TWI776768B - Heat dissipating sheet and chip on film package structure - Google Patents

Heat dissipating sheet and chip on film package structure Download PDF

Info

Publication number
TWI776768B
TWI776768B TW111101259A TW111101259A TWI776768B TW I776768 B TWI776768 B TW I776768B TW 111101259 A TW111101259 A TW 111101259A TW 111101259 A TW111101259 A TW 111101259A TW I776768 B TWI776768 B TW I776768B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
metal layer
chip
layer
adhesive layer
Prior art date
Application number
TW111101259A
Other languages
Chinese (zh)
Other versions
TW202329359A (en
Inventor
潘佩宜
Original Assignee
南茂科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南茂科技股份有限公司 filed Critical 南茂科技股份有限公司
Priority to TW111101259A priority Critical patent/TWI776768B/en
Priority to CN202210286350.3A priority patent/CN116463066A/en
Application granted granted Critical
Publication of TWI776768B publication Critical patent/TWI776768B/en
Publication of TW202329359A publication Critical patent/TW202329359A/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer

Abstract

A heat dissipating sheet and a chip on film package structure are provided. The heat dissipating sheet includes an insulating protective layer, a heat dissipating metal layer, a first adhesive layer and a second adhesive layer. The heat dissipating metal layer has a first side and a second side opposite to each other. The second side has a plurality of indentations, and the plurality of indentations is located on at least an edge of the second side. The first adhesive layer is disposed between the insulating protective layer and the first side of the heat dissipating metal layer. The heat dissipating metal layer is attached to the insulating protective layer by the first adhesive layer. The second adhesive layer is disposed on the second side of the heat dissipating metal layer.

Description

散熱貼片及薄膜覆晶封裝結構Thermal patch and thin film flip chip package structure

本發明是有關於一種貼片以及封裝結構,且特別是有關於一種散熱貼片以及採用此散熱貼片的薄膜覆晶封裝結構。The present invention relates to a patch and a package structure, and particularly to a heat dissipation patch and a film-on-chip packaging structure using the heat dissipation patch.

現行的薄膜覆晶封裝(Chip on Film,COF)為增進散熱效果,會貼附具可撓性的薄型散熱貼片於封裝結構的表面上,特別是針對發熱源(例如晶片)所在位置。一般而言,當貼附有散熱貼片的薄膜覆晶封裝結構判定為不良品時,為了避免對不良品進行衝切製程(punch process)時散熱貼片的黏膠殘留於刀具而造成刀具損耗,一般需先將散熱貼片撕除,再進行衝切。然而,由於現行的散熱貼片為可撓薄層結構且其貼附表面為平整面,因此散熱貼片通常會服貼於薄膜覆晶封裝結構上,造成撕除不易且耗時。In the current chip on film (COF) package, in order to improve the heat dissipation effect, a flexible thin heat dissipation patch is attached to the surface of the package structure, especially where the heat source (such as a chip) is located. Generally speaking, when the chip-on-film packaging structure with the heat dissipation chip attached is judged to be a defective product, in order to avoid the adhesive of the heat dissipation chip remaining on the tool during the punching process of the defective product, the tool loss will be caused , Generally, the heat dissipation patch needs to be torn off first, and then punched. However, since the current heat dissipation patch is a flexible thin layer structure and its attaching surface is a flat surface, the heat dissipation patch is usually adhered to the film-on-chip package structure, which is difficult and time-consuming to remove.

本發明提供一種散熱貼片,其可提升使用者撕除時的便利性,且可有效縮短作業時間。The present invention provides a heat-dissipating patch, which can improve the convenience of tearing off by a user, and can effectively shorten the operation time.

本發明提供一種薄膜覆晶封裝結構,包括上述的散熱貼片,可提升使用者撕除散熱貼片時的便利性,以有效縮短作業時間。The present invention provides a film-on-chip packaging structure, including the above-mentioned heat dissipation patch, which can improve the convenience of a user when removing the heat dissipation patch, thereby effectively shortening the operation time.

本發明的散熱貼片,其包括絕緣保護層、散熱金屬層、第一膠層以及第二膠層。散熱金屬層具有彼此相對的第一側面與第二側面。第二側面上具有多個凹紋,且凹紋位於第二側面的至少一邊緣處。第一膠層設置於絕緣保護層與散熱金屬層的第一側面之間。散熱金屬層透過第一膠層貼附於絕緣保護層上。第二膠層設置於散熱金屬層的第二側面上。The heat dissipation patch of the present invention includes an insulating protective layer, a heat dissipation metal layer, a first adhesive layer and a second adhesive layer. The heat dissipation metal layer has a first side surface and a second side surface opposite to each other. The second side surface has a plurality of concave grooves, and the concave grooves are located at at least one edge of the second side surface. The first adhesive layer is disposed between the insulating protection layer and the first side surface of the heat dissipation metal layer. The heat dissipation metal layer is attached to the insulating protection layer through the first adhesive layer. The second adhesive layer is disposed on the second side surface of the heat dissipation metal layer.

在本發明的一實施例中,上述的凹紋的深度小於散熱金屬層的厚度的1/2。In an embodiment of the present invention, the depth of the above-mentioned concave grooves is less than 1/2 of the thickness of the heat dissipation metal layer.

在本發明的一實施例中,上述的凹紋所佔面積小於散熱金屬層的總面積的1/3。In an embodiment of the present invention, the area occupied by the concave grooves is less than 1/3 of the total area of the heat dissipation metal layer.

在本發明的一實施例中,上述的第二膠層暴露出凹紋。In an embodiment of the present invention, the above-mentioned second adhesive layer exposes indentations.

在本發明的一實施例中,上述的凹紋位於散熱金屬層的第二側面相連的二個邊緣處。In an embodiment of the present invention, the above-mentioned concave grooves are located at two edges connected to the second side surface of the heat dissipation metal layer.

本發明的薄膜覆晶封裝結構,其包括可撓性線路載板、晶片以及散熱貼片。可撓性線路載板具有相對的第一表面與第二表面以及定義於第一表面的晶片設置區。晶片配置於晶片設置區內並與可撓性線路載板電性連接。散熱貼片配置於可撓性線路載板的第一表面或第二表面上並對應晶片設置區。散熱貼片包括絕緣保護層、散熱金屬層、第一膠層以及第二膠層。散熱金屬層具有彼此相對的第一側面與第二側面。第二側面上具有多個凹紋,且凹紋位於第二側面的至少一邊緣處。第一膠層設置於絕緣保護層與散熱金屬層的第一側面之間。散熱金屬層透過第一膠層貼附於絕緣保護層上。第二膠層設置於散熱金屬層的第二側面上。散熱貼片透過第二膠層貼附於可撓性線路載板的第一表面與晶片上或可撓性線路載板的第二表面上。The film-on-chip package structure of the present invention includes a flexible circuit carrier board, a chip and a heat dissipation patch. The flexible circuit carrier has a first surface and a second surface opposite to each other and a chip setting area defined on the first surface. The chip is arranged in the chip setting area and is electrically connected with the flexible circuit carrier board. The heat dissipation patch is disposed on the first surface or the second surface of the flexible circuit carrier and corresponds to the chip setting area. The heat dissipation patch includes an insulating protection layer, a heat dissipation metal layer, a first adhesive layer and a second adhesive layer. The heat dissipation metal layer has a first side surface and a second side surface opposite to each other. The second side surface has a plurality of concave grooves, and the concave grooves are located at at least one edge of the second side surface. The first adhesive layer is disposed between the insulating protection layer and the first side surface of the heat dissipation metal layer. The heat dissipation metal layer is attached to the insulating protection layer through the first adhesive layer. The second adhesive layer is disposed on the second side surface of the heat dissipation metal layer. The heat dissipation patch is attached to the first surface of the flexible circuit carrier and the chip or the second surface of the flexible circuit carrier through the second adhesive layer.

在本發明的一實施例中,上述的凹紋的深度小於散熱金屬層的厚度的1/2。In an embodiment of the present invention, the depth of the above-mentioned concave grooves is less than 1/2 of the thickness of the heat dissipation metal layer.

在本發明的一實施例中,上述的凹紋所佔面積小於散熱金屬層的總面積的1/3。In an embodiment of the present invention, the area occupied by the concave grooves is less than 1/3 of the total area of the heat dissipation metal layer.

在本發明的一實施例中,上述的第二膠層暴露出凹紋。In an embodiment of the present invention, the above-mentioned second adhesive layer exposes indentations.

在本發明的一實施例中,上述的凹紋位於散熱金屬層的第二側面相連的二個邊緣處。In an embodiment of the present invention, the above-mentioned concave grooves are located at two edges connected to the second side surface of the heat dissipation metal layer.

基於上述,由於凹紋是位於散熱金屬層的第二側面的至少一邊緣處,因而使得本發明的散熱貼片在邊緣處形成具高低差的粗糙表面,藉此,在衝切不良品的薄膜覆晶封裝結構前進行撕除散熱貼片的步驟中,可提升使用者撕除的便利性,以有效縮短作業時間。此外,本發明採用此散熱貼片的薄膜覆晶封裝結構,則可有效地提升生產效率。Based on the above, since the indentations are located at at least one edge of the second side surface of the heat-dissipating metal layer, the heat-dissipating patch of the present invention forms a rough surface with a height difference at the edge, thereby, the film of the defective product can be punched In the step of peeling off the heat dissipation patch before the flip chip package structure, the convenience for the user to peel off can be improved, and the operation time can be effectively shortened. In addition, the present invention adopts the film-on-chip packaging structure of the heat dissipation patch, which can effectively improve the production efficiency.

為了讓本發明的上述特徵及優點能夠更明顯易懂,下文特舉實施例,並配合所附圖式詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

參照本實施例之圖式以更全面地闡述本發明。然而,本發明亦可以各種不同的形式體現,而不應限於本文中所述之實施例。圖式中的層或區域的厚度、尺寸或大小會為了清楚起見而放大。The present invention is more fully described with reference to the drawings of this embodiment. However, the present invention may be embodied in various forms and should not be limited to the embodiments described herein. The thickness, size or size of layers or regions in the drawings may be exaggerated for clarity.

應說明的是,下述圖式的薄膜覆晶封裝結構係以捲帶傳輸的方式作業,儘管下述圖式的散熱貼片僅示意地繪示應用於形成薄膜覆晶封裝結構的捲帶上的一個元件區(device area),然而,本發明不限於此,下述圖式的散熱貼片可以同時應用於捲帶上的多個元件區。It should be noted that the chip-on-film packaging structure in the following figures is operated in a tape-and-reel mode, although the heat sink in the figures below is only schematically shown applied to the tape and tape forming the chip-on-film packaging structure. However, the present invention is not limited to this, and the heat dissipation patches of the following figures can be applied to a plurality of device areas on the tape at the same time.

圖1是依照本發明的一實施例的一種散熱貼片的透視示意圖。圖2A是沿圖1的A-A’線剖面的散熱貼片的一實施例的剖面示意圖。圖2B是沿圖1的A-A’線剖面的散熱貼片的另一實施例的剖面示意圖。為了清楚示意,圖1省略繪示部分構件(如第一膠層130及第二膠層140),僅示意地繪示絕緣保護層110、散熱金屬層120及多個凹紋124。FIG. 1 is a schematic perspective view of a heat dissipation patch according to an embodiment of the present invention. FIG. 2A is a schematic cross-sectional view of an embodiment of a heat dissipation patch taken along the line A-A' of FIG. 1 . Fig. 2B is a schematic cross-sectional view of another embodiment of the heat dissipation patch taken along the line A-A' of Fig. 1 . For the sake of clarity, FIG. 1 omits to illustrate some components (eg, the first adhesive layer 130 and the second adhesive layer 140 ), and only schematically illustrates the insulating protection layer 110 , the heat-dissipating metal layer 120 and the plurality of indentations 124 .

請同時參考圖1及圖2A,在本實施例中,散熱貼片100包括絕緣保護層110、散熱金屬層120、第一膠層130以及第二膠層140。絕緣保護層110的材料例如是聚醯亞胺(polyimide,PI)等可撓性材料,用以保護散熱金屬層120,以避免散熱金屬層120刮傷受損。散熱金屬層120具有彼此相對的第一側面121與第二側面122,其中散熱金屬層120的材料可包括金屬箔或石墨類薄膜,而金屬箔例如是鋁箔或銅箔,但本發明不以此為限。第一膠層130設置於絕緣保護層110與散熱金屬層120的第一側面121之間,且散熱金屬層120透過第一膠層130貼附於絕緣保護層110上。第二膠層140設置於散熱金屬層120的第二側面122上,有助於後續將散熱金屬層120貼附於發熱元件(如薄膜覆晶封裝結構)上。Please refer to FIG. 1 and FIG. 2A simultaneously. In this embodiment, the heat dissipation patch 100 includes an insulating protection layer 110 , a heat dissipation metal layer 120 , a first adhesive layer 130 and a second adhesive layer 140 . The material of the insulating protection layer 110 is, for example, a flexible material such as polyimide (PI), which is used to protect the heat dissipation metal layer 120 to prevent the heat dissipation metal layer 120 from being scratched and damaged. The heat-dissipating metal layer 120 has a first side 121 and a second side 122 opposite to each other, wherein the material of the heat-dissipating metal layer 120 may include metal foil or graphite thin film, and the metal foil is, for example, aluminum foil or copper foil, but the present invention does not use this limited. The first adhesive layer 130 is disposed between the insulating protection layer 110 and the first side surface 121 of the heat dissipation metal layer 120 , and the heat dissipation metal layer 120 is attached to the insulating protection layer 110 through the first adhesive layer 130 . The second adhesive layer 140 is disposed on the second side surface 122 of the heat-dissipating metal layer 120 , which facilitates the subsequent attachment of the heat-dissipating metal layer 120 to the heating element (eg, a chip-on-film package).

特別是,在本實施例中,散熱金屬層120的第二側面122上具有多個凹紋124,且這些凹紋124位於第二側面122的至少一邊緣123處。舉例來說,在本實施例中,這些凹紋124可位於散熱金屬層120的第二側面122相連的二個邊緣123a、123b處,但本發明不以此為限。凹紋124可例如是立體壓紋,但不以此為限,只要能形成非平整表面的圖案,皆屬於本發明所欲保護的範圍。In particular, in this embodiment, the second side surface 122 of the heat dissipation metal layer 120 has a plurality of concave grooves 124 , and the concave grooves 124 are located at at least one edge 123 of the second side surface 122 . For example, in this embodiment, the concave grooves 124 may be located at the two edges 123 a and 123 b connected to the second side surface 122 of the heat dissipation metal layer 120 , but the invention is not limited thereto. The indentations 124 may be, for example, three-dimensional embossing, but not limited thereto, as long as a pattern with a non-flat surface can be formed, it falls within the scope of the present invention.

應理解的是,本實施例僅示例性地繪示位於散熱金屬層120的第二側面122相連的二個邊緣123a、123b處的凹紋124,但並非用以限定本發明。於其他未繪示的實施例中,這些凹紋124可依實際需求設置於散熱金屬層120的第二側面122上任何一個或多個的邊緣處。It should be understood that the present embodiment merely illustrates the concave grooves 124 located at the two edges 123 a and 123 b connected to the second side surface 122 of the heat dissipation metal layer 120 , but is not intended to limit the present invention. In other not-shown embodiments, the concave grooves 124 may be disposed at any one or more edges of the second side surface 122 of the heat dissipation metal layer 120 according to actual requirements.

在一實施例中,散熱金屬層120具有一厚度T1,而位於散熱金屬層120的第二側面122上的這些凹紋124具有一深度T2。較佳地,這些凹紋124的深度T2例如是小於散熱金屬層120的厚度T1的1/2,但本發明不以此為限。在其他實施例中,這些凹紋124的深度T2亦可依實際需求調整。此處,散熱金屬層120的厚度T1例如是25微米或50微米,但不以此為限。In one embodiment, the heat dissipation metal layer 120 has a thickness T1, and the grooves 124 on the second side surface 122 of the heat dissipation metal layer 120 have a depth T2. Preferably, the depth T2 of these concave grooves 124 is, for example, less than 1/2 of the thickness T1 of the heat dissipation metal layer 120 , but the invention is not limited to this. In other embodiments, the depth T2 of the grooves 124 can also be adjusted according to actual needs. Here, the thickness T1 of the heat dissipation metal layer 120 is, for example, 25 microns or 50 microns, but not limited thereto.

在一實施例中,位於散熱金屬層120的第二側面122上的這些凹紋124所佔的面積例如是小於散熱金屬層120的總面積的1/3,但本發明不以此為限。在其他實施例中,這些凹紋124所佔的面積大小可依實際需求調整,以利於使用者撕除散熱貼片100。In one embodiment, the area occupied by the concave grooves 124 on the second side surface 122 of the heat dissipation metal layer 120 is, for example, less than 1/3 of the total area of the heat dissipation metal layer 120 , but the invention is not limited thereto. In other embodiments, the size of the area occupied by the concave grooves 124 can be adjusted according to actual needs, so as to facilitate the user to remove the heat dissipation patch 100 .

此外,結合圖1及圖2A所示,在本實施例中,設置於散熱金屬層120的第二側面122上的第二膠層140可覆蓋散熱金屬層120的第二側面122的大部分但暴露出這些凹紋124,使得第二膠層140的側壁大部分與散熱金屬層120的邊緣切齊,但其中的一個側壁140s則位在這些凹紋124的區域之外。也就是說,這些凹紋124並未被第二膠層140覆蓋,因而使得在這些凹紋124處的粗糙表面被暴露出,但本發明不以此為限。在其他實施例中,第二膠層140亦可不暴露出這些凹紋124。舉例而言,請參考圖2B,第二膠層140的側壁與散熱金屬層120的邊緣完全切齊,也就是說,第二膠層140完整覆蓋散熱金屬層120的第二側面122。此外,第二膠層140在這些凹紋124處可與散熱金屬層120呈共形設置,因而使得第二膠層140的表面142也具有與這些凹紋124相似的非平整表面。In addition, as shown in FIG. 1 and FIG. 2A , in this embodiment, the second adhesive layer 140 disposed on the second side surface 122 of the heat dissipation metal layer 120 can cover most of the second side surface 122 of the heat dissipation metal layer 120 but The dimples 124 are exposed, so that most of the sidewalls of the second adhesive layer 140 are flush with the edge of the heat dissipation metal layer 120 , but one of the sidewalls 140s is located outside the regions of the dimples 124 . That is to say, the concave grooves 124 are not covered by the second adhesive layer 140, so that the rough surfaces at the concave grooves 124 are exposed, but the invention is not limited thereto. In other embodiments, the dimples 124 may not be exposed by the second adhesive layer 140 . For example, referring to FIG. 2B , the sidewall of the second adhesive layer 140 is completely aligned with the edge of the heat dissipation metal layer 120 , that is, the second adhesive layer 140 completely covers the second side surface 122 of the heat dissipation metal layer 120 . In addition, the second adhesive layer 140 can be conformally disposed with the heat dissipation metal layer 120 at the concave grooves 124 , so that the surface 142 of the second adhesive layer 140 also has a non-flat surface similar to the concave grooves 124 .

在一實施例中,第一膠層130的尺寸可大致等於散熱金屬層120的尺寸並位於散熱金屬層120的範圍,以使散熱金屬層120與絕緣保護層110之間達到最大貼合面積,可提升兩者間的接合效果。第一膠層130的厚度T3小於第二膠層140的厚度T4,其中第一膠層130的厚度T3例如是20微米,而第二膠層140的厚度T4例如是60微米,但不以此為限。In one embodiment, the size of the first adhesive layer 130 may be approximately equal to the size of the heat-dissipating metal layer 120 and located within the range of the heat-dissipating metal layer 120, so that the maximum bonding area between the heat-dissipating metal layer 120 and the insulating protection layer 110 is achieved, It can improve the bonding effect between the two. The thickness T3 of the first adhesive layer 130 is smaller than the thickness T4 of the second adhesive layer 140, wherein the thickness T3 of the first adhesive layer 130 is, for example, 20 microns, and the thickness T4 of the second adhesive layer 140 is, for example, 60 microns, but not the same limited.

在一實施例中,絕緣保護層110的尺寸大於散熱金屬層120的尺寸,且絕緣保護層110完全覆蓋散熱金屬層120,以確實保護散熱金屬層120,但本發明不限於此。In one embodiment, the size of the insulating protection layer 110 is larger than that of the heat dissipation metal layer 120 , and the insulating protection layer 110 completely covers the heat dissipation metal layer 120 to protect the heat dissipation metal layer 120 , but the invention is not limited thereto.

圖3是依照本發明的另一實施例的一種散熱貼片的透視示意圖。圖4A是沿圖3的B-B’線剖面的散熱貼片的一實施例的剖面示意圖。圖4B是沿圖3的B-B’線剖面的散熱貼片的另一實施例的剖面示意圖。圖3的透視示意圖大致相似於圖1的透視示意圖,因此兩實施例中所記載的相同構件可參照前述內容,而兩實施例中相同的配置,在此不再贅述。3 is a schematic perspective view of a heat dissipation patch according to another embodiment of the present invention. FIG. 4A is a schematic cross-sectional view of an embodiment of a heat dissipation patch taken along the line B-B' of FIG. 3 . FIG. 4B is a schematic cross-sectional view of another embodiment of the heat dissipation patch taken along the line B-B' of FIG. 3 . The perspective schematic diagram of FIG. 3 is substantially similar to the perspective schematic diagram of FIG. 1 , so the same components described in the two embodiments may refer to the foregoing content, and the same configurations in the two embodiments will not be repeated here.

請同時參考圖3及圖4A,在本實施例的散熱貼片100’中,散熱金屬層120的第二側面122上具有多個凹紋124’,且這些凹紋124’位於第二側面122的其中一個邊緣123a處。舉例來說,如圖3所示,這些凹紋124’可位於散熱金屬層120的第二側面122的一個短邊的中央處,但本發明不以此為限,在其他未繪示的實施例中,這些凹紋124’可依實際需求設置於任一個邊緣的任意處。此外,於其他未繪示的實施例中,這些凹紋124’亦可依實際需求設置於散熱金屬層120的第二側面122上多個邊緣的任意處。Referring to FIG. 3 and FIG. 4A at the same time, in the heat dissipation patch 100 ′ of the present embodiment, the second side surface 122 of the heat dissipation metal layer 120 has a plurality of concave grooves 124 ′, and the concave grooves 124 ′ are located on the second side surface 122 at one of the edges 123a. For example, as shown in FIG. 3 , the concave grooves 124 ′ may be located at the center of a short side of the second side surface 122 of the heat dissipation metal layer 120 , but the present invention is not limited to this, and other implementations not shown For example, these concave grooves 124 ′ can be arranged anywhere on any edge according to actual requirements. In addition, in other not-shown embodiments, the concave grooves 124' can also be disposed at any positions of the plurality of edges on the second side surface 122 of the heat dissipation metal layer 120 according to actual requirements.

請再參考圖4A,相似於圖2A的剖面示意圖,在本實施例中,設置於散熱金屬層120的第二側面122上的第二膠層140亦可覆蓋散熱金屬層120的第二側面122的大部分但暴露出這些凹紋124’。也就是說,這些凹紋124’並未被第二膠層140覆蓋。並且,結合圖3及圖4A所示,由於本實施例中這些凹紋124’位於第二側面122的一個邊緣123a處且第二膠層140暴露出這些凹紋124’,因此設置於散熱金屬層120的第二側面122上的第二膠層140的局部的側壁140s’可圍繞於這些凹紋124’之外以暴露出凹紋124’處的粗糙表面,但本發明不以此為限。在其他實施例中,第二膠層140亦可不暴露出這些凹紋124’。舉例而言,請參考圖4B,第二膠層140的側壁與散熱金屬層120的邊緣完全切齊,也就是說,第二膠層140完整覆蓋散熱金屬層120的第二側面122。此外,第二膠層140在這些凹紋124’處可與散熱金屬層120呈共形設置,因而使得第二膠層140的表面142’也具有與這些凹紋124’相似的非平整表面。Please refer to FIG. 4A again. Similar to the schematic cross-sectional view of FIG. 2A , in this embodiment, the second adhesive layer 140 disposed on the second side surface 122 of the heat dissipation metal layer 120 can also cover the second side surface 122 of the heat dissipation metal layer 120 most of the indentations 124' are exposed. That is, these concave grooves 124' are not covered by the second adhesive layer 140. 3 and FIG. 4A , since these concave grooves 124 ′ are located at one edge 123 a of the second side surface 122 in this embodiment and the second adhesive layer 140 exposes these concave grooves 124 ′, they are disposed on the heat dissipation metal The local sidewalls 140s' of the second adhesive layer 140 on the second side surface 122 of the layer 120 may surround the grooves 124' to expose the rough surface of the grooves 124', but the invention is not limited thereto . In other embodiments, the second adhesive layer 140 may not expose these concave grooves 124'. For example, referring to FIG. 4B , the sidewall of the second adhesive layer 140 is completely aligned with the edge of the heat dissipation metal layer 120 , that is, the second adhesive layer 140 completely covers the second side 122 of the heat dissipation metal layer 120 . In addition, the second adhesive layer 140 may be conformally disposed with the heat dissipation metal layer 120 at the concave grooves 124', so that the surface 142' of the second adhesive layer 140 also has a non-flat surface similar to the concave grooves 124'.

由於散熱貼片100、100’分別具有位於散熱金屬層120的第二側面122上的至少一邊緣123處的這些凹紋124、124’,因而使得散熱貼片100、100’在邊緣處形成具高低差的粗糙表面,有利於使用者撕除時的便利性,可有效縮短作業時間。Since the heat dissipation patches 100 , 100 ′ respectively have these indentations 124 , 124 ′ located at at least one edge 123 on the second side surface 122 of the heat dissipation metal layer 120 , the heat dissipation patches 100 , 100 ′ are formed at the edges with The rough surface with different heights is beneficial to the convenience of the user when tearing off, which can effectively shorten the operation time.

在此必須說明的是,以下實施例沿用上述實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明,關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。It must be noted here that the following embodiments use the element numbers and parts of the above-mentioned embodiments, wherein the same or similar numbers are used to represent the same or similar elements, and the description of the same technical content is omitted, and the description of the omitted part is omitted. Reference may be made to the foregoing embodiments, and detailed descriptions in the following embodiments will not be repeated.

圖5是依照本發明的如圖1所示的實施例的一種薄膜覆晶封裝結構的俯視示意圖。圖6是圖5的薄膜覆晶封裝結構的剖面示意圖。為了清楚示意,圖5省略繪示部分構件,省略的部分可參考圖6的剖面示意圖加以理解。FIG. 5 is a schematic top view of a chip on film package structure according to the embodiment shown in FIG. 1 according to the present invention. FIG. 6 is a schematic cross-sectional view of the chip on film package structure of FIG. 5 . For the sake of clarity, some components are omitted in FIG. 5 , and the omitted parts can be understood with reference to the schematic cross-sectional view in FIG. 6 .

請同時參考圖1、圖5及圖6,本實施例的薄膜覆晶封裝結構10包括例如是上述的散熱貼片100、可撓性線路載板200以及晶片300。可撓性線路載板200具有相對的第一表面201與第二表面202以及定義於第一表面201的晶片設置區201a。晶片300可以是採用覆晶(flip-chip)的方式配置於晶片設置區201a內並與可撓性線路載板200電性連接。散熱貼片100配置於可撓性線路載板200的第一表面201上並對應晶片設置區201a,其中散熱貼片100可透過第二膠層140貼附於可撓性線路載板200的第一表面201且覆蓋晶片300。Please refer to FIG. 1 , FIG. 5 and FIG. 6 at the same time, the chip on film package structure 10 of the present embodiment includes, for example, the heat dissipation patch 100 , the flexible circuit carrier 200 and the chip 300 as described above. The flexible circuit carrier 200 has a first surface 201 and a second surface 202 opposite to each other, and a chip placement area 201 a defined on the first surface 201 . The chip 300 may be disposed in the chip setting area 201 a in a flip-chip manner and electrically connected to the flexible circuit carrier board 200 . The heat dissipation patch 100 is disposed on the first surface 201 of the flexible circuit carrier 200 and corresponds to the chip setting area 201 a, wherein the heat dissipation patch 100 can be attached to the first surface of the flexible circuit carrier 200 through the second adhesive layer 140 . A surface 201 covers the wafer 300 .

應說明的是,儘管在本實施例中散熱貼片100僅設置於第一表面201上,然而,本發明不限制散熱貼片100所貼附的表面,也不限制貼附的表面及其數量。只要散熱貼片100至少設置於第一表面201與第二表面202的其中之一上,皆屬於本發明的保護範圍。舉例來說,在其他實施例中,散熱貼片100 亦可以是僅設置於第二表面202或同時設置於第一表面201與第二表面202上。也就是說,於其他實施例中,散熱貼片100亦可配置於可撓性線路載板200的第二表面202上並對應晶片設置區201a,且散熱貼片100可透過第二膠層140貼附於可撓性線路載板200的第二表面202上;或者是,可以有兩個散熱貼片100,分別設置在可撓性線路載板200的第一表面201及第二表面202上,上述皆屬於本發明所欲保護的範圍。It should be noted that, although the heat dissipation patch 100 is only disposed on the first surface 201 in this embodiment, the present invention does not limit the surface to which the heat dissipation patch 100 is attached, nor does it limit the attached surface and the number thereof . As long as the heat dissipation patch 100 is disposed on at least one of the first surface 201 and the second surface 202 , it belongs to the protection scope of the present invention. For example, in other embodiments, the heat dissipation patch 100 may also be disposed only on the second surface 202 or on both the first surface 201 and the second surface 202 . That is, in other embodiments, the heat dissipation patch 100 can also be disposed on the second surface 202 of the flexible circuit carrier 200 and correspond to the chip setting area 201 a, and the heat dissipation patch 100 can pass through the second adhesive layer 140 attached to the second surface 202 of the flexible circuit carrier 200; or, there may be two heat dissipation patches 100, which are respectively disposed on the first surface 201 and the second surface 202 of the flexible circuit carrier 200 , the above all belong to the scope of protection of the present invention.

於此,可撓性線路載板200可包括可撓性基板210、多個引腳220以及防焊層230。可撓性基板210的材質例如是聚乙烯對苯二甲酸酯(polyethylene terephthalate,PET)、聚醯亞胺(polyimide,PI)、聚醚(polyethersulfone,PES)、碳酸脂(polycarbonate,PC)或其他適合的可撓性材料。可撓性基板210具有彼此相對的上表面211與下表面212,而引腳220設置於可撓性基板210的上表面211上。防焊層230設置於可撓性基板210的上表面211上,且位於晶片設置區201a外並局部覆蓋多個引腳220,以避免引腳220受損或因異物而橋接短路。多個引腳220被防焊層230裸露出的部分可用於與晶片300或外部元件電性連接。防焊層230的材料例如是綠漆,於此並不加以限制。Here, the flexible circuit carrier 200 may include a flexible substrate 210 , a plurality of pins 220 and a solder resist layer 230 . The material of the flexible substrate 210 is, for example, polyethylene terephthalate (PET), polyimide (PI), polyethersulfone (PES), carbonate (PC) or Other suitable flexible materials. The flexible substrate 210 has an upper surface 211 and a lower surface 212 opposite to each other, and the pins 220 are disposed on the upper surface 211 of the flexible substrate 210 . The solder mask layer 230 is disposed on the upper surface 211 of the flexible substrate 210 and is located outside the chip disposing area 201a and partially covers the plurality of pins 220 to prevent the pins 220 from being damaged or bridged and short-circuited by foreign objects. The exposed portions of the plurality of pins 220 by the solder mask layer 230 can be used for electrical connection with the chip 300 or external components. The material of the solder resist layer 230 is, for example, green paint, which is not limited herein.

在一實施例中,薄膜覆晶封裝結構10還包括填充膠層310,其中填充膠層310可填充於可撓性基板210與晶片300之間,以防止水氣或異物侵入造成電性接點損壞或電性異常。填充膠層310的材料例如是底部填充膠(underfill),但不以此為限。In one embodiment, the chip on film package structure 10 further includes an adhesive filler layer 310 , wherein the adhesive filler layer 310 can be filled between the flexible substrate 210 and the chip 300 to prevent the intrusion of moisture or foreign matter to cause electrical contacts damage or electrical abnormalities. The material of the filling layer 310 is, for example, underfill, but not limited thereto.

由於本實施例的薄膜覆晶封裝結構10包括散熱貼片100,且散熱貼片100具有位於散熱金屬層120的第二側面122上的至少一邊緣123處的這些凹紋124,可使散熱貼片100易於被撕除,進而可提升薄膜覆晶封裝結構10的生產效率。應理解的是,儘管僅示出包括散熱貼片100的薄膜覆晶封裝結構10的實施例,但並非用以限定本發明。於其他未繪示的實施例中,薄膜覆晶封裝結構也可包括前述的散熱貼片100’。Since the chip on film package structure 10 of the present embodiment includes the heat dissipation patch 100 , and the heat dissipation patch 100 has these indentations 124 on at least one edge 123 on the second side surface 122 of the heat dissipation metal layer 120 , the heat dissipation patch 100 can The sheet 100 can be easily torn off, thereby improving the production efficiency of the chip on film package structure 10 . It should be understood that although only an embodiment of the chip on film package structure 10 including the heat dissipation patch 100 is shown, it is not intended to limit the present invention. In other not-shown embodiments, the chip on film package structure may also include the aforementioned heat dissipation patch 100'.

綜上所述,由於凹紋是位於散熱金屬層的第二側面的至少一邊緣處,因而使得本發明的散熱貼片在邊緣處形成具高低差的粗糙表面,藉此,在衝切不良品的薄膜覆晶封裝結構前進行撕除散熱貼片的步驟中,可提升使用者撕除的便利性,以有效縮短作業時間。此外,本發明採用此散熱貼片的薄膜覆晶封裝結構,則可有效地提升生產效率。To sum up, since the concave grooves are located at at least one edge of the second side surface of the heat dissipation metal layer, the heat dissipation patch of the present invention forms a rough surface with a height difference at the edge, thereby preventing the punching of defective products. In the step of peeling off the heat dissipation patch before the thin film-on-chip package structure, the convenience of the user's peeling can be improved, and the operation time can be effectively shortened. In addition, the present invention adopts the film-on-chip packaging structure of the heat dissipation patch, which can effectively improve the production efficiency.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.

10:薄膜覆晶封裝結構 100、100’:散熱貼片 110:絕緣保護層 120:散熱金屬層 121:第一側面 122:第二側面 123、123a、123b:邊緣 124、124’:凹紋 130:第一膠層 140:第二膠層 140s、140s’:側壁 142、142’:表面 211:上表面 212:下表面 200:可撓性線路載板 201:第一表面 201a:晶片設置區 202:第二表面 210:可撓性基板 220:引腳 230:防焊層 300:晶片 310:填充膠層 T1、T3、T4:厚度 T2:深度10: Thin film flip chip packaging structure 100, 100': heat dissipation patch 110: Insulation protective layer 120: heat dissipation metal layer 121: The first side 122: Second side 123, 123a, 123b: Edge 124, 124': Indentation 130: The first adhesive layer 140: The second adhesive layer 140s, 140s’: sidewall 142, 142': surface 211: Upper surface 212: Lower Surface 200: Flexible circuit carrier board 201: First Surface 201a: Wafer setting area 202: Second Surface 210: Flexible Substrate 220: pin 230: Solder mask 300: Wafer 310: Filler layer T1, T3, T4: Thickness T2: Depth

圖1是依照本發明的一實施例的一種散熱貼片的透視示意圖。 圖2A是沿圖1的A-A’線剖面的散熱貼片的一實施例的剖面示意圖。 圖2B是沿圖1的A-A’線剖面的散熱貼片的另一實施例的剖面示意圖。 圖3是依照本發明的另一實施例的一種散熱貼片的透視示意圖。 圖4A是沿圖3的B-B’線剖面的散熱貼片的一實施例的剖面示意圖。 圖4B是沿圖3的B-B’線剖面的散熱貼片的另一實施例的剖面示意圖。 圖5是依照本發明的一實施例的一種薄膜覆晶封裝結構的俯視示意圖。 圖6是圖5的薄膜覆晶封裝結構的剖面示意圖。 FIG. 1 is a schematic perspective view of a heat dissipation patch according to an embodiment of the present invention. FIG. 2A is a schematic cross-sectional view of an embodiment of a heat dissipation patch taken along the line A-A' of FIG. 1 . Fig. 2B is a schematic cross-sectional view of another embodiment of the heat dissipation patch taken along the line A-A' of Fig. 1 . 3 is a schematic perspective view of a heat dissipation patch according to another embodiment of the present invention. FIG. 4A is a schematic cross-sectional view of an embodiment of a heat dissipation patch taken along the line B-B' of FIG. 3 . FIG. 4B is a schematic cross-sectional view of another embodiment of the heat dissipation patch taken along the line B-B' of FIG. 3 . FIG. 5 is a schematic top view of a chip on film package structure according to an embodiment of the present invention. FIG. 6 is a schematic cross-sectional view of the chip on film package structure of FIG. 5 .

100:散熱貼片 100: heat dissipation patch

110:絕緣保護層 110: Insulation protective layer

120:散熱金屬層 120: heat dissipation metal layer

123、123a、123b:邊緣 123, 123a, 123b: Edge

124:凹紋 124: Indentation

140s:側壁 140s: Sidewalls

Claims (10)

一種散熱貼片,包括: 一絕緣保護層; 一散熱金屬層,具有彼此相對的一第一側面與一第二側面,該第二側面上具有多個凹紋,該些凹紋位於該第二側面的至少一邊緣處; 一第一膠層,設置於該絕緣保護層與該散熱金屬層的該第一側面之間,該散熱金屬層透過該第一膠層貼附於該絕緣保護層上;以及 一第二膠層,設置於該散熱金屬層的該第二側面上。 A heat dissipation patch, comprising: an insulating protective layer; a heat-dissipating metal layer, which has a first side surface and a second side surface opposite to each other, the second side surface has a plurality of concave grooves, and the concave grooves are located at at least one edge of the second side surface; a first adhesive layer disposed between the insulating protective layer and the first side surface of the heat-dissipating metal layer, the heat-dissipating metal layer is attached to the insulating protective layer through the first adhesive layer; and A second adhesive layer is disposed on the second side surface of the heat dissipation metal layer. 如請求項1所述的散熱貼片,其中該些凹紋的深度小於該散熱金屬層的厚度的1/2。The heat dissipation patch according to claim 1, wherein the depth of the recesses is less than 1/2 of the thickness of the heat dissipation metal layer. 如請求項1所述的散熱貼片,其中該些凹紋所佔面積小於該散熱金屬層的總面積的1/3。The heat dissipation patch according to claim 1, wherein the area occupied by the concave grooves is less than 1/3 of the total area of the heat dissipation metal layer. 如請求項1所述的散熱貼片,其中該第二膠層暴露出該些凹紋。The heat dissipation patch according to claim 1, wherein the second adhesive layer exposes the indentations. 如請求項1所述的散熱貼片,其中該些凹紋位於該散熱金屬層的該第二側面相連的二個邊緣處。The heat dissipation patch of claim 1, wherein the concave grooves are located at two edges connected to the second side surface of the heat dissipation metal layer. 一種薄膜覆晶封裝結構,包括: 一可撓性線路載板,具有相對的一第一表面與一第二表面以及定義於該第一表面的一晶片設置區; 一晶片,配置於該晶片設置區內並與該可撓性線路載板電性連接;以及 一散熱貼片,配置於該可撓性線路載板的該第一表面或該第二表面上並對應該晶片設置區,該散熱貼片包括: 一絕緣保護層; 一散熱金屬層,具有彼此相對的一第一側面與一第二側面,該第二側面上具有多個凹紋,該些凹紋位於該第二側面的至少一邊緣處; 一第一膠層,設置於該絕緣保護層與該散熱金屬層的該第一側面之間,該散熱金屬層透過該第一膠層貼附於該絕緣保護層上;以及 一第二膠層,設置於該散熱金屬層的該第二側面上,其中該散熱貼片透過該第二膠層貼附於該可撓性線路載板的該第一表面與該晶片上或該可撓性線路載板的該第二表面上。 A film-on-chip packaging structure, comprising: a flexible circuit carrier having a first surface and a second surface opposite to each other and a chip setting area defined on the first surface; a chip, disposed in the chip setting area and electrically connected with the flexible circuit carrier; and A heat dissipation patch, disposed on the first surface or the second surface of the flexible circuit carrier and corresponding to the chip setting area, the heat dissipation patch includes: an insulating protective layer; a heat-dissipating metal layer, which has a first side surface and a second side surface opposite to each other, the second side surface has a plurality of concave grooves, and the concave grooves are located at at least one edge of the second side surface; a first adhesive layer disposed between the insulating protective layer and the first side surface of the heat-dissipating metal layer, the heat-dissipating metal layer is attached to the insulating protective layer through the first adhesive layer; and a second adhesive layer disposed on the second side of the heat dissipation metal layer, wherein the heat dissipation patch is attached to the first surface of the flexible circuit carrier and the chip or through the second adhesive layer on the second surface of the flexible circuit carrier. 如請求項6所述的薄膜覆晶封裝結構,其中該些凹紋的深度小於該散熱金屬層的厚度的1/2。The chip-on-film package structure of claim 6, wherein the depth of the recesses is less than 1/2 of the thickness of the heat dissipation metal layer. 如請求項6所述的薄膜覆晶封裝結構,其中該些凹紋所佔面積小於該散熱金屬層的總面積的1/3。The chip on film package structure of claim 6, wherein the area occupied by the concave grooves is less than 1/3 of the total area of the heat dissipation metal layer. 如請求項6所述的薄膜覆晶封裝結構,其中該第二膠層暴露出該些凹紋。The chip-on-film packaging structure of claim 6, wherein the second adhesive layer exposes the concavities. 如請求項6所述的薄膜覆晶封裝結構,其中該些凹紋位於該散熱金屬層的該第二側面相連的二個邊緣處。The chip on film package structure of claim 6, wherein the concave grooves are located at two edges connected to the second side surface of the heat dissipation metal layer.
TW111101259A 2022-01-12 2022-01-12 Heat dissipating sheet and chip on film package structure TWI776768B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW111101259A TWI776768B (en) 2022-01-12 2022-01-12 Heat dissipating sheet and chip on film package structure
CN202210286350.3A CN116463066A (en) 2022-01-12 2022-03-23 Heat dissipation patch and thin film flip chip package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111101259A TWI776768B (en) 2022-01-12 2022-01-12 Heat dissipating sheet and chip on film package structure

Publications (2)

Publication Number Publication Date
TWI776768B true TWI776768B (en) 2022-09-01
TW202329359A TW202329359A (en) 2023-07-16

Family

ID=84957902

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111101259A TWI776768B (en) 2022-01-12 2022-01-12 Heat dissipating sheet and chip on film package structure

Country Status (2)

Country Link
CN (1) CN116463066A (en)
TW (1) TWI776768B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110143625A1 (en) * 2007-07-20 2011-06-16 Choi Kyoung-Sei Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
US20190363051A1 (en) * 2018-05-28 2019-11-28 Samsung Electronics Co., Ltd. Film package and package module including the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110143625A1 (en) * 2007-07-20 2011-06-16 Choi Kyoung-Sei Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
US20190363051A1 (en) * 2018-05-28 2019-11-28 Samsung Electronics Co., Ltd. Film package and package module including the same

Also Published As

Publication number Publication date
TW202329359A (en) 2023-07-16
CN116463066A (en) 2023-07-21

Similar Documents

Publication Publication Date Title
US8673690B2 (en) Method for manufacturing a semiconductor device and a semiconductor device
US20080315398A1 (en) Packaging substrate with embedded chip and buried heatsink
US10236234B2 (en) Chip on film package
WO2014129351A1 (en) Semiconductor device and method for manufacturing same
KR20010014930A (en) Semiconductor device
US10418305B2 (en) Chip on film package
CN111668172B (en) Thin film flip chip packaging structure
KR20160121764A (en) Semiconductor packages having heat spreaders and methods for fabricating the same
KR20150125814A (en) Semiconductor Package Device
KR20080101650A (en) Method for manufacturing tag integrated circuit flexible board and structure of the same
TWI776768B (en) Heat dissipating sheet and chip on film package structure
JP2004319644A (en) High heat dissipation type plastic package and manufacturing method thereof
TWI776752B (en) Heat dissipating sheet and chip on film package structure
CN109659294B (en) Power conversion circuit device
TWI761060B (en) Chip on film package structure
TWI779956B (en) Heat dissipating sheet and chip on film package structure
JP3002174B2 (en) Electronic component package and method of forming the same
JP5259336B2 (en) Semiconductor device and manufacturing method of semiconductor device
CN214797398U (en) Chip on film packaging device
KR20130025641A (en) Cof package having improved heat dissipation
JP2004134478A (en) Semiconductor package and its manufacturing method
JP2861984B2 (en) Semiconductor device and method of manufacturing the semiconductor device
JPH06334061A (en) Semiconductor mounting board
TW202046466A (en) Heat dissipation chip-on-film package
JP3055675B2 (en) Semiconductor device

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent