CN214625022U - Chip on film, display module and display device - Google Patents
Chip on film, display module and display device Download PDFInfo
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- CN214625022U CN214625022U CN202120441768.8U CN202120441768U CN214625022U CN 214625022 U CN214625022 U CN 214625022U CN 202120441768 U CN202120441768 U CN 202120441768U CN 214625022 U CN214625022 U CN 214625022U
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Abstract
The utility model discloses a cover brilliant film, display module assembly and display device. The chip on film comprises a substrate, a chip and a heat dissipation paste; the substrate is provided with a mounting surface, the mounting surface is provided with at least two positioning points, and the at least two positioning points are arranged at intervals; the chip is arranged on the mounting surface, and the chip and the positioning point are arranged at intervals; the heat dissipation paste is arranged on the surface, back to the substrate, of the chip, and the positioning points are located outside the projection range of the heat dissipation paste on the substrate. The utility model provides a can promote the radiating effect, and can not influence the cover brilliant film of cutting.
Description
Technical Field
The utility model relates to a show the field, in particular to cover brilliant film, display module assembly and display device.
Background
At present, a Chip On Film (COF) with a heat dissipation paste is pasted on the back of the COF, and because the front of the COF is an IC, when the COF is separated and cut, a cutting device can detect a front chip (IC) so as to realize the separation and cutting of the COF; however, the heat dissipation effect is poor when the heat dissipation tape is attached to the back surface of the COF, and the cutting device may not be able to effectively identify the detection point due to the change of the position of the heat dissipation tape, so that the COF cannot be cut.
Disclosure of Invention
The present application is directed to a chip on film, and aims to provide a chip on film that can improve heat dissipation without affecting dicing.
In order to achieve the above object, the present application provides a chip on film, which includes a substrate, a chip and a heat dissipation patch; the substrate is provided with a mounting surface, the mounting surface is provided with at least two positioning points, and the at least two positioning points are arranged at intervals; the chip is arranged on the mounting surface, and the chip and the positioning point are arranged at intervals; the heat dissipation paste is arranged on the surface, back to the substrate, of the chip, and the positioning points are located outside the projection range of the heat dissipation paste on the substrate.
In an embodiment of the present application, the chip and the heat dissipation patch are disposed opposite to each other, and a projection area of the heat dissipation patch on the substrate is larger than a projection area of the chip on the substrate.
In an embodiment of the present application, a projection of the chip on the substrate falls into a projection of the heat sink attached to the substrate.
In an embodiment of the application, at least two positioning points are arranged at intervals along a circumferential direction of the chip.
In an embodiment of the application, the mounting surface is convexly provided with a protruding portion, and the protruding portion is the positioning point.
In another embodiment of the present application, the mounting surface is provided with an opening, and the opening is the positioning point.
In a further embodiment of the application, the mounting surface is provided with a coating, the coating being the anchor point.
In an embodiment of the present application, the cross-sectional shape of the positioning point is a circle;
or the cross section of the positioning point is rectangular;
or the cross section of the positioning point is polygonal.
The application also provides a display module, which comprises a display panel and a plurality of chip on films, wherein the plurality of chip on films are arranged on the display panel at intervals; the chip on film comprises a substrate, a chip and a heat dissipation paste; the substrate is provided with a mounting surface, the mounting surface is provided with at least two positioning points, and the at least two positioning points are arranged at intervals; the chip is arranged on the mounting surface, and the chip and the positioning point are arranged at intervals; the heat dissipation paste is arranged on the surface, back to the substrate, of the chip, and the projection of the heat dissipation paste on the substrate and the positioning points are arranged at intervals.
The application also provides a display device, which comprises a display module.
According to the chip on film, the heat dissipation sticker is arranged on the surface of the chip, which faces away from the substrate, at least two positioning points are arranged on the mounting surface of the substrate, and the positioning points are positioned outside the projection range of the heat dissipation sticker on the substrate; therefore, the heat dissipation effect of the chip can be improved through the heat dissipation paste, and in addition, when the chip on film is cut by using the cutting equipment, the positioning points on the mounting surface can be used as the positioning detection points of the cutting equipment, so that the cutting of the chip on film is realized. That is, the technical scheme of this application provides a can promote the radiating effect, and can not influence the cover brilliant film of cutting.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a flip chip on film according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of an embodiment of a chip on film of the present application;
FIG. 3 is a cross-sectional view of another embodiment of the chip on film of the present application;
fig. 4 is a cross-sectional view of another embodiment of the chip on film of the present application.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Chip on |
1112 | |
| 10 | |
1113 | |
| 11 | |
20 | Chip and method for manufacturing the same |
| 111 | |
30 | |
| 1111 | Raised part |
The implementation, functional features and advantages of the objectives of the present application will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are referred to in the embodiments of the present application, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
The present application provides a chip on film 100, and aims to provide a chip on film 100 that can improve the heat dissipation effect without affecting the dicing.
The specific structure of the flip chip film 100 of the present application will be described below, and the flip chip film 100 is taken as an example of a horizontal position:
referring to fig. 1 and fig. 2 in combination, in an embodiment of the chip on film 100 of the present application, the chip on film 100 includes a substrate 10, a chip 20 and a heat sink 30, wherein the substrate 10 has a mounting surface 11, the mounting surface 11 is provided with at least two positioning points 111, and at least two positioning points 111 are arranged at intervals; the chip 20 is arranged on the mounting surface 11, and the chip 20 and the positioning point 111 are arranged at intervals; the heat dissipation patch 30 is attached to a surface of the chip 20 facing away from the substrate 10, and the positioning point 111 is located outside a projection range of the heat dissipation patch 30 on the substrate 10.
It can be understood that, in the chip on film 100 of the present application, the heat dissipation patch 30 is attached to the surface of the chip 20 facing away from the substrate 10, and at least two positioning points 111 are disposed on the mounting surface 11 of the substrate 10, and the positioning points 111 are located outside the projection range of the heat dissipation patch 30 on the substrate 10; therefore, the heat dissipation effect of the chip 20 can be enhanced by the heat dissipation patch 30, and in addition, when the dicing device is used to dice the chip on film 100, the positioning points 111 on the mounting surface 11 can be used as the positioning detection points of the dicing device to achieve the dicing of the chip on film 100. That is, the technical solution of the present application provides a flip chip film 100 that can improve the heat dissipation effect and does not affect the dicing.
In this embodiment, in the working process, the heat source chip 20 in the chip on film 100 generates a large amount of heat, which is accompanied with the temperature rise of the chip on film 100, because the substrate 10 usually adopted is a Polyimide (PI) substrate, which is an insulating material that is not easy to dissipate heat and can prevent the heat from dissipating, the heat dissipation patch 30 is attached to the back surface of the substrate 10 at present, that is, when the substrate 10 is attached to the surface opposite to the chip 20, most of the heat generated by the chip 20 is conducted to the substrate 10 and then conducted to the heat dissipation patch 30 for heat dissipation, but the heat dissipation effect of the substrate 10 is poor, and most of the heat is difficult to be conducted to the heat dissipation patch 30 for heat dissipation, so that the heat dissipation efficiency is greatly reduced; and this application pastes 30 through pasting the surface of pasting chip 20 back to base plate 10, pastes the front at chip 20 promptly, and the heat that chip 20 produced can directly conduct to heat dissipation and paste 30 department, and each surface through heat dissipation pastes 30 is with the heat fast going to promote the radiating effect to chip 20.
Specifically, at least two positioning points 111 are located at the periphery of the chip 20 and at the periphery of the projection of the heat sink 30 on the substrate 10, so as to prevent the chip 20 and the heat sink from blocking the positioning points 111, so that the cutting device uses the positioning points 111 as positioning detection points during the cutting process, thereby completing the precise cutting.
In practical application, the heat dissipation patch 30 may be made of one or more of nano-carbon, graphene, silver, copper, aluminum, steel, and other heat dissipation materials.
Referring to fig. 2, in an embodiment of the chip on film 100 of the present application, the chip 20 and the heat dissipation paste 30 are disposed opposite to each other, and a projection area of the heat dissipation paste 30 on the substrate 10 is larger than a projection area of the chip 20 on the substrate 10.
It can be understood that, by disposing the chip 20 and the heat dissipation paste 30 opposite to each other and ensuring that the projection area of the heat dissipation paste 30 on the substrate 10 is larger than the projection area of the chip 20 on the substrate 10, the contact area between the chip 20 and the heat dissipation paste 30 is increased, so that the heat generated by the chip 20 can be sufficiently conducted to the heat dissipation paste 30 for heat dissipation, thereby further increasing the heat dissipation effect on the chip 20.
Further, referring to fig. 2, in an embodiment of the chip on film 100 of the present application, a projection of the chip 20 on the substrate 10 falls within a projection of the heat sink 30 on the substrate 10.
It can be understood that, by making the projection of the chip 20 on the substrate 10 fall into the projection of the heat dissipation paste 30 on the substrate 10, that is, ensuring that the heat dissipation paste 30 completely covers the front surface of the chip 20, the contact area between the chip 20 and the heat dissipation paste 30 is further increased, so that the heat generated by the chip 20 can be sufficiently conducted to the heat dissipation paste 30 for heat dissipation treatment, so as to further increase the heat dissipation effect on the chip 20.
Specifically, the chip 20 and the heat dissipation patch 30 are each substantially rectangular parallelepiped in shape.
Referring to fig. 1, in an embodiment of the chip on film 100 of the present application, at least two positioning points 111 are disposed at intervals along a circumferential direction of the chip 20.
It is understood that, by disposing at least two positioning points 111 at intervals along the circumferential direction of the chip 20, for example, when there are two positioning points 111, the two positioning points 111 may be respectively located at two opposite sides of the chip 20, and may also be respectively located at the outer sides of the opposite corners of the chip 20, that is, disposed along the diagonal of the chip 20; when the positioning points 111 are four, the four positioning points 111 may be respectively located outside the four sides of the chip 20, or respectively located outside the four corners of the chip 20, and so on. The above arrangement is convenient for the dicing device to find the corresponding positioning point 111 smoothly, and also can ensure the aesthetic degree of the flip chip film 100.
Referring to fig. 2, in an embodiment of the chip on film 100 of the present application, the mounting surface 11 is convexly provided with a protrusion 1111, and the protrusion 1111 is the positioning point 111.
It is understood that, in the production process, by providing at least two protrusions 1111 on the mounting surface 11 of the substrate 10, the protrusions 1111 can be used as the positioning points 111, and the cutting device can directly use the protrusions 1111 as the positioning detection points to complete the precise cutting.
Specifically, the convex portion 1111 may be formed by forming a copper exposure spot by means of dropping on the mounting surface 11 of the substrate 10.
Referring to fig. 3, in another embodiment of the chip on film 100 of the present application, the mounting surface 11 is formed with openings 1112, and the openings 1112 are the positioning points 111.
It can be understood that, in the production process, at least two openings 1112 penetrating to the surface opposite to the mounting surface 11 of the substrate 10 are formed on the mounting surface, so that the openings 1112 are used as the positioning points 111, and the cutting equipment can directly use the openings 1112 as the positioning detection points to complete the precise cutting.
Referring to fig. 4, in another embodiment of the chip on film 100 of the present application, the mounting surface 11 is provided with a coating 1113, and the coating 1113 is the positioning point 111.
It is understood that, during the production process, the cutting device can directly use the coating 1113 as the positioning detection point by providing at least two coatings 1113 on the mounting surface 11 of the substrate 10 to use the coatings 1113 as the positioning points 111, so as to complete the precise cutting.
Specifically, the coating layer 1113 may be formed by forming ink dots on the mounting surface 11 of the substrate 10 by coating or printing.
Referring to fig. 2 to fig. 4, in an embodiment of the chip on film 100 of the present application, the cross-sectional shape of the positioning point 111 is circular; or, the cross section of the positioning point 111 is rectangular; alternatively, the cross-sectional shape of the positioning point 111 is a polygon. The shape of the positioning point 111 can be set according to the actual use situation, for example, the cross-sectional area of the positioning point 111 can be set to be circular, rectangular, polygonal, cross-shaped, frame-shaped, and so on.
It should be noted that, in the present embodiment, the size, number, position and shape of the positioning points 111 can be set according to the actual use situation, and it should be understood that, since different lines are disposed on some substrates 10, the positioning points 111 need to be set avoiding the lines, which requires setting the specific size, number, position and shape of the positioning points 111 according to the actual situation.
The present application further provides a display module, which includes a display panel and the above-mentioned flip-chip film 100, and the specific structure of the flip-chip film 100 is described in detail in the foregoing embodiments. Since the display module employs all the technical solutions of the foregoing embodiments, at least all the beneficial effects brought by all the technical solutions of the foregoing embodiments are achieved, and are not described in detail herein. The plurality of flip chips 100 are disposed, and the plurality of flip chips 100 are disposed on the display panel at intervals.
The present application further provides a display device, which includes the display module described above, and the specific structure of the display module is detailed in the foregoing embodiments. Since the display device adopts all the technical solutions of the foregoing embodiments, at least all the beneficial effects brought by all the technical solutions of the foregoing embodiments are achieved, and no further description is given here.
The above description is only an alternative embodiment of the present application, and not intended to limit the scope of the present application, and all modifications and equivalents of the technical solutions that can be directly or indirectly applied to other related fields without departing from the spirit of the present application are intended to be included in the scope of the present application.
Claims (10)
1. A chip on film, comprising:
the positioning device comprises a substrate, a positioning mechanism and a positioning mechanism, wherein the substrate is provided with a mounting surface, the mounting surface is provided with at least two positioning points, and the at least two positioning points are arranged at intervals;
the chip is arranged on the mounting surface, and the chip and the positioning point are arranged at intervals; and
the heat dissipation paste is arranged on the surface, back to the substrate, of the chip, and the positioning points are located outside the projection range of the heat dissipation paste on the substrate.
2. The chip on film of claim 1, wherein the chip is disposed opposite to the heat dissipation patch, and a projected area of the heat dissipation patch on the substrate is larger than a projected area of the chip on the substrate.
3. The chip on film of claim 2, wherein a projection of the chip onto the substrate falls within a projection of the heat sink onto the substrate.
4. The chip on film of claim 1, wherein at least two of the anchor points are spaced apart along the circumference of the chip.
5. The chip on film as claimed in claim 1, wherein the mounting surface is convexly provided with a protrusion, and the protrusion is the positioning point.
6. The chip on film as claimed in claim 1, wherein the mounting surface has an opening, and the opening is the positioning point.
7. The chip on film of claim 1, wherein the mounting surface is provided with a coating, the coating being the anchor point.
8. The chip on film of any one of claims 1 to 7, wherein the cross-sectional shape of the anchor point is circular;
or the cross section of the positioning point is rectangular;
or the cross section of the positioning point is polygonal.
9. A display module, comprising a display panel and a plurality of flip-chip films according to any one of claims 1 to 8, wherein the plurality of flip-chip films are disposed on the display panel at intervals.
10. A display device comprising the display module according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120441768.8U CN214625022U (en) | 2021-03-01 | 2021-03-01 | Chip on film, display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120441768.8U CN214625022U (en) | 2021-03-01 | 2021-03-01 | Chip on film, display module and display device |
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| Publication Number | Publication Date |
|---|---|
| CN214625022U true CN214625022U (en) | 2021-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120441768.8U Active CN214625022U (en) | 2021-03-01 | 2021-03-01 | Chip on film, display module and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114613266A (en) * | 2022-03-07 | 2022-06-10 | 深圳市华星光电半导体显示技术有限公司 | Display module and display device |
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2021
- 2021-03-01 CN CN202120441768.8U patent/CN214625022U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114613266A (en) * | 2022-03-07 | 2022-06-10 | 深圳市华星光电半导体显示技术有限公司 | Display module and display device |
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