CN114613266A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
- Publication number
- CN114613266A CN114613266A CN202210217378.1A CN202210217378A CN114613266A CN 114613266 A CN114613266 A CN 114613266A CN 202210217378 A CN202210217378 A CN 202210217378A CN 114613266 A CN114613266 A CN 114613266A
- Authority
- CN
- China
- Prior art keywords
- sub
- heat dissipation
- heat dissipating
- auxiliary
- display module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 138
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101710157310 Tegument protein UL47 homolog Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display module and a display device, wherein the display module comprises: a display panel; drive chip and heat dissipation subsides, wherein, the heat dissipation subsides are the cross, including attached in the first heat dissipation part of drive chip top surface and by first heat dissipation part extends to drive chip week side and attached in the second heat dissipation part of each side of drive chip, the second heat dissipation part include respectively with a plurality of heat dissipation sub-parts that first heat dissipation part is connected, one be equipped with one on the side the heat dissipation sub-part, through pasting the design of shape to the heat dissipation promptly, make the heat dissipation subsides can attach in the surface and the side of drive chip simultaneously, promote drive chip's effective heat radiating area to promote radiating efficiency, in order to satisfy the increasingly high heat dissipation demand of drive chip, thereby solve and lead to the drive chip to become invalid and then lead to showing bad problem in advance because of the heat dissipation is not good.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a display device.
Background
With the development of display technology, the requirement of a display panel on resolution is higher and higher, and the integration level of a driving chip is higher and higher, so that the working temperature of the driving chip is increased under high-speed driving, and if the driving chip works at a high temperature for a long time, the driving chip fails in advance to cause poor display, so that how to dissipate heat of the driving chip becomes a problem to be solved.
At present, a rectangular heat dissipation paste is generally used for dissipating heat of a driving chip, but the heat dissipation paste can only be attached to the upper surface of the driving chip, so that the heat dissipation area is limited, and the requirement of a high-integration driving chip on heat dissipation cannot be met.
Disclosure of Invention
The invention provides a display module and a display device, which solve the problem of poor display caused by early failure of a driving chip due to poor heat dissipation.
In order to solve the above problem, in a first aspect, the present invention provides a display module, including:
a display panel;
the driving chip is arranged on the display panel and comprises a top surface far away from one side of the display panel and a plurality of side surfaces adjacent to the top surface and positioned on the peripheral side of the driving chip;
the heat dissipation patch is attached to the driving chip;
the heat dissipation sticker is cross-shaped and comprises a first heat dissipation part attached to the top surface and a second heat dissipation part extending to the periphery of the driving chip from the first heat dissipation part and attached to each side surface, the second heat dissipation part comprises a plurality of heat dissipation sub-parts respectively connected with the first heat dissipation part, and one side surface is provided with one heat dissipation sub-part.
In an embodiment of the display module, the plurality of side surfaces include a first side surface, a second side surface, a third side surface and a fourth side surface, and the second heat dissipation portion includes a first heat dissipation sub-portion attached to the first side surface, a second heat dissipation sub-portion attached to the second side surface, a third heat dissipation sub-portion attached to the third side surface, and a fourth heat dissipation sub-portion attached to the fourth side surface.
In an embodiment of the display module, the first heat dissipating sub-portion completely covers the first side surface, the second heat dissipating sub-portion completely covers the second side surface, the third heat dissipating sub-portion completely covers the third side surface, and the fourth heat dissipating sub-portion completely covers the fourth side surface.
In the display module provided by the embodiment of the invention, the first heat sink part completely covers the top surface of the side of the driving chip far away from the display panel.
In the display module provided in the embodiment of the present invention, the heat dissipation paste is made of metal, and the first heat dissipation sub-portion, the second heat dissipation sub-portion, the third heat dissipation sub-portion, the fourth heat dissipation sub-portion and the first heat dissipation portion surround each other and enclose the driving chip therein.
In the display module provided by the embodiment of the invention, the heat dissipation sticker further comprises an auxiliary sticking part, and the auxiliary sticking part is connected with the second heat dissipation part and stuck on the display panel.
In one embodiment of the display module, the auxiliary pasting portion includes a first auxiliary pasting sub-portion connected to a side of the first heat dissipating sub-portion away from the first heat dissipating portion, a second auxiliary pasting sub-portion connected to a side of the second heat dissipating sub-portion away from the first heat dissipating portion, a third auxiliary pasting sub-portion connected to a side of the third heat dissipating sub-portion away from the first heat dissipating portion, and a fourth auxiliary pasting sub-portion connected to a side of the fourth heat dissipating sub-portion away from the first heat dissipating portion, and the first auxiliary pasting sub-portion, the second auxiliary pasting sub-portion, the third auxiliary pasting sub-portion, and the fourth auxiliary pasting sub-portion are respectively pasted on the display panel.
In the display module according to the embodiment of the present invention, the first auxiliary pasting sub-portion is disposed opposite to the third auxiliary pasting sub-portion, the second auxiliary pasting sub-portion is disposed opposite to the fourth auxiliary pasting sub-portion, a length of the first auxiliary pasting sub-portion along a connection direction with the first heat dissipating sub-portion is greater than a length of the first heat dissipating sub-portion, and a length of the third auxiliary pasting sub-portion along a connection direction with the third heat dissipating sub-portion is greater than a length of the third heat dissipating sub-portion.
In the display module provided by the embodiment of the invention, the display module further comprises a flexible circuit board bound on the display panel, the driving chip is arranged on the flexible circuit board and electrically connected with the flexible circuit board, and the auxiliary pasting part is attached to the flexible circuit board.
In a second aspect, the present invention provides a display device, including the display module provided in the foregoing embodiment.
Has the advantages that: the invention provides a display module, a preparation method thereof and a display device, in the display panel, the heat dissipation patch attached on the driving chip is in a cross shape and comprises a first heat dissipation part attached on the top surface of the driving chip and a second heat dissipation part extending from the first heat dissipation part to the periphery of the driving chip and attached on each side surface, the second heat dissipation part comprises a plurality of heat dissipation sub-parts respectively connected with the first heat dissipation part, one side surface is provided with the heat dissipation sub-part, namely, the heat dissipation paste can be simultaneously attached to the surface and the side surface of the driving chip by designing the shape of the heat dissipation paste, so that the effective heat dissipation area of the driving chip is increased, thereby promote the radiating efficiency to satisfy the increasingly high heat dissipation demand of driver chip, thereby solve and lead to the driver chip to become invalid in advance and then lead to showing bad problem because of the heat dissipation is not good.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a display module according to the prior art;
fig. 2 is a schematic plan view of a display module according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view at position AA' in FIG. 2;
fig. 4 is a schematic plan view of a heat dissipation patch in a display module according to an embodiment of the present invention in an unfolded state;
FIG. 5 is a schematic plan view of another display module according to an embodiment of the present invention;
fig. 6 is a schematic plan view of another display module according to an embodiment of the invention, in which the heat sink is disposed in an unfolded state;
FIG. 7 is a schematic cross-sectional view of the BB' position in FIG. 5;
fig. 8 is a schematic plan view illustrating a heat dissipation patch in a display module according to another embodiment of the present invention in an unfolded state;
fig. 9 is a schematic plan view illustrating a display module according to another embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
Referring to fig. 1, a cross-sectional structure of a conventional display module in the prior art is shown, where the display module includes a display panel 210, a driving chip 220 disposed on the display panel 210, and a heat dissipation patch 230 attached to the driving chip 220, the heat dissipation patch 230 is rectangular and is only attached to an upper surface of the driving chip 220 away from the display panel 210, an outer edge of the heat dissipation patch 230 is attached to the display panel 210, and forms a cavity with a side surface of the driving chip 220, and the heat dissipation patch 230 is only attached to the upper surface of the driving chip 220, so that a heat dissipation effect is limited, which is not enough to meet a requirement of a current high-integration driving chip on heat dissipation.
In view of the above problems, embodiments of the present invention provide a display module, which is described in detail below with reference to fig. 2 to 4.
Referring to fig. 2, a plane structure of the display module and a cross-sectional structure of the display module at AA' in fig. 3 are shown, wherein the display module includes a display panel 110, a driving chip 120 and a heat dissipation patch 130;
the driving chip 120 is disposed on the display panel 110 and electrically connected to signal traces inside the display panel 110, for transmitting driving signals to the display panel 110 to drive corresponding pixels to emit light for display, wherein the driving chip 120 includes a top surface S1 far away from one side of the display panel 110, and a plurality of side surfaces S2 adjacent to the top surface S1 and located around the driving chip 120; the heat dissipation patch 130 is attached to the driving chip 120;
the heat dissipation patch 130 is cross-shaped, specifically referring to the planar structure of the heat dissipation patch 130 shown in fig. 4 in the unfolded state, the heat dissipation patch 130 includes a first heat dissipation part 131 and a second heat dissipation part 132 connected to the outer side of the first heat dissipation part 131, and the second heat dissipation part 132 includes a plurality of heat dissipation sub-parts 132a respectively connected to the outer sides of the first heat dissipation part 131;
the first heat sink member 131 is attached to the top surface S1, and each of the heat sink portions 132a extends toward the periphery of the driving chip 120 and is attached to the corresponding side surface S2.
In the display module assembly that this embodiment provided, paste the shape design for the cross through dispelling the heat, make the heat dissipation pastes and can attach in driver chip's surface and side simultaneously, promotes driver chip's effective heat radiating area to promote the radiating efficiency, with the more and more high heat dissipation demand that satisfies driver chip and bring because of the integrated level is more and more high, thereby solve and lead to the driver chip to lose efficacy and then lead to showing bad problem in advance because of the heat dissipation is not good.
In some embodiments, the top surface S1 of the driver chip 120 is rectangular, and the driver chip 120 includes four side surfaces S2 respectively adjacent to the four side surfaces of the top surface S1, that is, a first side surface, a second side surface, a third side surface and a fourth side surface; correspondingly, referring to fig. 4, the second heat dissipating part includes a first heat dissipating sub-part 1321, a second heat dissipating sub-part 1322, a third heat dissipating sub-part 1323 and a fourth heat dissipating sub-part 1324, the first heat dissipating sub-part 1321 is attached to the first side surface, the second heat dissipating sub-part 1322 is attached to the second side surface, the third heat dissipating sub-part 1323 is attached to the third side surface, and the fourth heat dissipating sub-part 1324 is attached to the fourth side surface.
Namely, the heat dissipation pastes are adhered to four side surfaces of the driving chip, so that heat generated by the driving chip during operation is conducted to all directions of the peripheral side through the conduction of the second heat dissipation part, and high heat dissipation efficiency is achieved.
In some embodiments, the first heat dissipating sub-portion 1321 completely covers the first side surface, the second heat dissipating sub-portion 1322 completely covers the second side surface, the third heat dissipating sub-portion 1323 completely covers the third side surface, and the fourth heat dissipating sub-portion 1324 completely covers the fourth side surface, and the first heat dissipating portion 131 completely covers the surface of the side of the driving chip away from the display panel, that is, all exposed surfaces of the driving chip are covered by the heat dissipating patch, so that the heat dissipating area is maximized.
In some embodiments, the heat dissipation patch 130 is made of metal, and the first heat dissipation sub-portion 1321, the second heat dissipation sub-portion 1322, the third heat dissipation sub-portion 1323, the fourth heat dissipation sub-portion 1324 and the first heat dissipation portion 131 surround each other and enclose the driving chip 120 inside, that is, the heat dissipation patch 130 can also be regarded as a metal conductive housing that encloses the driving chip 120 outside on the basis of achieving a heat dissipation function, so as to protect the driving chip 120 inside, and the driving chip 120 inside is protected from an external electric field by an electrostatic shielding function, so that a risk that the driving chip 120 is damaged by electrostatic shock is greatly reduced.
Further, the material of the heat dissipation patch 130 may be a metal material with a relatively high thermal conductivity, which is conventionally used in the art, and may be, for example, aluminum or copper.
In some embodiments, please refer to fig. 5 for a schematic plan structure of another display module, which is different from the foregoing embodiments in that the specific structure of the heat dissipation patch is different, and the plan structure of the heat dissipation patch in the unfolded state is as shown in fig. 6, wherein the heat dissipation patch 130 further includes an auxiliary bonding portion 133, the auxiliary bonding portion 133 is connected to a side of the second heat dissipation portion 132 away from the first heat dissipation portion 131, and the auxiliary bonding portion 133 is attached to the display panel 110, specifically refer to the cross-sectional structure at the position BB' in fig. 5 shown in fig. 7.
Compared with the foregoing embodiments, in the display module provided in this embodiment, the heat dissipation paste 130 is not only attached to the driving chip 120, but also further attached to the surface of the display panel 110, so as to enhance the adhesion tightness between the heat dissipation paste 130 and the driving chip 120, thereby reducing the risk of bubbles generated or even peeling off at the adhesion interface between the driving chip 120 and the heat dissipation paste 130 due to heat.
With reference to fig. 5 and fig. 6, the auxiliary attaching portion 133 includes a plurality of auxiliary attaching sub-portions 133a connected to the plurality of second heat dissipating sub-portions 132a in a one-to-one correspondence manner, respectively, a first auxiliary attaching sub-portion 1331 connected to a side of the first heat dissipating sub-portion 1321 away from the first heat dissipating portion 131, a second auxiliary attaching sub-portion 1332 connected to a side of the second heat dissipating sub-portion 1322 away from the first heat dissipating portion 131, a third auxiliary attaching sub-portion 1333 connected to a side of the third heat dissipating sub-portion 1323 away from the first heat dissipating portion 131, and a fourth auxiliary attaching sub-portion 1334 connected to a side of the fourth heat dissipating sub-portion 1324 away from the first heat dissipating portion 131, the first auxiliary sticker part 1331, the second auxiliary sticker part 1332, the third auxiliary sticker part 1333 and the fourth auxiliary sticker part 1334 are respectively attached to the display panel 110.
Further, referring to fig. 8, the first auxiliary pasting sub-portion 1331 is disposed opposite to the third auxiliary pasting sub-portion 1333, the second auxiliary pasting sub-section 1332 is disposed opposite to the fourth auxiliary pasting sub-section 1334, the length of the first auxiliary pasting sub-portion 1331 in the direction of connection with the first heat radiating sub-portion 1321 is greater than the length of the first heat radiating sub-portion 1321, the length of the third auxiliary pasting sub-portion 1333 in the direction of coupling with the third heat radiating sub-portion 1323 is greater than the length of the third heat radiating sub-portion 1323, that is, the total area of the auxiliary bonding portion 133 is further increased, and the heat dissipation paste is bonded to the driving chip and the display panel to form a planar structure of the display module, referring to fig. 9, the bonding area between the heat dissipation paste 130 and the display panel is increased, the adhesion tightness between the heat dissipation patch 130 and the driving chip 120 is further enhanced.
In some embodiments, the display module further includes a flexible printed circuit board bound on the display panel, the driving chip is disposed on the flexible printed circuit board and electrically connected to the flexible printed circuit board, compared to the previous embodiment in which the driving chip is directly disposed on the display panel, the display module can achieve the purposes of high packaging density, light weight, reduced volume, and free bending installation, and the auxiliary adhesion portion is attached to the flexible printed circuit board.
The heat dissipation efficiency of the cross-shaped heat dissipation patch in the display module provided by the embodiment of the invention is further described by combining specific experimental data as follows:
providing 12 display modules with the same model, wherein each display module comprises a display panel (the size is 75 inches, the scanning frequency is 60Hz), a flexible circuit board is bound on each display panel, a driving chip is arranged on each flexible circuit board and is an IC 1-IC 12 in the following table, and a rectangular heat dissipation patch and a cross-shaped heat dissipation patch provided by the embodiment are respectively used for verifying the heat dissipation effect, wherein the rectangular heat dissipation patch and the cross-shaped heat dissipation patch are both formed by aluminum foils, and the structure of the cross-shaped heat dissipation patch is shown in FIG. 6;
the test method is that a thermocouple (the crossriver GP10) is used for measuring the highest temperature of the surface of the IC, Z in the following table is the temperature measured when the heat dissipation paste is not attached and is used as a reference value for evaluating the heat dissipation efficiency, Y in the following table is the temperature measured when the rectangular heat dissipation paste is attached, Z in the following table is the temperature measured when the cross-shaped heat dissipation paste is attached, and the temperature difference between the front and the back of the heat dissipation paste/the temperature before the heat dissipation paste is attached is used as the heat dissipation efficiency of the heat dissipation paste, so that the heat dissipation efficiency of the rectangular heat dissipation paste is 26.30-27.30%, and the heat dissipation efficiency of the cross-shaped heat dissipation paste is 29.93-32.13%.
As can be seen from the above experimental data, in the display module provided in the embodiment of the present invention, since the cross-shaped heat dissipation patch is used, the heat dissipation efficiency is significantly improved compared to the rectangular heat dissipation patch in the prior art.
Another embodiment of the present invention further provides a display device, including the display module provided in the foregoing embodiments, where the display device includes, but is not limited to, a smart phone, a smart watch, a tablet computer, a notebook computer, a television, and the like.
The display module and the display device provided by the embodiment of the invention are described in detail, and the principle and the implementation mode of the invention are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. The utility model provides a display module assembly which characterized in that, display module assembly includes:
a display panel;
the driving chip is arranged on the display panel and comprises a top surface far away from one side of the display panel and a plurality of side surfaces adjacent to the top surface and positioned on the peripheral side of the driving chip;
the heat dissipation patch is attached to the driving chip;
the heat dissipation sticker is cross-shaped and comprises a first heat dissipation part attached to the top surface and a second heat dissipation part extending to the periphery of the driving chip from the first heat dissipation part and attached to each side surface, the second heat dissipation part comprises a plurality of heat dissipation sub-parts respectively connected with the first heat dissipation part, and one side surface is provided with one heat dissipation sub-part.
2. The display module as claimed in claim 1, wherein the plurality of side surfaces includes a first side surface, a second side surface, a third side surface and a fourth side surface, and the second heat dissipating part includes a first heat dissipating sub-part attached to the first side surface, a second heat dissipating sub-part attached to the second side surface, a third heat dissipating sub-part attached to the third side surface, and a fourth heat dissipating sub-part attached to the fourth side surface.
3. The display module of claim 2, wherein the first heat dissipating sub-portion completely covers the first side surface, the second heat dissipating sub-portion completely covers the second side surface, the third heat dissipating sub-portion completely covers the third side surface, and the fourth heat dissipating sub-portion completely covers the fourth side surface.
4. The display module as claimed in claim 3, wherein the first heat sink member completely covers a top surface of the driving chip on a side away from the display panel.
5. The display module as claimed in claim 4, wherein the heat dissipation paste is made of metal, and the first heat dissipation sub-portion, the second heat dissipation sub-portion, the third heat dissipation sub-portion, the fourth heat dissipation sub-portion and the first heat dissipation portion surround each other and enclose the driving chip therein.
6. The display module as claimed in claim 3, wherein the heat dissipation paste further comprises an auxiliary paste portion, and the auxiliary paste portion is connected to the second heat dissipation portion and is adhered to the display panel.
7. The display module as claimed in claim 6, wherein the auxiliary attaching portion includes a first auxiliary attaching sub-portion connected to a side of the first heat dissipating sub-portion away from the first heat dissipating portion, a second auxiliary attaching sub-portion connected to a side of the second heat dissipating sub-portion away from the first heat dissipating portion, a third auxiliary attaching sub-portion connected to a side of the third heat dissipating sub-portion away from the first heat dissipating portion, and a fourth auxiliary attaching sub-portion connected to a side of the fourth heat dissipating sub-portion away from the first heat dissipating portion, and the first auxiliary attaching sub-portion, the second auxiliary attaching sub-portion, the third auxiliary attaching sub-portion, and the fourth auxiliary attaching sub-portion are respectively attached to the display panel.
8. The display module according to claim 7, wherein the first auxiliary paste sub-portion is disposed opposite to the third auxiliary paste sub-portion, the second auxiliary paste sub-portion is disposed opposite to the fourth auxiliary paste sub-portion, a length of the first auxiliary paste sub-portion in a direction connecting with the first heat dissipating sub-portion is greater than a length of the first heat dissipating sub-portion, and a length of the third auxiliary paste sub-portion in a direction connecting with the third heat dissipating sub-portion is greater than a length of the third heat dissipating sub-portion.
9. The display module as claimed in claim 6, wherein the display module further comprises a flexible printed circuit board bound on the display panel, the driving chip is disposed on the flexible printed circuit board and electrically connected to the flexible printed circuit board, and the auxiliary bonding portion is attached to the flexible printed circuit board.
10. A display device, characterized in that the display device comprises the display module according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210217378.1A CN114613266A (en) | 2022-03-07 | 2022-03-07 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210217378.1A CN114613266A (en) | 2022-03-07 | 2022-03-07 | Display module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114613266A true CN114613266A (en) | 2022-06-10 |
Family
ID=81861723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210217378.1A Pending CN114613266A (en) | 2022-03-07 | 2022-03-07 | Display module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114613266A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1428830A (en) * | 2001-12-27 | 2003-07-09 | 威宇科技测试封装（上海）有限公司 | Semiconductor package with radiator |
| CN1734754A (en) * | 2004-08-14 | 2006-02-15 | 鸿富锦精密工业（深圳）有限公司 | Integrated circuit package structure and manufacture method thereof |
| CN106898587A (en) * | 2015-12-17 | 2017-06-27 | 颀邦科技股份有限公司 | Heat dissipation packaging structure |
| CN111171746A (en) * | 2020-01-03 | 2020-05-19 | 京东方科技集团股份有限公司 | Anti-static heat dissipation adhesive tape and preparation method thereof, and display device and preparation method thereof |
| CN111240069A (en) * | 2020-03-07 | 2020-06-05 | 张家刘 | Chip on film and display panel |
| CN111668172A (en) * | 2019-03-06 | 2020-09-15 | 南茂科技股份有限公司 | Thin film flip chip packaging structure |
| CN214254395U (en) * | 2020-11-19 | 2021-09-21 | 颀邦科技股份有限公司 | Flexible semiconductor package structure |
| CN214625022U (en) * | 2021-03-01 | 2021-11-05 | 惠科股份有限公司 | Chip on film, display module and display device |
| CN114068438A (en) * | 2020-07-31 | 2022-02-18 | 河南烯力新材料科技有限公司 | Thin film flip chip packaging structure and display device |
| CN114078946A (en) * | 2021-11-24 | 2022-02-22 | 京东方科技集团股份有限公司 | Display module assembly and display device |
-
2022
- 2022-03-07 CN CN202210217378.1A patent/CN114613266A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1428830A (en) * | 2001-12-27 | 2003-07-09 | 威宇科技测试封装（上海）有限公司 | Semiconductor package with radiator |
| CN1734754A (en) * | 2004-08-14 | 2006-02-15 | 鸿富锦精密工业（深圳）有限公司 | Integrated circuit package structure and manufacture method thereof |
| CN106898587A (en) * | 2015-12-17 | 2017-06-27 | 颀邦科技股份有限公司 | Heat dissipation packaging structure |
| CN111668172A (en) * | 2019-03-06 | 2020-09-15 | 南茂科技股份有限公司 | Thin film flip chip packaging structure |
| CN111171746A (en) * | 2020-01-03 | 2020-05-19 | 京东方科技集团股份有限公司 | Anti-static heat dissipation adhesive tape and preparation method thereof, and display device and preparation method thereof |
| CN111240069A (en) * | 2020-03-07 | 2020-06-05 | 张家刘 | Chip on film and display panel |
| CN114068438A (en) * | 2020-07-31 | 2022-02-18 | 河南烯力新材料科技有限公司 | Thin film flip chip packaging structure and display device |
| CN214254395U (en) * | 2020-11-19 | 2021-09-21 | 颀邦科技股份有限公司 | Flexible semiconductor package structure |
| CN214625022U (en) * | 2021-03-01 | 2021-11-05 | 惠科股份有限公司 | Chip on film, display module and display device |
| CN114078946A (en) * | 2021-11-24 | 2022-02-22 | 京东方科技集团股份有限公司 | Display module assembly and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4176979B2 (en) | Flat panel display | |
| US6476885B1 (en) | Stress-free socketed optical display package with die non-rigidly attached to containment structure | |
| US9760754B2 (en) | Printed circuit board assembly forming enhanced fingerprint module | |
| CN211879388U (en) | Photosensitive module | |
| US20140238729A1 (en) | Printed circuit board structure with heat dissipation function | |
| KR20160020181A (en) | Chip-on-film package having bending part | |
| CN210836909U (en) | Display substrate and display device | |
| US8630096B2 (en) | Large capacity memory module mounting device for portable terminal | |
| US6535262B2 (en) | Display unit for chip cards with folded sheet a method for manufacturing such a display unit | |
| CN103582286B (en) | Circuit board assemblies and camera module | |
| CN113539091B (en) | Display device | |
| CN112183396B (en) | Display assembly and display device | |
| KR20140125673A (en) | Cof package and display device including the same | |
| JP2010267954A (en) | Electronic device | |
| CN114613266A (en) | Display module and display device | |
| CN111210730A (en) | Display panel and display device | |
| CN103188869B (en) | Flexible print circuit board | |
| CN111477099B (en) | Display module and display device | |
| CN114503064B (en) | Display device and electronic apparatus | |
| CN114554811A (en) | Display module and display device | |
| CN114627792A (en) | Display module and display device | |
| JP7287579B2 (en) | Electronics | |
| CN217788389U (en) | Package and electronic device | |
| CN219536649U (en) | Display device, electronic equipment and vehicle | |
| CN210868605U (en) | Display module prevents short circuit structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |