CN111240069A - Chip on film and display panel - Google Patents
Chip on film and display panel Download PDFInfo
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- CN111240069A CN111240069A CN202010154196.5A CN202010154196A CN111240069A CN 111240069 A CN111240069 A CN 111240069A CN 202010154196 A CN202010154196 A CN 202010154196A CN 111240069 A CN111240069 A CN 111240069A
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- chip
- locking
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
- G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Abstract
The invention belongs to the technical field of display equipment, in particular to a chip on film and a display panel, which comprise a chip on film body; the chip is packaged on the side surface of the body, a heat dissipation shell is arranged outside the chip, a locking plate is arranged on the side surface of the heat dissipation shell, a fixing block is arranged at the body at the end part of the locking plate, a locking groove is formed in the side surface of the fixing block, a sliding plate is connected inside the locking groove, a first clamping groove is formed in the middle of the sliding plate, and a second clamping groove is formed in the side wall of the locking groove; a fixing plate is assembled on the fixing block, and a third clamping groove is formed in the side face of the fixing plate; the invention reduces the tearing damage of the chip on film body when the radiating shell is removed and can also improve the radiating effect of the chip on film by arranging the radiating shell and the fixed block at the chip of the chip on film body, thereby greatly improving the working effect and the service life of the chip on film and the display panel when assembling and forming the display module.
Description
Technical Field
The invention belongs to the technical field of display equipment, and particularly relates to a chip on film and a display panel.
Background
In the flat panel display device, the TFT-LCD for short has the characteristics of small volume, low power consumption, relatively low manufacturing cost, no radiation, etc., and occupies a leading position in the current flat panel display market, in the existing TFT-LCD, the chip is connected with the liquid crystal panel and the printed circuit board, the chip is packaged on the chip-on-film, along with the continuous improvement of the image quality requirement of the display device by the consumer, the quantity of the system signals and the power information processed by the chip is also larger and larger, the improvement of the load capacity can bring more heating values inevitably, therefore, the chip needs to be well cooled, and the scheme adopted by the prior art for cooling the chip is as follows: and attaching a heat dissipation patch covering the chip on the chip-on-film so as to dissipate heat of the chip.
However, after the conventional flip chip and the heat dissipation patch are bonded, when the heat dissipation patch needs to be detached, the flip chip and the heat dissipation patch are easily pulled due to large bonding force, so that poor contact between the flip chip and the gas component is caused, and if the flip chip and the heat dissipation patch are not firmly bonded, a gap is easily generated between the flip chip and the heat dissipation patch, so that the heat dissipation effect is greatly reduced.
In view of this, the invention provides a chip on film and a display panel, in which the chip of the chip on film body is provided with the heat dissipation shell and the fixing block, so as to reduce the tearing damage of the heat dissipation shell to the chip on film body when the heat dissipation shell is removed, and simultaneously improve the heat dissipation effect of the chip on film, thereby greatly improving the working effect and the service life of the chip on film and the display panel when the chip on film and the display panel are assembled and form a display module.
Disclosure of Invention
In order to make up for the defects of the prior art, the invention provides the chip on film and the display panel, and the heat dissipation shell and the fixed block are arranged at the chip of the chip on film body, so that the tearing damage of the heat dissipation shell to the chip on film body during the detachment is reduced, and the heat dissipation effect of the chip on film is improved, thereby greatly improving the working effect and the service life of the chip on film and the display panel during the assembly and the formation of the display module.
The technical scheme adopted by the invention for solving the technical problems is as follows: a chip on film comprises a chip on film body arranged in a U shape; the side surface of the end part of the body is packaged with a chip, a heat dissipation shell made of aluminum alloy material is arranged outside the chip, the heat dissipation shell can be sleeved on the outer surface of the chip and is in contact fit with the outer surface of the chip, the side surface, close to the end part of the body, of the heat dissipation shell is provided with an inclined bending type locking plate, a fixing block is arranged at the side surface of the body corresponding to the end part of the locking plate, the bottom end of the side surface, corresponding to the locking plate, of the fixing block is provided with a locking groove, and the end part of the locking plate can be extruded into the; when the flip chip is in work, the chip and the heat dissipation patch are often attached and covered on the flip chip, and after the conventional flip chip and the heat dissipation patch are bonded, when the heat dissipation patch needs to be detached, the flip chip and the heat dissipation patch are very easy to pull due to high bonding force, so that poor contact between the flip chip and the gas part is caused, and if the flip chip and the heat dissipation patch are not firmly bonded, a gap is easy to generate between the flip chip and the heat dissipation patch, so that the heat dissipation effect is greatly reduced; when the chip on film is used, the radiating shell and the fixed block are arranged at the chip of the body, when the radiating shell is assembled, the outer end of the locking plate of the radiating shell is aligned with the side wall of the fixed block, then the locking plate is extruded towards one side of the fixed block, so that the locking plate is bent towards one side of the chip under the extrusion of the side wall of the fixed block, then the radiating shell is pushed to slide into the outer surface of the chip and is sleeved, at the time, the locking plate synchronously moves to the locking groove at the inner end of the side wall of the fixed block, at the time, the locking plate resets and is clamped in the locking groove under the action of self-rebounding force, at the time, the mutually clamped locking groove and the locking plate can fix the radiating shell on the outer surface of the chip, not only is convenient and rapid, but also the tearing damage to the chip and the chip on film on body when the radiating shell is dismounted can be reduced, and the, the heat dissipation shell can effectively dissipate the heat inside the chip, so that the working quality and the service life of the chip on film are greatly enhanced.
Preferably, the end part of the side surface of the locking plate corresponding to the fixing block is provided with a first inclined surface, and the side surface of the fixing block corresponding to the first inclined surface is provided with a second inclined surface parallel to the first inclined surface; the during operation, through setting the inclined plane parallel with the corresponding both sides face of locking plate and fixed block, make the locking plate tip with the fixed block side just can be more stable and light laminating when beginning to act on, only need exert thrust to the outer terminal surface of heat dissipation shell afterwards and can make it drive an inclined plane and drive locking plate simultaneous movement when sliding on No. two inclined planes, until the locking plate moves to locking inslot portion and accomplish the assembly, reduced the assembly in-process and exerted the pressure of side direction to the locking plate in advance and make it support and press the process at the fixed block lateral wall, thereby the convenience of heat dissipation shell when the assembly has been improved greatly.
Preferably, a gap generated after the side surface of the locking plate and the chip are assembled is filled with an elastic heat-conducting silica gel sheet, and the heat-conducting silica gel sheet is assembled in the gap in an interference manner; the during operation, because the locking plate sets to the slope form, make it and chip assembly back produce the space between locking plate and chip side, thereby reduced the radiating effect of heat dissipation shell to the chip, this moment through the elastic heat conduction silica gel piece of interference fit in this space, make the locking plate and the chip side that the locking plate corresponds can carry out the heat transfer through the heat conduction silica gel piece, the heat conduction silica gel piece that has good heat conduction effect this moment can be high-efficient quick gives the locking plate and scatters and disappears for the heat transfer that produces the chip, thereby further improved the radiating effect of heat dissipation shell.
A display panel is suitable for the chip on film and comprises a panel surface, one side, far away from a chip, of the body is connected with the panel surface, one end, close to the chip, of the body is arranged to be L-shaped and connected with a printed circuit board, a through type locking groove is formed, a sliding plate is connected inside the locking groove in a sliding mode, a connecting plate is arranged at one end, far away from the chip, of the sliding plate, the connecting plate is connected with a fixed block through an elastic block, a first clamping groove is formed in the middle of the sliding plate, a second clamping groove penetrating through the end face of the fixed block is formed in the side wall, corresponding to the first clamping groove, of the locking groove, and the sliding plate can drive the first clamping groove to be aligned with the second clamping groove; the bottom end of the printed circuit board is provided with a fixed plate, a third clamping groove matched with the second clamping groove is formed in the side face of the fixed plate, a locking rod is arranged in the third clamping groove, and the locking rod can penetrate into the third clamping groove and is matched and locked with the third clamping groove; when the heat dissipation shell is assembled on the outer surface of the chip and the locking plate is inserted into the locking groove, the end part of the locking plate extrudes the sliding plate in the locking groove and drives the connecting plate to move towards the end far away from the chip, so that the first clamping groove on the sliding plate moves to be aligned with the second clamping groove on the fixed block, when the printed circuit board, the chip on film body and the panel surface are assembled into the display module, the third clamping groove on the fixing plate is aligned with the first clamping groove and the second clamping groove, then the locking rod is inserted into the three mutually aligned clamping grooves and is clamped and locked with the three mutually aligned clamping grooves, the first clamping groove fixes the locking rod under the clamping action of the locking rod, the occurrence that the locking plate is separated from the inside of the locking groove due to uncontrollable external force factors and the assembly failure of the heat dissipation shell and the chip is reduced, therefore, the flip chip thin film body, the panel surface and the printed circuit board are assembled to form the stability of the display module.
Preferably, threads are arranged inside the second clamping groove, the middle part of the locking rod is in threaded connection with the second clamping groove, and the bottom end of the locking rod and the side surface corresponding to the first clamping groove are arranged in a polished rod mode; the during operation, No. one draw-in groove, No. two draw-in grooves and No. three draw-in grooves when aliging mutually, through setting the check lock lever to threaded connection's form with No. two draw-in grooves this moment, make No. two draw-in grooves can carry out along ascending fixed of check lock lever axial direction to the check lock lever of twisting wherein, thereby make the check lock lever can carry out self location when locking above-mentioned three draw-in grooves, reduce the unexpected effect that breaks away from and lead to of check lock lever from above-mentioned three draw-in grooves inside and became invalid, simultaneously through setting the form of polished rod to the check lock lever bottom, make the motion that the check lock lever bottom can relax fix to a draw-in groove inside and locking plate, thereby convenience and high efficiency when having strengthened flip chip film body and printed circuit board assembly greatly.
Preferably, when the first clamping groove moves to be aligned with the second clamping groove, a gap is formed between the end face of the top end of the connecting plate and the side face of the body; the during operation, move to when aligning with No. two draw-in grooves through setting up a draw-in groove, there is the clearance between connecting plate top terminal surface and the body side, on the one hand can reduce the contact extrusion between the connecting plate of motion and the body side, simultaneously when needs break away from locking plate from locking inslot portion, the clearance that sets up this moment makes things convenient for the operator to extrude the connecting plate in this clearance, thereby make the connecting plate atress drive slide exert the effort and make it break away from locking inslot portion to the locking plate, and then improved the convenience and the high efficiency of radiating shell when dismantling greatly.
The invention has the following beneficial effects:
1. the chip of the chip on film body is provided with the heat dissipation shell and the fixed block, so that the assembly is convenient and quick, the tearing damage to the chip and the chip on film body caused by the disassembly of the heat dissipation shell can be reduced, and the inner wall of the assembled heat dissipation shell can also be stably contacted with the outer wall of the chip inside, so that the heat dissipation shell can more effectively dissipate the heat inside the chip, thereby greatly enhancing the working quality and the service life of the chip on film.
2. According to the invention, the locking mechanism capable of fixing the locking plate is arranged in the fixing block, so that the occurrence of assembly failure of the heat dissipation shell and the chip caused by the fact that the locking plate is separated from the locking groove due to uncontrollable external force factors is effectively reduced, and the stability of the flip chip film body, the panel surface and the printed circuit board when the flip chip film body is assembled to form the display module is improved.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is an enlarged view at A in FIG. 1;
FIG. 3 is a schematic structural view of the present invention;
FIG. 4 is an enlarged view at B in FIG. 3;
FIG. 5 is an enlarged view at C in FIG. 4;
FIG. 6 is a perspective view of a heat sink housing according to the present invention;
in the figure: the heat dissipation structure comprises a body 1, a chip 11, a heat dissipation shell 2, a locking plate 21, a first inclined surface 22, a heat conduction silica gel sheet 23, a fixing block 3, a locking groove 31, a second inclined surface 32, a sliding plate 33, a connecting plate 34, an elastic block 35, a first clamping groove 36, a second clamping groove 37, a panel surface 4, a printed circuit board 5, a fixing plate 51, a third clamping groove 52, a locking rod 53 and a gap 6.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the following embodiments.
As shown in fig. 1-6, the chip on film of the present invention comprises a chip on film body 1 disposed in a U-shape; a chip 11 is packaged on the side surface of the end part of the body 1, a heat dissipation shell 2 made of an aluminum alloy material is arranged outside the chip 11, the heat dissipation shell 2 can be sleeved on the outer surface of the chip 11 and is in contact fit with the chip 11, the side surface, close to the end part of the body 1, of the heat dissipation shell 2 is provided with an inclined bent locking plate 21, a fixed block 3 is arranged on the side surface of the body 1 corresponding to the end part of the locking plate 21, the bottom end of the side surface, corresponding to the locking plate 21, of the fixed block 3 is provided with a locking groove 31, and the end part of the locking plate 21 can be extruded into the locking groove; when the flip chip is in work, the chip 11 and the heat dissipation patch are often attached and covered on the flip chip, and after the existing flip chip and the heat dissipation patch are bonded, when the heat dissipation patch needs to be detached, the flip chip and the heat dissipation patch are very easy to pull due to high bonding force, so that poor contact between the flip chip and a gas part is caused, and if the flip chip and the heat dissipation patch are not firmly bonded, a gap 6 is easily generated between the flip chip and the heat dissipation patch, so that the heat dissipation effect is greatly reduced; when the chip on film is used, the heat dissipation shell 2 and the fixed block 3 are arranged at the chip 11 of the body 1, when the heat dissipation shell 2 is assembled, the outer end of the locking plate 21 of the heat dissipation shell 2 is aligned with the side wall of the fixed block 3, then the locking plate 21 is extruded towards one side of the fixed block 3, so that the locking plate 21 bends towards one side of the chip 11 under the extrusion of the side wall of the fixed block 3, then the heat dissipation shell 2 is pushed to slide into the outer surface of the chip 11 and is sleeved on the chip, at the moment, the locking plate 21 synchronously moves to the locking groove 31 at the inner end of the side wall of the fixed block 3, at the moment, the locking plate 21 resets and is clamped in the locking groove 31 under the action of self-rebounding force, at the moment, the mutually clamped locking groove 31 and the locking plate 21 can fix the heat dissipation shell 2 on the outer surface of the chip 11, thereby being convenient and rapid, and reducing the tearing damage to the chip 11, meanwhile, the inner wall of the assembled heat dissipation shell 2 can also be stably contacted with the outer wall of the chip 11 inside, so that the heat dissipation shell 2 can more effectively dissipate the heat inside the chip 11, and the working quality and the service life of the chip on film are greatly enhanced.
As an embodiment of the invention, the end of the side surface of the locking plate 21 corresponding to the fixing block 3 is provided with a first inclined surface 22, and the side surface of the fixing block 3 corresponding to the first inclined surface 22 is provided with a second inclined surface 32 parallel to the first inclined surface; during operation, through setting the locking plate 21 and the corresponding both sides face of fixed block 3 to parallel inclined plane, make the locking plate 21 tip with the fixed block 3 side can be more stable and light laminating when just beginning to act on, only need exert thrust to the outer terminal surface of heat dissipation shell 2 afterwards and can make it drive the synchronous motion of locking plate 21 when driving that inclined plane 22 slides on No. two inclined planes 32, until locking plate 21 moves to locking groove 31 inside and accomplish the assembly, reduced in the assembling process in advance to apply lateral pressure to locking plate 21 and make it support and press the process at fixed block 3 lateral wall, thereby the convenience of heat dissipation shell 2 when the assembly has been improved greatly.
As an embodiment of the present invention, a gap generated after the side surface of the locking plate 21 and the chip 11 are assembled is filled with an elastic heat-conducting silicone sheet 23, and the heat-conducting silicone sheet 23 is interference-assembled in the gap; the during operation, because locking plate 21 sets up to the slope form, make it produce the space with chip 11 assembly back between locking plate 21 and chip 11 side, thereby the radiating effect of heat dissipation shell 2 to chip 11 has been reduced, this moment through elastic heat conduction silica gel piece 23 of interference fit in this space, make locking plate 21 and the chip 11 side that locking plate 21 corresponds can carry out the heat transfer through heat conduction silica gel piece 23, the heat conduction silica gel piece 23 that has good heat conduction effect this moment can be high-efficient quick gives locking plate 21 and scatters and disappears for the heat transfer that chip 11 produced, thereby the radiating effect of heat dissipation shell 2 has further been improved.
A display panel is suitable for the chip on film and comprises a panel surface 4, one side, far away from a chip 11, of a body 1 is connected with the panel surface 4, one end, close to the chip 11, of the body 1 is arranged to be L-shaped and connected with a printed circuit board 5, a locking groove 31 is arranged to be through type, a sliding plate 33 is connected in the locking groove 31 in a sliding mode, one end, far away from the chip 11, of the sliding plate 33 is provided with a connecting plate 34, the connecting plate 34 is connected with a fixed block 3 through an elastic block 35, the middle of the sliding plate 33 is provided with a first clamping groove 36, the side wall of the locking groove 31 corresponding to the first clamping groove 36 is provided with a second clamping groove 37 penetrating through the end face of the fixed block 3, and the sliding plate 33 can drive the first clamping groove 36 to be aligned with the second clamping groove; a fixing plate 51 is arranged at the bottom end of the printed circuit board 5, a third clamping groove 52 matched with the second clamping groove 37 is formed in the side face of the fixing plate 51, a locking rod 53 is arranged inside the third clamping groove 52, and the locking rod 53 can be inserted into the third clamping groove and matched with the third clamping groove for locking; when the heat dissipation module is in operation, when the heat dissipation shell 2 is assembled on the outer surface of the chip 11 and the locking plate 21 is inserted into the locking groove 31, the end of the locking plate 21 extrudes the sliding plate 33 inside the locking groove 31 and drives the connecting plate 34 to move towards the end far away from the chip 11, so that the first engaging groove 36 on the sliding plate 33 moves to align with the second engaging groove 37 on the fixing block 3, when the printed circuit board 5 is assembled with the flip-chip film body 1 and the panel surface 4 into the display module, the third engaging groove 52 on the fixing plate 51 aligns with the first engaging groove 36 and the second engaging groove 37, then the locking rod 53 is inserted into the three aligned engaging grooves and is locked with the three aligned engaging grooves, at this time, the first engaging groove 36 fixes the locking rod 53 under the engaging action of the locking rod 53, thereby reducing the occurrence of assembling failure of the heat dissipation shell 2 and the chip 11 caused by the locking plate 21 being separated from the inside of the locking groove 31 due to uncontrollable external force, thereby improving the stability of the flip chip film body 1, the panel surface 4 and the printed circuit board 5 when assembling and forming the display module.
As an embodiment of the present invention, a thread is disposed inside the second engaging groove 37, the middle of the locking rod 53 is connected to the second engaging groove 37 by a thread, and the bottom end of the locking rod 53 is disposed on the side corresponding to the first engaging groove 36 in the form of a polish rod; in operation, No. one draw-in groove 36, No. two draw-in grooves 37 and No. three draw-in grooves 52 when being aligned, through setting the check lock lever 53 and No. two draw-in grooves 37 to threaded connection's form this moment, make No. two draw-in grooves 37 can carry out along the ascending fixed of check lock lever 53 axial direction to the check lock lever 53 that twists wherein, thereby make check lock lever 53 can carry out self location when locking above-mentioned three draw-in grooves, reduce the unexpected effect that breaks away from and lead to of check lock lever 53 from above-mentioned three draw-in grooves inside and inefficacy, simultaneously through setting the form of polished rod to the check lock lever 53 bottom, make the motion that the check lock lever 53 bottom can be relaxed to draw-in groove 36 inside and fix jam plate 21, thereby convenience and high efficiency when having strengthened flip chip film body 1 and printed circuit board 5 equipment greatly.
As an embodiment of the present invention, when the first engaging groove 36 moves to align with the second engaging groove 37, a gap 6 is provided between the end surface of the top end of the connecting plate 34 and the side surface of the body 1; the during operation, move to the time of being aligned with No. two draw-in grooves 37 through setting up draw-in groove 36, there is clearance 6 between connecting plate 34 top terminal surface and the body 1 side, on the one hand can reduce the contact extrusion between the connecting plate 34 of motion and the body 1 side, simultaneously when needs break away from locking plate 21 from locking groove 31 is inside, clearance 6 that set up this moment makes things convenient for the operator to extrude this clearance 6 interior connecting plate 34, thereby make connecting plate 34 atress drive slide 33 exert the effort and make it break away from locking groove 31 inside to locking plate 21, and then improved radiating shell 2 convenience and high efficiency when dismantling greatly.
When the radiating shell 2 and the fixing block 3 are arranged at the chip 11 of the body 1, when the radiating shell 2 is assembled, the outer end of the locking plate 21 of the radiating shell 2 is aligned with the side wall of the fixing block 3, then the locking plate 21 is extruded towards one side of the fixing block 3, so that the locking plate 21 is bent towards one side of the chip 11 under the extrusion of the side wall of the fixing block 3, then the radiating shell 2 is pushed to slide into the outer surface of the chip 11 and is sleeved, at the moment, the locking plate 21 also synchronously moves to the locking groove 31 at the inner end of the side wall of the fixing block 3, at the moment, the locking plate 21 resets and is clamped in the locking groove 31 under the action of self-rebounding force, at the moment, the locking groove 31 and the locking plate 21 which are mutually clamped can fix the radiating shell 2 on the outer surface of the chip 11, thereby being convenient and rapid, and reducing the tearing damage to the chip 11 and the chip coated film, meanwhile, the inner wall of the assembled heat dissipation shell 2 can also be stably contacted with the outer wall of the chip 11 inside, so that the heat dissipation shell 2 can more effectively dissipate heat inside the chip 11, and the working quality and the service life of the chip on film are greatly enhanced; when the heat dissipation housing 2 is assembled on the outer surface of the chip 11 and the locking plate 21 is inserted into the locking groove 31, the end of the locking plate 21 presses the sliding plate 33 inside the locking groove 31 and drives the connecting plate 34 to move towards the end away from the chip 11, so that the first engaging groove 36 on the sliding plate 33 moves to align with the second engaging groove 37 on the fixing block 3, when the printed circuit board 5 is assembled with the flip-chip film body 1 and the panel surface 4 into a display module, the third engaging groove 52 on the fixing plate 51 aligns with the first engaging groove 36 and the second engaging groove 37, and then the locking rod 53 is inserted into the three aligned engaging grooves and is locked with the three aligned engaging grooves, at this time, the first engaging groove 36 fixes the locking rod 53 under the engaging action of the locking rod 53, thereby reducing the occurrence of assembling failure of the heat dissipation housing 2 and the chip 11 caused by the locking plate 21 being separated from the inside of the locking groove 31 due to uncontrollable external force, thereby improving the stability of the flip chip film body 1, the panel surface 4 and the printed circuit board 5 when assembling and forming the display module.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A chip on film comprises a chip on film body (1) arranged in a U shape; the method is characterized in that: body (1) tip side surface is packaged with chip (11), chip (11) outside is equipped with heat dissipation shell (2) that aluminum alloy material made, heat dissipation shell (2) can the suit contact the laminating on chip (11) surface and with it, the side that heat dissipation shell (2) is close to body (1) tip sets the formula of buckling locking plate (21) of slope to, and body (1) side department that this locking plate (21) tip corresponds is equipped with fixed block (3), fixed block (3) are provided with locking groove (31) with the corresponding side bottom of locking plate (21), locking plate (21) tip can be extruded into locking groove (31) inside and with it cooperation locking.
2. The chip on film of claim 1, wherein: the end part of the side surface of the locking plate (21) corresponding to the fixing block (3) is provided with a first inclined surface (22), and the side surface of the fixing block (3) corresponding to the first inclined surface (22) is provided with a second inclined surface (32) parallel to the first inclined surface.
3. The chip on film of claim 2, wherein: a gap generated after the side face of the locking plate (21) and the chip (11) are assembled is filled with an elastic heat-conducting silica gel sheet (23), and the heat-conducting silica gel sheet (23) is assembled in the gap in an interference mode.
4. A display panel adapted for use with a flip-chip on film according to any one of claims 1-3, comprising a panel plane (4), characterized in that: one side of the body (1) far away from the chip (11) is connected with the panel surface (4), one end of the body (1) close to the chip (11) is arranged in an L shape and is connected with a printed circuit board (5), the locking groove (31) is arranged in a through type, a sliding plate (33) is connected in the locking groove (31) in a sliding way, one end of the sliding plate (33) far away from the chip (11) is provided with a connecting plate (34), the connecting plate (34) is connected with the fixed block (3) through an elastic block (35), a first clamping groove (36) is arranged in the middle of the sliding plate (33), a second clamping groove (37) penetrating to the end face of the fixing block (3) is arranged on the side wall of the locking groove (31) corresponding to the first clamping groove (36), the sliding plate (33) can drive the first clamping groove (36) to be aligned with the second clamping groove (37) when sliding in the locking groove (31); printed circuit board (5) bottom is equipped with fixed plate (51), be provided with No. three draw-in grooves (52) with No. two draw-in grooves (37) matched with on fixed plate (51) side, No. three draw-in grooves (52) inside is equipped with check lock lever (53), check lock lever (53) can alternate in above-mentioned three draw-in grooves inside and cooperate the locking with it.
5. The display panel according to claim 4, wherein: the inside screw thread that is provided with of No. two draw-in grooves (37), just locking lever (53) middle part and No. two draw-in grooves (37) threaded connection, the side department that locking lever (53) bottom and draw-in groove (36) correspond sets the form into the polished rod.
6. The display panel according to claim 5, wherein: when the first clamping groove (36) moves to be aligned with the second clamping groove (37), a gap (6) is formed between the end face of the top end of the connecting plate (34) and the side face of the body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010154196.5A CN111240069A (en) | 2020-03-07 | 2020-03-07 | Chip on film and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010154196.5A CN111240069A (en) | 2020-03-07 | 2020-03-07 | Chip on film and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111240069A true CN111240069A (en) | 2020-06-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010154196.5A Pending CN111240069A (en) | 2020-03-07 | 2020-03-07 | Chip on film and display panel |
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| CN (1) | CN111240069A (en) |
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| CN114613266A (en) * | 2022-03-07 | 2022-06-10 | 深圳市华星光电半导体显示技术有限公司 | Display module and display device |
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| CN203406277U (en) * | 2013-08-13 | 2014-01-22 | 深圳Tcl新技术有限公司 | Radiating fin, source electrode driving chip heat dissipation structure and liquid crystal display apparatus |
| CN103887255A (en) * | 2014-03-06 | 2014-06-25 | 京东方科技集团股份有限公司 | Chip-on-film and display device |
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| CN114613266A (en) * | 2022-03-07 | 2022-06-10 | 深圳市华星光电半导体显示技术有限公司 | Display module and display device |
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