CN102400116A - Plating Device Applicable To Print Circuit Board - Google Patents

Plating Device Applicable To Print Circuit Board Download PDF

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Publication number
CN102400116A
CN102400116A CN2011100272924A CN201110027292A CN102400116A CN 102400116 A CN102400116 A CN 102400116A CN 2011100272924 A CN2011100272924 A CN 2011100272924A CN 201110027292 A CN201110027292 A CN 201110027292A CN 102400116 A CN102400116 A CN 102400116A
Authority
CN
China
Prior art keywords
printed substrate
coating solution
plating
injection unit
injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011100272924A
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Chinese (zh)
Other versions
CN102400116B (en
Inventor
柳达铉
吴世民
崔凤圭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN102400116A publication Critical patent/CN102400116A/en
Application granted granted Critical
Publication of CN102400116B publication Critical patent/CN102400116B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Provided is a plating device applicable to a print circuit board. The plating device comprises: a plating groove accepting the print circuit board, a first injection unit and a second injection unit which are formed at different positions of the edge of the print circuit board contained in the plating groove and composed of multiple nozzles for injecting plating solution, and a first guide direction and a second guide direction which are formed ahead of the first injection unit and the second injection unit and change the flowing of the plating solution injected from the first and second injection units to the print circuit board.

Description

The plater that is used for printed substrate
The cross reference of related application
The application requires the right of priority of on September 10th, 2010 at the korean patent application No.10-2010-0089026 of Korea S Department of Intellectual Property submission, and its content is incorporated into this for your guidance.
Technical field
The present invention relates to a kind of plater that is used for printed substrate, more specifically, relate to a kind of like this plater that is used for printed substrate, it can carry out plating through forming along whole printed substrate mobile streamline on whole printed substrate.
Background technology
Printed substrate (PCB) is electrically connected through each device that the wiring diagram that is formed on the insulating material (for example, resol insulcrete, epoxy resins insulation plate etc.) will be mounted thereon, and supplies electric power etc. to each device, and simultaneously, these devices of mechanical fixation.As printed substrate, the multi-ply wood (MLB) that forms the two-sided PCB of wiring on the single face PCB of wiring, the both sides at insulated substrate and form wiring with multilayer forming on the side of insulated substrate is only arranged.
Wherein, The technology of making two-sided PCB or MLB comprises such technology: on the both sides of PCB, form in the schematic circuit or be formed on the contact pad on the outermost layer and form in the resist of being processed by gold (Au), nickel (Ni) etc., on the both sides of PCB, carry out plating.
The plater that is used for the plating printed substrate according to prior art is incorporated into the plating groove with several printed substrates, and uses from the plating liquid plating printed substrate of nozzle ejection.Because several printed substrates are contained in the plating groove simultaneously; Because of the coating solution mobile ununiformity in the plating groove; Cause local stop up (congest) of coating solution, the coating solution that perhaps is incorporated in the gap between the printed substrate can not smooth flow.Therefore, can't carry out plating equably, thereby cause the mass defect of printed substrate.
Especially, when the plating groove is narrower, possibly near printed substrate, form eddy current, make, on the contrary,, thereby cause the mass defect of printed substrate only to a part of plating of printed substrate not to whole printed substrate plating.
Summary of the invention
One aspect of the present invention provides a kind of plater that is used for printed substrate, its have through being formed on mobile streamline on the whole printed substrate can the whole printed substrate of plating flow line system.
According to an aspect of the present invention, a kind of plater that is used for printed substrate is provided, comprises: the plating groove that holds printed substrate; Injection unit, it is formed on the inwall of plating groove and by a plurality of nozzles that spray coating solution and constitutes, and makes coating solution flow along the inwall of plating groove; And liner; Be formed on the direction of the coating solution that sprays from injection unit; And, this liner with the surperficial parallel direction of printed substrate on change flowing of coating solution, make surface flow along the inwall mobile coating solution of plating groove along printed substrate.
Injection unit can be configured to comprise first injection unit and second injection unit; They are formed at the different positions place on the inwall of plating groove; And constitute by a plurality of nozzles that spray coating solution, make coating solution flow along the inwall of plating groove, and; Liner can be configured to comprise first liner and second liner; They are formed on from first and second injection units sprays on the direction of coating solution, and with the surperficial parallel direction of printed substrate on change flowing of coating solution, make surface flow from the coating solution of first and second injection units injection along printed substrate.
First and second injection units can be formed on the same level on the inwall of plating groove; And; First and second liners can be formed on the injection direction of first and second injection units; With with the surperficial parallel direction of printed substrate on change flowing of coating solution, make surface flow along the inwall mobile coating solution of plating groove along printed substrate.
First injection unit can be arranged on the lower edge of plating groove; Second injection unit can be formed on the following center of plating groove; And; First and second liners can all be formed on the injection direction of first and second injection units, changing into the surperficial parallel direction with printed substrate along the direction of the inwall mobile coating solution of plating groove, make coating solution flow along the lower surface and the upper surface of printed substrate.
Injection unit can utilize the transverse injection scheme to spray coating solution.
The plating groove can hold a plurality of printed substrates simultaneously.
The amount that is incorporated into the coating solution in the gap between each printed substrates of said a plurality of printed substrates can be its overall flow rate 35% or more.
Electroless Plating Ni, electroless plating Pd and soak gold (ENEPIG) technology and can be used for printed substrate.Particularly, the plater that is used for printed substrate can be used for the plating Pd of ENEPIG technology.
Description of drawings
From detailed description below in conjunction with accompanying drawing, will more be expressly understood above and others, characteristic and other advantage of the present invention, in the accompanying drawing:
Fig. 1 is the broken-open perspective view according to the plater that is used for printed substrate of an illustrative embodiments of the present invention;
Fig. 2 is the cross-sectional view according to the plater that is used for printed substrate of an illustrative embodiments of the present invention; And
Fig. 3 shows the mobile glide path figure that is formed at according to the coating solution in the plater that is used for printed substrate of an illustrative embodiments of the present invention.
Embodiment
Hereinafter, will be described in detail with reference to the attached drawings illustrative embodiments, and make one of skill in the art of the present invention can put into practice these illustrative embodiments like a cork.Yet, in describing illustrative embodiments of the present invention, omit the detailed description of well-known function or structure, can not make description of the invention fuzzy like this through unnecessary detailed description.
In addition, in all figure, similar reference number representes to carry out the parts of identity function and action.
In addition, only if describe clearly in addition, will understand " comprising " any parts and represent to comprise other parts, rather than get rid of any other parts.
Fig. 1 is the broken-open perspective view according to the plater that is used for printed substrate of an illustrative embodiments of the present invention, and Fig. 2 is the cross-sectional view according to the plater that is used for printed substrate of an illustrative embodiments of the present invention.
With reference to figure 1, comprise according to the plater that is used for printed substrate of an illustrative embodiments of the present invention: the plating groove 100 that holds printed substrate 110; Injection unit is formed on the inwall of plating groove and by a plurality of nozzles that spray coating solution and constitutes, and makes coating solution flow along the inwall of plating groove; And liner, be formed on from injection unit and spray on the direction of coating solution, and this liner changes flowing of coating solution, make surface flow along the inwall mobile coating solution of plating groove along printed substrate.
Can in single plating groove, form a plurality of injection units.According to an illustrative embodiment of the invention; Can injection unit be configured to comprise two injection units, that is, and first injection unit and second injection unit; They are formed at the different positions place on the inwall of plating groove; And constitute by a plurality of nozzles that spray coating solution, make coating solution flow, but be not limited thereto along the inwall of plating groove.
In addition, according to an illustrative embodiment of the invention plater comprises being formed on from first injection unit and second injection unit and sprays first liner and second liner on the direction of coating solution.First liner and second liner can be changed into the surperficial parallel direction with printed substrate with from the coating solution inwall mobile direction along the plating groove of flowing of coating solution; Promptly; Coating solution is along the direction of the surface flow of printed substrate, makes the coating solution that sprays from first injection unit and the second injection unit whole surface flow along printed substrate.
Particularly; According to an illustrative embodiment of the invention; First injection unit and second injection unit are formed on the same level on the inwall of plating groove; And; First liner is formed on the distance that separates with predetermined space on the injection direction of first injection unit, and second liner is formed on the distance that separates with predetermined space on the injection direction of second injection unit, maybe be with changing into along the direction of the surface flow of printed substrate along the direction of inwall mobile coating solution thereby make.
Be arranged on the lower edge of plating groove with reference to figure 1, the first injection unit 10,20 and 30, and first liner 201 is formed on the distance that separates with predetermined space on the injection direction of first injection unit 10,20 and 30.In addition, be appreciated that second injection unit 40,50 and 60 is formed on the following center of plating groove, and second liner 202 is formed on its lower edge.
Mobile from the coating solution of first injection unit and the injection of second injection unit along the inwall of plating groove.Then, first liner and second liner be the mobile surface flow of changing into along printed substrate of coating solution, that is, with the surperficial parallel direction of printed substrate on.
Plating groove 100 is according to an illustrative embodiment of the invention carried out plating technic through in plating technic, spraying coating solution.
Plating groove 100 according to an illustrative embodiment of the invention can be used in Electroless Plating Ni, electroless plating Pd and soak in gold (ENEPIG) technology, but is not limited thereto.ENEPIG technology mainly is divided into plating Ni, plating Pd and plating Au.The plating groove that in ENEPIG technology, uses is carried out plating, in a plating groove, arranges 10 to 25 printed substrates according to the size of plating groove simultaneously.
Particularly, according to an illustrative embodiment of the invention plating groove 100 can be used to plate Pd.In order to carry out plating Pd, adopts such scheme: from the coating solution of the interior nozzle ejection of plating groove 100 be disposed to printed substrate with the Pd ion-transfer to printed substrate.
According to an illustrative embodiment of the invention, in order in the plating groove, to carry out metal deposition, 10 to 25 printed substrates are incorporated in the plating groove 100.Then, spray coating solution by first injection unit 10,20 and 30 and second injection unit 40,50 and 60, said injection unit is made up of a plurality of nozzles of the edge that is positioned at the printed wiring panel area that is contained in plating groove 110.Coating solution is being evenly distributed on the whole printed substrate with after to its supplying metal ion, coating solution flows out to a strainer through outlet.In addition, the plating groove has the hot well tank that is installed in wherein, carrying out plating reposefully, makes can be in heat protocol the temperature of coating solution to be remained on 80 ℃.
The plater that is used for printed substrate according to an illustrative embodiment of the invention prevents coating solution local obstruction in plating groove 100, perhaps prevents in the part of printed substrate, to produce eddy current.And its coating solution that prevents to be incorporated in the gap between the printed substrate does not flow reposefully.Therefore, can be at a plurality of printed substrates carry out metal deposition on the whole equably.
According to an illustrative embodiment of the invention, can a plurality of printed substrates 110 be incorporated in the plating groove 100.According to an illustrative embodiment of the invention, single plating technic capable of using comes a plurality of printed substrates 110 of plating.
And nonessentially utilize single plating technic to come a plurality of printed substrates 110 of plating.Yet,, can utilize single plating technic to come the several printed substrates of plating in order to carry out plating technic effectively and to shorten the plating time.And, can printed substrate be incorporated in the plating groove 100, so that its both sides of plating or one-sided.
With reference to figure 1 and Fig. 2, be appreciated that in plating groove 100, to be formed with a plurality of nozzles 10,20,30,40,50 and 60.
According to an illustrative embodiment of the invention, first injection unit 10,20 and 30 and second injection unit 40,50 and 60 all are formed on the bottom of plating groove 100, to construct a flow line system, make coating solution in plating groove 100, form streamline.
First injection unit 10,20 and 30 and second injection unit, 40,50 and 60 various schemes capable of using are sprayed coating solution.As the scheme of spraying coating solution, have and in plating groove 100, spray the downward ejection schemes of coating solution downwards and the transverse injection scheme of transverse injection coating solution in plating groove 100.
According to an illustrative embodiment of the invention, can adopt the transverse injection scheme that coating solution laterally is injected into plating groove 100, but be not limited thereto.
In the situation of using downward ejection schemes, possibly form eddy current in the bottom of printed substrate, and 25% or coating solution still less of overall flow rate are introduced in the gap between the printed substrate.
Yet; According to an illustrative embodiment of the invention; Adopt the transverse injection scheme, thereby make and can prevent that the bottom at printed substrate from producing eddy current, and will be incorporated into coating solution in the gap between the printed substrate increase to its overall flow rate 35% or more.
According to an illustrative embodiment of the invention; Can be through being formed at first liner 201 and second liner 202 of first injection unit 10,20 and 30 and second injection unit 40,50 and 60 fronts; To be injected into the lateral coating solution of plating groove 100 from first injection unit 10,20 and 30 and second injection unit 40,50 and 60; Guiding promptly, is flowed on the printed substrate direction in plating groove 100, upwards flowing.
With reference to figure 1 and Fig. 2; First liner 201 according to an illustrative embodiment of the invention and second liner 202 are formed on first injection unit 10,20 that is made up of three nozzles and 30 and second injection unit 40,50 that is made up of three nozzles and 60 front, to change from the direction of the coating solution of first injection unit 10,20 and 30 and second injection unit 40,50 and 60 transverse injections.
According to an illustrative embodiment of the invention; First injection unit 10,20 and 30; First liner 210; Second injection unit 40,50 and 60 and second liner 202 form flow line system, with a plurality of streamlines of formation coating solution on whole printed substrate, thereby on whole printed substrate, spray coating solution.Therefore, the whole printed substrate of plating equably.
Fig. 3 shows the glide path figure that is formed at according to the streamline of the coating solution in the plater that is used for printed substrate of example meaning property embodiment of the present invention.
Referring to figs. 2 and 3, be appreciated that the streamline of the coating solution that an illustrative embodiments according to the present invention forms is formed on the whole printed substrate.
According to an illustrative embodiment of the invention; First injection unit 10,20 and 30; First liner, 210, the second injection units 40,50 and 60 and second liner 202 are configured on whole printed substrate, forming the flow line system of the streamline of coating solution.
First injection unit 10,20 and 30 is arranged on the lower edge of printed substrate 110; And first liner 201 is arranged on the following center of printed substrate; Separating with predetermined space, thereby form along the streamline of the bottom mobile coating solution of printed substrate with first injection unit.
Therefore, form streamline like this, make promptly, to be injected into the bottom righthand side of printed substrate 110 in center and the bottom that coating solution is injected into a plurality of printed substrates 110, thereby make and on the bottom righthand side of printed substrate 110, to carry out plating.
Second injection unit 40,50 and 60 is arranged on the following center of printed substrate; And second liner 202 is arranged on the lower edge of printed substrate; Separating with predetermined space, thereby form along the streamline of the top mobile coating solution of printed substrate with second injection unit 40,50 and 60.
Therefore, form streamline like this, make promptly, to be injected into the left upper end of printed substrate in center and the top that coating solution is injected into a plurality of printed substrates 110, thereby make and on the left upper end of printed substrate 110, to carry out plating.
Flow line system according to an illustrative embodiment of the invention is not necessarily limited to this.Can first injection unit 10,20 and 30 be arranged on the left hand edge place, and the direction that can suitably regulate first and second liners 201 and 202 makes and on whole printed substrate, sprays the coating solution from first and second injection units.
The plater that is used for printed substrate according to the present invention comprises a plurality of first injection units 10,20 and 30 in plating groove 100; Second injection unit 40,50 and 60; First liner 210 and second liner 202, thereby feasible can formation along whole printed substrate mobile streamline.Therefore, can reduce the eddy current of the bottom that is formed at printed substrate significantly.In addition, be incorporated into flow velocity in the gap between the printed substrate and be overall flow rate 35% or more, thereby make a plurality of printed substrates of plating equably.
According to an illustrative embodiment of the invention, in the plating groove, be formed with the streamline of edge and the surperficial parallel direction mobile coating solution of printed substrate, thereby reduced the incidence of eddy current and printed substrate collision.
Therefore, can prevent the surface of printed substrate plating unevenly, and several printed substrates of plating effectively, even in having the plating groove of small volume.
As a result,, simplified the ME that is used for printed substrate, especially, simplified the plating technic that is used for printed substrate,, thereby made the manufacturing cost that can reduce printed substrate with the cost of reduction plating technic according to the present invention.
As stated, according to an illustrative embodiment of the invention,, on whole printed substrate, form streamline through being formed at the flow line system of the plater that is used for printed substrate.Therefore, can provide can the whole printed substrate of plating the plater that is used for printed substrate.
Though combined illustrative embodiments to illustrate and described the present invention; But; To those skilled in the art will it is obvious that, under the prerequisite that does not deviate from the essence of the present invention that is defined by the following claims and scope, can make amendment and change.

Claims (9)

1. plater that is used for printed substrate comprises:
The plating groove holds said printed substrate;
Injection unit is formed on the inwall of said plating groove and by a plurality of nozzles that spray coating solution and constitutes, and makes coating solution flow along the inwall of said plating groove; And
Liner; Be formed on from said injection unit and spray on the direction of coating solution; And; Said liner with the surperficial parallel direction of said printed substrate on change flowing of coating solution, make surface flow along the inwall mobile coating solution of said plating groove along said printed substrate.
2. the plater that is used for printed substrate according to claim 1; Wherein, Said injection unit is constructed to comprise first injection unit and second injection unit, and said first injection unit and second injection unit are formed at the different positions place on the inwall of said plating groove, and is made up of a plurality of nozzles that spray coating solution; Make coating solution flow along the inwall of said plating groove, and
Said liner is constructed to comprise first liner and second liner; Said first liner and second liner are formed on from said first and second injection units and spray on the direction of coating solution; And with the surperficial parallel direction of said printed substrate on change flowing of coating solution, make the coating solution that sprays from said first and second injection units surface flow along said printed substrate.
3. the plater that is used for printed substrate according to claim 2, wherein, said first and second injection units are formed on the same level on the inwall of said plating groove, and
Said first and second liners are formed on the injection direction of said first and second injection units; With with the surperficial parallel direction of said printed substrate on change flowing of coating solution, make surface flow along the inwall mobile coating solution of said plating groove along said printed substrate.
4. the plater that is used for printed substrate according to claim 3, wherein, said first injection unit is arranged on the lower edge of said plating groove, and said second injection unit is formed on the following center of said plating groove, and
Said first and second liners all are formed on the injection direction of said first and second injection units; Changing into the surperficial parallel direction with said printed substrate, make coating solution flow along the lower surface and the upper surface of said printed substrate along the direction of the inwall mobile coating solution of said plating groove.
5. the plater that is used for printed substrate according to claim 1, wherein, said injection unit utilizes the transverse injection scheme to spray coating solution.
6. the plater that is used for printed substrate according to claim 1, wherein, said plating groove holds a plurality of printed substrates simultaneously.
7. the plater that is used for printed substrate according to claim 6, wherein, the amount that is incorporated into the coating solution in the gap between each printed substrate in said a plurality of printed substrate be its overall flow rate 35% or more.
8. the plater that is used for printed substrate according to claim 1, wherein, Electroless Plating Ni, electroless plating Pd and soak gold (ENEPIG) technology and be used for said printed substrate.
9. the plater that is used for printed substrate according to claim 8, wherein, it is used for the plating Pd of ENEPIG technology.
CN201110027292.4A 2010-09-10 2011-01-21 Plating device applicable to print circuit board Expired - Fee Related CN102400116B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0089026 2010-09-10
KR1020100089026A KR101153537B1 (en) 2010-09-10 2010-09-10 A plating device for printed circuit board a plating device for printed circuit board

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CN102400116A true CN102400116A (en) 2012-04-04
CN102400116B CN102400116B (en) 2014-12-10

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1235879A (en) * 1998-05-15 1999-11-24 阿托技术美国公司 Fluid delivery apparatus and method
TW565895B (en) * 2001-04-06 2003-12-11 Sony Corp Apparatus and method for electroless plating
US20060046481A1 (en) * 2004-08-26 2006-03-02 Takuya Tokuda Manufacturing methods and electroless plating apparatus for manufacturing wiring circuit boards
CN101235494A (en) * 2007-01-30 2008-08-06 三星电机株式会社 Device and method for chemical plating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3079698B2 (en) * 1991-10-09 2000-08-21 イビデン株式会社 Surface treatment equipment for printed wiring boards
TWI229367B (en) * 2002-12-26 2005-03-11 Canon Kk Chemical treatment apparatus and chemical treatment method
EP1602127A2 (en) * 2003-03-11 2005-12-07 Ebara Corporation Plating apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1235879A (en) * 1998-05-15 1999-11-24 阿托技术美国公司 Fluid delivery apparatus and method
TW565895B (en) * 2001-04-06 2003-12-11 Sony Corp Apparatus and method for electroless plating
US20060046481A1 (en) * 2004-08-26 2006-03-02 Takuya Tokuda Manufacturing methods and electroless plating apparatus for manufacturing wiring circuit boards
CN101235494A (en) * 2007-01-30 2008-08-06 三星电机株式会社 Device and method for chemical plating

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KR101153537B1 (en) 2012-06-11
CN102400116B (en) 2014-12-10
KR20120026858A (en) 2012-03-20

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