TW201733821A - Elements assembly temporary fixing sheet and manufacturing method wherein the element assembly temporary fixing sheet comprises an element assembly fixing layer and a support layer with alignment marks set on the support layer - Google Patents

Abstract

The present invention relates to an element assembly temporary fixing sheet and a manufacturing method. The element assembly temporary fixing sheet comprises an element assembly fixing layer for temporarily fixing an element assembly in which a plurality of optical semiconductor elements are arranged, and a support layer for supporting the element assembly fixing layer and containing a synthetic resin. Alignment marks are set on the support layer.

Description

Component assembly temporary fixing sheet and manufacturing method

The present invention relates to a component assembly temporary fixing sheet and a manufacturing method thereof, and more particularly to a component assembly temporary fixing sheet and a method of manufacturing the same.

Conventionally, a method of covering a plurality of LEDs with a cover layer such as a phosphor layer has been known. For example, there has been proposed a method of preparing a support sheet having a rigid support plate, disposing a semiconductor element on the upper surface of the support sheet, and covering the semiconductor element with a sealing layer, and thereafter, cutting the sealing layer corresponding to the semiconductor element ( For example, refer to Japanese Patent Laid-Open Publication No. 2014-168036. In Japanese Laid-Open Patent Publication No. 2014-168036, a support mark is provided on a support plate, and the seal layer is cut based on the reference mark.

However, since the support board is hard, there is a problem that it is difficult to set the mark. An object of the present invention is to provide a method of manufacturing a component assembly temporary fixing sheet capable of easily providing an alignment mark on a support layer, and a component assembly temporary fixing sheet obtained by the manufacturing method. The present invention [1] is a component assembly temporary fixing sheet, characterized in that the element assembly temporary fixing sheet includes a component assembly fixed layer that temporarily suspends a component assembly in which a plurality of optical semiconductor elements are arranged a support layer supporting the above-mentioned component assembly fixing layer, comprising a synthetic resin; and an alignment mark provided on the support layer. In the element assembly temporary fixing sheet, an alignment mark is provided on the support layer containing the synthetic resin, and therefore, the alignment mark can be easily formed on the support layer. [2] The component assembly temporary fixing sheet according to [1], wherein the alignment mark comprises a carbon material. According to the temporary assembly of the element assembly, the alignment mark contains the carbon material, and therefore the visibility of the alignment mark can be improved. [3] The component assembly temporary fixing sheet according to [2], wherein the carbon material contains carbon black. According to the element assembly temporary fixing piece, since the carbon material contains carbon black, the visibility of the alignment mark can be improved. The component assembly temporary fixing sheet according to any one of [1] to [3] wherein the alignment mark is a self-contained group of thermal transfer and inkjet printing. A pattern set by at least one of the methods selected. According to the element assembly temporary fixing sheet, the alignment mark is provided by at least one method including the group selection of the thermal transfer printing and the ink jet printing, so that the alignment mark can be easily provided. [5] The component assembly temporary fixing sheet according to [1], wherein the element assembly fixing layer and the support layer are transparent, and the alignment mark is opaque. According to the element assembly temporary fixing piece, the opaque alignment mark can be reliably recognized. Therefore, it is possible to surely fix the element assembly with the alignment mark as a reference, or to reliably cut the sealing layer of the sealing element assembly. [6] The component assembly temporary fixing sheet according to [1], wherein the alignment mark is a development pattern. According to the element assembly temporary fixing piece, the alignment mark is a development pattern, and thus the alignment mark can be easily set. [7] The component assembly temporary fixing sheet according to [1] or [6], wherein the alignment mark contains silver. According to the temporary assembly of the element assembly, the alignment mark contains silver, so that the visibility of the alignment mark can be improved. The component assembly temporary fixing sheet according to the aspect [1], wherein the element assembly fixing layer and the support layer are colored, and the alignment mark penetrates the element assembly fixing layer and the The through hole of the support layer. According to the element assembly temporary fixing piece, the element assembly fixing layer and the support layer are colored, and the alignment mark penetrates the through hole of the element assembly fixing layer and the support layer, so that the alignment mark can be reliably recognized. [9] The component assembly temporary fixing sheet according to [1], wherein the element assembly fixing layer has a thickness of less than 120 μm. The element assembly fixing layer of the element assembly temporary fixing sheet has a thin thickness of less than 120 μm, and therefore has excellent handleability. The component assembly temporary fixing sheet according to [1], wherein the element assembly fixing layer is provided on at least one surface of the support layer. In the element assembly temporary fixing sheet, since the element assembly fixing layer is provided on at least one side of the support layer, the visibility of the alignment mark can be improved. The invention [11] is a method for manufacturing a component assembly temporary fixing sheet, characterized in that the method for manufacturing the component assembly temporary fixing sheet comprises: a step (1) of preparing a support layer provided with a photosensitive layer; a step (2) of forming an alignment mark in the form of a development pattern from the photosensitive layer; and a component assembly fixing layer for temporarily fixing the element assembly in which the plurality of optical semiconductor elements are arranged in an array is provided in the above support Step (3) of the layer. According to the method of manufacturing the element assembly temporary fixing piece, the alignment mark can be easily provided. The present invention [12] includes a method of manufacturing a component assembly temporary fixing sheet, characterized in that the method for manufacturing the component assembly temporary fixing sheet comprises: a step (2) of forming an alignment mark from a carbon material on a support layer; The element assembly fixing layer for temporarily fixing the element assembly in which the plurality of optical semiconductor elements are arranged in an array is provided in the support layer (3). According to the method of manufacturing the element assembly temporary fixing piece, the alignment mark can be easily provided. The method of producing a component assembly temporary fixing sheet according to the above [12], wherein the carbon material contains carbon black. According to the manufacturing method of the component assembly temporary fixing sheet, an alignment mark with improved visibility can be provided. The method of manufacturing a component assembly temporary fixing sheet according to the above [12] or [13], characterized in that in the above step (2), by self-contained thermal transfer and inkjet printing The alignment mark is formed by at least one of the group selection methods. According to the manufacturing method of the component assembly temporary fixing sheet, the alignment mark can be easily provided. According to a fifth aspect of the invention, there is provided a method of manufacturing a component assembly temporary fixing sheet, comprising: temporarily fixing a component assembly in which a plurality of optical semiconductor elements are arranged in an array The step (3) of providing the element assembly fixing layer on the support layer; and the step (4) of providing the through hole penetrating through the element assembly fixing layer and the support layer as alignment marks. According to the method of manufacturing the element assembly temporary fixing piece, the alignment mark can be easily provided.

In FIG. 2, the upper and lower sides of the paper are in the vertical direction (the first direction and the thickness direction), and the upper side of the paper is on the upper side (one side in the first direction and one side in the thickness direction), and the lower side of the paper is on the lower side (the first direction) The other side, the other side of the thickness direction). In FIG. 2, the left-right direction of the paper surface is the left-right direction (the second direction orthogonal to the first direction, the width direction), and the right side of the paper surface is the right side (one side in the second direction, one side in the width direction), and the left side of the paper side is the left side. (the other side in the second direction and the other side in the width direction). In FIG. 2, the paper thickness direction is the front-back direction (the third direction orthogonal to the first direction and the second direction), the front side of the paper surface is the front side (one side in the third direction), and the deep side of the paper surface is the rear side (the third side) The other side of the 3 directions). Specifically, the direction arrows of each figure shall prevail. 1. In the first embodiment, as shown in FIG. 1 and FIG. 2, the component assembly temporary fixing sheet 1 has a flat plate shape, specifically, a specific thickness, and a direction perpendicular to the thickness direction (left-right direction and front-rear direction). ) extended with a flat front and a flat back. Further, in the element assembly temporary fixing sheet 1, a flat plate shape having a length in the front-rear direction and a length (width) in the left-right direction is long. Alternatively, the component assembly temporary fixing sheet 1 has a long strip shape having a long front and rear direction. As shown in FIG. 2, the element assembly temporary fixing sheet 1 includes the element assembly fixing layer 3, the support layer 2, and the first pressure-sensitive adhesive layer 4 in this order. Specifically, the component assembly temporary fixing sheet 1 includes: a support layer 2; a component assembly fixed layer 3 which is provided on the support layer 2; and a first pressure-sensitive adhesive layer 4 which is disposed under the support layer 2 . Further, in the element assembly temporary fixing sheet 1, the element assembly fixing layer 3 is provided with an alignment mark 7. Hereinafter, each member will be described. 1-1. Support Layer The support layer 2 is located at the center in the thickness direction of the temporary assembly sheet 1 of the component assembly. That is, the support layer 2 is interposed between the element assembly fixed layer 3 and the first pressure sensitive layer 4. The element assembly temporary fixing sheet 1 has a flat plate shape, specifically, has a specific thickness, and extends in the left-right direction and the front-rear direction, and has a flat front surface and a flat back surface. Further, the support layer 2 has flexibility. The support layer 2 supports the element assembly fixed layer 3 and the first pressure-sensitive adhesive layer 4. The support layer 2 contains a synthetic resin. Examples of the synthetic resin include polyethylene (for example, low density polyethylene, medium density polyethylene, high density polyethylene, linear low density polyethylene, etc.), polypropylene, ethylene-propylene copolymer, and ethylene-C4 or higher. An olefin polymer such as an olefin copolymer, for example, an ethylene-ethyl acrylate copolymer, an ethylene-methyl methacrylate copolymer, an ethylene-n-butyl acrylate copolymer, or the like, an ethylene-(meth) acrylate copolymer, for example, a poly A polyester such as polyethylene terephthalate (PET) or polyethylene naphthalate, such as a polycarbonate, for example, a polyurethane, for example, a polymer such as polyimine. The copolymer may also be any of a random copolymer and a block copolymer. The synthetic resin may be used alone or in combination of two or more. Further, the support layer 2 may be porous as described above for the synthetic resin. Preferably, the support layer 2 comprises PET or polycarbonate. Further, the support layer 2 may be composed of a single layer or a plurality of layers. Further, the above synthetic resin is, for example, transparent. That is, the support layer 2 is transparent. Specifically, the total light transmittance of the support layer 2 is, for example, 80% or more, preferably 90% or more, more preferably 95% or more, and further, for example, 99.9% or less. The linear expansion coefficient of the support layer 2 is, for example, 500×10^-6 K^-1 Hereinafter, it is preferably 300×10^-6 K^-1 Hereinafter, again, for example, 2×10^-6 K^-1 Above, preferably 10×10^-6 K^-1 %the above. When the linear expansion coefficient of the support layer 2 is equal to or less than the above upper limit, the alignment of the optical semiconductor element 11 based on the alignment mark 7 and/or the cutting of the sealing layer 12 can be achieved. The coefficient of linear expansion of the support layer 2 can be measured by a linear expansion coefficient measuring device (TMA). The coefficient of linear expansion of the following members can also be determined by the same method. The tensile elastic modulus E of the support layer 2 at 25 ° C is, for example, 200 MPa or less, preferably 100 MPa or less, more preferably 80 MPa or less, and further, for example, 50 MPa or more. When the tensile elastic modulus E of the support layer 2 is less than or equal to the above upper limit, flexibility can be ensured, and the alignment mark 7 can be easily provided. The thickness of the support layer 2 is, for example, 10 μm or more, preferably 30 μm or more, and further, for example, 350 μm or less, preferably 100 μm or less. 1-2. Element assembly fixing layer The element assembly fixing layer 3 is located at the upper end of the element assembly temporary fixing piece 1. The element assembly fixing layer 3 is disposed on the upper surface of the support layer 2. That is, the element assembly fixing layer 3 forms the upper surface of the element assembly temporary fixing sheet 1. The element assembly fixing layer 3 has a flat plate shape, specifically, has a specific thickness, and extends in the left-right direction and the front-rear direction, and has a flat front surface and a flat back surface (except for a portion corresponding to the alignment mark 7 to be described later). ). The element assembly fixing layer 3 is configured such that the element assembly 16 in which a plurality of optical semiconductor elements 11 are arranged in an array (described below with reference to FIGS. 1 and 4B) is temporarily fixed. Further, the element assembly fixing layer 3 has pressure-sensitive adhesiveness (adhesiveness). The component assembly fixing layer 3 contains a pressure-sensitive adhesive. Examples of the pressure-sensitive adhesive include an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, an SIS (styrene-isoprene-styrene/block copolymer) pressure-sensitive adhesive, and an anthrone. Pressure-sensitive adhesive, vinyl alkyl ether pressure-sensitive adhesive, polyvinyl alcohol pressure-sensitive adhesive, polyvinylpyrrolidone pressure-sensitive adhesive, polypropylene amide-based pressure-sensitive adhesive, cellulose-based pressure-sensitive adhesive A urethane-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, a polyamine-based pressure-sensitive adhesive, and an epoxy-based pressure-sensitive adhesive. Preferably, an anthrone-based pressure-sensitive adhesive is used. Further, the element assembly fixing layer 3 is transparent. The total light transmittance of the element assembly fixing layer 3 is, for example, 80% or more, preferably 90% or more, more preferably 95% or more, and for example, 99.9% or less. The linear expansion coefficient of the component assembly fixed layer 3 is, for example, 500×10^-6 K^-1 Hereinafter, it is preferably 300×10^-6 K^-1 Hereinafter, again, for example, 2×10^-6 K^-1 Above, preferably 10×10^-6 K^-1 the above. The element assembly fixing layer 3 is pressure-sensitive to the gusset, and the peeling force when the element assembly fixing layer 3 is peeled off from the gusset at 180 degrees at 25 ° C is, for example, 0.1 N/mm or more, preferably 0.3 N/mm. The above is, for example, 1 N/mm or less. When the peeling force of the element assembly fixing layer 3 is equal to or higher than the above lower limit, the plurality of optical semiconductor elements 11 can be surely fixed. The thickness of the element assembly fixing layer 3 is, for example, 5 μm or more, preferably 10 μm or more, and further, for example, less than 120 μm, preferably less than 100 μm, more preferably 80 μm or less, still more preferably 60 μm. the following. When the thickness of the element assembly fixing layer 3 exceeds the above lower limit, pressure-sensitive adhesiveness can be surely imparted to the upper surface of the element assembly temporary fixing sheet 1. Therefore, the component assembly temporary fixing sheet 1 can be easily manufactured. When the thickness of the element assembly fixing layer 3 is lower than the above upper limit, the rationality of the element assembly fixing layer 3 can be improved. 1-3. First pressure-sensitive adhesive layer The first pressure-sensitive adhesive layer 4 is located at the lower end portion of the component assembly temporary fixing sheet 1. Further, the first pressure-sensitive adhesive layer 4 is disposed on the lower surface of the support layer 2. That is, the first pressure-sensitive adhesive layer 4 forms the lower surface of the component assembly temporary fixing sheet 1. Further, the first pressure-sensitive adhesive layer 4 is spaced apart from the element assembly fixing layer 3 by the support layer 2 in the thickness direction. The first pressure-sensitive adhesive layer 4 has a flat plate shape, specifically, has a specific thickness, and extends in the left-right direction and the front-rear direction, and has a flat front surface and a flat back surface. The first pressure-sensitive adhesive layer 4 has pressure-sensitive adhesive properties (adhesiveness). Specifically, the first pressure-sensitive adhesive layer 4 includes the same pressure-sensitive adhesive as the element assembly fixed layer 3 . The first pressure-sensitive layer 4 is transparent. The total light transmittance of the first pressure-sensitive adhesive layer 4 is, for example, 80% or more, preferably 90% or more, more preferably 95% or more, and further, for example, 99.9% or less. The coefficient of linear expansion of the first pressure-sensitive adhesive layer 4 is, for example, 500 × 10^-6 K^-1 Hereinafter, it is preferably 300×10^-6 K^-1 Hereinafter, again, for example, 2×10^-6 K^-1 Above, preferably 10×10^-6 K^-1 %the above. The thickness of the first pressure-sensitive adhesive layer 4 is, for example, 5 μm or more, preferably 10 μm or more, and is, for example, less than 100 μm, preferably 80 μm or less, and more preferably 60 μm or less. 1-4. Alignment mark As shown in Fig. 2, the alignment mark 7 is provided on the upper surface of the support layer 2. As shown in FIGS. 1 and 2, specifically, the alignment mark 7 is provided in plural at the right end portion of the upper surface of the support layer 2. In detail, the alignment mark 7 is provided in the mark formation region 18 which is divided on the right side (one of the width direction side) of the element assembly forming region 17, and the element assembly forming region 17 is provided with a component assembly which will be described later. 16. The mark forming region 18 is disposed along the front-rear direction at the right end portion of the element assembly temporary fixing sheet 1. The alignment mark 7 is a reference mark for temporarily fixing the element assembly 16 to the element assembly fixing layer 3 and for cutting the sealing layer 12 of the sealing element assembly 16. Specifically, the alignment mark 7 is provided with the arrangement mark 8 and the cut mark 9. The alignment mark 8 and the cut mark 9 are arranged in correspondence with a plurality of optical semiconductor elements 11 (described later) arranged in a line in the left-right direction, and are arranged in a row at intervals in the left-right direction. The alignment mark 8 is a mark on the left side of the alignment mark 7, and a plurality of marks are arranged at intervals in the front-rear direction. Each of the plurality of alignment marks 8 has, for example, a substantially circular shape. The cut marks 9 are marks on the right side of the alignment marks 7, and are arranged at a plurality of intervals in the front-rear direction. Specifically, the plurality of cut marks 9 are arranged so as not to overlap each of the plurality of arrangement marks 8 when projected in the left-right direction. In other words, the plurality of array marks 8 and the plurality of cut marks 9 are arranged in a staggered manner, that is, alternately arranged in the front-rear direction when projected in the left-right direction. Each of the plurality of cut marks 9 is disposed on the right oblique front side with respect to each of the plurality of array marks 8 at intervals. Each of the plurality of cut marks 9 has, for example, a substantially rod (straight line) shape extending in the left-right direction. The alignment mark 7 is opaque. To this end, the alignment mark 7 contains an opaque (described later) material. Examples of such a material include a metal material such as silver (metal silver) and a carbon material such as carbon black. As a metal material, silver is preferable. As long as the silver is applied, the visibility of the alignment mark 7 can be further improved. Further, as the carbon material, carbon black is preferred. As long as the carbon black is used, the visibility of the alignment mark 7 can be further improved. The size of the alignment mark 7 can be appropriately set. The diameter (maximum length) of the alignment mark 8 is, for example, 0.05 mm or more, preferably 0.1 mm or more, and is, for example, 1 mm or less, preferably 0.5 mm or less. The distance (i.e., the pitch) between the centers of the adjacent alignment marks 8 is, for example, 0.05 mm or more, preferably 0.1 mm or more, and further, for example, 1.0 mm or less, preferably 0.8 mm or less. The length in the left-right direction of the cutting mark 9 is, for example, 0.05 mm or more, preferably 0.1 mm or more, and is, for example, 1 mm or less, preferably 0.5 mm or less. The width (length in the front-rear direction) of the cutting mark 9 is, for example, 0.05 mm or more, preferably 0.1 mm or more, and is, for example, 1 mm or less, preferably 0.25 mm or less. The interval between the arrangement marks 8 and the cut marks 9 which are adjacent to each other when projected in the front-rear direction is, for example, 0.1 mm or more, preferably 0.2 mm or more, and is, for example, 1 mm or less, preferably 0.8 mm or less. The distance between the centers of the cut marks 9 is, for example, 0.05 mm or more, preferably 0.1 mm or more, and further, for example, 1.0 mm or less, preferably 0.8 mm or less. The thickness of the alignment mark 7 is, for example, 0.5 μm or more, preferably 1 μm or more, and is, for example, 10 μm or less, or preferably 5 μm or less. The total light transmittance of the alignment mark 7 is, for example, 40% or less, preferably 20% or less, more preferably 10% or less, and further, for example, 0.1% or more. 1-5. First Peeling Layer and Second Peeling Layer As shown in FIG. 2, the element assembly temporary fixing sheet 1 further includes a first peeling layer 5 and a second peeling layer 6. As shown in FIG. 4A and FIG. 4B, the first peeling layer 5 is detachably attached to the component in order to protect the component assembly fixing layer 3 until the optical semiconductor element 11 is temporarily fixed by the component assembly fixing layer 3. The front side of the assembly fixed layer 3. In other words, the first release layer 5 is a flexible film containing a resin, and is laminated on the surface of the component assembly fixing layer 3 so as to cover the surface of the component assembly fixing layer 3 when it is shipped, transported, and stored. The surface of 3 may be peeled off from the front surface of the element assembly fixing layer 3 in a substantially U-shape before the element assembly fixing layer 3 is used. Further, the bonding surface of the flexible film is subjected to a release treatment as needed. The flexible film may, for example, be a polymer film such as a polyethylene film or a polyester film (PET or the like). The thickness of the first peeling layer 5 is, for example, 1 μm or more, preferably 10 μm or more, and is, for example, 2000 μm or less, or preferably 1000 μm or less. The second peeling layer 6 is peelably bonded to the back surface of the first pressure-sensitive adhesive layer 4 in order to protect the first pressure-sensitive adhesive layer 4 until the first pressure-sensitive adhesive layer 4 is supported by the carrier 10 . In other words, the second release layer 6 is a flexible film containing a resin, and is laminated on the first pressure-sensitive layer so as to cover the back surface of the first pressure-sensitive adhesive layer 4 when the component assembly temporary fixing sheet 1 is shipped, transported, and stored. Next, the back surface of the layer 4 can be peeled off from the back surface of the first pressure-sensitive adhesive layer 4 in a substantially U-shape immediately before the first pressure-sensitive adhesive layer 4 is used. Further, the bonding surface of the flexible film is subjected to a release treatment as needed. The flexible film may, for example, be a polymer film such as a polyethylene film or a polyester film (PET or the like). The thickness of the second peeling layer 6 is, for example, 1 μm or more, preferably 10 μm or more, and is, for example, 2000 μm or less, preferably 1000 μm or less. Further, the element assembly temporary fixing sheet 1 does not include the carrier 10 and the optical semiconductor element 11, and sequentially includes the second release layer 6, the first pressure-sensitive adhesive layer 4, the support layer 2, the element assembly fixed layer 3, and the first Peel layer 5. Preferably, the element assembly temporary fixing sheet 1 is composed only of the second release layer 6, the first pressure-sensitive adhesive layer 4, the support layer 2, the element assembly fixed layer 3, and the first release layer 5. 1-6. Method of Manufacturing Element Assembly Temporary Fixing Sheet Next, a method of manufacturing the element assembly temporary fixing sheet 1 will be described. Referring to Fig. 2, in the method, the support layer 2 is first prepared, and then the alignment mark 7 is set. The method of providing the alignment mark 7 is not particularly limited, and examples thereof include a method using photo lithography, a thermal transfer (see, for example, Japanese Patent Laid-Open Publication No. 2000-135871), embossing, letterpress printing, gravure printing, and stencil printing. (Screen printing), inkjet printing (refer to, for example, Japanese Patent Laid-Open Publication No. 2014-10823). From the viewpoint of accurately arranging the alignment mark 7, a method using photolithography or screen printing is preferable, and a method using photo lithography is more preferable. Moreover, from the viewpoint of easily providing the alignment mark 7, thermal transfer printing and inkjet printing are exemplified. In the method of using photolithography, specifically, as shown in FIGS. 3A to 3C, the step (1) of preparing the support layer 2 on which the photosensitive layer 21 is provided (see FIG. 3A), and by light are sequentially performed. The lithography self-photosensitive layer 21 forms the alignment mark 7 in the form of the development pattern 23 (see FIGS. 3B and 3C). In the step (1), the support layer 22 with the photosensitive layer is prepared as shown in FIG. 3A, and the support layer 22 with the photosensitive layer is provided with a support layer 2, and a photosensitive layer 21 provided on the upper surface of the support layer 2. The photosensitive layer 21 is disposed on the entire upper surface of the support layer 2. The photosensitive layer 21 contains a photosensitive material which can form the developing pattern 23 by photolithography. As a photosensitive material, a silver salt emulsion is mentioned, for example. Silver salt emulsions contain, for example, silver salts. The silver salt may, for example, be an inorganic silver salt such as a silver halide, or an organic silver salt such as silver acetate. Preferably, an inorganic silver salt which is excellent in light responsiveness is exemplified. The thickness of the photosensitive layer 21 is, for example, 0.5 μm or more, preferably 1 μm or more, and is, for example, 10 μm or less, preferably 5 μm or less. In the step (2), as shown in FIG. 3B, the photosensitive layer 21 is irradiated with an active energy ray via a photomask (not shown). Specifically, the photosensitive layer 21 is partially covered with a metal mask including a metal such as stainless steel, and then the photosensitive layer 21 exposed from the metal mask is irradiated with laser light (peak wavelength: 150 nm or more and 250 nm or less). Thereby, an exposed portion of the same pattern as the alignment mark 7 and an unexposed portion of the pattern opposite to the alignment mark 7 can be formed on the photosensitive layer 21. Thereafter, as shown in FIG. 3C, the photosensitive layer 21 is immersed in the developing solution, and the exposed portion is left to remove the unexposed portion (developing). Thereby, the alignment mark 7 is formed in the form of the development pattern 23. Thereafter, the element assembly fixing layer 3 is provided on the support layer 2 (an example of the step (3)), and the first pressure-sensitive adhesive layer 4 is provided under the support layer 2. In order to provide the element assembly fixing layer 3 and the first pressure-sensitive adhesive layer 4 in the support layer 2, first, the element assembly fixing layer 3 and the first pressure-sensitive adhesive layer 4 are prepared. The element assembly fixing layer 3 is provided on, for example, the surface of the first peeling layer 5. The first pressure-sensitive adhesive layer 4 is provided, for example, on the surface of the second peeling layer 6. Next, the element assembly fixing layer 3 is placed on the upper surface of the support layer 2. At this time, the element assembly fixing layer 3 is placed on the upper surface of the support layer 2 so as to embed the alignment mark 7. Further, the first pressure-sensitive adhesive layer 4 is disposed on the lower surface of the support layer 2. Thereby, the element assembly temporary fixing sheet 1 is provided, and the element assembly temporary fixing sheet 1 includes the support layer 2, the element assembly fixing layer 3 and the first pressure sensitive layer 4 which are respectively disposed above the support layer 2, and respectively The first assembly layer 5 and the second release layer 6 disposed on the element assembly fixing layer 3 and the first pressure sensitive layer 4 are disposed. The thickness of the element assembly temporary fixing sheet 1 is, for example, 15 μm or more, preferably 40 μm or more, and is, for example, 550 μm or less, or preferably 260 μm or less. Further, the component assembly temporary fixing sheet 1 has flexibility. 1-7. Method of using the component assembly temporary fixing piece Next, a method of using the element assembly temporary fixing piece 1 will be described. As shown in FIG. 4A, first, the carrier 10 is placed on the lower surface of the first pressure-sensitive adhesive layer 4. Specifically, first, the second peeling layer 6 shown by the imaginary line in FIG. 2 is peeled off from the first pressure-sensitive adhesive layer 4, and then, as shown in FIG. 4A, the carrier 10 is directly brought into contact with the first pressure-sensitive layer. Next to the lower surface of layer 4. Thereby, the carrier 10 is pressure-sensitive to the first pressure-sensitive adhesive layer 4. The carrier 10 is used for a support plate for temporarily fixing the sheet 1 from the lower support member assembly. The carrier 10 is formed in a substantially flat plate shape extending in the front-rear direction and the left-right direction. The carrier 10 has the same shape as that of the component assembly temporary fixing sheet 1 in plan view. The thickness of the carrier 10 is, for example, 100 μm or more, preferably 350 μm or more, and further, for example, 1000 μm or less, preferably 600 μm or less. Carrier 10 comprises a hard material. Examples of the hard material include a transparent material such as glass, and an opaque material such as ceramic or stainless steel. The Vickers hardness of the hard material is, for example, 0.5 GPa or more, preferably 1 GPa or more, more preferably 1.2 GPa or more, and further, for example, 10 GPa or less. As long as the carrier 10 contains a hard material, specifically, the Vickers hardness of the hard material is at least the above lower limit, and the element assembly temporary fixing sheet 1 can be surely supported. Thereby, the temporary fixing member 30 which has the carrier 10 and the element assembly temporary fixing sheet 1 in order can be obtained. Further, the temporary fixing member 30 has an alignment mark 7 provided on the support layer 2 of the element assembly temporary fixing sheet 1. Next, as shown by the imaginary line arrow in FIG. 4A, after the first peeling layer 5 is peeled off from the upper surface of the element assembly fixing layer 3, as shown in FIG. 4B, a plurality of optical semiconductor elements 11 are temporarily fixed to the element. The upper surface of the assembly layer 3 is fixed. At this time, a plurality of optical semiconductor elements 11 are arranged (arranged) on the upper surface of the element assembly fixing layer 3 with reference to the alignment mark 8. Further, a plurality of optical semiconductor elements 11 are provided in the element assembly forming region 17 of the element assembly fixing layer 3. Specifically, the plurality of optical semiconductor elements 11 are positioned in the left-right direction and the front-rear direction while viewing the alignment mark 8, and the plurality of optical semiconductor elements 11 are directly in contact with the upper surface of the element assembly fixing layer 3. In order to visually recognize the alignment mark 8, the alignment mark 8 is viewed from above the self-aligned mark 8 by a camera or the like provided above the temporary fixing member 30. At this time, since the element assembly fixing layer 3 is transparent, the alignment mark 8 can be viewed from above the element assembly fixing layer 3. Further, the optical semiconductor element 11 has an upper surface, a surface disposed opposite to the upper surface in the thickness direction, and a circumferential side surface connecting the upper surface and the lower surface. An electrode is formed on the lower surface. A plurality of optical semiconductor elements 11 are arranged side by side on the upper surface of the alignment mark 8, thereby constituting the element assembly 16. The interval between the adjacent optical semiconductor elements 11 (the interval in the front-rear direction and/or the left-right direction) is, for example, 0.05 mm or more, preferably 0.1 mm or more, and is, for example, 1.0 mm or less, preferably 0.8 mm or less. . Further, the thickness (height) of each of the plurality of optical semiconductor elements 11 is, for example, 0.1 μm or more, preferably 0.2 μm or more, and is, for example, 500 μm or less, or preferably 200 μm or less. The length in the left-right direction and/or the length in the front-rear direction of each of the plurality of optical semiconductor elements 11 is, for example, 0.05 mm or more, preferably 0.1 mm or more, and is, for example, 1.0 mm or less, preferably 0.8 mm or less. Next, the element assembly 16 is sealed by the sealing layer 12 as shown by the solid line in FIG. 4C and the alternate long and short dash line in FIG. The component assembly 16 is sealed, for example, by a sealing sheet comprising a semi-solid or solid sealing composition. Alternatively, the component assembly 16 is sealed by infusing a liquid sealing composition. The sealing composition contains a transparent resin such as an anthrone resin or an epoxy resin. The sealing composition may contain particles such as a filler, a phosphor, and light-reflecting particles in an appropriate ratio as needed. The sealing layer 12 covers the upper surface and the side surface of each of the plurality of optical semiconductor elements 11, and the upper surface of the element assembly fixing layer 3 exposed from each of the plurality of optical semiconductor elements 11. The sealing layer 12 is provided on the upper surface of the element assembly fixing layer 3 in the element assembly forming region 17 so that the upper surface of the element assembly fixing layer 3 in the mark forming region 18 is exposed. Thereby, the sealing element assembly 19 including the plurality of optical semiconductor elements 11 (the element assembly 16) and one sealing layer 12 can be obtained. In other words, the sealing element assembly 19 is obtained in a state of being temporarily fixed to the element assembly temporary fixing sheet 1. The thickness of the sealing layer 12 is, for example, 40 μm or more, preferably 50 μm or more, and is, for example, 500 μm or less, preferably 300 μm or less. As shown by the chain double-dashed line in FIG. 1 and the one-dot chain line in FIG. 4D, the sealing layer 12 is cut in such a manner that the optical semiconductor element 11 is singulated. That is, the sealing element assembly 19 is singulated. In order to cut the sealing layer 12, for example, a cutting device including a cutter, for example, a cutting device including a laser irradiation source can be used. As a cutting device provided with a cutter, for example, a cutting device including a disk-shaped dicing saw (cutting blade), for example, a cutting device including a cutter, may be mentioned. It is preferable to use a cutting device having a cutter, and it is more preferable to use a cutting device. In the cutting of the sealing layer 12 by the above-described cutting device, the sealing layer 12 is cut with reference to the cutting mark 9 of the alignment mark 7. Further, the sealing layer 12 is cut while viewing the cutting mark 9 of the alignment mark 7 from above by the same camera as the camera for viewing the alignment mark 8. The length of the sealing layer 12 that has been cut in the front-rear direction and/or the length in the left-right direction is, for example, 20 mm or more, preferably 40 mm or more, and is, for example, 150 mm or less, preferably 100 mm or less. Thereby, a plurality of sealed optical semiconductor elements 13 having one optical semiconductor element 11 and one sealing layer 12 can be obtained in a state of being temporarily fixed to the element assembly fixing layer 3 (temporary fixing member 30). Next, as shown by the arrow in FIG. 4D, a plurality of sealed optical semiconductor elements 13 are respectively peeled off from the element assembly fixing layer 3. Then, in the temporary fixing member 30 in which the plurality of sealed optical semiconductor elements 13 have been peeled off, the carrier 10 is peeled off from the first pressure-sensitive adhesive layer 4, and the carrier 10 is reused. On the other hand, the component assembly temporary fixing sheet 1 (the support layer 2, the element assembly fixed layer 3, and the first pressure sensitive layer 4) is discarded. That is, the component assembly temporary fixing sheet 1 is a disposable type. Thereafter, as shown in FIG. 4E, the sealed optical semiconductor element 13 is flip-chip mounted on the substrate 14. The substrate 14 has a flat plate shape extending in the front-rear direction and the left-right direction. A terminal electrically connected to the electrode of the optical semiconductor element 11 is formed on the upper surface of the substrate 14. Thereby, the optical semiconductor device 15 including the sealed optical semiconductor element 13 and the substrate 14 can be obtained. 2. Operation and Effect of the First Embodiment Further, in the element assembly temporary fixing sheet 1, the alignment mark 7 is provided on the support layer 2 including the synthetic resin, so that the alignment mark 7 can be easily formed on the support layer 2 . However, in Japanese Laid-Open Patent Publication No. 2014-168036, a mark is provided on a rigid support plate, and thus such a support plate cannot be reused. However, in the component assembly temporary fixing sheet 1, the alignment mark 7 is provided not on the carrier 10 but on the support layer 2 which is separately provided on the component assembly temporary fixing sheet 1, so that the support layer can be provided at a relatively low cost. The component assembly of 2 is temporarily discarded, and on the other hand, the carrier 10 can be reused. Therefore, the manufacturing cost of the sealed optical semiconductor element 13 can be suppressed, and the manufacturing cost of the optical semiconductor device 15 can be suppressed. According to the element assembly temporary fixing sheet 1, as long as the alignment mark 7 contains a carbon material, the visibility of the alignment mark 7 can be improved. According to the element assembly temporary fixing sheet 1, as long as the carbon material is carbon black, the visibility of the alignment mark 7 can be improved. According to the element assembly temporary fixing sheet 1, the alignment mark 7 can be easily provided by arranging the alignment mark 7 by a pattern provided by at least one method including group selection of thermal transfer and inkjet printing. Further, according to the element assembly temporary fixing sheet 1, the opaque alignment mark 7 can be surely viewed through the transparent element assembly fixing layer 3. Therefore, as shown in FIG. 4B, the component assembly 16 can be temporarily fixed with reference to the alignment mark 8, or as shown by the alternate long and short dash line in FIG. 4D, the sealing can be surely cut off based on the cut mark 9. Layer 12. Further, according to the element assembly temporary fixing sheet 1, as shown in Figs. 3B and 3C, the alignment mark 7 can be easily provided as long as the alignment mark 7 is the development pattern 23. According to the element assembly temporary fixing sheet 1, as long as the alignment mark 7 contains silver, the visibility of the alignment mark 7 can be improved. Further, in the element assembly temporary fixing sheet 1, if the thickness of the element assembly fixing layer is less than 120 μm, the thickness is thin, and therefore the element assembly fixing layer 3 is excellent in rationality. According to the manufacturing method of the element assembly temporary fixing sheet 1, the alignment mark 7 can be easily provided. 3. Modification of the first embodiment In the first embodiment, as shown in Fig. 1, the arrangement mark 8 has a substantially circular shape, and the cut mark 9 has a substantially linear shape. However, the shape of each of the alignment marks 7 is not particularly limited. In addition, after the element assembly fixing layer 3 is formed on the surface of the first peeling layer 5 (see the imaginary line of FIG. 3), the element assembly fixing layer 3 is transferred from the first peeling layer 5 to the support layer 2, However, for example, the component assembly fixing layer 3 may be formed directly on the upper surface of the support layer 2. Further, first, the first pressure-sensitive adhesive layer 4 is formed on the surface of the second release layer 6 (see the imaginary line of FIG. 3), and then the first pressure-sensitive adhesive layer 4 is transferred from the second release layer 6 to the support layer. 2. For example, the first pressure-sensitive adhesive layer 4 may be formed directly on the lower surface of the support layer 2, for example. Further, in the first embodiment, as shown in FIG. 2, the alignment mark 7 is provided on the upper surface of the support layer 2. In a variation, as shown in FIG. 5, the alignment mark 7 is disposed on the lower surface of the support layer 2. The alignment mark 7 is embedded in the first pressure-sensitive adhesive layer 4 . As shown in FIG. 4B, when a plurality of optical semiconductor elements 11 are arranged in the element assembly fixing layer 3, or when the sealing layer 12 is cut as shown in FIG. 4D, the camera is disposed above the temporary fixing member 30. The mark 8 or the cut mark 9 is viewed through the element assembly fixing layer 3 and the support layer 2. Further, although not shown, the alignment mark 7 may be provided on the upper and lower surfaces of the support layer 2. Preferably, the alignment mark 7 is provided only on one side of the support layer 2, that is, only on the upper surface or only on the lower surface. If the alignment mark 7 is provided only on one side of the support layer 2, the alignment mark 7 can be easily formed as compared with the case where the alignment mark 7 is disposed on the upper and lower surfaces of the support layer 2, thereby correspondingly Reduce manufacturing costs. More preferably, as shown in FIG. 2 of the first embodiment, the alignment mark 7 is provided on the upper surface of the support layer 2. According to this configuration, the alignment mark 7 can be visually recognized from the upper side as compared with the case where the alignment mark 7 is provided on the lower surface of the support layer 2. Further, although not shown, the alignment mark 7 may be provided as a recess in which the support layer 2 is recessed in the thickness direction. Further, in the method of use of the first embodiment, as shown by the alternate long and short dash line in FIG. 4D, the sealing layer 12 is cut and the sealing member assembly 19 is singulated. However, in the modified example, as shown in FIG. 6A, the sealing member assembly 19 is peeled off from the element assembly fixing layer 3 without cutting the sealing layer 12, and thereafter, as shown in FIG. 6B, the sealing member assembly 19 is used. The flip chip is mounted on the substrate 14. In this modification, the sealing layer 12 is not cut. Therefore, although not shown, the alignment mark 7 may be formed only by the arrangement mark 8 without the cutting mark 9. In the second embodiment, the same members and steps as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted. In the first embodiment, as shown in FIGS. 2 and 4A, alignment marks 7 are provided on the element assembly temporary fixing sheet 1 (specifically, the support layer 2). In the second embodiment, as shown in FIG. 8A, the alignment mark 7 is formed to penetrate the through hole 26 of the element assembly temporary fixing sheet 1. The through hole 26 penetrates the element assembly fixing layer 3, the support layer 2, and the first pressure-sensitive adhesive layer 4 in the thickness direction. In the second embodiment, the carrier 10 is colorless, and at least one of the element assembly fixing layer 3, the support layer 2, and the first pressure-sensitive adhesive layer 4 is colored, and at least one of the colored layers has a dye, for example, in an appropriate ratio. Colored components such as pigments. The total light transmittance of the carrier 10 is, for example, 80% or more, preferably 90% or more, more preferably 95% or less, and further, for example, 99.9% or less. The total light transmittance of at least one of the above-mentioned colored layers is, for example, 80% or less, preferably 65% or less, more preferably 50% or less. Since at least one of the layers is colored, the through hole 26 is regarded as being colorless in plan view. That is, the through hole 26 can be clearly seen as shown in FIG. 7 by using the contrast between the at least one of the colored ones and the colorless through hole 26. In order to manufacture the element assembly temporary fixing sheet 1, the element assembly temporary fixing sheet 1 is prepared as shown in FIG. 2, and the element assembly temporary fixing sheet 1 includes the second peeling layer 6 and the first pressure-sensitive adhesive layer 4 in this order. The support layer 2, the element assembly fixed layer 3, and the first release layer 5. Next, the through hole 26 through which the second peeling layer 6 , the first pressure sensitive adhesive layer 4 , the support layer 2 , the element assembly fixed layer 3 , and the first peeling layer 5 are collectively penetrated is formed in the thickness direction. The through hole 26 is formed by, for example, cutting, punching, laser processing, or the like. Preferably, the through hole 26 is formed by laser processing. Examples of the laser processing include excimer laser, YAG (Yttrium Aluminum Garnet) laser, and CO.₂ For the laser or the like, a YAG laser is preferable from the viewpoint of continuously manufacturing the component assembly temporary fixing sheet 1 in a roll-to-roll manner and forming the through hole 26 in a wide range. In the method of using the element assembly temporary fixing sheet 1, the second release layer 6 is peeled off from the first pressure-sensitive adhesive layer 4, and thereafter, as shown in FIG. 8A, the carrier 10 and the first pressure-sensitive adhesive layer 4 are formed. The surface is in direct contact. Next, the first peeling layer 5 is peeled off from the upper surface of the element assembly fixing layer 3. Thereafter, as shown in FIG. 8B, a plurality of optical semiconductor elements 11 are arranged (arranged) on the upper surface of the element assembly fixing layer 3 with reference to the alignment mark 8. At this time, the plurality of optical semiconductor elements 11 are positioned in the left-right direction and the front-rear direction while viewing the alignment mark 8, and the plurality of optical semiconductor elements 11 are in direct contact with the upper surface of the element assembly fixing layer 3. Specifically, the visual alignment mark 8 (through hole 26) is colorless. The alignment mark 8 (through hole 26) can be clearly viewed by the contrast with at least one of the above colored layers (see Fig. 7). Moreover, as shown in FIG. 8D, when the sealing layer 12 is cut, the cutting mark 9 is used as a reference. Specifically, the cut mark 9 (through hole 26) is visually recognized by the same method as the above-described alignment mark 8 (through hole 26) (see FIG. 7). 5. Operation and Effect of the Second Embodiment According to the second embodiment, the same operational effects as those of the first embodiment can be obtained. In particular, according to this method, the alignment mark 7 can be simply made into the through hole 26. 6. Variation of the second embodiment In the above description, as shown in FIG. 8A, the element assembly fixing layer 3, the support layer 2, and the first pressure-sensitive adhesive layer 4 are formed in the thickness direction. Through hole 26. However, although not shown, the through hole 26 penetrating the element assembly fixing layer 3 and the support layer 2 without penetrating the first pressure sensitive adhesive layer 4 may be formed. In this case, the first pressure-sensitive adhesive layer 4 is colorless, and at least one of the aggregate fixed layer 3 and the support layer 2 is colored. According to this modification, the same operational effects as those of the second embodiment can be exhibited. 6. In the third embodiment, the same members and steps as those in the first embodiment and the second embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted. 6-1. Element assembly temporary fixing sheet As shown in FIG. 9, the component assembly temporary fixing sheet 1 of the third embodiment includes the support layer 2 and the component set without including the first pressure sensitive adhesive layer 4 (see FIG. 2). Body fixing layer 3. Further, the element assembly temporary fixing sheet 1 may further include the first release layer 5. Preferably, the element assembly temporary fixing sheet 1 is composed only of the support layer 2 and the element assembly fixing layer 3, and if necessary, it is preferably only the support layer 2, the element assembly fixing layer 3, and the first peeling layer. 5 composition. In order to manufacture the component assembly temporary fixing sheet 1, the support layer 2 is first prepared, and then the alignment mark 7 is placed on the support layer 2 by the above method (the method of FIGS. 3A to 3C). Thereafter, the element assembly fixing layer 3 is provided on the entire upper surface of the support layer 2. 6-2. Method of using the temporary assembly of the component assembly Next, the method of using the temporary assembly of the component assembly will be described. As shown in FIG. 10A, first, the first peeling layer 5 (see FIG. 9) is peeled off from the element assembly fixing layer 3, and then the carrier 10 is placed on the upper surface of the element assembly fixing layer 3. The carrier 10 contains a transparent material such as glass. Thereby, the temporary fixing member 30 which has the support layer 2, the element assembly fixed layer 3, and the carrier 10 in order can be obtained. Preferably, the temporary fixing member 30 is composed only of the support layer 2, the element assembly fixing layer 3, and the carrier 10. Next, the second pressure-sensitive adhesive layer 25 is placed on the upper surface of the carrier 10. The second pressure-sensitive adhesive layer 25 has a flat plate shape and has a specific thickness, and extends in the left-right direction and the front-rear direction, and has a flat front surface and a flat back surface. The second pressure-sensitive adhesive layer 25 has pressure-sensitive adhesive properties (adhesiveness). The second pressure-sensitive adhesive layer 25 has the same layer configuration as the above-described component assembly temporary fixing sheet 1 (support layer 2, element assembly fixed layer 3, and first pressure-sensitive adhesive layer 4) shown in Fig. 2 . Further, the second pressure-sensitive adhesive layer 25 may include an adhesive layer described in JP-A-2014-168036. Further, the second pressure-sensitive adhesive layer 25 has a size smaller than that of the element assembly temporary fixing sheet 1 in plan view, and specifically, the second pressure-sensitive adhesive layer 25 is not aligned with the alignment mark when projected in the thickness direction. 7 overlapping configuration. Specifically, the second pressure-sensitive adhesive layer 25 is disposed in the element assembly forming region 17 of the carrier 10 . The thickness of the second pressure-sensitive adhesive layer 25 is, for example, 30 μm or more, preferably 50 μm or more, and is, for example, 500 μm or less, or preferably 300 μm or less. As shown in FIG. 10B, next, a plurality of optical semiconductor elements 11 are pressure-sensitively applied to the upper surface of the second pressure-sensitive adhesive layer 25. At this time, the plurality of optical semiconductor elements 11 are arranged (arranged) on the second pressure-sensitive adhesive layer 25 by arranging the alignment marks 8 of the alignment marks 7 from the upper side of the temporary fixing member 30 and on the basis of the arrangement marks 8 surface. The alignment mark 8 is viewed through the transparent carrier 10 and the element assembly fixing layer 3. Thereby, the element assembly 16 including the one second pressure-sensitive adhesive layer 25 and the plurality of optical semiconductor elements 11 can be obtained in a state of being supported by the carrier 10. That is, the component assembly 16 is supported by the carrier 10. In other words, the element assembly 16 is temporarily fixed to the element assembly temporary fixing sheet 1 (the element assembly fixing layer 3) via the carrier 10. As shown in FIG. 10C, next, a plurality of optical semiconductor elements 11 of the element assembly 16 are sealed by the sealing layer 12. The sealing layer 12 covers the upper surface and the side surface of each of the plurality of optical semiconductor elements 11 and the upper surface of the second pressure-sensitive adhesive layer 25 exposed from each of the plurality of optical semiconductor elements 11. On the other hand, the sealing layer 12 is not formed on the upper surface of the carrier 10. Thereby, the sealing element assembly 19 including the element assembly 16 and the sealing layer 12 covering the element assembly 16 can be obtained. The sealing element assembly 19 includes one second pressure-sensitive adhesive layer 25, a plurality of optical semiconductor elements 11, and one sealing layer 12 in this order. Preferably, the sealing element assembly 19 is composed of only one second pressure-sensitive adhesive layer 25, a plurality of optical semiconductor elements 11, and one sealing layer 12. The sealing layer 12 is next cut as shown by the alternate long and short dash line in Fig. 10D. Thereby, a plurality of sealed optical semiconductor elements 13 including one optical semiconductor element 11 and one sealing layer 12 can be obtained in a state of being temporarily fixed to the second pressure-sensitive adhesive layer 25. As shown by the arrow in Fig. 10E, the sealing member assembly 19 is peeled off from the upper surface of the carrier 10. Next, each of the plurality of sealed optical semiconductor elements 13 is peeled off from the second pressure-sensitive adhesive layer 25. In the temporary fixing member 30, the carrier 10 is peeled off from the upper surface of the element assembly fixing layer 3, and the carrier 10 is reused. On the other hand, the component assembly temporary fixing sheet 1 (the support layer 2 and the element assembly fixed layer 3) is discarded. That is, the component assembly temporary fixing sheet 1 is a disposable type. As shown in FIG. 10F, thereafter, the sealed optical semiconductor element 13 is flip-chip mounted on the substrate 14 to obtain the optical semiconductor device 15. 7. Operation and Effect of the Third Embodiment According to the third embodiment, the same operational effects as those of the first embodiment and the second embodiment can be exhibited. Further, as shown in FIG. 9, the element assembly temporary fixing sheet 1 does not include the first pressure-sensitive adhesive layer 4 (see FIG. 2), and therefore, the element assembly of the first embodiment including the first pressure-sensitive adhesive layer 4 is provided. Compared with the body temporary fixing piece 1, the layer constitution can be made simple. 8. Variation of the third embodiment In the third embodiment, as shown in Fig. 9, the alignment mark 7 is provided on the upper surface of the support layer 2. In a variation, as shown in FIG. 11, the alignment mark 7 is provided on the lower surface of the support layer 2. The alignment mark 7 is exposed downward. As shown in FIG. 10B, when a plurality of optical semiconductor elements 11 are arranged in the second pressure-sensitive adhesive layer 25, or when the sealing layer 12 is cut as shown in FIG. 10D, it is disposed above the temporary fixing member 30. The alignment mark 8 or the cut mark 9 is visually recognized by the camera via the carrier 10, the element assembly fixing layer 3, and the support layer 2. Further, although not shown, the alignment mark 7 may be provided on the upper and lower surfaces of the support layer 2. Preferably, the alignment mark 7 is provided only on one side of the support layer 2, that is, only on the upper surface or only on the lower surface. If the alignment mark 7 is provided only on one side of the support layer 2, the alignment mark 7 can be easily formed as compared with the case where the alignment mark 7 is disposed on the upper and lower surfaces of the support layer 2, thereby being correspondingly lowered manufacturing cost. More preferably, as shown in FIG. 9 of the third embodiment, the alignment mark 7 is provided on the upper surface of the support layer 2. According to this configuration, the alignment mark 7 can be visually recognized from above in comparison with the case where the alignment mark 7 is provided on the lower surface of the support layer 2. Further, although not shown, the alignment mark 7 may be provided as a recess in which the support layer 2 is recessed in the thickness direction. Further, in the method of use of the third embodiment, the sealing layer 12 is cut as shown by a one-dot chain line in Fig. 10D. However, in the modified example, as shown in FIG. 12A, the second pressure-sensitive adhesive layer 25 is peeled off from the upper surface of the carrier 10 without cutting the sealing layer 12. Next, as shown in FIG. 12B, the sealing member assembly 19 is peeled off from the lower surface of each of the plurality of optical semiconductor elements 11 and the lower surface of the sealing layer 12. Thereafter, as shown in FIG. 12C, a plurality of optical semiconductor elements 11 are flip-chip mounted on the substrate 14. In this modification, as shown in FIG. 12A, the sealing layer 12 is not cut. Therefore, although not shown, the alignment mark 7 may be formed only by the arrangement mark 8 without the cutting mark 9. In the fourth embodiment, members and steps that are the same as those in the first embodiment to the third embodiment are denoted by the same reference numerals, and the detailed description thereof is omitted as shown in Fig. 13A. The alignment mark 7 is provided to penetrate the through hole 26 of the element assembly temporary fixing piece 1 in the thickness direction. The through hole 26 penetrates the support layer 2 and the element assembly fixing layer 3 in the thickness direction. In this modification, as shown in FIG. 7, the through hole 26 can be clearly seen by the contrast with the support layer 2 and the element assembly fixing layer 3. In the method of using the element assembly temporary fixing sheet 1, the carrier 10 is placed on the upper surface of the element assembly fixing layer 3. As shown in FIG. 13A, next, the second pressure-sensitive adhesive layer 25 is placed on the upper surface of the carrier 10. As shown in FIG. 13B, next, a plurality of optical semiconductor elements 11 are pressure-sensitively applied to the upper surface of the second pressure-sensitive adhesive layer 25. At this time, the alignment mark 8 of the alignment mark 7 is viewed from above the temporary fixing member 30, and a plurality of optical semiconductor elements 11 are arranged (arranged) on the second pressure-sensitive adhesive layer 25 with reference to the alignment mark 8 surface. At this time, the alignment mark 8 is regarded as a through-hole 26 in the element assembly fixing layer 3 and the support layer 2 which are colored by the carrier 10 from above. The alignment mark 8 (through hole 26) can be clearly viewed by the contrast with at least one of the above layers (see Fig. 7). As shown by the one-dot chain line in FIG. 13D, next, the sealing layer 12 is cut with reference to the cut mark 9 of the alignment mark 7. Further, according to the fourth embodiment, the same operational effects as those of the third embodiment can be exhibited. Specific values such as the blending ratio (content ratio), physical property value, and parameters used in the following descriptions may be substituted for the blending ratios described in the above-mentioned "Forms for Carrying Out the Invention". The upper limit value (defined as "the following", "less than") or the lower limit (defined as "above" and "exceeded") is the corresponding upper limit value (defined as "below" or "less than"). Example 1 (Example corresponding to the first embodiment) 1. Manufacturing of element assembly temporary fixing sheet Referring to Fig. 3A, first, a support layer 22 with a photosensitive layer is provided, and the support layer 22 with a photosensitive layer is provided with PET. A support layer 2 having a thickness of 175 μm, a photosensitive layer 21 having a thickness of 3 μm, which is provided on the upper surface of the support layer 2 and containing a silver salt emulsion containing silver halide (step (1)). The support layer 22 with the photosensitive layer has a length of 600 mm in the front and rear direction and a length of 500 mm in the left and right direction. The total light transmittance of support layer 2 is 95%. The linear expansion coefficient of support layer 2 is 70×10^-6 K^{- 1} . The tensile modulus E of the support layer 2 at 25 ° C is 60 MPa. The total light transmittance of the element assembly fixing layer 3 was 95%. The linear expansion coefficient of the component assembly fixed layer 3 is 220×10^-6 K^-1 . Next, as shown in FIG. 3B, the photosensitive layer 21 is partially covered with a metal mask containing stainless steel, and thereafter, the photosensitive layer 21 exposed from the metal mask is irradiated with laser light having a peak wavelength of 193 nm. Thereby, the alignment mark 8 and the cut mark 9 are formed in the form of an exposure pattern. Thereafter, the support layer 22 with the photosensitive layer is immersed in the developer, and the exposed portion is left to remove the unexposed portion (developed). Thereby, as shown in FIG. 3C and FIG. 1, the alignment mark 7 having the circular arrangement mark 8 and the linear shape cut mark 9 is formed in the form of the development pattern 23. The diameter of the alignment mark 8 is 0.5 mm, the interval between adjacent alignment marks 8 is 1.14 mm, and the distance between adjacent alignment marks 8 is 1.64 mm. The length of the cut mark 9 in the left-right direction is 0.5 mm, and the length in the front-rear direction is 0.2 mm. The interval between adjacent cut marks 9 is 1.62 mm, and the distance between adjacent cut marks 9 is 1.64 mm. The alignment mark 7 is opaque, specifically, the total light transmittance is 10%. A component assembly fixing layer 3 having a thickness of 25 μm including an anthrone-based adhesive is prepared separately on the surface of the first release layer 5, and a thickness of 15 μm including an anthrone-based adhesive is prepared on the surface of the second release layer 6. The first sensitization is followed by layer 4. Next, the element assembly fixing layer 3 is disposed on the upper surface of the support layer 2 so as to include the alignment mark 7, and the first pressure-sensitive adhesive layer 4 is disposed on the lower surface of the support layer 2. As a result, as shown in FIG. 2, the element assembly temporary fixing piece including the second release layer 6, the first pressure sensitive adhesive layer 4, the support layer 2, the element assembly fixed layer 3, and the first release layer 5 in this order is obtained. 1. 2. Use of the current assembly of the component assembly (sealing of the sealed optical semiconductor device and the optical semiconductor device) Thereafter, the sealed optical semiconductor device 13 is manufactured by using the component assembly temporary fixing sheet 1, and then the optical semiconductor device 15 is manufactured. In other words, the second release layer 6 is peeled off from the first pressure-sensitive adhesive layer 4, and thereafter, as shown in FIG. 4A, a carrier 10 having a glass thickness of 700 μm is disposed on the lower surface of the first pressure-sensitive adhesive layer 4. As shown by the imaginary line arrow in Fig. 4, the first peeling layer 5 is peeled off from the upper surface of the element assembly fixing layer 3, and thereafter, as shown in Fig. 4B, a plurality of optical semiconductor elements 11 are arranged with reference to the alignment mark 8. It is disposed in the component assembly fixed layer 3. At this time, the camera visually recognizes the mark 8 from above. The thickness of the optical semiconductor element 11 is 150 μm, the length of the optical semiconductor element 11 in the left-right direction and the length in the front-rear direction are 1.14 mm, and the interval between the adjacent optical semiconductor elements 11 is 0.5 mm or more. As shown in FIG. 4C, next, the component assembly 16 is sealed by the sealing layer 12. The sealing layer 12 contains a sealing composition containing 100 parts by mass of an fluorenone resin and 15 parts by mass of a phosphor. The thickness of the sealing layer 12 is 400 μm. Thereby, the sealing element assembly 19 including the plurality of optical semiconductor elements 11 and one sealing layer 12 is obtained. As shown by the one-dot chain line in FIG. 1 and FIG. 4D, the sealing layer 12 is cut by a dicing saw with reference to the cutting mark 9, and the sealing element assembly 19 is singulated. At this time, the camera recognizes the cut mark 9 from above. The length in the left-right direction and the length in the front-rear direction of the cut seal layer 12 are respectively 100 mm. Thereby, the sealed optical semiconductor element 13 including the optical semiconductor element 11 and the sealing layer 12 is obtained in a state of being temporarily fixed to the temporary fixing member 30. Next, as shown by the arrow in FIG. 4D, each of the plurality of sealed optical semiconductor elements 13 is peeled off from the element assembly fixing layer 3. Thereafter, as shown in FIG. 4E, the sealed optical semiconductor element 13 is flip-chip mounted on the substrate 14. Example 2 (Examples corresponding to the first embodiment) A component set was obtained in the same manner as in Example 1 except that the alignment mark 7 was formed by inkjet printing and drying of a coating liquid containing carbon black. The body temporarily fixes the sheet 1, and then, the sealed optical semiconductor element 13 is manufactured using the element assembly temporary fixing sheet 1, and the optical semiconductor device 15 is subsequently manufactured. Example 3 (Examples corresponding to the modifications of the second embodiment) A laminate (trade name "TRM-6250-L", manufactured by Nitto Denko Corporation) having a thickness of 25 μm containing polyimine was prepared. The support layer 2, the element assembly fixing layer 3 having a thickness of 6 μm including an anthrone-based pressure-sensitive adhesive, and the first release layer 5 having a polyester thickness of 50 μm. The total light transmittance of support layer 2 is 95%. The linear expansion coefficient of support layer 2 is 70×10^{- 6} K^{- 1} . The tensile modulus E of the support layer 2 at 25 ° C is 60 MPa. The total light transmittance of the element assembly fixing layer 3 was 95%. The linear expansion coefficient of the component assembly fixed layer 3 is 220×10^{- 6} K^{- 1} . Next, the through hole 26 was formed in the same pattern as in the first embodiment by a YAG laser. The conditions of the YAG laser are as follows. YAG laser: MODEL5330 (manufactured by ESI) Beam diameter: 5 μm Laser power: 2.5 W Pulse repetition rate: 30 kHz Scan speed = 150 mm (mm) / sec. Thereafter, the surface is placed under the support layer 2 The first pressure-sensitive adhesive layer 4 and the second peeling layer 6 each having a thickness of 15 μm including an anthrone-based adhesive. Thereby, the element assembly temporary fixing sheet 1 is obtained. Then, the sealed assembly optical element 13 (see FIGS. 8A to 8D) is produced by using the element assembly temporary fixing sheet 1 in the same manner as in the first embodiment, and then the optical semiconductor device 15 is manufactured (see FIG. 8E). Example 4 (Examples corresponding to the third embodiment) 1. Manufacturing of the element assembly temporary fixing sheet was carried out in the same manner as in Example 1 except that the second peeling layer 6 and the first pressure-sensitive adhesive layer 4 were not provided. The component assembly is temporarily fixed to the sheet 1. That is, as shown in FIG. 9, the element assembly temporary fixing sheet 1 is provided with the support layer 2, the element assembly fixed layer 3, and the first peeling layer 5 in this order. The thickness of the component assembly temporary fixing sheet 1 is 100 μm. 2. Use of the current assembly of the component assembly (sealing of the sealed optical semiconductor device and the optical semiconductor device) Thereafter, the sealed optical semiconductor device 13 is manufactured by using the component assembly temporary fixing sheet 1, and then the optical semiconductor device 15 is manufactured. In other words, first, the first peeling layer 5 is peeled off from the element assembly fixing layer 3, and then, as shown in FIG. 10A, a carrier 10 having a glass thickness of 700 μm is placed on the upper surface of the element assembly fixing layer 3. Further, a second pressure-sensitive adhesive layer 25 including a thickness of 90 μm of the element assembly temporary fixing sheet 1 is disposed on the upper surface of the carrier 10, and the component assembly temporary fixing sheet 1 includes a support layer 2, a component assembly fixed layer 3, and The first sensitization is followed by layer 4. As shown in FIG. 10B, next, a plurality of optical semiconductor elements 11 are arranged on the upper surface of the second pressure-sensitive adhesive layer 25 with reference to the alignment mark 8. At this time, the camera visually recognizes the mark 8 from above. The size of the optical semiconductor element 11 and the size between the adjacent optical semiconductor elements 11 are the same as in the first embodiment. Thereby, the element assembly 16 including the second pressure-sensitive adhesive layer 25 and the plurality of optical semiconductor elements 11 is obtained in a state in which the carrier assembly temporary fixing sheet 1 is supported via the carrier 10. As shown in FIG. 10C, next, a plurality of optical semiconductor elements 11 of the element assembly 16 are sealed by the sealing layer 12. The sealing layer 12 contains a sealing composition containing 100 parts by mass of an fluorenone resin and 15 parts by mass of a phosphor. The thickness of the sealing layer 12 is 400 μm. Thereby, the sealing element assembly 19 including the element assembly 16 and the sealing layer 12 covering the plurality of optical semiconductor elements 11 is obtained. As shown by the alternate long and short dash line in FIG. 10D, the sealing layer 12 is cut by a dicing saw with reference to the cut mark 9. At this time, the camera recognizes the cut mark 9 from above. The length of the seal layer 12 which has been cut in the left-right direction and the length in the front-rear direction are both 1.62 mm. Thereafter, as shown by the arrow in Fig. 10E, the sealing member assembly 19 is peeled off from the upper surface of the carrier 10. Next, each of the plurality of sealed optical semiconductor elements 13 is peeled off from the second pressure-sensitive adhesive layer 25. Thereafter, as shown in FIG. 10F, the sealed optical semiconductor element 13 is flip-chip mounted on the substrate 14 to obtain the optical semiconductor device 15. Example 5 (Example corresponding to the third embodiment) A component set was obtained in the same manner as in Example 4 except that the alignment mark 7 was formed by inkjet printing and drying of a coating liquid containing carbon black. The body temporarily fixes the sheet 1. Next, the sealed optical semiconductor element 13 is manufactured using the element assembly temporary fixing sheet 1, and the optical semiconductor device 15 is subsequently manufactured. Example 6 (Examples corresponding to the fourth embodiment) The element assembly temporary fixing sheet 1 was obtained in the same manner as in Example 3 except that the second peeling layer 6 and the first pressure-sensitive adhesive layer 4 were not provided. Refer to Figure 13A). Next, the sealed optical semiconductor element 13 (see FIGS. 13A to 13E) is manufactured, and then the optical semiconductor device 15 is manufactured (see FIG. 13F). In addition, the above description is provided as an exemplified embodiment of the present invention, but it is merely illustrative and should not be construed as limiting. Variations of the invention known to those skilled in the art are included in the scope of the following claims.

1‧‧‧Component assembly temporary fixed piece
2‧‧‧Support layer
3‧‧‧Component assembly fixed layer
4‧‧‧1st pressure-sensitive layer
5‧‧‧1st peeling layer
6‧‧‧Second peeling layer
7‧‧‧ alignment mark
8‧‧‧Alignment marks
9‧‧‧cut mark
10‧‧‧ Carrier
11‧‧‧Optical semiconductor components
12‧‧‧ Sealing layer
13‧‧‧Optical semiconductor components
14‧‧‧Substrate
15‧‧‧Optical semiconductor device
16‧‧‧Component assembly
17‧‧‧Component assembly area
18‧‧‧mark forming area
19‧‧‧ Sealing element assembly
21‧‧‧Photosensitive layer
22‧‧‧Support layer
23‧‧‧Development pattern
25‧‧‧2nd pressure-sensitive layer
26‧‧‧through holes
30‧‧‧ temporary fixed components
AA‧‧‧ line

Fig. 1 is a plan view showing a first embodiment of a component assembly temporary fixing sheet of the present invention. Fig. 2 is a cross-sectional view taken along line A-A of the component assembly temporary fixing piece shown in Fig. 1. 3A to 3C are process diagrams showing a method of setting an alignment mark using photolithography, FIG. 3A shows a step (1) of preparing a support layer with a photosensitive layer and a photosensitive layer, and FIG. 3B shows a step of performing a photosensitive layer. The step of exposure, Fig. 3C shows the step (2) of developing the photosensitive layer. 4A to 4E are process diagrams showing a method of temporarily fixing a sheet using the component assembly shown in Fig. 2. Fig. 4A shows a step of disposing the carrier under the temporary assembly of the component assembly, and Fig. 4B shows a plurality of optical semiconductors. The component is temporarily fixed to the component assembly temporary fixing sheet, and FIG. 4C shows the step of sealing the plurality of optical semiconductor components by the sealing layer. FIG. 4D shows the sealing of the sealing layer and the sealing of the optical semiconductor component from the component assembly. The step of peeling the fixing piece, and FIG. 4E shows the step of flip-chip mounting the sealed optical semiconductor element on the substrate. Fig. 5 is a cross-sectional view showing a component assembly temporary fixing piece according to a modification of the first embodiment. 6A and 6B show a modification of the method of using the component assembly temporary fixing sheet of the first embodiment, and FIG. 6A shows a step of peeling the sealing element assembly from the element assembly temporary fixing sheet when the film is not cut. Fig. 6B shows a step of flip-chip mounting the sealing member assembly on the substrate. Fig. 7 is a plan view showing the component assembly temporary fixing sheet of the second embodiment. 8A to 8E are process diagrams of a method of temporarily fixing a sheet using the component assembly shown in Fig. 7. Fig. 8A shows a step of disposing the carrier under the temporary assembly of the component assembly, and Fig. 8B shows a plurality of optical semiconductors. The component is temporarily fixed to the component assembly temporary fixing member. FIG. 8C shows a step of sealing a plurality of optical semiconductor components by a sealing layer, and FIG. 8D shows that the sealing layer is cut to temporarily seal the optical semiconductor component from the component assembly. The step of peeling the fixing piece, and Fig. 8E shows the step of flip-chip mounting the sealed optical semiconductor element on the substrate. Fig. 9 is a plan view showing a third embodiment of the component assembly temporary fixing sheet of the present invention. 10A to 10F are process diagrams showing a method of temporarily fixing a sheet using the component assembly shown in Fig. 9. Fig. 10A shows that the carrier is placed on the temporary assembly of the component assembly, and the second pressure-sensitive adhesive layer is placed on Step of preparing a temporary fixing member on the carrier, FIG. 10B shows a step of temporarily fixing a plurality of optical semiconductor elements to the second pressure-sensitive adhesive layer, and FIG. 10C shows a step of sealing a plurality of optical semiconductor elements by a sealing layer. Fig. 10D shows a step of cutting the sealing layer, Fig. 10E shows a step of peeling the sealed optical semiconductor element from the second pressure-sensitive adhesive layer, and Fig. 10F shows a step of flip-chip mounting the sealed optical semiconductor element on the substrate. Fig. 11 shows a component assembly temporary fixing sheet according to a modification of the third embodiment. 12A to 12C are diagrams showing a modification of the method of using the component assembly temporary fixing sheet according to the third embodiment, and FIG. 12A shows that the second pressure-sensitive adhesive layer is temporarily fixed from the component assembly without cutting the sealing member assembly. In the step of peeling off, FIG. 12B shows a step of peeling off the optical semiconductor element and the sealing layer from the second pressure-sensitive adhesive layer, and FIG. 12C shows a step of flip-chip mounting the optical semiconductor element on the substrate. 13A to 13F are process diagrams of a method of temporarily fixing a sheet using the element assembly of the fourth embodiment, and Fig. 13A shows that the carrier is placed on the element assembly temporary fixing piece, and the second pressure sensitive layer is placed on a step of preparing a temporary fixing member on the carrier, FIG. 13B showing a step of temporarily fixing a plurality of optical semiconductor elements to the second pressure-sensitive adhesive layer, and FIG. 13C showing a step of sealing a plurality of optical semiconductor elements by a sealing layer, Fig. 13D shows a step of cutting the sealing layer, Fig. 13E shows a step of peeling the sealed optical semiconductor element from the second pressure-sensitive adhesive layer, and Fig. 13F shows a step of flip-chip mounting the sealed optical semiconductor element on the substrate.

1‧‧‧Component assembly temporary fixed piece

2‧‧‧Support layer

7‧‧‧ alignment mark

8‧‧‧Alignment marks

9‧‧‧cut mark

11‧‧‧Optical semiconductor components

12‧‧‧ Sealing layer

16‧‧‧Component assembly

17‧‧‧Component assembly area

A-A‧‧‧ line

Claims (15)

An element assembly temporary fixing sheet comprising: a component assembly fixing layer for temporarily fixing a component assembly in which a plurality of optical semiconductor elements are arranged in an array; and a support layer for fixing the component assembly Support is provided to include a synthetic resin; and an alignment mark is provided on the above support layer. The component assembly of claim 1 is temporarily fixed, wherein the alignment mark comprises a carbon material. The component assembly of claim 2 is temporarily fixed, wherein the carbon material comprises carbon black. The element assembly temporary fixing sheet according to any one of claims 1 to 3, wherein the alignment mark is a pattern set by at least one of a method including group selection of thermal transfer printing and inkjet printing. The component assembly temporary fixing sheet of claim 1, wherein the component assembly fixing layer and the support layer are transparent, and the alignment mark is opaque. The component assembly of claim 1 is temporarily fixed, wherein the alignment mark is a development pattern. The component assembly of claim 1 or 6 is temporarily fixed, wherein the alignment mark comprises silver. The component assembly temporary fixing sheet of claim 1, wherein the alignment mark penetrates through the through hole of the element assembly fixing layer and the support layer. The component assembly of claim 1 is temporarily fixed, wherein the thickness of the fixed layer of the component assembly is less than 120 μm. The component assembly temporary fixing sheet of claim 1, wherein the component assembly fixing layer is disposed on at least one side of the support layer. A method for manufacturing a component assembly temporary fixing sheet, comprising: a step (1) of preparing a support layer provided with a photosensitive layer; forming an alignment mark in the form of a development pattern from the photosensitive layer by photolithography Step (2); and a step (3) of disposing the element assembly fixing layer temporarily fixing the element assembly in which the plurality of optical semiconductor elements are arranged in the support layer. A method for manufacturing a component assembly temporary fixing sheet, comprising: a step (2) of forming an alignment mark from a carbon material on a support layer; and temporarily suspending a component assembly in which a plurality of optical semiconductor elements are arranged in an array The fixed component assembly fixing layer is disposed in the step (3) of the support layer. A method of producing a component assembly temporary fixing sheet according to claim 12, wherein the carbon material comprises carbon black. The method of manufacturing a component assembly temporary fixing sheet according to claim 12 or 13, wherein in the step (2), the alignment is formed by at least one of a method including group selection including thermal transfer printing and inkjet printing. mark. A method for manufacturing a component assembly temporary fixing sheet, comprising: a step (3) of providing a component assembly fixing layer for temporarily fixing a component assembly in which a plurality of optical semiconductor elements are arranged in an array; And a step (4) of providing a through hole penetrating through the element assembly fixing layer and the support layer as an alignment mark.