JP2014216610A - Heat dissipation structure and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipation structure capable of making an electronic apparatus thin and improving efficiency of heat dissipation, and the electronic apparatus.SOLUTION: The heat dissipation structure comprises: a first sheet-like thermal diffusion member 15 for diffusing heat from a heating element in a sheet face direction; an extension thermal diffusion member 12 extending in a predetermined direction and thermally connected with the first sheet-like thermal diffusion member for diffusing heat from the first sheet-like thermal diffusion member in the predetermined direction; and a second sheet-like thermal diffusion member 11 formed in a sheet shape and thermally connected with the extension thermal diffusion member for diffusing heat from the extension thermal diffusion member in the sheet face direction.

Description

  The present invention relates to a heat dissipation structure that dissipates heat generated by a heating element, and an electronic device that incorporates the heat dissipation structure.

  2. Description of the Related Art In recent years, portable electronic devices tend to increase the heat generation of built-in electronic components due to high performance, and there is a need for efficient heat dissipation of the built-in heat dissipation structure. Further, in such portable electronic devices, a heat dissipation structure corresponding to a reduction in thickness is also required.

  As a technique for thinning a heat dissipation structure, for example, in Patent Document 1, a fan mechanism that has a case and a blade member accommodated in the case and sucks and exhausts by rotating the blade member, and a blade A cover which is attached to the case 16 so as to cover the member and can conduct heat, and a heat pipe as a heat transfer mechanism for transmitting heat generated from a heating element provided outside the case to the cover. A heat dissipation device is disclosed.

  Moreover, in patent document 2, the circuit board part which has the heat receiving area | region thermally connected to a heat-emitting component, the thermal radiation area | region which becomes low temperature compared with the said heat receiving area | region, and the 1st edge part attached to the said heat receiving area | region And a heat diffusing member having a second end attached to the heat dissipation region is disclosed.

JP 2005-158979 A JP 2007-115097 A

  The following analysis is given by the inventor.

  However, in the heat radiating device described in Patent Document 1, since the heat pipe is superposed on the heat generator via the heat diffusing portion (the structure superposed in the thickness direction), A large thickness is required, and it is difficult to reduce the thickness of the electronic device. In addition, since the heat dissipating device described in Patent Document 1 has a structure in which heat pipes are stacked on the fan cover, the heat pipe, the cover, and the case need to be thick, and the size of the electronic device is increased. It is difficult to reduce the thickness of the electronic device.

  Furthermore, in the board unit described in Patent Document 2, the heat generated by the heat generating component is transferred to the heat diffusing member through the heat receiving area of the circuit board portion, so that the amount of heat generated by the heat generating component is small and the heat dissipation is efficient. It is difficult to make it.

  The main subject of this invention is providing the heat dissipation structure and electronic device which can aim at thickness reduction of an electronic device, and efficiency improvement of heat dissipation.

  According to a first aspect of the present invention, in the heat dissipation structure, a first sheet-like heat diffusion member that is formed in a sheet shape and diffuses heat from the heating element in the sheet surface direction, and extends in a predetermined direction. And an extended heat diffusion member that is thermally connected to the first sheet-like heat diffusion member and diffuses heat from the first sheet-like heat diffusion member in the predetermined direction; A second sheet-like heat diffusion member that is formed and thermally connected to the extended heat diffusion member and diffuses heat from the extended heat diffusion member in the sheet surface direction. It is characterized by.

  According to a second aspect of the present invention, an electronic device includes the heat dissipation structure, the heating element, and a printed wiring board on which the heating element is mounted.

  In a third aspect of the present invention, in the heat dissipation method, heat from the heating element is diffused in the sheet surface direction in the first sheet-like heat diffusion member, and heat from the first sheet-like heat diffusion member is extended. The heat diffusion member diffuses in the extending direction, and heat from the extended heat diffusion member is diffused in the sheet surface direction in the second sheet-like heat diffusion member.

  According to the present invention, it is possible to reduce the thickness and increase the efficiency of heat dissipation.

It is the top view which showed typically the structure of the thermal radiation structure which concerns on Embodiment 1 of this invention. It is sectional drawing between AA 'of FIG. 1, and BB' of FIG. 1 which showed the structure of the thermal radiation structure which concerns on Embodiment 1 of this invention typically. It is the top view which showed typically the structure of the electronic device which concerns on Embodiment 2 of this invention. It is sectional drawing between AA 'of FIG. 3, and BB' of FIG. 3 which showed the structure of the electronic device which concerns on Embodiment 2 of this invention typically. It is the top view which showed typically the structure of the electronic device which concerns on Embodiment 3 of this invention. It is sectional drawing between AA 'of FIG. 5, and BB' of FIG. 5 which showed the structure of the electronic device which concerns on Embodiment 3 of this invention typically. It is the top view which showed typically the structure of the thermal radiation structure which concerns on Embodiment 4 of this invention. It is sectional drawing between AA 'of FIG. 7, and BB' which showed typically the structure of the thermal radiation structure which concerns on Embodiment 4 of this invention.

[Embodiment 1]
A heat dissipation structure according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view schematically showing a configuration of a heat dissipation structure according to Embodiment 1 of the present invention. 2 is a cross-sectional view between AA ′ and BB ′ in FIG. 1 schematically showing the configuration of the heat dissipation structure according to Embodiment 1 of the present invention.

  The heat dissipating structure 2 in FIG. 1 is a structure that dissipates heat generated by the electronic component 14 serving as a heat generating element. The heat dissipation structure 2 is mounted (built in or mounted) in a housing of the electronic device. The heat dissipation structure 2 includes a heat diffusion sheet 11, a heat pipe 12, and a heat diffusion sheet 15.

  The thermal diffusion sheet 11 is a thermal diffusion member formed in a sheet shape. The thermal diffusion sheet 11 is thermally connected (fixed here) to the heat pipe 12 at a predetermined position on the lower surface (the lower surface in FIG. 2). The heat diffusion sheet 11 has the same surface (upper surface in FIG. 2) and heat as the back surface of the electronic component 14 in the heat pipe 12 (surface opposite to the main surface electrically connected to the printed wiring board 13). Connected. The heat diffusion sheet 11 mainly serves as a cooling unit that diffuses heat from the heat pipe 12 in the sheet surface direction and transmits the heat to the outside (including outside air) or other members. The thickness of the heat diffusion sheet 11 is thinner than the thickness of the heat pipe 12 and thinner than the thickness of the electronic component 14. The thermal diffusion sheet 11 can be made of a material that can be thinned and has a higher thermal conductivity than copper. For example, a graphite sheet can be used.

  The heat pipe 12 is a heat diffusion member extending in a predetermined direction. The heat pipe 12 is thermally connected to the thermal diffusion sheet 11 at a predetermined position on the upper surface (the upper surface in FIG. 2), and is thermally connected to the thermal diffusion sheet 15 at another predetermined position. It is connected. The heat pipe 12 diffuses the heat from the heat diffusion sheet 15 in a predetermined direction (longitudinal direction) and makes it uniform and transmits the heat to the heat diffusion sheet 11. The heat pipe 12 is disposed so as not to overlap the electronic component 14 in the thickness direction of the electronic component 14 that generates heat. The heat pipe 12 is disposed adjacent to the side end surface of the electronic component 14. The thickness of the heat pipe 12 is thinner than the thickness of the electronic component 14. The heat pipe 12 can be made of a material having high thermal conductivity. For example, a volatile liquid (hydraulic fluid such as hydrodynamic fluid) is contained in a pipe made of a material having high thermal conductivity (for example, copper or aluminum). It is possible to use those encapsulating chlorofluorocarbons, alternative fluorocarbons such as hydrofluorocarbons).

  The thermal diffusion sheet 15 is a thermal diffusion member formed in a sheet shape. The thermal diffusion sheet 15 is thermally connected (fixed here) to the heat pipe 12 at a predetermined position on the lower surface (the lower surface in FIG. 2), and the electronic component 14 at another predetermined position. And thermally connected. The heat diffusion sheet 15 has the same surface (upper surface in FIG. 2) and heat as the back surface of the electronic component 14 in the heat pipe 12 (the surface opposite to the main surface electrically connected to the printed wiring board 13). Connected. The thermal diffusion sheet 15 is thermally connected to the back surface of the electronic component 14 (the surface on the opposite side to the main surface electrically connected to the printed wiring board 13, the upper surface in FIG. 2). The heat diffusion sheet 15 mainly serves as a heat receiving portion that receives the heat generated by the electronic component 14 serving as a heat generating element, and diffuses the received heat in the surface direction of the sheet and transmits it to the heat pipe 12. The thickness of the thermal diffusion sheet 15 is thinner than the thickness of the heat pipe 12 and thinner than the thickness of the electronic component 14. The thermal diffusion sheet 15 can be made of a material that can be thinned and has a higher thermal conductivity than copper, and for example, a graphite sheet can be used.

  An electronic component 14 is mounted (mounted) on the printed wiring board 13 to be cooled. Components (not shown) other than the electronic component 14 may be mounted on the printed wiring board 13. In addition, the electronic component 14 to be cooled is a heating element that generates heat during operation of the electronic device. A metal shield frame or the like for noise suppression may be mounted on the upper surface of the electronic component 14. In addition, on the back surface of the electronic component 14 (the surface on the opposite side to the main surface electrically connected to the printed wiring board 13, the upper surface in FIG. 2), grease or an adhesive is added to increase contact stability. It may be applied or filled with heat conductive resin or heat conductive rubber.

  In addition, although the thermal diffusion sheet | seats 11 and 15 are used for both a heat receiving part and a cooling part, you may make either one into a conventional structure.

  Next, the operation of the heat dissipation structure according to Embodiment 1 of the present invention will be described.

  The electronic component 14 generates heat during operation. The heat generated by the electronic component 14 is transmitted to the heat pipe 12 via the thermal diffusion sheet 15. The heat pipe 12 transfers heat to the heat diffusion sheet 11 fixed to the heat pipe 12 in order to diffuse the heat from the heat diffusion sheet 15. The heat transmitted to the thermal diffusion sheet 11 is radiated to the surrounding air and other media such as other members.

  According to the first embodiment, by using the thermal diffusion sheets 11 and 15 that are thermally connected to the heat pipe 12, heat can be diffused in the sheet surface direction. It is possible to arrange the pipe 12 so as not to overlap the thickness direction of the electronic component 14, and the thickness can be reduced. Further, according to the first embodiment, by using the thermal diffusion sheets 11 and 15, the heat transmission path of the electronic component 14 can be increased while being thinned, and the efficiency of heat dissipation can be improved. Furthermore, according to the first embodiment, the heat generated by the electronic component 14 serving as a heating element is diffused over a wide area through the thermal diffusion sheet 15, the heat pipe 12, and the thermal diffusion sheet 11. 14 and the surrounding temperature can be lowered.

[Embodiment 2]
An electronic apparatus according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 3 is a plan view schematically showing the configuration of the electronic apparatus according to the second embodiment of the present invention. FIG. 4 is a cross-sectional view taken along the line AA ′ and BB ′ in FIG. 3 schematically showing the configuration of the electronic apparatus according to the second embodiment of the present invention. In FIG. 3, the internal frame 19 and the bonding portion 20 are omitted.

  In the second embodiment, the heat dissipation structure (2 in FIG. 1) of the first embodiment is modified and mounted in the housing 17 of the electronic device 1. The electronic device 1 can be applied to a thin and portable device such as a mobile phone, a smartphone, a game machine, a tablet PC (Personal Computer), a notebook PC, a PDA (Personal Data Assistants), a digital camera, and the like. The electronic device 1 includes a heat dissipation structure 2, a printed wiring board 13, an electronic component 14, a shield frame 16, a casing 17, a battery 18, an internal frame 19, and an adhesive portion 20.

  The heat dissipating structure 2 is a structure that dissipates heat generated by the electronic component 14 serving as a heat generating element. The heat dissipation structure 2 is mounted (built in or mounted) in the housing 17 of the electronic device 1. The heat dissipation structure 2 includes a heat diffusion sheet 11, a heat pipe 12, and a heat diffusion sheet 15.

  The thermal diffusion sheet 11 is a thermal diffusion member formed in a sheet shape. The thermal diffusion sheet 11 is thermally connected (fixed here) to the heat pipe 12 at a predetermined position on the lower surface (lower surface in FIG. 4), and is connected to the battery 18 at another predetermined position. Thermally connected. The thermal diffusion sheet 11 is thermally connected (fixed here) to the internal frame 19 on the upper surface (the upper surface in FIG. 4). The heat diffusion sheet 11 has the same surface (upper surface in FIG. 4) and heat as the back surface of the electronic component 14 in the heat pipe 12 (surface opposite to the main surface electrically connected to the printed wiring board 13). Connected. The heat diffusion sheet 11 mainly serves as a cooling unit that diffuses heat from the heat pipe 12 in the sheet surface direction and transmits the heat to the outside (including outside air), the battery 18, the housing 17, the internal frame 19, and the like. The thickness of the heat diffusion sheet 11 is thinner than the thickness of the heat pipe 12 and thinner than the thickness of the electronic component 14 and the battery 18. The thermal diffusion sheet 11 can be made of a material that can be thinned and has a higher thermal conductivity than copper. For example, a graphite sheet can be used.

  The heat pipe 12 is a heat diffusion member extending in a predetermined direction. The heat pipe 12 is thermally connected to the thermal diffusion sheet 11 at a predetermined position on the upper surface (the upper surface in FIG. 4), and is connected to the internal frame via the bonding portion 20 at another predetermined position. 19 is thermally connected (fixed here). The heat pipe 12 is thermally connected to the thermal diffusion sheet 15 at a predetermined position on the lower surface (the lower surface in FIG. 4). The heat pipe 12 diffuses the heat from the heat diffusion sheets 11 and 15 in a predetermined direction (longitudinal direction) and makes it uniform, and transmits the heat to the internal frame 19 via the bonding portion 20. The heat pipe 12 is disposed so as not to overlap the electronic component 14 and the battery 18 in the thickness direction of the electronic component 14 and the battery 18 that generate heat. The heat pipe 12 is disposed adjacent to the side end surface of the battery 18. The heat pipe 12 is disposed so as to be adjacent to the side wall surface of the shield frame 16 through the heat diffusion sheet 15. The thickness of the heat pipe 12 is thinner than the thickness of the electronic component 14 and the battery 18. The heat pipe 12 can be made of a material having high thermal conductivity. For example, a volatile liquid (hydraulic fluid such as hydrodynamic fluid) is contained in a pipe made of a material having high thermal conductivity (for example, copper or aluminum). It is possible to use those encapsulating chlorofluorocarbons, alternative fluorocarbons such as hydrofluorocarbons).

  The thermal diffusion sheet 15 is a thermal diffusion member formed in a sheet shape. The thermal diffusion sheet 15 is thermally connected (fixed here) to the shield frame 16 at a predetermined position on the lower surface (the lower surface in FIG. 4). The thermal diffusion sheet 15 is thermally connected (fixed here) to the heat pipe 12 at a predetermined position on the upper surface (the upper surface in FIG. 4). The heat diffusion sheet 15 is thermally connected to the same surface (the lower surface in FIG. 4) as the main surface (surface electrically connected to the printed wiring board 13) of the electronic component 14 in the heat pipe 12. ing. The heat diffusion sheet 15 is thermally connected to the back surface of the electronic component 14 (the surface opposite to the main surface electrically connected to the printed wiring board 13, the upper surface in FIG. 4) through the shield frame 16. ing. The thermal diffusion sheet 15 is disposed between the adjacent heat pipe 12 and the side wall surface of the shield frame 16. The heat diffusion sheet 15 mainly serves as a heat receiving portion that receives the heat generated by the electronic component 14 serving as a heat generating element, and diffuses the received heat in the surface direction of the sheet and transmits it to the heat pipe 12. The thickness of the heat diffusion sheet 15 is thinner than the thickness of the heat pipe 12 and thinner than the thickness of the electronic component 14 and the battery 18. The thermal diffusion sheet 15 can be made of a material that can be thinned and has a higher thermal conductivity than copper, and for example, a graphite sheet can be used.

  The printed wiring board 13 is a board in which wiring (not shown) is printed on an insulating plate (not shown). The printed wiring board 13 is mounted inside the housing 17. The printed wiring board 13 is arranged at a predetermined interval from the internal frame 19. The printed wiring board 13 has an electronic component 14 mounted (mounted) on an upper surface (the upper surface in FIG. 4), and a shield frame 16 disposed so as to cover the electronic component 14 is mounted. Note that components (not shown) other than the electronic component 14 may be mounted on the printed wiring board 13.

  The electronic component 14 is an electronic component that generates heat when operated. The electronic component 14 is mounted (mounted) at a predetermined position on the upper surface (the upper surface in FIG. 4) of the printed wiring board 13. The electronic component 14 is electrically connected to the printed wiring board 13 on the main surface (the surface electrically connected to the printed wiring board 13, the lower surface in FIG. 4). The electronic component 14 is covered with a shield frame 16. The electronic component 14 is thermally connected to the shield frame 16 on the back surface (the surface opposite to the main surface electrically connected to the printed wiring board 13, the upper surface in FIG. 4). In addition, in order to improve contact stability, the back surface (the surface opposite to the main surface electrically connected to the printed wiring board 13 or the upper surface in FIG. 4) of the electronic component 14 is coated with grease or an adhesive. It may be applied or filled with heat conductive resin or heat conductive rubber.

  The shield frame 16 is a thin metal frame. The shield frame 16 is for absorbing noise generated in the electronic component 14 and reinforcing the printed wiring board 13. The shield frame 16 is disposed so as to cover the electronic component 14 and is mounted on the printed wiring board 13. The shield frame 16 is thermally connected to the back surface of the electronic component 14 (the surface on the opposite side to the main surface electrically connected to the printed wiring board 13, the upper surface in FIG. 4). The shield frame 16 is thermally connected (fixed here) to the thermal diffusion sheet 15 on the upper surface (the upper surface in FIG. 4).

  The housing 17 is a box-shaped case that stores various components, and is an exterior case of an electronic device. The housing 17 is configured by combining a plurality of components so as to be assembled.

  The battery 18 is a power source for operating the electronic device 1. The battery 18 is housed inside the housing 17. The battery 18 is held by the housing 17 and is held by the internal frame 19 via the heat diffusion sheet 11. The battery 18 is thermally connected to the thermal diffusion sheet 11.

  The internal frame 19 is a frame that is fixed inside the housing 17. The internal frame 19 is thermally connected (fixed here) to the heat pipe 12 via an adhesive portion 20. The thermal diffusion sheet 11 is thermally connected (fixed here) to the internal frame 19.

  The bonding portion 20 is a portion that bonds the heat pipe 12 to the internal frame 19. For the bonding portion 20, for example, a heat conductive adhesive, a heat conductive resin, a heat conductive rubber, or the like can be used.

  Next, the operation of the heat dissipation structure according to Embodiment 2 of the present invention will be described.

  The electronic component 14 of the electronic device 1 generates heat during operation. The heat generated in the electronic component 14 is transmitted to the heat pipe 12 through the shield frame 16 and the heat diffusion sheet 15. The heat pipe 12 transfers heat to the heat diffusion sheet 11 fixed to the heat pipe 12 in order to diffuse the heat from the heat diffusion sheet 15. The heat transmitted to the heat diffusion sheet 11 is dissipated to the surrounding air, the battery 18, the casing 17, the internal frame 19, and the like.

  According to the second embodiment, the same effect as that of the first embodiment is obtained, and since heat is diffused over a wide area through the heat diffusion sheet 15, the heat pipe 12, and the heat diffusion sheet 11, the electronic component 14 and the electronic The temperature of the housing 17 above the component 14 can be lowered.

  If the configuration of the second embodiment is not used, the heat stays around the electronic component 14 and becomes high temperature. When the periphery of the electronic component 14 becomes high temperature, a failure or malfunction of the electronic component 14 occurs. Even when a failure or malfunction does not occur, the casing 17 above the electronic component 14 becomes high temperature.

[Embodiment 3]
An electronic apparatus according to Embodiment 3 of the present invention will be described with reference to the drawings. FIG. 5 is a plan view schematically showing the configuration of an electronic apparatus according to Embodiment 3 of the present invention. 6 is a cross-sectional view taken along the line A-A 'and the line B-B' in FIG. 5 schematically showing the configuration of the electronic apparatus according to the third embodiment of the present invention. In FIG. 5, the inner frame 19 and the bonding portion 20 are omitted.

  The third embodiment is a modification of the second embodiment, and the configuration of the heat pipe 12 is the same. However, the printed wiring board 13 and the battery 18 are stacked in the thickness direction of the printed wiring board 13. An electronic component 22 different from the electronic component 14 mounted on the electronic component 14 can also dissipate heat. The electronic device 1 includes a heat dissipation structure 2 (a heat diffusion sheet 11, a heat pipe 12, a heat diffusion sheet 15), a printed wiring board 13, an electronic component 14, a shield frame 16, a housing 17, and a battery 18. The inner frame 19, the bonding portion 20, the shield frame 21, and the electronic component 22. The heat pipe 12, the thermal diffusion sheet 15, the electronic component 14, the shield frame 16, the housing 17, the internal frame 19, and the bonding portion 20 are the same as those in the second embodiment.

  The thermal diffusion sheet 11 is a thermal diffusion member formed in a sheet shape. The thermal diffusion sheet 11 is thermally connected (fixed here) to the shield frame 21 at a predetermined position on the lower surface (the lower surface in FIG. 6). The thermal diffusion sheet 11 is thermally connected (fixed here) to the heat pipe 12 at a predetermined position on the upper surface (the upper surface in FIG. 6). The heat diffusion sheet 11 is thermally connected to the same surface (the lower surface in FIG. 6) as the main surface (surface electrically connected to the printed wiring board 13) of the electronic component 22 in the heat pipe 12. ing. The thermal diffusion sheet 11 is thermally connected to the back surface of the electronic component 22 (the surface opposite to the main surface electrically connected to the printed wiring board 13, the upper surface in FIG. 6) via the shield frame 21. ing. The thermal diffusion sheet 11 is disposed between the adjacent heat pipe 12 and the side wall surface of the shield frame 21. The heat diffusion sheet 11 mainly serves as a heat receiving portion that receives the heat generated by the electronic component 22 serving as a heat generating element, and diffuses the received heat in the surface direction of the sheet and transmits it to the heat pipe 12. The thickness of the heat diffusion sheet 11 is thinner than the thickness of the heat pipe 12 and thinner than the thickness of the electronic component 14 and the electronic component 22. The thermal diffusion sheet 11 can be made of a material that can be thinned and has a higher thermal conductivity than copper. For example, a graphite sheet can be used.

  The printed wiring board 13 is a board in which wiring (not shown) is printed on an insulating plate (not shown). The printed wiring board 13 is mounted inside the housing 17. The printed wiring board 13 is arranged at a predetermined interval from the internal frame 19. The printed circuit board 13 has the electronic component 14 and the electronic component 22 mounted (mounted) on the upper surface (the upper surface in FIG. 6), and a shield frame 16 disposed so as to cover the electronic component 14 is mounted. The shield frame 16 is mounted so as to cover the electronic component 22. Note that components (not shown) other than the electronic components 14 and 22 may be mounted on the printed wiring board 13.

  The battery 18 is a power source for operating the electronic device 1. The battery 18 is housed inside the housing 17. The battery 18 is held by the casing 17 and also by the printed wiring board 13.

  The shield frame 21 is a thin metal frame. The shield frame 21 is for absorbing noise generated in the electronic component 22 and reinforcing the printed wiring board 13. The shield frame 21 is arranged so as to cover the electronic component 22 and is mounted on the printed wiring board 13. The shield frame 21 is thermally connected to the back surface of the electronic component 22 (the surface on the opposite side to the main surface electrically connected to the printed wiring board 13, the upper surface in FIG. 6). The shield frame 21 is thermally connected (fixed here) to the thermal diffusion sheet 11 on the upper surface (the upper surface in FIG. 6).

  The electronic component 22 is an electronic component that generates heat when operated. The electronic component 22 is mounted (mounted) at another predetermined position on the upper surface of the printed wiring board 13 (the upper surface in FIG. 6). The electronic component 22 is electrically connected to the printed wiring board 13 on the main surface (the surface electrically connected to the printed wiring board 13, the lower surface in FIG. 6). The electronic component 22 is covered with the shield frame 21. The electronic component 22 is thermally connected to the shield frame 21 on the back surface (the surface opposite to the main surface electrically connected to the printed wiring board 13, the upper surface in FIG. 6). In addition, grease or an adhesive is applied to the back surface of the electronic component 22 (the surface opposite to the main surface electrically connected to the printed wiring board 13, the upper surface in FIG. 6) in order to improve contact stability. It may be applied or filled with heat conductive resin or heat conductive rubber.

  Next, the operation of the heat dissipation structure according to Embodiment 3 of the present invention will be described.

  Heat generated in the electronic component 14 is transmitted to the heat pipe 12 via the shield frame 16 and the heat diffusion sheet 15. The heat pipe 12 transfers heat to the heat diffusion sheet 11 fixed to the heat pipe 12 in order to diffuse the heat from the heat diffusion sheet 15. The heat transmitted to the thermal diffusion sheet 11 is radiated to the surrounding air, the shield frame 21 and the like.

  Similarly, heat generated in the electronic component 22 is transmitted to the heat pipe 12 via the shield frame 21 and the heat diffusion sheet 11. The heat pipe 12 transmits heat to the heat diffusion sheet 15 fixed to the heat pipe 12 in order to diffuse the heat from the heat diffusion sheet 15. The heat transmitted to the heat diffusion sheet 15 is radiated to the surrounding air, the shield frame 16 and the like.

  According to the third embodiment, the same effects as in the second embodiment can be obtained, and the amount of heat generated in the electronic component 14 and the electronic component 22 may be extremely large depending on the operating conditions of the device. It is possible to prevent an extreme temperature rise of one electronic component by diffusing heat into the electronic component.

[Embodiment 4]
An electronic apparatus according to Embodiment 4 of the present invention will be described with reference to the drawings. FIG. 7 is a plan view schematically showing the configuration of the heat dissipation structure according to Embodiment 4 of the present invention. FIG. 8 is a cross-sectional view between AA ′ and BB ′ in FIG. 7 schematically showing the configuration of the heat dissipation structure according to Embodiment 4 of the present invention.

  The fourth embodiment is a modification of the first embodiment, in which the printed wiring board (13 in FIG. 1) in the first embodiment is omitted. That is, in the heat dissipation structure 2, a heat diffusion sheet 11 (first sheet-like heat diffusion member) that is formed in a sheet shape and diffuses heat from the electronic component 14 (heating element) in the sheet surface direction, and a predetermined A heat pipe 12 (extension type) that extends in the direction and is thermally connected to the first sheet-like heat diffusion member and diffuses heat from the first sheet-like heat diffusion member in the predetermined direction. Heat diffusion member) and a heat diffusion sheet that is formed in a sheet shape and is thermally connected to the extended heat diffusion member and diffuses heat from the extended heat diffusion member in the sheet surface direction. 15 (second sheet-like heat diffusion member). In the heat dissipation structure 2, heat from the electronic component 14 (heating element) is diffused in the sheet surface direction in the heat diffusion sheet 11 (first sheet-like heat diffusion member), and heat from the first sheet-like heat diffusion member is diffused. The heat pipe 12 (extended heat diffusing member) diffuses in the extending direction, and the heat from the extended heat diffusing member diffuses in the sheet surface direction in the heat diffusing sheet 15 (second sheet-like heat diffusing member). .

  According to the fourth embodiment, similarly to the first embodiment, by using the thermal diffusion sheets 11 and 15 that are thermally connected to the heat pipe 12, heat can be diffused in the sheet surface direction. Thus, the electronic component 14 and the heat pipe 12 can be arranged so as not to overlap with each other in the thickness direction of the electronic component 14, and the thickness can be reduced. Further, according to the fourth embodiment, by using the heat diffusion sheets 11 and 15, the heat transmission path of the electronic component 14 can be enlarged while being thinned, and the efficiency of heat dissipation can be improved.

  Note that, in the present application, where reference numerals are attached to the drawings, these are only for the purpose of helping understanding, and are not intended to be limited to the illustrated embodiments.

  Further, within the scope of the entire disclosure (including claims and drawings) of the present invention, the embodiments and examples can be changed and adjusted based on the basic technical concept. Various combinations or selections of various disclosed elements (including each element of each claim, each element of each embodiment or example, each element of each drawing, etc.) are included within the scope of the claims of the present invention. Is possible. That is, the present invention naturally includes various variations and modifications that could be made by those skilled in the art according to the entire disclosure including the claims and the drawings, and the technical idea.

(Appendix)
According to a first aspect of the present invention, in the heat dissipation structure, a first sheet-like heat diffusion member that is formed in a sheet shape and diffuses heat from the heating element in the sheet surface direction, and extends in a predetermined direction. And an extended heat diffusion member that is thermally connected to the first sheet-like heat diffusion member and diffuses heat from the first sheet-like heat diffusion member in the predetermined direction; A second sheet-like heat diffusion member that is formed and thermally connected to the extended heat diffusion member and diffuses heat from the extended heat diffusion member in the sheet surface direction. It is characterized by.

  In the heat dissipation structure of the present invention, it is preferable that the extended heat diffusing member is disposed so as not to overlap the heating element in the thickness direction of the heating element.

  In the heat dissipation structure of the present invention, it is preferable that the extended heat diffusing member is disposed adjacent to a side end surface of the heating element.

  In the heat dissipation structure of the present invention, the first sheet-like heat diffusing member includes a portion disposed on the back surface of the heat generating element (the surface opposite to the main surface electrically connected to the printed wiring board). It is preferable to have.

  In the heat dissipation structure of the present invention, the first sheet-like heat diffusing member and the second sheet-like heat diffusing member are principal surfaces of the heating element in the extended heat diffusing member (electrically with the printed wiring board). It is preferable to be thermally connected to the surface on the same side as the surface to be connected) or the back surface (the surface opposite to the main surface).

  In the heat dissipation structure of the present invention, it is preferable that each thickness of the first sheet-like heat diffusion member and the second sheet-like heat diffusion member is thinner than the thickness of the extended heat diffusion member.

  In the heat dissipation structure of the present invention, it is preferable that each thickness of the first sheet-like heat diffusion member and the second sheet-like heat diffusion member is thinner than the thickness of the heating element.

  In the heat dissipation structure of the present invention, it is preferable that a thickness of the extended heat diffusion member is thinner than a thickness of the heating element.

  In the heat dissipation structure of the present invention, it is preferable that the first sheet-like heat diffusion member and the second sheet-like heat diffusion member are made of a material having higher thermal conductivity than copper.

  In the heat dissipation structure of the present invention, it is preferable that the first sheet-like heat diffusion member and the second sheet-like heat diffusion member are made of a graphite sheet.

  In the heat dissipation structure of the present invention, it is preferable that the extended heat diffusion member is a heat pipe.

  According to a second aspect of the present invention, an electronic device includes the heat dissipation structure, the heating element, and a printed wiring board on which the heating element is mounted.

  The electronic apparatus according to the present invention preferably includes a shield frame interposed between the heating element and the first sheet-like heat diffusion member.

  The electronic apparatus according to the present invention preferably includes an internal frame that is thermally connected to any one of the first sheet-like heat diffusion member, the second sheet-like heat diffusion member, and the extended heat diffusion member.

  The electronic device of the present invention includes a battery that is thermally connected to the second sheet-like heat diffusion member, and the extended heat diffusion member is disposed adjacent to a side end surface of the battery. Is preferred.

  The electronic device of the present invention preferably includes another heating element mounted on the printed wiring board, and the second sheet-like heat diffusing member transmits heat from the other heating element.

  In a third aspect of the present invention, in the heat dissipation method, heat from the heating element is diffused in the sheet surface direction in the first sheet-like heat diffusion member, and heat from the first sheet-like heat diffusion member is extended. The heat diffusion member diffuses in the extending direction, and heat from the extended heat diffusion member is diffused in the sheet surface direction in the second sheet-like heat diffusion member.

DESCRIPTION OF SYMBOLS 1 Electronic device 2 Heat dissipation structure 11 Heat diffusion sheet (2nd sheet-like heat diffusion member)
12 Heat pipe (Extended heat diffusion member)
13 Printed wiring board 14, 22 Electronic component (heating element)
15 Thermal diffusion sheet (first sheet-shaped thermal diffusion member)
16, 21 Shield frame 17 Case 18 Battery 19 Internal frame 20 Adhesive part

Claims (10)

A first sheet-like heat diffusion member that is formed in a sheet shape and diffuses heat from the heating element in the sheet surface direction;
Extending type thermal diffusion that extends in a predetermined direction and is thermally connected to the first sheet-like heat diffusion member and diffuses heat from the first sheet-like heat diffusion member in the predetermined direction Members,
A second sheet-like heat diffusing member that is formed in a sheet shape, is thermally connected to the extended heat diffusing member, and diffuses heat from the extended heat diffusing member in the sheet surface direction;
A heat dissipating structure comprising:   The heat radiating structure according to claim 1, wherein the extended heat diffusing member is disposed so as not to overlap the heat generating element in a thickness direction of the heat generating element.   3. The heat dissipation structure according to claim 1, wherein each thickness of the first sheet-like heat diffusion member and the second sheet-like heat diffusion member is thinner than the thickness of the extended heat diffusion member. .   The heat dissipation structure according to any one of claims 1 to 3, wherein the first sheet-like heat diffusion member and the second sheet-like heat diffusion member are made of a material having higher thermal conductivity than copper. .   The heat dissipation structure according to claim 4, wherein the first sheet-like heat diffusion member and the second sheet-like heat diffusion member are made of a graphite sheet.   The heat dissipation structure according to any one of claims 1 to 5, wherein the extended heat diffusion member is formed of a heat pipe. A heat dissipation structure according to any one of claims 1 to 6,
The heating element;
A printed wiring board on which the heating element is mounted;
An electronic device comprising: A battery thermally connected to the second sheet-like heat diffusion member;
The electronic device according to claim 7, wherein the extended heat diffusion member is disposed adjacent to a side end surface of the battery. Other heating elements mounted on the printed wiring board,
The electronic device according to claim 7, wherein heat from the other heating element is transmitted to the second sheet-like heat diffusion member.   The heat from the heating element is diffused in the sheet surface direction in the first sheet-like heat diffusion member, the heat from the first sheet-like heat diffusion member is diffused in the extension direction in the extended heat diffusion member, and the extension A heat dissipating method characterized by diffusing heat from the mold heat diffusing member in the sheet surface direction in the second sheet-like heat diffusing member.

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