TWI360585B - Apparatus and method for electroless plating - Google Patents

Description

1360585 IX. Description of the invention: [Technical jaw region to which the invention pertains] The present invention relates to an electroless forging device and method. [Prior Art]

Electroless plating refers to a type of plating that is completed by a chemical reaction without using electricity. In general, electroplating is often used for plating, but for materials such as epoxy resins and other plastics, the material does not allow electrical conduction, so that electroplating cannot be performed. In such an example, the plating is accomplished using electroless plating. Electroless plating can be divided into 1) reduction bond type and 2) displacement plating type. "Reduction plating type" is a type of bond, which is replaced by a reduction reaction. The substitution plating type is a type of plating that utilizes the difference in oxidation/reduction force. A typical example of a displacement plating type is a nickel/gold (Ni/Au) bond.

This type of electroless type is applied as a method of performing surface treatment in the manufacture of printed circuit boards. For example, electroless plating of approximately 5 microns high nickel on a copper layer of a printed circuit board to surface treat the printed circuit board followed by electroless plating of approximately 0.03 micron high gold. However, in this way, electroless nickel is performed on a printed circuit board, and the low suspicion of the nickel chain coating causes problems. When the reliability of the nickel plating layer is lowered due to the unwrapped forging environment, the local nickel is excessively replaced during the process of forming the golden bell coating by the displacement reaction (after the forging), so that the gold 5 1360585 is covered. The thickness of the layer becomes excessive 'causing a loss of material cost. Figure 1 is a perspective view of an electroless plating apparatus interposed in accordance with the prior art. Referring to Fig. 1, the operation of the electroless plating apparatus (according to the prior art) is as follows.

When the plating solution is sprayed through the two tubes 30 to the bottom of the plating tank 1 , the forging liquid supplies the recording ions to the circuit board (not shown) placed in the basket 2 ' and then flows through the mask film 50 to reach Auxiliary tank 70. The flow of the plating solution to the auxiliary tank 70 is accomplished by supplying energy by a heat exchanger 40 having a surface temperature of 110 °C (located on the side of the plating tank 10). The energized plating solution flows out through the water outlet 72 of the auxiliary tank 70, and is again moved to the tube member 30» through a circulation configuration, while a blower 60 is disposed adjacent to the heat exchanger 4 to dissipate heat. In the electroless plating equipment operating in this type of configuration, the inaccurate construction/operating environment in the plating tank causes an error in the plating environment, so that the nozzle and the heat exchanger (on the side) appear in comparison with the surrounding 'high temperature. nearby.

Furthermore, the vortex caused by the nozzle structure sprayed toward the bottom of the plating tank causes an error in the flow rate of the plating solution close to the circuit board and the temperature deviation. Furthermore, since the plating solution is supplied with energy (when it flows to the auxiliary tank), a high temperature loss occurs, so that the heat exchanger must be operated to a temperature of 80 Å to maintain the necessary temperature of the plating process. (:, because of the high possibility of decomposing the forging liquid due to the high temperature of the heat exchanger. Therefore, there is a need for a method that can make the plating environment uniform in order to improve the reliability of the plating layer. 6 1360585 [Summary] An aspect of the invention provides an apparatus and method for electroless plating, wherein the plating bath configuration is modified to allow the plating environment to change. One aspect of the present invention provides an electroless plating apparatus comprising: a plating bath a heat exchanger disposed near the bottom surface of the plating tank; a supply member disposed adjacent to the heat exchanger to provide a plating solution to the inside of the plating tank; and a basket disposed in the plating tank for supporting Plated subject matter.

An additional circulation component can be formed to supply the components with the plating solution in the tank. The supply is supplied to the clock cover. The supply unit supplies plating liquid to the heat exchange and is disposed on one end close to the heat exchanger. At the same time, the heat exchanger is molded - the flat plating fluid moves along the heat exchanger surface. And the supply parts supply parts are provided by a plurality of nozzle parts and are arranged close to the upper surface of the heat exchanger. For example, a second nozzle that may be near the lower surface of the heat exchanger. ’' and set in Beifang Shao, Shishi

The plating solution provided will move the plating solution provided by the nozzle member along the upper surface of the first nozzle member of the heat exchanger, and the T* heat exchanger having the heat exchanger by the second spray σ The surface temperature will be "^ to the surface of the surface. Another aspect of the present invention provides one. The hard enamel is provided by etching to provide electroless plating, ', and the liquid is given to the target. The plating tank is supplied with a plating solution on the bottom surface of the plating tank, and the target material is supplied in the crucible. The heat is required to give the target material to the coating liquid which is supplied with heat energy. X coating liquid, and providing heat energy supply system to be set in the complex The heat exchanger on the bottom surface is executed, and 7 1360585 plating solution is supplied toward the heat exchanger. The plating liquid supply ^ ^ , , is from the first nozzle part (the second nozzle part is set close to the heat exchanger) Providing a lower surface close to the heat exchanger) the key coating provided by the dispensing nozzle component moves along the upper surface of the heat exchanger and the plating fluid provided by the second nozzle component will follow the heat exchanger The lower surface moves. Additional aspects and advantages of the present invention, Will be set forth in part in the following,

The other part is clearly inferred from the description or can be learned from the practice of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In accordance with the present invention, in each of the drawings, the same, the electroless plating apparatus and method of the embodiment will be more clearly described with reference to the accompanying drawings, wherein the elements are given the same element numbers, and the description is not repeated.

Fig. 2 is a perspective view of an electroless plating apparatus described in accordance with an embodiment of the first disclosed embodiment of the present invention. Figure 2 depicts a plating tank u〇, a shelf 112, and several baskets! 20a, 12〇b, _ supply part n〇, a first nozzle part 131, a second nozzle part 132, a plurality of nozzles i3u, 132a, a heat exchanger 140, an auxiliary tank 17A and a water outlet 172. The plating tank 1 1 〇 is a space for accommodating the plating liquid to perform plating. The above different components are disposed in the plating tank 11, such as the blue bodies 120a, 120b, the supply member 130, the heat exchanger mo, and the like. The baskets 120a, 120b are members that support a plated object such as a circuit board (not shown). Although only two baskets 12〇a, 12〇b are described in the 8 1360585 2 circle, the number and shape of the baskets 120a, 120b may vary with the plating target. The supply member 130 is provided with plating. The liquid is applied to the components in the plating tank 110. In Fig. 2, the first nozzle member 13i and the second nozzle member 132 are regarded as the supply member 130. By using a plurality of nozzle parts as supply parts, the number of supply plating solutions and the supply direction can be adjusted. This supply member 130 is provided with a plating solution which is disposed in the bottom layer of the plating tank.

At the same time, in order to supply thermal energy to the plating liquid (supplying from the supply member 130), the heat exchanger 140 is disposed on the bottom surface of the plating tank 110, adjacent to the supply member 130. The heat exchanger 丨4〇 is a member for supplying thermal energy to the plating liquid so that the plating liquid supplied into the plating tank 11〇 reaches a temperature suitable for the plating step. Since this heat exchanger 140 is disposed on the bottom surface of the plating tank 110, close to the supply member 130, heat energy is directly supplied to the mineral deposit supplied to the chain groove 110, and the running efficiency can be improved.

Further, the heat exchanger 140' which makes the plating liquid reach the temperature suitable for the plating step does not need to be set to have an excessively high surface temperature, so that the decomposition of the key liquid (which occurs close to the heat exchanger 14) can be avoided. For example, in order to make the plating solution (after receiving heat energy from the heat exchanger 14), in the vicinity of the circuit board (not shown) of the money-covered object, the temperature 8 (TC, surface of the heat exchanger 140) suitable for the plating step is maintained. The temperature will be set between 9 〇t and 1 〇〇 °c. This is because setting a temperature lower than 90C makes it difficult to maintain the key coating near the board, so it will be smooth during the plating process. 9 error occurs, when the temperature changer 140 is disengaged at the same time, for direct contact with the heat exchanger from the heat exchanger with reference to the second supply and delivery liquid to the flattener 140 of the flattener 14 4 . The efficiency is executed again, The upper portion of the nozzle 140 is divided by the arrow in FIG. 3, and the nozzle member 1 is a second-nozzle portion surface so that it can be used for forging the hot-headed arrow. The overcoat liquid from the converter 140 will be set to exceed the luot along the heat, which will cause the plating solution to approach the heat. The component 130 will provide a key coating to the heat exchanger 14〇. The converter 14 0 provides the plating solution. In order to supply thermal energy to the plating solution with a more efficient side 140. When the component 130 is lifted from the side of the heat exchanger 14 to the plate-shaped heat exchanger 140, the plating solution will move along the heat interface, and then the plating liquid has more opportunities to exchange heat with the heat exchanger. 140 to the thermal conductivity of the plating solution, as described in Fig. 3, the supply member 丨3 提供 provides a plating solution from the direction of heat exchange to the surface of the heat exchanger 14 〇 as usual. The number indicates the supply direction of the ore coating. The purpose is to directly provide the setting of the plating solution to the heat exchanger side, etc., and may have different modifications as necessary. When a plurality of nozzle parts are supplied to the part 130, a second turn is set in the proximity heat exchanger 140. The upper surface, and the member 132 is disposed adjacent to the heat exchanger 丨4〇 in the direction parallel to the surface of the heat exchanger 14 to extract the exchanger 140, as depicted in Fig. 2. In Fig. 2 The supply direction of the liquid coating. The plating liquid supplied from the first nozzle member 131 will move along the heat exchange surface and move the lower surface of the key exchanger 140 supplied by the second nozzle member 132 to allow the heat energy to pass the efficiency of 10 1360585. Maximize. At the same time, set one a circulating component for circulating the plating solution that has participated in the plating step. Referring to FIG. 2, when the new plating liquid is supplied through the supply member 130 of the bottom surface of the plating tank 11 , it has participated in the step of covering the money. The plating solution will be relatively moved to the higher portion of the plating bath 11 。. After the 'rich plating liquid element fills the inside of the bell jar 11 , inside, the plating. The higher part of the plating solution of the tank 110 And flowing to the auxiliary tank 17A via the shelf 112 (the side formed on the upper portion of the plating tank 11). The plating liquid supplied to the auxiliary tank 17〇 is discharged through the water outlet 172, and the discharged key liquid is permeated. A pipe or the like is supplied to the supply member 130 and thus is again used in the plating step. The reprocessing step is also performed in the recycling step to remove impurities contained in the plating solution, etc. Another embodiment of the electroless plating method according to the present invention is described with reference to Fig. 4. Figure 4 is a flow chart of the electroless plating method described in accordance with another aspect of the present invention.

First, the subject matter is provided in the plating tank 110 (sl〇). The ruthenium object may be directly provided in the plating tank, but may be provided in the plating tank 110 to support the baskets l2a, i2〇b in the plating tank 110 to avoid the object and supply. The component 130 or the heat exchanger 140 is in contact. Before the target is supplied to the plating tank 110, the inside of the plating tank 110 is filled with a certain amount of plating liquid. Then, the plating liquid is supplied to the bottom surface of the plating tank 110 (s20), and heat energy is supplied to the supplied plating liquid (s30). The supply of the bell coating and the supply of thermal energy are performed by the supply member 130 of the electroless plating apparatus described above and the heat exchanger 140 11 1360585. In other words, as described in FIG. 2, after the heat exchanger 140 is disposed on the bottom surface of the plating tank 110 and the supply member 130 is disposed on the side of the heat exchanger 140, the plating liquid is supplied to the heat exchanger 140. . Prior to the plating step, thermal performance is increased by directly supplying thermal energy to the plating solution (supplied in the plating tank 110). Further, the heat exchanger 140 which makes the plating solution reach the temperature suitable for the plating process does not need to be set to have an excessive surface temperature, so that the plating solution can be prevented from being decomposed near the heat exchanger 140.

For example, in order to maintain a temperature suitable for the plating step of 80 ° C after the plating solution in the vicinity of the board of the plating target (after receiving heat energy from the heat exchanger 140), the surface temperature of the heat exchanger 140 is set at 90 °. C to l ° ° C, as described above. The plating solution is supplied to the heat exchanger. The plating solution can be supplied directly to the heat exchanger 140 to supply thermal energy from the heat exchanger 140 to the plating solution in a more efficient manner.

As described in FIG. 2, when the supply member 130 provides a plating solution to the flat heat exchanger 140 from the side of the heat exchanger 140, the plating solution will move along the surface of the heat exchanger 140. The heat transfer from the heat exchanger 140 to the plating solution can be made more efficient, as described above. When the plating liquid which has supplied the thermal energy in the above manner is supplied to the target (s40), electroless plating is performed. According to some specific examples of the present invention as set forth above, it is possible to achieve a uniform plating environment and improve the reliability of the plating layer by placing the heat exchanger at the bottom of the plating tank and facing the heat exchanger in the discharge direction of the plating solution. . Although the spirit of the present invention has been described in detail with reference to the specific embodiments thereof, the particular embodiments disclosed herein It will be apparent to those skilled in the art that the present invention may be modified or modified without departing from the scope and spirit of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of an electroless plating apparatus according to the prior art.

Fig. 2 is a perspective view of an electroless plating apparatus according to a first embodiment of the present invention. Figure 3 is a perspective view of an electroless plating apparatus according to a second disclosed embodiment of the present invention. Fig. 4 is a flow chart showing an electroless plating method according to another aspect of the present invention. 13 1360585

[Main component symbol description] 10, 110 plating tank 30 conduit 50 shielding film 70, 1 70 auxiliary groove 112 shelf 131, 23 1 first nozzle member 131a ' 132a nozzle S10 ' S20 > S30 ' S40 step 20, 120a 120b basket 40, 140 heat exchanger 60 blower 72, 172 water outlet 130' 230 supply part 132' 232 second nozzle part 14

Claims (1)

1360585 X. Patent application scope: 1. An electroless plating apparatus comprising: a plating tank; a heat exchanger disposed adjacent to a bottom surface of the plating tank; a supply member adjacent to the heat An exchanger is disposed and configured to supply a plating solution to the interior of the plating tank; and a basket disposed in the plating tank and configured to support a plating target, wherein the The supply member supplies the plating solution toward the heat exchanger, wherein the supply member includes a plurality of nozzle members, wherein the heat exchanger is molded into a flat plate, and the supply member includes: a first nozzle member and a a second nozzle member, the first: nozzle member being disposed adjacent to an upper surface of the heat exchanger, the second nozzle member being disposed adjacent to a lower surface of the heat exchanger; The plating liquid supplied is moved along an upper surface of the heat exchanger; and the plating liquid supplied from the second nozzle member is moved along a lower surface of the heat exchanger. 2. The electroless plating apparatus according to claim 1, further comprising a circulation member configured to resupply the plating liquid supplied into the plating tank to the supply member. 15 1360585 3. Electroless plating as described in claim 1 of the patent application. The supply member is disposed adjacent to one end of the heat exchanger. 4. The electroless plating according to claim 1, wherein the heat exchanger is molded into a flat plate, and the plating liquid supplied from the supply member moves along the heat. 5. Electroless plating as described in item 1 of the patent application. The surface temperature of the heat exchanger is between 90 ° C and 1 ° C. 6. A method performed by supplying a plating solution to a target, comprising the steps of: providing the target in a plating bath; supplying the plating solution from a bottom surface of the plating tank; a heat exchanger on a bottom surface of the plating tank supplies a plating liquid; and the plating liquid supplied to the thermal energy is supplied to the target, wherein the plating liquid is supplied toward the heat exchanger, wherein the supply plating The step of the liquid is performed by a first nozzle second nozzle member disposed at an upper surface of the phase exchanger, the second nozzle member being disposed at a lower surface of the adjacent converter, and 1 〇l). 41·月1吴修正杂I, which is prepared, in which the surface of the converter is prepared, in which no electroplating heat is given to the part with a heat adjacent to the heat of the 16 1360585 1CVVI correction replacement page by the upper The plating liquid supplied from the heat-crossing first nozzle member of the table is moved along the heat exchanger; and the plating liquid supplied from the second nozzle member is moved along the heat exchanger. The electroless plating method described in claim 6 wherein the surface temperature of the device is between 90 ° C and 100 ° C. 17