CN107231754A - It is a kind of to improve the bad method of the plated through-hole produced in assist side manufacturing process - Google Patents
It is a kind of to improve the bad method of the plated through-hole produced in assist side manufacturing process Download PDFInfo
- Publication number
- CN107231754A CN107231754A CN201710516409.2A CN201710516409A CN107231754A CN 107231754 A CN107231754 A CN 107231754A CN 201710516409 A CN201710516409 A CN 201710516409A CN 107231754 A CN107231754 A CN 107231754A
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- China
- Prior art keywords
- hole
- plated
- heavy copper
- manufacturing process
- improve
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Abstract
The present invention relates to field of printed circuit board fabrication, it is specially a kind of to improve the bad method of the plated through-hole produced in assist side manufacturing process, this improves the bad method of the plated through-hole produced in assist side manufacturing process, dust suction processing is carried out to processing hole in drilling, the dust produced during drilling is sucked away in time, drilling dust plug-hole is effectively prevent.In the secondary groove that heating system is arranged to heavy copper cylinder, the heavy copper liquid of secondary groove is delivered to major trough by circulated filter system, it is to avoid reaction is accelerated to cause the situation of copper powder plug-hole caused by being directly heated due to major trough, effectively reduces hole and sinks the bad situation of copper.In outer layer pretreatment procedure using being handled before super roughening, dry film plug-hole can be effectively prevented, above-mentioned three kinds of technique can integrally improve wiring board manufacture quality, reduce scrappage, save production cost.
Description
Technical field
The present invention relates to what is produced in field of printed circuit board fabrication, more particularly to a kind of improvement assist side manufacturing process
The bad method of plated through-hole.
Background technology
Wiring board is the supporter of electronic component, and electrical connection is provided for electronic component.The production technology of wiring board
Flow is generally：Sawing sheet → inner figure transfer → internal layer etching → lamination → drilling → heavy copper → whole plate plating → outer graphics
Transfer → graphic plating → etching → welding resistance → surface treatment → processing and forming etc..
Often occur the problem of plated through-hole is bad in assist side manufacturing process, analysis reason is broadly divided into following several
Class：1st, dry film is produced in figure transfer process and enters hole situation；2nd, because the heavy copper of the reasons such as bubble generation is bad during heavy process for copper；
3rd, dust plug-hole phenomenon during bore process；4th, produced during tin plating technique tin plating bad；5th, whole plate plating and during graphic plating technique
Cause bad phenomenon of plated through-hole etc. in copper ashes access aperture.Above-mentioned reason has triggered the having no copper in the holes of the plated through-hole of wiring board
The problem of, cause wiring board scrappage high, increase the cost manufactured, influence due date.Pass through the system to scrappage
Meter analysis, dry film enter hole, drilling dust plug-hole and heavy copper it is bad be three main causes for causing wiring board to be scrapped.
The content of the invention
The present invention for dry film enter hole, drilling dust plug-hole and heavy copper it is bad initiation plated through-hole it is bad the problem of there is provided
It is a kind of to heat and surpass roughening pretreatment mode by the dust suction that drills, the heavy secondary groove of copper cylinder and produced to improve in assist side manufacturing process
The bad method of plated through-hole.
To achieve the above object, the present invention uses following technical scheme：
It is a kind of to improve the bad method of the plated through-hole produced in assist side manufacturing process, including work is manufactured to wiring board
The improvement of sequence, wiring board manufacturing process includes drilling operating, heavy copper process, whole plate electroplating work procedure and makes outer-layer circuit process,
Heavy copper process is completed using heavy copper cash, heavy copper cash include being used for sinking the major trough of process for copper, the pair for overflow in heavy copper process
Groove and heating system, heating system are arranged on secondary groove, entered between major trough and secondary grooves by circulated filter system connection each other
During capable heavy copper process, heating system is heated to secondary groove.
Further, in heavy copper process, heavy copper cash are additionally provided with the heavy copper basket for placing production plate, and heavy copper basket is inclined
Tiltedly it is arranged in major trough.
Further, the side of heavy copper basket is provided with slot, and the slot angle vertical of heavy copper basket tilts 3 °.
Further, after heavy copper process, production plate is placed in atmosphere, management and control time≤2 hour of placement.
Further, in drilling operating, dust suction processing is carried out to processing hole when being additionally included in drilling.
Further, in drilling operating, dust suction processing carries out dust suction using 1000~1500Kpa negative pressure.
Further, in drilling operating, when processing the aperture≤0.5mm in hole, drilled using twolip single flute drill nozzle.
Further, in outer-layer circuit process is made, when being additionally included in outer layer pretreatment procedure, the aperture for processing hole
The pretreatment mode that≤0.25mm production plate is used is the super roughening nog plate mode that is carried out by chemical method.
Further, make in outer-layer circuit process, including patch dry film and developing procedure, for process the aperture in hole≤
0.25mm production plate, this period that patch dry film to developing procedure is completed need to be less than 12 hours.
Further, in addition to pin sensing process, for radius-thickness ratio 8：More than 1 back drill hole and/or the hole for processing hole
Footpath≤0.25mm production plate, device to hole is entered respectively after the drilling operating in completing wiring board manufacture and after whole plate electroplating work procedure
Row Quality Detection and performance detection.
Compared with prior art, the beneficial effects of the invention are as follows：This improves the metal produced in assist side manufacturing process
Change the bad method in hole, dust suction processing is carried out to processing hole in drilling so that the dust produced during drilling can be inhaled in time
Walk, effectively prevent drilling dust plug-hole.In the secondary groove that heating system is arranged to heavy copper cylinder, the heavy copper liquid of secondary groove is by following
Ring filtration system is delivered to major trough, it is to avoid reaction is accelerated to cause the situation of copper powder plug-hole caused by being directly heated due to major trough,
Effectively reduce the bad situation of the heavy copper in hole.In outer layer pretreatment procedure using being handled before super roughening, can effectively it prevent
Only dry film plug-hole, above-mentioned three kinds of technique can integrally improve wiring board manufacture quality, reduce scrappage, saved and be produced into
This.
Embodiment
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme
It is described further and illustrates.
Embodiment
The technological process of production of wiring board is generally：Sawing sheet → inner figure transfer → internal layer etching → lamination → drilling →
Heavy copper → whole plate is electroplated → makes outer-layer circuit → welding resistance → surface treatment → processing and forming etc., and the present invention provides a kind of improve
The bad method of the plated through-hole that is produced in circuit board manufacturing process, is specially drilling operating wherein, heavy copper process, whole plate
Electroplating work procedure and making outer-layer circuit process are improved, specific as follows to solve the problem of plated through-hole is bad in wiring board：
Wherein drilling operating is performed such：Drilled using the drilling parameter of high rotating speed, the low depth of cut, during drilling
Dust suction processing is carried out to processing hole, dust suction processing carries out dust suction using 1000~1500Kpa negative pressure, is the hole for processing hole
During footpath≤0.5mm, using twolip single flute drill nozzle.After the completion of drilling operating, for radius-thickness ratio 8：More than 1 back drill hole and/or
Aperture≤the 0.25mm in person's processing hole production plate carries out pin sensing, prevents bad hole from entering next step process.
Wherein sink what copper process was performed such：In heavy copper process, wherein completing heavy using heavy copper cash in heavy copper process
Copper process, heavy copper cash include being used for sinking the major trough of process for copper, the secondary groove for overflow, heavy copper basket and heating system, major trough and
Between secondary groove by circulated filter system connection each other, heating system is arranged in secondary groove, by being heated again to secondary groove
Major trough is recycled to by circulated filter system, can effectively avoid major trough reaction from accelerating to reduce the phenomenon of copper powder plug-hole.
Be provided with slot in the side of heavy copper basket, the slot angle vertical of copper basket of sinking tilts 3 °, will needed for heavy copper metal aperture court
To tilting down 3 °, also enter once reduce the phenomenon of copper powder plug-hole.
After heavy copper process, production plate originally is placed in atmosphere using board slot is supported, and foster board slot is a kind of special cool puts
The cell body of plate is produced, production plate is placed in atmosphere without using foster board slot now, management and control time≤2 hour of placement, to prevent
When placing production plate, friction causes heavy layers of copper and the edges of boards base material of production plate to produce the feelings come off between production plate and heavy copper basket
Condition.
After whole plate electroplating work procedure, to radius-thickness ratio 8：More than 1 back drill hole and/or the aperture≤0.25mm for processing hole
Produce plate and carry out pin sensing, prevent bad hole from entering next step process.
Wherein make what outer-layer circuit process was performed such：In outer layer pretreatment procedure, the aperture for processing hole
≤ 0.25mm production plate is using the super pretreatment mode being roughened.Super roughening is a kind of processing mode using chemical nog plate.It is right
Do not allow to produce using volcanic ash pre-treatment in the aperture≤0.25mm in processing hole production plate, dry film plug-hole can be prevented.
Paste dry film to developing procedure and complete this period, the storage period of the production plate of aperture≤0.25mm for processing hole need to be less than
12 hours, hole probability is entered to reduce dry film gummosis.
Wherein surpass what the pretreatment mode being roughened was performed such：Enter plate (checking supplied materials plate face quality) → pickling → overflow
Washing → adhesive-bonded fabric polish-brush nog plate → pressurization washing → HF washings → inspection → super roughening → overflow washing → HF washings pickling →
Overflow washing → ultrasonic wave water washing → HF washings → high-pressure washing → dry plate combination → ejecting plate (inspection is grinding into the plate face quality of plate).
This improves the bad method of the plated through-hole produced in assist side manufacturing process, and processing hole is carried out in drilling
Dust suction is handled so that the dust produced during drilling can be timely sucked away, and is effectively prevented drilling dust plug-hole.Will heating
System is arranged in the secondary groove of heavy copper cylinder, the heavy copper liquid of secondary groove is delivered to major trough by circulated filter system, it is to avoid in major trough
Due to reacting the situation for accelerating to cause copper powder plug-hole caused by heat when system is heated, the bad feelings of heavy copper are effectively reduced
Condition.In outer layer pretreatment procedure using processing before super roughening, and after the completion of patch dry film to developing procedure, production plate is stopped
The time is put less than 12 hours, dry film gummosis can be reduced and enter hole probability, and effectively prevents dry film plug-hole, it is overall to improve circuit
Plate manufactures quality, reduces scrappage, has saved production cost.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, and any technology done according to the present invention extends or recreated, and is sent out by this
Bright protection.
Claims (10)
1. a kind of improve the bad method of the plated through-hole produced in assist side manufacturing process, including to wiring board manufacturing process
Improvement, the wiring board manufacturing process includes drilling operating, heavy copper process, whole plate electroplating work procedure and makes outer-layer circuit work
Sequence, it is characterised in that complete heavy copper process using heavy copper cash in the heavy copper process, the heavy copper cash include being used for sinking coppersmith
The major trough of skill, secondary groove and heating system for overflow, between the major trough and secondary groove by circulated filter system connection each other,
The heating system is arranged on secondary groove, when carrying out heavy copper process, heating system is heated to secondary groove.
2. according to claim 1 improve the bad method of the plated through-hole produced in assist side manufacturing process, it is special
Levy and be：In the heavy copper process, the heavy copper cash are additionally provided with the heavy copper basket for placing production plate, and heavy copper basket is inclined
Tiltedly it is arranged in major trough.
3. according to claim 2 improve the bad method of the plated through-hole produced in assist side manufacturing process, it is special
Levy and be：The side of the heavy copper basket is provided with slot, and the slot angle vertical of the heavy copper basket tilts 3 °.
4. as claimed in any of claims 1 to 3 improve the plated through-hole produced in assist side manufacturing process not
Good method, it is characterised in that：After the heavy copper process, production plate is placed in atmosphere, and management and control time≤2 of placement are small
When.
5. according to claim 1 improve the bad method of the plated through-hole produced in assist side manufacturing process, it is special
Levy and be：In the drilling operating, dust suction processing is carried out to processing hole when being additionally included in drilling.
6. according to claim 5 improve the bad method of the plated through-hole produced in assist side manufacturing process, it is special
Levy and be：In the drilling operating, dust suction processing carries out dust suction using 1000~1500Kpa negative pressure.
7. the bad method of the plated through-hole produced in the improvement assist side manufacturing process according to claim 5 or 6, its
It is characterised by：In the drilling operating, when processing the aperture≤0.5mm in hole, drilled using twolip single flute drill nozzle.
8. according to claim 1 improve the bad method of the plated through-hole produced in assist side manufacturing process, it is special
Levy and be：It is described making outer-layer circuit process in, when being additionally included in outer layer pretreatment procedure, for process hole aperture≤
The pretreatment mode that 0.25mm production plate is used is the super roughening nog plate mode that is carried out by chemical method.
9. according to claim 1 or 2 improve the bad method of the plated through-hole produced in assist side manufacturing process, its
It is characterised by：In the making outer-layer circuit process, including patch dry film and developing procedure, aperture≤0.25mm for processing hole
Production plate, patch dry film to developing procedure this period for completing need to be less than 12 hours.
10. according to claim 1 improve the bad method of the plated through-hole produced in assist side manufacturing process, it is special
Levy and be：Also include pin sensing process, for radius-thickness ratio 8：More than 1 back drill hole and/or process the aperture in hole≤
0.25mm production plate, device to hole carries out product respectively after the drilling operating in completing wiring board manufacture and after whole plate electroplating work procedure
Quality detection and performance detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710516409.2A CN107231754B (en) | 2017-06-29 | 2017-06-29 | It is a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710516409.2A CN107231754B (en) | 2017-06-29 | 2017-06-29 | It is a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107231754A true CN107231754A (en) | 2017-10-03 |
| CN107231754B CN107231754B (en) | 2019-10-22 |
Family
ID=59935663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710516409.2A Active CN107231754B (en) | 2017-06-29 | 2017-06-29 | It is a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process |
Country Status (1)
| Country | Link |
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| CN (1) | CN107231754B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587968A (en) * | 2018-12-11 | 2019-04-05 | 深圳崇达多层线路板有限公司 | One kind preventing consent or the undesirable PCB production method of plated hole |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040062007A1 (en) * | 2002-10-01 | 2004-04-01 | George Hsieh | Heat sink and retaining clip assembly |
| CN101235494A (en) * | 2007-01-30 | 2008-08-06 | 三星电机株式会社 | Device and method for chemical plating |
| CN202610378U (en) * | 2011-12-21 | 2012-12-19 | 北大方正集团有限公司 | System for filtering metallic coating of printed circuit board |
| CN103290395A (en) * | 2013-06-04 | 2013-09-11 | 中国电子科技集团公司第四十五研究所 | Chemical plating device for film belt heated by belt and method thereof |
| CN104684266A (en) * | 2015-02-04 | 2015-06-03 | 江门崇达电路技术有限公司 | Manufacturing method of matted gold line of circuit board |
| CN105163521A (en) * | 2015-08-26 | 2015-12-16 | 昆山苏杭电路板有限公司 | Small-hole hole metallization processing method |
-
2017
- 2017-06-29 CN CN201710516409.2A patent/CN107231754B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040062007A1 (en) * | 2002-10-01 | 2004-04-01 | George Hsieh | Heat sink and retaining clip assembly |
| CN101235494A (en) * | 2007-01-30 | 2008-08-06 | 三星电机株式会社 | Device and method for chemical plating |
| CN202610378U (en) * | 2011-12-21 | 2012-12-19 | 北大方正集团有限公司 | System for filtering metallic coating of printed circuit board |
| CN103290395A (en) * | 2013-06-04 | 2013-09-11 | 中国电子科技集团公司第四十五研究所 | Chemical plating device for film belt heated by belt and method thereof |
| CN104684266A (en) * | 2015-02-04 | 2015-06-03 | 江门崇达电路技术有限公司 | Manufacturing method of matted gold line of circuit board |
| CN105163521A (en) * | 2015-08-26 | 2015-12-16 | 昆山苏杭电路板有限公司 | Small-hole hole metallization processing method |
Non-Patent Citations (1)
| Title |
|---|
| 程婕: "《电子产品制造工程训练》", 31 December 2008 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109587968A (en) * | 2018-12-11 | 2019-04-05 | 深圳崇达多层线路板有限公司 | One kind preventing consent or the undesirable PCB production method of plated hole |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107231754B (en) | 2019-10-22 |
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