CN101235494A - Device and method for chemical plating - Google Patents
Device and method for chemical plating Download PDFInfo
- Publication number
- CN101235494A CN101235494A CNA2007101073940A CN200710107394A CN101235494A CN 101235494 A CN101235494 A CN 101235494A CN A2007101073940 A CNA2007101073940 A CN A2007101073940A CN 200710107394 A CN200710107394 A CN 200710107394A CN 101235494 A CN101235494 A CN 101235494A
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- China
- Prior art keywords
- plating
- heat exchanger
- bath
- supply
- plating bath
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/168—Control of temperature, e.g. temperature of bath, substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a device and a method for chemical plating. The device for chemical plating comprises: a plating groove; a heat exchanger arranged to be adjacent to bottom surface of the plating groove; a supply portion arranged to be adjacent to the heat exchanger and supply the plating solution into the plating groove; and a basket arranged within the plating groove and containing a plating target; the device for chemical plating can equalize the plating cover conditions and enhance the dependability of plating layer by arranging the heat exchanger at the bottom of the plating groove and leading ejection direction of the plating solution to face the heat exchanger.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
The application requires the rights and interests to the 10-2007-0009517 korean patent application of Korea S Department of Intellectual Property submission on January 30th, 2007, and its disclosure all is hereby expressly incorporated by reference.
Technical field
The present invention relates to a kind of apparatus and method that are used for electroless plating.
Background technology
Electroless plating is meant a kind of plating type that realizes need not to make electricity consumption by chemical reaction.Generally speaking, plating uses the plating that utilizes electricity to realize usually, but for the material such as Resins, epoxy and other plastics, these materials do not allow conduction, thereby can not electroplate.In this case, use electroless plating to realize plating.Electroless plating can be divided into 1) reduction plating type and 2) displacement plating type.
Reduction plating type is the plating type by the reduction reaction precipitating metal, and displacement plating type is to utilize the plating type of the difference of oxidation/reducing power.The representative instance of displacement plating type is nickel plating (Ni)/gold (Au).
When making printed circuit board (PCB), this electroless plating type can be as carrying out the surface-treated method.For example, can pass through electroless plating and gold-plated extremely about 0.03 micron then for extremely about 5 microns, printed circuit board (PCB) is carried out surface treatment by chemical nickel plating on the copper layer of printed circuit board (PCB).
But, in this process of on printed circuit board (PCB), carrying out chemical nickel plating, in nickel coating, produced the low problem of reliability.When the reliability of nickel coating reduces owing to uneven plating condition, the excessive metathetical situation of local nickel takes place during will utilizing replacement(metathesis)reaction to form the process of gold plate after nickel plating, it is blocked up that thereby the thickness of gold plate becomes, and causes the loss of material cost.
Fig. 1 shows the stereographic map according to the chemical plating appts of prior art.Below, with reference to Fig. 1 the operation according to the chemical plating appts of prior art is described.
When passing through two pipes 30 when plating bath is sprayed in the bottom of coating bath 10, plating bath is to the substrate (not shown) supply nickel ion that is arranged at basket (basket) 20 inside, and plating bath flows out to auxiliary tank 70 through screened film 50.By the heat exchanger 40 that is arranged at coating bath 10 sidepieces and has 110 ℃ of surface temperatures, to being provided with energy towards auxiliary tank 70 effusive plating baths.
The plating bath that is provided with energy flows out through the outlet 72 of auxiliary tank 70, and the loop structure of flowing through, so that flow to pipe 30 once more.Simultaneously, gas blower 60 is arranged on the position of proximity thermal interchanger 40, is used for thermodiffusion.
In the chemical plating appts of operating by means of this structure, since the irrational mix/operational condition in the coating bath, thereby deviation appears in the plating condition, and, compare with surrounding environment, ozzle and near the temperature that is arranged at the heat exchanger on the sidepiece are higher.
And, owing to whirlpool appears in the structure of the ozzle that sprays towards coating bath bottom, thereby cause the speed and the temperature difference of near the plating bath the substrate deviation to occur.
In addition, because plating bath is provided with energy when flowing to auxiliary tank, the loss of temperature is bigger, and institute is so that heat exchanger must be controlled to 110 ℃, keeping the necessary 80 ℃ temperature of plating technic, and near because the high temperature the heat exchanger and plating bath is decomposed.
Therefore, occurred, to improve the reliability of coating for the demand that makes plating condition uniform method.
Summary of the invention
The invention provides a kind of device and method that is used for electroless plating, wherein improved the structure of coating bath, so that the plating condition can be even.
One aspect of the present invention can provide a kind of chemical plating appts, and this device comprises: coating bath; Heat exchanger is configured to be adjacent to the basal surface of coating bath; Supply department is configured to be adjacent to heat exchanger, and plating bath is fed to the inside of coating bath; And basket, be arranged at coating bath inside, and hold plating target (plating target).
Can be additionally formed circulation portions, the plating bath that this circulation portions will be fed to coating bath inside is fed to supply department once more.
Supply department can heat exchanger supply plating bath, and this supply department can be arranged to an end of proximity thermal interchanger.
Simultaneously, heat exchanger can form the shape of plate, and can be along the surface flow of heat exchanger from the plating bath of supply department's supply.
Supply department can be made of a plurality of ozzle portion.For example, the first ozzle portion and the second ozzle portion can be arranged, the described first ozzle portion is configured to be adjacent to the upper surface of heat exchanger, and the described second ozzle portion is configured to be adjacent to the lower surface of heat exchanger, wherein the plating bath from the supply of the first ozzle portion can flow along the upper surface of heat exchanger, and can flow along the lower surface of heat exchanger from the plating bath of second ozzle portion supply.
The surface temperature of heat exchanger can be 90 ℃ to 100 ℃.
It is a kind of by plating bath being offered the method that the plating target carries out electroless plating that another aspect of the present invention can provide, and this method comprises: will plate target and be arranged in the coating bath; Basal surface supply plating bath from coating bath; To plating bath supply heat; And the plating bath that will be provided with heat offers the plating target.
Can carry out the supply of heat by means of the heat exchanger that is arranged on the coating bath bottom surface, and plating bath can be towards the heat exchanger supply.
The first ozzle portion that can be provided with and become proximity thermal interchanger lower surface and the second ozzle portion that is provided with carries out the supply of plating bath by means of proximity thermal interchanger upper surface, wherein, can flow along the upper surface of heat exchanger from the plating bath of first ozzle portion supply, and can flow along the lower surface of heat exchanger from the plating bath of second ozzle portion supply.
Other aspects and advantages of the present invention will partly be set forth in the following description, and partly will be apparent by this description, perhaps can know by implementing the present invention.
Description of drawings
Fig. 1 shows the stereographic map according to the chemical plating appts of prior art.
Fig. 2 shows the stereographic map of the chemical plating appts of first disclosed embodiment according to the present invention.
Fig. 3 shows the stereographic map of the chemical plating appts of second disclosed embodiment according to the present invention.
Fig. 4 shows the schema of chemical plating method according to a further aspect of the invention.
Embodiment
Below, with reference to the accompanying drawings the device and method according to the electroless plating of certain embodiments of the invention being described in more detail, in the accompanying drawing, no matter how many figure numbers is, those identical or corresponding parts are represented with identical reference number, and the repetitive description thereof will be omitted.
Fig. 2 shows the stereographic map according to the chemical plating appts of first embodiment of the invention.Coating bath 110, support 112, basket 120a, 120b, supply department 130, the first ozzle portion 131, the second ozzle portion 132, ozzle 131a, 132a, heat exchanger 140, auxiliary tank 170 have been shown among Fig. 2 and have exported 172.
Simultaneously, in order to supply heat to the plating bath of supplying from supply department 130, heat exchanger 140 can be arranged on the bottom surface of coating bath 110, and contiguous supply department 130.Heat exchanger 140 is the devices that are used for to plating bath supply heat, makes the plating bath that is fed to coating bath 110 inside reach the temperature that is suitable for plating technic.
Because this heat exchanger 140 is arranged on the bottom surface and the contiguous supply department 130 of coating bath 110, thus can directly supply heat to the plating bath that is fed to coating bath 110 inside, so that improve operation efficiency.
And the heat exchanger 140 that is used to that plating bath is reached and is suitable for the temperature of plating technic does not need to be set to and has too high surface temperature, thereby can prevent near the decomposition of contingent plating bath heat exchanger 140.
For example, can near substrate (not shown) (this substrate is the plating target), remain on 80 ℃ the temperature that is suitable for plating technic, the surface temperature of heat exchanger 140 can be set at 90 ℃ to 100 ℃ in order to make the plating bath after heat exchanger 140 absorbs heat.
This is to make that plating bath is difficult to remain on 80 ℃ near substrate because the temperature below 90 ℃ is set, thus the plating technic that is difficult to be well on.And the setting of the temperature more than 100 ℃ may cause plating bath to decompose near heat exchanger 140.
Simultaneously, supply department 130 can be towards heat exchanger 140 supply plating baths.Directly make and supply heat from heat exchanger 140 to plating bath in more effective mode towards heat exchanger 140 supply plating baths.
With reference to Fig. 2 and since supply department 130 from the sidepiece of heat exchanger 140 towards plate heat exchanger 140 supply plating baths, so plating bath can be along the surface flow of heat exchanger 140, and plating bath has more opportunity contact heat exchanger 140.Therefore, make heat passage more effective from heat exchanger 140 to plating bath.
And very natural as shown in Figure 3, supply department 130 can supply plating bath along the direction perpendicular to heat exchanger 140 surfaces from the top of heat exchanger 140.The supplier that arrow among Fig. 3 is represented plating bath to.
Except aforesaid way, can be as required will directly be modified into a plurality of substitute modes towards the method for heat exchanger supply plating bath and in order to being provided with of the supply department that realizes this method etc.
Simultaneously, when a plurality of ozzle portion is used for supply department 130, the first ozzle portion 131 can be arranged to the upper surface of proximity thermal interchanger 140, and the second ozzle portion 132 can be arranged to the lower surface of proximity thermal interchanger 140, as shown in Figure 2, thus each ozzle portion can be towards heat exchanger 140 along the direction supply plating bath that be parallel to heat exchanger 140 surfaces.The supplier that arrow among Fig. 2 is represented plating bath to.
Therefore, can be mobile by the plating bath of the first ozzle portion, 131 supplies along the upper surface of heat exchanger 140, and can be mobile along the lower surface of heat exchanger 140 by the plating bath of the second ozzle portion, 132 supplies, so that make heat passage maximizing efficiency.
Simultaneously, circulation portions can be installed, reuse the plating bath that participated in plating technic.With reference to Fig. 2, when the supply department 130 by coating bath 110 bottom surface supplied new plating bath, the plating bath that had participated in plating technic flowed with respect to the top of coating bath 110.
Afterwards, when plating bath was full of the inside of coating bath 110 fully, the support 112 at the side place of the plating bath on coating bath 110 tops by being formed at coating bath 110 tops flowed to auxiliary tank 170.The plating bath that is fed to auxiliary tank 170 is discharged by outlet 172, and the plating bath of discharging is supplied to supply department 130 by pipe etc., thereby can reuse this plating bath in plating technic.
During this working cycle, can also carry out re-treating process, be used for removing impurity that is included in plating bath etc.
Below, with reference to Fig. 4 according to a further aspect of the invention chemical plating method is described.Fig. 4 shows the schema of chemical plating method according to a further aspect of the invention.
At first, will plate target and be arranged at (S10) in the coating bath 110.Though the plating target directly can be arranged in the coating bath 110, also can be arranged in the coating bath 110 and be contained among basket 120a, the 120b of coating bath 110 inside plating target, contact with supply department 130 or heat exchanger 140 etc. so that prevent to plate target.Plating before target is arranged in the coating bath 110, can in coating bath 110, fill a certain amount of plating bath.
Next, at the bottom surface supply plating bath (S20) of coating bath 110, and to the plating bath supply heat of being supplied (S30).The supply of plating bath and the supply of heat can be carried out by means of the supply department 130 and the heat exchanger 140 of above-mentioned chemical plating appts.In other words, as shown in Figure 2, can be after heat exchanger 140 being arranged at the bottom surface of coating bath 110 and supply department 130 being arranged at the sidepiece of heat exchanger 140, towards heat exchanger 140 supply plating baths.
By before plating technic, directly supplying heat, can improve thermo-efficiency to the plating bath that so is fed to coating bath 110 inside.And the heat exchanger 140 that is used to that plating bath is reached and is suitable for the temperature of plating technic need not be set at has too high surface temperature, thereby can prevent near the decomposition of contingent plating bath heat exchanger 140.
For example, as has been described above, in order to make the plating bath after heat exchanger 140 absorbs heat near substrate (not shown) (this substrate is the plating target), remain on 80 ℃ the temperature that is suitable for plating technic, the surface temperature of heat exchanger 140 can be set at 90 ℃ to 100 ℃.
Can be towards heat exchanger 140 supply plating baths.Directly make and supply heat from heat exchanger 140 to plating bath in more effective mode towards heat exchanger 140 supply plating baths.
As shown in Figure 2, as has been described above, because supply department 130 towards plate heat exchanger 140 supply plating baths, so plating bath can be along the surface flow of heat exchanger 140, thereby makes heat passage more effective from heat exchanger 140 to plating bath from the sidepiece of heat exchanger 140.
When the plating bath that will so be provided with heat offers plating target (S140), carry out electroless plating.
According to above-mentioned some embodiment of the present invention, bottom place by heat exchanger being arranged at coating bath and the emission direction that makes plating bath can make the plating condition even, and improve the reliability of coating towards this heat exchanger.
Though with reference to specific embodiment spirit of the present invention is described in detail, these embodiment only are used for the example purpose, rather than are used for limiting the present invention.Can understand that without departing from the scope and spirit of the present invention, those skilled in the art can change or improve embodiment.
Claims (13)
1. chemical plating appts comprises:
Coating bath;
Heat exchanger is configured to the basal surface of contiguous described coating bath;
Supply department is configured to contiguous described heat exchanger, and is configured to plating bath is fed to the inside of described coating bath; And
Basket is arranged at described coating bath inside, and is configured to hold the plating target.
2. chemical plating appts according to claim 1 further comprises circulation portions, and the described plating bath that described circulation portions is configured to be fed to described coating bath inside is fed to described supply department once more.
3. chemical plating appts according to claim 1, wherein, described supply department supplies described plating bath towards described heat exchanger.
4. chemical plating appts according to claim 3, wherein, described supply department is configured to an end of contiguous described heat exchanger.
5. chemical plating appts according to claim 3, wherein, described heat exchanger forms the shape of plate, and
Surface flow from the described plating bath of described supply department supply along described heat exchanger.
6. chemical plating appts according to claim 3, wherein, described supply department comprises a plurality of ozzle portion.
7. chemical plating appts according to claim 6, wherein, described heat exchanger forms the shape of plate, and
Described supply department comprises the first ozzle portion and the second ozzle portion, and the described first ozzle portion is configured to be adjacent to the upper surface of described heat exchanger, and the described second ozzle portion is configured to be adjacent to the lower surface of described heat exchanger,
Mobile from the described plating bath of described first ozzle portion supply along the upper surface of described heat exchanger, and
Mobile from the described plating bath of described second ozzle portion supply along the lower surface of described heat exchanger.
8. chemical plating appts according to claim 1, wherein, the surface temperature of described heat exchanger is 90 ℃ to 100 ℃.
9. one kind is carried out the method for electroless plating by plating bath being offered the plating target, and described method comprises:
Described plating target is arranged in the coating bath;
Supply described plating bath from the basal surface of described coating bath;
To described plating bath supply heat; And
The described plating bath that will be provided with heat offers described plating target.
10. method according to claim 9 wherein, is carried out the supply of heat by means of the heat exchanger of the bottom surface that is arranged on described coating bath.
11. method according to claim 10, wherein, described plating bath is towards described heat exchanger supply.
12. method according to claim 11, wherein, the lower surface of first ozzle portion that is provided with by means of the upper surface of contiguous described heat exchanger and contiguous described heat exchanger and the second ozzle portion that is provided with and carry out the supply of described plating bath,
Mobile from the described plating bath of described first ozzle portion supply along the upper surface of described heat exchanger, and
Mobile from the described plating bath of described second ozzle portion supply along the lower surface of described heat exchanger.
13. method according to claim 10, wherein, the surface temperature of described heat exchanger is 90 ℃ to 100 ℃.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070009517A KR100846318B1 (en) | 2007-01-30 | 2007-01-30 | Apparatus and method for electroless plating |
| KR10-2007-0009517 | 2007-01-30 | ||
| KR1020070009517 | 2007-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101235494A true CN101235494A (en) | 2008-08-06 |
| CN101235494B CN101235494B (en) | 2010-09-29 |
Family
ID=39727925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101073940A Expired - Fee Related CN101235494B (en) | 2007-01-30 | 2007-06-01 | Device and method for chemical plating |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4416808B2 (en) |
| KR (1) | KR100846318B1 (en) |
| CN (1) | CN101235494B (en) |
| TW (1) | TWI360585B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102400116A (en) * | 2010-09-10 | 2012-04-04 | 三星电机株式会社 | Plating Device Applicable To Print Circuit Board |
| CN103602963A (en) * | 2013-12-03 | 2014-02-26 | 昆山亿诚化工容器有限公司 | Novel electroplating facility |
| CN107231754A (en) * | 2017-06-29 | 2017-10-03 | 深圳崇达多层线路板有限公司 | It is a kind of to improve the bad method of the plated through-hole produced in assist side manufacturing process |
| CN115595566A (en) * | 2022-11-17 | 2023-01-13 | 西华大学（Cn） | Environment-friendly, energy-saving, efficient and flexible chemical plating device and method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI485286B (en) * | 2011-11-16 | 2015-05-21 | Ebara Corp | Electroless plating and electroless plating |
| KR101816028B1 (en) | 2015-01-23 | 2018-01-08 | 코닝정밀소재 주식회사 | Metal bonded substrate |
| CN110408916B (en) * | 2019-08-26 | 2021-08-17 | 惠州市安泰普表面处理科技有限公司 | Chemical nickel plating method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3075409B2 (en) * | 1989-10-30 | 2000-08-14 | イビデン株式会社 | Electroless plating equipment |
| CN2399403Y (en) * | 1999-12-16 | 2000-10-04 | 张贵洲 | Alloyed launder |
| CN2601259Y (en) * | 2003-01-30 | 2004-01-28 | 中国第一汽车集团公司 | Water bath heating chemical plating plant |
-
2007
- 2007-01-30 KR KR1020070009517A patent/KR100846318B1/en not_active IP Right Cessation
- 2007-04-03 TW TW096111852A patent/TWI360585B/en not_active IP Right Cessation
- 2007-04-25 JP JP2007114964A patent/JP4416808B2/en not_active Expired - Fee Related
- 2007-06-01 CN CN2007101073940A patent/CN101235494B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102400116A (en) * | 2010-09-10 | 2012-04-04 | 三星电机株式会社 | Plating Device Applicable To Print Circuit Board |
| CN102400116B (en) * | 2010-09-10 | 2014-12-10 | 三星电机株式会社 | Plating device applicable to print circuit board |
| CN103602963A (en) * | 2013-12-03 | 2014-02-26 | 昆山亿诚化工容器有限公司 | Novel electroplating facility |
| CN107231754A (en) * | 2017-06-29 | 2017-10-03 | 深圳崇达多层线路板有限公司 | It is a kind of to improve the bad method of the plated through-hole produced in assist side manufacturing process |
| CN115595566A (en) * | 2022-11-17 | 2023-01-13 | 西华大学（Cn） | Environment-friendly, energy-saving, efficient and flexible chemical plating device and method |
| CN115595566B (en) * | 2022-11-17 | 2024-05-28 | 西华大学 | Environment-friendly, energy-saving, efficient and flexible chemical plating device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4416808B2 (en) | 2010-02-17 |
| TW200831702A (en) | 2008-08-01 |
| JP2008184687A (en) | 2008-08-14 |
| CN101235494B (en) | 2010-09-29 |
| TWI360585B (en) | 2012-03-21 |
| KR100846318B1 (en) | 2008-07-15 |
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