thickness direction are formed in the cover window, and the front and rear surfaces of the heat source A pattern-type heat dissipation tape that is adhered to each of the heat sources to radiate heat generated from the heat source; A heat transfer film made of copper or aluminum that is stacked on the outer surface of the heat dissipation tape to transfer heat radiated by the heat dissipation tape; And a graphite film made of a graphite material that is laminated on the outer surface of the heat transfer film and absorbs some of the heat transferred by the heat transfer film to lower the heat temperature.

Here, the microhole of the cover window is formed in a form in which the inner diameter gradually expands toward the front side to enhance accessibility of external air to the microhole, and the inner diameter of the microhole is formed to be 1um to 1000um, The inner circumferential surface may be treated with water repellent by fluorine coating, so that the entry of air through the microhole is allowed, while the entry of water and oil is blocked.

In addition, a plurality of microholes for discharging heat generated from the heat source in the thickness direction are formed in the back cover, and the microholes formed in the back cover are formed in a form in which the inner diameter gradually expands toward the rear side. It enhances the accessibility of external air to, and the inner diameter of the microhole is formed from 1um to 1000um, and the inner circumferential surface of the microhole is treated with water repellent by fluorine coating to allow the entry of air through the microhole while allowing the entry of water and oil. It may be characterized in that it is possible to block.

In addition, it is installed between the display panel and the graphite film located in front of the heat source among the graphite films, and the heat temperature of each layer is uniform so that the heat generated and transferred from the heat source is diffused so that heat is not concentrated only in a part of the internal space. A porous polyamide film in which a plurality of microholes are formed by rowing horizontally and vertically; And a cooling pipe passing through the heat source in close contact with the surface of the heat source, and through which a heat transfer fluid for cooling the heat source is transferred therein.

On the other hand, the pattern-type heat dissipation tape manufacturing method of the present invention includes a first mask having a first coating hole perforated corresponding to the first area, and a second mask having a first coating hole perforated corresponding to the second area. Providing a second mask having an application hole; Forming a heat dissipating polymer layer by applying the first mask to the surface of the body film and then applying a heat dissipating polymer to the first region through a first coating hole; And forming an adhesive layer by applying the second mask to the surface of the body film and then applying the adhesive to the second region through the second application hole.

The patterned heat dissipation tape according to the present invention has a configuration in which the heat dissipation polymer and the adhesive are not mixed. As the heat dissipation polymer and the adhesive that were in inverse proportion to each other are mixed, the interference phenomenon that deteriorates the performance of each other disappears, thereby increasing both thermal conductivity and adhesion It is possible to implement at the level. Accordingly, a distinct heat dissipation effect can be expected when attached to a heat source with severe heat generation.

In addition, the present invention is much easier to accurately control the thermal conductivity by controlling the content of graphene particles added to the heat-radiating polymer because the interference phenomenon caused by the mixing of the heat-radiating polymer and the adhesive has disappeared, and the thermal conductivity and adhesive strength are controlled when the heat-radiating tape is manufactured. And it has the advantage of being very easy to correct.

In addition, the smartphone implementing the heat radiation sheet structure with the patterned heat dissipation tape of the present invention is a combination of heat radiation, heat dissipation, external heat dissipation from the front, rear, and sides, and circulation heat dissipation by the heat transfer fluid. Even if the temperature of the heat source is high during the loss, there is no problem that the heat concentration phenomenon occurs only at some points, and the heat temperature is drastically reduced while the heat source reaches the display panel, so that the screen output through the display panel and the functions of internal parts can be performed normally without any problem. .

1 is a plan view for explaining the configuration of a pattern-type heat dissipation tape according to a first embodiment of the present invention
2A and 2B are plan views of a first mask and a second mask for manufacturing a patterned heat dissipating tape according to a first embodiment of the present invention.
3 is a plan view for explaining the configuration of a pattern-type heat dissipation tape according to a second embodiment of the present invention
4 is a plan view for explaining the configuration of a patterned heat dissipation tape according to a third embodiment of the present invention
5 is a plan view for explaining the configuration of a pattern-type heat dissipation tape according to a fourth embodiment of the present invention
6 is a sample photograph of a first mask for manufacturing a patterned heat dissipation tape according to the first embodiment of the present invention
7 is a sample photograph of a first mask for manufacturing a patterned heat dissipating tape according to a second embodiment of the present invention
8 is a sample photograph of a first mask for manufacturing a patterned heat radiation tape according to a third embodiment of the present invention
9 is a sample photograph of a first mask for manufacturing a patterned heat dissipating tape according to a fourth embodiment of the present invention
10 is a perspective view of a smartphone according to an embodiment of the present invention
11 is a configuration diagram for explaining a heat dissipation sheet structure in a smartphone according to an embodiment of the present invention
12A and 12B are side views and perspective views for explaining a cooling pipe included in a heat radiation sheet structure in a smart phone according to an embodiment of the present invention

With reference to the accompanying drawings will be described in detail with respect to the pattern-type heat dissipation tape and a smartphone having the same according to embodiments of the present invention. Since the present invention can apply various changes and have various forms, specific embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific form of disclosure, and it should be understood that all changes, equivalents, and substitutes included in the spirit and scope of the present invention are included. In describing each drawing, similar reference numerals have been used for similar elements. In the accompanying drawings, the dimensions of the structures are shown to be enlarged from the actual one for clarity of the present invention or reduced from the actual one to understand the schematic configuration.

In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Meanwhile, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.

<Example>

1 is a plan view for explaining the configuration of a patterned heat dissipating tape according to a first embodiment of the present invention, and FIGS. 2A and 2B are a first mask for manufacturing a patterned heat dissipating tape according to the first embodiment of the present invention And a plan view of the second mask.

As shown in Figure 1, the patterned heat dissipation tape according to the first embodiment of the present invention is a heat dissipation tape that can be used for attaching to a heat source in a device including a heat source for generating heat, and the body film and the body film surface A heat-dissipating polymer layer formed by applying a heat-dissipating polymer having a heat-dissipating function to improve thermal conductivity, and an adhesive layer formed by applying an adhesive having adhesiveness to improve adhesion to the surface of the body film.

It should be noted that the first region 131 in which the heat dissipating polymer layer is formed on the surface of the body film and the second region 132 in which the adhesive layer is formed by applying the adhesive are repeatedly formed in a state separated from the same layer , The heat dissipation polymer layer and the adhesive layer are not mixed with each other. Referring to FIG. 1, in the case of the patterned heat dissipation tape 130 according to the first embodiment, the first region 131 and the second region 132 are formed of square unit regions having the same size, and are horizontal and vertical. It alternates in directions to form a check pattern in the form of a checkerboard. Such a check pattern in the form of a checkerboard can be said to be the most basic pattern in the patterned heat dissipation tape according to the present invention. The square unit region may have a horizontal length and a vertical length of about 3 to 6 mm, and the size of the square unit region may be adjusted as necessary. Such a rectangular unit region, the first region 131 and the second region 132 are illustrated to be clearly identifiable in the drawings, but they are not.

As described above, according to the configuration in which the first region 131 and the second region 132 are separated and patterned on the same layer so that the heat dissipating polymer and the adhesive are not mixed, the heat dissipating polymer and the adhesive, which were in inverse proportion to each other, are mixed. As the interference phenomenon that deteriorates the performance disappears, it has become possible to implement both the thermal conductivity and the adhesion at a high level. Therefore, when it is attached to a heat source with severe heat generation, a distinct heat dissipation effect can be expected. In addition, since the interference phenomenon caused by the mixing of the heat dissipating polymer and the adhesive disappeared, it is much easier to accurately control the thermal conductivity by controlling the content of graphene particles added to the heat dissipating polymer. Therefore, there is an advantage in that it is very easy to control and correct thermal conductivity and adhesion when manufacturing a heat radiation tape.

Such a patterned heat dissipation tape 130 may be manufactured using the first mask and the second mask shown in FIGS. 2A and 2B. This will be described in detail as follows.

First, a first mask having a first coating hole M1 perforated corresponding to the first area 131 of the patterned heat dissipation tape 130 according to the first embodiment of the present invention, and the second area 132 ), a step of providing a second mask having a second coating hole (M2) opposite to the first coating hole (M1) is performed. For reference, in Fig. 6, a pattern according to the first embodiment of the present invention is performed. A photo of the first mask actually manufactured to manufacture the type heat-dissipating tape is attached, the black part in the photo corresponds to the first application hole (M1) The photo of the second mask is not attached, but the first mask is attached. It can be understood that the second coating hole M2 is formed opposite to the first coating hole M1.

Thereafter, after the first mask shown in FIG. 2A is applied to the surface of the body film, a heat radiation polymer is applied to the first region 131 through the first coating hole M1 to form a heat radiation polymer layer.

Finally, after the second mask shown in FIG. 2B is applied to the surface of the body film, an adhesive is applied to the second region 132 through the second coating hole M2 to form an adhesive layer on the same layer as the heat dissipating polymer layer. Go through the steps. Thus, it is possible to simply complete the manufacturing of the patterned heat dissipation tape 130.

3 is a plan view illustrating a configuration of a patterned heat dissipating tape according to a second embodiment of the present invention.

As shown, the patterned heat dissipation tape 230 according to the second embodiment of the present invention is characterized in that it is formed in a star pattern, unlike the check pattern in the first embodiment.

To this end, the first region 131 in which the heat dissipating polymer layer is formed is a large square region formed by extending four square unit regions by two in the horizontal and vertical directions, and one square extending in a diagonal direction at each corner of the square region. It consists of 4 small square areas formed as unit areas. The first region 131 is continuously arranged without spaces in a diagonal direction, but is arranged in a form that shares a small square region, and the second region 132 in which the adhesive layer is formed is not formed with the first region 131. A star pattern is formed while filling the remaining areas.

For reference, a photograph of a first mask actually manufactured to manufacture the patterned heat dissipating tape 230 according to the second embodiment of the present invention is attached to FIG. 7. The black part in the photo corresponds to the first application hole (M1). Although the photograph of the second mask is not attached, it can be understood that the second coating hole M2 is formed opposite to the first coating hole M1 of the first mask.

In the case of the second embodiment formed with a star pattern as described above, it can be seen that the first region 131 and the second region 132 form a pattern with a larger area compared to the first embodiment formed with a check pattern. In the second embodiment, only the pattern shape is different from that of the first embodiment, and the rest of the configurations are substantially the same, so further description will be omitted.

4 is a plan view illustrating a configuration of a patterned heat dissipating tape according to a third embodiment of the present invention.

As shown, the patterned heat dissipation tape 330 according to the third embodiment of the present invention is characterized in that it is formed in a diagonal pattern, unlike the check pattern formed in the first embodiment.

To this end, the first region 131 in which the heat dissipating polymer layer is formed is formed of a rectangular region formed by extending two square unit regions in a horizontal direction. The second region 132 in which the adhesive layer is formed is formed of a square region formed as one square unit region. In addition, the first region 131 and the second region 132 form an inclined pattern in which rows are arranged in a diagonal direction while alternating in a horizontal direction and a vertical direction.

For reference, a photograph of a first mask actually manufactured to manufacture the patterned heat dissipating tape 330 according to the third embodiment of the present invention is attached to FIG. 8. The black part in the photo corresponds to the first application hole (M1). Although the photograph of the second mask is not attached, it can be understood that the second coating hole M2 is formed opposite to the first coating hole M1 of the first mask.

In the case of the third embodiment formed with an inclined pattern as described above, since the first region 131 forms a pattern with a larger area than the second region 132 compared to the first embodiment formed with a check pattern, the thermal conductivity is relatively higher than the adhesive force. It can be seen that it is an easy form to increase the value. In the third embodiment, only the pattern shape is different from that of the first embodiment, and the remaining configurations are substantially the same, and thus further description will be omitted.

5 is a plan view illustrating a configuration of a patterned heat dissipating tape according to a fourth embodiment of the present invention.

As shown, the patterned heat dissipation tape 430 according to the fourth embodiment of the present invention is characterized in that it is formed in a diagonal pattern, unlike the check pattern in the first embodiment.

To this end, the second region 132 in which the adhesive layer is formed is composed of a square region formed by extending four square unit regions by two in the horizontal and vertical directions, and is spaced apart horizontally and vertically, but spaced apart by the square unit region. Are placed in a row. The first region 131 in which the heat dissipating polymer layer is formed surrounds the second region 132 while filling the spaced regions of the second region 132 to form a cross pattern.

For reference, a photograph of a first mask actually manufactured to manufacture the patterned heat dissipating tape 430 according to the fourth embodiment of the present invention is attached to FIG. 9. The black part in the photo corresponds to the first application hole (M1). Although the photograph of the second mask is not attached, it can be understood that the second coating hole M2 is formed opposite to the first coating hole M1 of the first mask.

In the case of the fourth embodiment formed with an inclined pattern as described above, since the first region 131 forms a pattern with a larger area than the second region 132 compared to the first embodiment formed with a check pattern, the thermal conductivity is relatively higher than the adhesive force. It can be seen that it is an easy form to increase the value. In the fourth embodiment, only the pattern shape is different from that of the first embodiment, and the remaining configurations are substantially the same, and thus further description will be omitted.

Continuing below, the structure of the heat dissipation sheet of the smart phone provided with the above-described pattern-type heat dissipation tape will be described.

10 is a perspective view of a smart phone according to an embodiment of the present invention, Figure 11 is a configuration diagram for explaining the structure of a heat dissipation sheet in a smart phone according to an embodiment of the present invention, Figures 12a and 12b are implementation of the present invention A side view and a perspective view for explaining a cooling pipe included in the heat dissipation sheet structure in a smartphone according to an example.

As shown, in the smart phone according to the embodiment of the present invention, the heat dissipation sheet structure including the patterned heat dissipation tape rapidly diffuses the heat generated from the heat source inside the electronic device by microholes (MH) formed in various positions to Through a three-dimensional method of lowering and discharging it to the outside, it is possible to quickly lower the heat temperature even when the temperature of the heat source exceeds 40 degrees.

To this end, as shown in FIG. 11, a plurality of microholes (MH) are formed in the thickness direction in the cover window 120 and the back cover 110 so that heat generated from the heat source can be discharged to the outside.

Note that, as can be seen in the enlarged portion of FIG. 11, the microhole MH formed in the back cover 110 is formed in a form in which the inner diameter gradually expands toward the rear side, and the microhole formed in the cover window 120 The hole (MH) is formed in the form of gradually widening the inner diameter toward the front side. This makes it possible to enhance the accessibility of external air to the microhole (MH). In other words, when considering the distribution of air filled in the microhole (MH), which has an inner diameter that expands toward the outside, the amount of external air having a low temperature in the microhole (MH) is higher than the amount of internal air having a high temperature. Because there are many, the tendency of the heat flow to the outside in the microhole MH appears strong, and it becomes possible to quickly release heat.

In the case of the back cover 110, in the case of being of an edge type according to the recent trend of smartphones, the flat portion 110a of the back cover 110 and the edge portion 110b formed in a form bent at the circumference of the flat portion 110a ) All microholes (MH) may be formed. Furthermore, the micro-holes (MH) formed in the flat portion of the back cover 110 are formed relatively more densely in the area near the heat source, especially the camera module, the AP Chip, and the battery, compared to other areas, so that the heat generated from the heat source is less than other areas. It is actively released to the outside. In addition, the microholes MH formed in the edge portion 110b are formed more densely (at twice the density) than the microholes MH formed in the flat portion 110a to increase the heat dissipation area ratio, thereby increasing the back cover ( 110) sideways also strengthen heat dissipation to occur actively. Accordingly, the flow of heat generated from the heat source is formed in a three-dimensional form in both the vertical direction and the horizontal direction. This configuration can be applied in the same way even when the cover window 120 is made of an edge type.

In the case of the microhole MH formed in the back cover 110 and the cover window 120, the inner diameter is formed to be 1 um to 1000 um. Such microholes (MH) can be formed through laser irradiation or plasma treatment. The inner circumferential surface of the microhole MH is treated with water-repellent treatment by fluorine coating so that the air through the microhole MH is allowed, while the water and oil can be actively blocked. As a result, even if microholes (MH) are formed in the back cover 110 and the cover window 120 to dissipate heat to the outside, unlike a general misconception, moisture penetration can be almost completely blocked, and due to the moisture penetration, a heat source or other Nothing causes damage to the parts.

In the heat dissipation sheet structure, the above-described patterned heat dissipation tape 130, heat transfer film 140, graphite film 150, in order to effectively perform a heat dissipation function in the inner space surrounded by the back cover 110 and the cover window 120, A porous polyamide film 160 and a cooling pipe 170 are further included. Each of these components will be described below.

The patterned heat dissipation tape 130 serves to radiate heat generated from the heat source by being adhered to the front and rear surfaces of the heat source, respectively. As described above, the patterned heat dissipation tape 130 separates the first region 131 in which the heat dissipation polymer layer is formed and the second region 132 in which the adhesive layer is formed in the same layer to be patterned so that the heat dissipating polymer and the adhesive are Due to the configuration so as not to be mixed, the heat dissipating polymer and the adhesive, which were inversely related to each other, were mixed, and the interference phenomenon that deteriorated the performance of each other disappeared, and from this, it became possible to realize both the thermal conductivity and the adhesive strength at a high level. Therefore, when it is attached to a heat source with severe heat generation, a distinct heat dissipation effect can be expected. In addition, since the interference phenomenon caused by the mixing of the heat dissipating polymer and the adhesive disappeared, it is much easier to accurately control the thermal conductivity by controlling the content of graphene particles added to the heat dissipating polymer. Therefore, there is an advantage in that it is very easy to control and correct thermal conductivity and adhesion when manufacturing a heat radiation tape.

The heat transfer film 140 is stacked on the outer surface of the heat radiation tape 130 to transfer heat radiated by the heat radiation tape 130 to the graphite film 150.

The graphite film 150 is laminated on the outer surface of the heat transfer film 140 to absorb some of the heat transferred by the heat transfer film 140 to lower the heat temperature.

The porous polyamide film 160 is installed between the display panel and the graphite film 150 positioned in front of the heat source among the two graphite films 150 disposed around the heat source. In the porous polyamide film 160, a plurality of microholes (MH) for lowering a heat temperature by releasing heat generated from a heat source and transmitted are formed in a row in a horizontal and vertical manner. If the micro-holes (MH) formed in the cover window 120 and the back cover 110 are for the purpose of dissipating heat, the micro-holes (MH) formed in the porous polyamide film 160 are the cover window 120 and the back cover 110 In the middle of the inner space surrounded by ), the inner heat is uniformly diffused to each layer to induce the heat temperature not to increase in a specific area. Of course, the heat diffused from the inside by the porous polyamide film 160 is discharged to the outside through the microholes MH formed in the cover window 120 and the back cover 110.

Here, unlike the micro-holes MH formed in the cover window 120 and the back cover 110, the microholes MH formed in the porous polyamide film 160 are formed in an asymmetrical shape with an enlarged inner diameter or are not treated with water repellency. There is definitely a difference.

The cooling pipe 170 passes through the heat source in a form in close contact with the surface of the heat source, and a heat transfer fluid for cooling the heat source is transferred therein. The cooling pipe 170 makes contact with both the front and rear surfaces (the upper side is the front side of the electronic device and the lower side is the rear side of the electronic device in the drawing) centering on the heat source as shown in FIG. 12A, and as shown in FIG. If possible, it is desirable to make zigzag contact with the main heat sources generating much heat, for example, the camera module, the AP chip, and the battery while the cooling pipe 170 passes through it.

As described above, the heat dissipation sheet structure for an electronic device in a smartphone according to an embodiment of the present invention is used in combination with heat radiation, heat dissipation, heat dissipation consisting of front and rear, and side surfaces, and circulating heat dissipation by the cooling pipe 170. As a result, even when the temperature of the heat source is at a high level of 50°C, the heat temperature of 38°C ㅁ2°C has decreased significantly when the display panel reaches the display panel, and it can be confirmed that the screen output through the display panel is normally performed for a long time without any problems.

Although the preferred embodiment of the present invention has been described above, the present invention can use various changes, modifications, and equivalents. It is clear that the present invention can be applied in the same manner by appropriately modifying the above embodiments. Therefore, the above description does not limit the scope of the present invention determined by the limits of the following claims.

110: back cover: 120: cover window
130, 230, 330, 430: heat dissipation tape 131: first area
132: second region 140: heat transfer film
150: graphite film 160: porous polyamide film
170: cooling pipe 180a: heat dissipation layer
180b: heat extinguishing layer MH: microhole
M1: 1st application hole M2: 2nd application hole

Claims (11)

In a smartphone that has a built-in heat source and a display panel to generate heat,
A pattern-type heat dissipation tape having a plurality of microholes formed in the cover window for discharging heat generated from the heat source to the outside in a thickness direction, and are adhered to the front and rear surfaces of the heat source to radiate heat generated from the heat source; A heat transfer film made of copper or aluminum that is stacked on the outer surface of the heat dissipation tape to transfer heat radiated by the heat dissipation tape; And a graphite film made of a graphite material that is laminated on the outer surface of the heat transfer film and absorbs some of the heat transferred by the heat transfer film to lower the heat temperature.
The heat dissipation tape, the body film; A heat radiation polymer layer formed by coating a heat radiation polymer having a heat radiation function on the surface of the body film to improve thermal conductivity; Including; an adhesive layer formed by applying an adhesive having adhesiveness to improve adhesion to the surface of the body film, wherein the first region in which a heat dissipating polymer layer is formed by applying a heat dissipating polymer to the surface of the body film and the adhesive layer are applied The formed second region is repeatedly formed in a state separated on the same layer so that the heat dissipation polymer layer and the adhesive layer are not mixed with each other,
The microhole of the cover window is formed in a form that gradually expands the inner diameter toward the front side to enhance the accessibility of external air to the microhole, the inner diameter of the microhole is formed from 1um to 1000um, and the inner peripheral surface of the microhole is A smartphone, characterized in that the water-repellent treatment by a fluorine coating allows the entry of air through the microhole while blocking the entry of water and oil. The method of claim 1,
The first area and the second area are formed of square unit areas having the same size and alternately in a horizontal direction and a vertical direction to form a checkerboard-shaped check pattern. The method of claim 1,
The first region is composed of a large square region formed by extending four square unit regions by two in the horizontal and vertical directions, and four small square regions formed by one square unit region extending in a diagonal direction at each corner of the square region. The first region is arranged in a diagonal direction without spaced apart, but is arranged in a form that shares a small square region, and the second region fills the remaining regions in which the first region is not formed and forms a star pattern. Smartphone, characterized in that to form. The method of claim 1,
The first area is formed of a rectangular area formed by two square unit areas extending in a horizontal direction, the second area is formed of a square area formed of one square unit area, and the first area and the second area are A smartphone, characterized in that it forms a diagonal pattern in which rows are arranged in a diagonal direction while alternating in a horizontal direction and a vertical direction. The method of claim 1,
The second area is composed of a square area formed by extending four square unit areas by two in a horizontal direction and a vertical direction, and is continuously arranged spaced apart in a horizontal direction and a vertical direction, but is continuously arranged spaced apart by a square unit area. A smartphone, characterized in that the first area fills the spaced area of the second area and surrounds the second area to form a cross pattern. The method according to any one of claims 2 to 5,
The square unit area is a smartphone, characterized in that the horizontal length and the vertical length of 3 ~ 6mm. delete delete The method of claim 1,
A number of microholes are formed in the back cover in the thickness direction to dissipate heat generated from the heat source to the outside, and the microholes formed in the back cover are formed in a form in which the inner diameter gradually expands toward the rear side. Strengthen the accessibility of outside air,
The inner diameter of the microhole is formed from 1um to 1000um, and the inner circumferential surface of the microhole is treated with water-repellent treatment by fluorine coating to allow the entry of air through the microhole while blocking the entry of water and oil. pawn. The method of claim 1,
It is installed between the display panel and the graphite film located in front of the heat source among the graphite films, and spreads the heat generated and transferred from the heat source to make the heat temperature of each layer uniform so that heat is not concentrated only in part of the internal space. A porous polyamide film in which a number of microholes are formed by rowing horizontally and vertically; And
A smart phone comprising: a cooling pipe through which the heat source is in close contact with the surface of the heat source and through which a heat transfer fluid for cooling the heat source is transferred. Body film; A heat radiation polymer layer formed by coating a heat radiation polymer having a heat radiation function on the surface of the body film to improve thermal conductivity; Including; an adhesive layer formed by applying an adhesive having adhesiveness to improve adhesion to the surface of the body film, wherein the first region in which a heat dissipating polymer layer is formed by applying a heat dissipating polymer to the surface of the body film and the adhesive layer are applied As a pattern-type heat-dissipating tape manufacturing method in which the formed second area is repeatedly formed in a state that is divided in the same layer, so that the heat-radiating polymer layer and the adhesive layer are not mixed with each other,
Providing a first mask having a first coating hole perforated corresponding to the first area and a second mask having a second coating hole opposite to the first coating hole corresponding to the second area; Forming a heat radiation polymer layer by applying the first mask to the surface of the body film and then applying a heat radiation polymer to the first region through a first coating hole; And forming an adhesive layer by applying the second mask to the surface of the body film and then applying an adhesive to the second region through the second coating hole.

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