CN105246270B - A kind of preparation process of plug-in type blind hole HDI plates - Google Patents
A kind of preparation process of plug-in type blind hole HDI plates Download PDFInfo
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- CN105246270B CN105246270B CN201510690455.5A CN201510690455A CN105246270B CN 105246270 B CN105246270 B CN 105246270B CN 201510690455 A CN201510690455 A CN 201510690455A CN 105246270 B CN105246270 B CN 105246270B
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- hole
- blind hole
- inner plating
- plating
- internal layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention belongs to wiring board manufacture fields, and in particular to a kind of preparation process of plug-in type blind hole HDI plates.The plug-in type blind hole HDI plates are by lamina rara externa, the inner plating with through-hole and need not make the remaining inner plating of blind hole and form；The preparation process by the lamina rara externa, the inner plating with through-hole and need not make blind hole remaining inner plating sequence overlapping be pressed together；The lead to the hole site that the inner plating with through-hole is corresponded in lamina rara externa drills to form blind hole；The heavy copper of outer layer, electric plating of whole board, outer graphics, graphic plating, outer layer alkali etching, silk-screen welding resistance, silk-screen character, surface treatment, rear process are carried out again.The technique solves deep-controlled technical problem, it is ensured that blind hole will not lead to open circuit or short circuit because of depth problem；Avoid bottom hole without copper phenomenon.The making of plug-in unit blind hole only can be completed by common electroplating liquid medicine, filling perforation electroplating liquid medicine can not had to and carry out blind hole plating, manufacture difficulty reduces；To reduce cost.
Description
Technical field
The invention belongs to wiring board manufacture fields, and in particular to a kind of preparation process of plug-in type blind hole HDI plates.
Background technology
Assist side field can realize better function, it is necessary to same to meet on same pcb board
The positive and negative of block PCB installs the component of different welds types, and the HDI plates with single side large aperture blind hole can be very good completely
The requirement of different welds types components is installed on sufficient same pcb board.
The method in making single side large aperture back drill hole is at present：After pcb board is completed pressing, by the side for controlling deep back drill hole
Method drills out blind hole, after then through-hole sinks copper and filling perforation plating, graphic plating and outer layer etching, completes the metallization in back drill hole, from
And form the HDI plates of plug-in type blind hole.But to be easy to cause plug-in type blind hole depth inadequate for such process, so as to cause
Component can not be installed, and when blind hole metallizes, and be easy to cause that hole bottom outlet copper is too thin or even bottom hole is without copper, to lead
Cause plug-in type blind via bottom poor flow.For current technology method there are the problem of, this patent devises a kind of making
The new process of plug-in type blind hole HDI plates can be very good to solve problems.
But the prior art is primarily present many problems, such as：Blind hole is made using the method in control deep back drill hole, due to pressing
The thick degree of medium is easy to cause that back drill hole depth is inadequate or depth is too deep, so as to cause metallization there are certain error afterwards
Afterwards, blind hole open circuit or blind hole short circuit；When due to graphic plating, the blind hole that back drill hole is formed, since liquid medicine cannot be handed over well
It changes, hole bottom easy tos produce tin plating bad phenomenon, and after causing outer layer alkali etching, hole bottom is eventually led to without copper
Plug-in type blind hole is opened a way.
Invention content
For this purpose, technical problem to be solved by the present invention lies in the thick degree of medium after overcoming pressing in the prior art, there are one
Fixed error or hole bottom easy to produce it is tin plating it is bad be easy to cause back drill hole depth not enough so as to cause metallization after,
Blind hole is opened a way or the technical bottleneck of short circuit, to propose that it is deep-controlled that one kind can carry out, it is ensured that blind hole will not open short circuit, and avoid
Preparation process of the bottom hole without copper phenomenon.
In order to solve the above technical problems, the invention discloses a kind of preparation processes of plug-in type blind hole HDI plates, wherein institute
Plug-in type blind hole HDI plates are stated by lamina rara externa, the inner plating with through-hole and the remaining inner plating of blind hole need not be made forms；Institute
Preparation process is stated to include the following steps：
By the lamina rara externa, the inner plating with through-hole and the remaining inner plating sequence overlapping progress that blind hole need not be made
It is pressed together；The lead to the hole site that the inner plating with through-hole is corresponded in lamina rara externa drills to form blind hole；Outer layer is carried out again sinks copper, complete
Plate plating, outer graphics, graphic plating, outer layer alkali etching, silk-screen welding resistance, silk-screen character, surface treatment, rear process.
The preparation process of the plug-in type blind hole HDI plates, wherein described when the inner plating with through-hole is 1 layer
The preparation process of inner plating with through-hole includes the following steps：
S1, sawing sheet is carried out to the edges of boards of the inner plating with through-hole, then carries out subtracting Copper treatment；
S2, internal layer drilling processing is carried out to the inner plating with through-hole；
S3, to it is described with through-hole inner plating sequence carry out internal layer sink copper, inner plating electricity, slice analysis, inner figure,
Internal layer etching, internal layer inspection, brown, the processing of rear process.
The preparation process of the plug-in type blind hole HDI plates, wherein described when 1 layer of the inner plating ＞ with through-hole
The preparation process of inner plating with through-hole includes the following steps：
S1, sawing sheet is carried out to the edges of boards of the inner plating with through-hole, then carries out subtracting Copper treatment；
S2, inner figure, internal layer etching are carried out to the inner plating with through-hole；
S3, brown processing is carried out to the inner plating with through-hole, is pressed together；
S4, it drills to the internal layer inner cord with through-hole, the heavy copper of internal layer, inner plating electricity, slice analysis, internal layer figure
Shape, internal layer etching, brown, rear process.
The preparation process of the plug-in type blind hole HDI plates, wherein when residue need not make blind hole in the HDI plates
Remaining inner plating number of plies when being equal to 1 layer, need the remaining inner plating that need not make blind hole to described sequence to be located as follows
Reason：Edges of boards sawing sheet, inner figure processing, the processing of internal layer etching process, brown, the processing of rear process.
The preparation process of the plug-in type blind hole HDI plates, wherein when need not be made in the HDI plates more than blind hole
When lower inner plating number of plies ＞ 1, need that the remaining inner plating sequence that need not make blind hole is handled as follows：Edges of boards are opened
Material, first time inner figure, the first secondary internal layer etching, brown, pressing, second of inner figure, the etching of the second secondary internal layer, brown
Processing, the processing of rear process.
The preparation process of the plug-in type blind hole HDI plates, wherein any inner plating electric treatment needs disposable
Hole copper, table copper are electroplated.
The preparation process of the plug-in type blind hole HDI plates, wherein in any drilling processing, aperture 0.20-
5.5mm。
The above technical solution of the present invention has the following advantages over the prior art：
1, when technique of the present invention can be very good to solve to make blind hole using control deep back drill hole, deep-controlled technology
Problem, it is ensured that blind hole will not lead to open circuit or short circuit because of depth problem；
2, technique of the present invention can be very good after solving back drill hole metallization, and bottom hole is tin plating when due to figure electricity bad makes
At bottom hole without copper phenomenon.
3, technique of the present invention can use common electroplating liquid medicine that the making of plug-in unit blind hole can be completed, and can not have to
Filling perforation electroplating liquid medicine carries out blind hole plating, and technique manufacture difficulty reduces.
Specific implementation mode
Embodiment 1 is as follows present embodiment discloses a kind of preparation process of plug-in type blind hole HDI plates：
Definition：Total number of plies of pcb board is N (N minimum values are 4), and it is that (n takes positive integer, n to n+1 that the number of plies, which is connected, in plug-in type blind hole
The internal layer of connection is represented, 1 represents outer layer), and N ＞ n+1.
Work as N=4, when n=1
Layer with plug-in type blind hole is other：Sawing sheet → subtract the heavy copper of copper → internal layer drilling → internal layer → inner plating electricity (disposably
By hole copper, the plating of table copper is enough) → slice analysis → inner figure → internal layer etching → internal layer AOI → brown → rear process；
The remaining layer that blind hole need not be made is other：Sawing sheet → inner figure → internal layer etching → internal layer AOI → brown → after
Process；
The not windowing of gummosis PP pieces：The gummosis PP of sawing sheet → not windowings → rear process；
Outer layer flow after two daughter boards and not gummosis PP pressings：Pressing → outer layer drilling → outer layer sink copper → electric plating of whole board →
Outer graphics → graphic plating → outer layer alkali etching → outer layer AOI → silk-screen welding resistance → silk-screen character → surface treatment → electrical measurement
Examination → molding → FQC → FQA → packaging；
The blind hole aperture is 0.20-5.5mm.
Embodiment 2 is as follows present embodiment discloses a kind of preparation process of plug-in type blind hole HDI plates：
Work as N=4, when n=2
Layer with plug-in type blind hole is other：Sawing sheet → subtract copper → inner figure → internal layer etching → internal layer AOI → brown →
Pressing → internal layer drilling → internal layer sinks copper → inner plating electricity (disposably by hole copper, the plating of table copper is enough) → slice analysis → inner figure
→ internal layer etching → internal layer AOI → brown → rear process；
The not windowing of gummosis PP pieces：The gummosis PP of sawing sheet → not windowings → rear process；
Daughter board and outer layer flow after not gummosis PP pressings：Pressing → outer layer drilling → outer layer sinks copper → electric plating of whole board → outer layer
Figure → graphic plating → outer layer alkali etching → outer layer AOI → silk-screen welding resistance → silk-screen character → surface treatment → electrical testing →
Molding → FQC → FQA → packaging；
The blind hole aperture is 0.20-5.5mm.
Embodiment 3 is as follows present embodiment discloses a kind of preparation process of plug-in type blind hole HDI plates：
As N ＞ 4, n=1
Layer with plug-in type blind hole is other：Sawing sheet → subtract the heavy copper of copper → internal layer drilling → internal layer → inner plating electricity (disposably
By hole copper, the plating of table copper is enough) → slice analysis → inner figure → internal layer etching → internal layer AOI → brown → rear process；
The remaining layer that blind hole need not be made is other：The secondary internal layer etching of sawing sheet → first time inner figure → first → first time
The secondary internal layers of internal layer AOI → brown → pressing → second of inner figure → second etching the → the second secondary internal layer AOI → brown → after
Process；
The not windowing of gummosis PP pieces：The gummosis PP of sawing sheet → not drillings → rear process；
Outer layer flow after two daughter boards and not gummosis PP pressings：Pressing → outer layer drilling → outer layer sink copper → electric plating of whole board →
Outer graphics → graphic plating → outer layer alkali etching → outer layer AOI → silk-screen welding resistance → silk-screen character → surface treatment → electrical measurement
Examination → molding → FQC → FQA → packaging；
The blind hole aperture is 0.20-5.5mm.
Embodiment 4 is as follows present embodiment discloses a kind of preparation process of plug-in type blind hole HDI plates：
As N ＞ 4, n ＞ 1
Layer with plug-in type blind hole is other：Sawing sheet → inner figure → internal layer etching → internal layer AOI → brown → pressing →
Internal layer drilling → internal layer sinks copper → inner plating electricity (disposably by hole copper, the plating of table copper is enough) → slice analysis → inner figure → internal layer
Etching → internal layer AOI → brown → rear process；
The remaining layer that blind hole need not be made is other：The secondary internal layer etching of sawing sheet → first time inner figure → first → first time
The secondary internal layers of internal layer AOI → brown → pressing → second of inner figure → second etching the → the second secondary internal layer AOI → brown → after
Process；
The not windowing of gummosis PP pieces：The gummosis PP of sawing sheet → not drillings → rear process；
Outer layer flow after two daughter boards and not gummosis PP pressings：Pressing → outer layer drilling → outer layer sink copper → electric plating of whole board →
Outer graphics → graphic plating → outer layer alkali etching → outer layer AOI → silk-screen welding resistance → silk-screen character → surface treatment → electrical measurement
Examination → molding → FQC → FQA → packaging；
The blind hole aperture is 0.20-5.5mm.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (3)
1. a kind of preparation process of plug-in type blind hole HDI plates, which is characterized in that the plug-in type blind hole HDI plates are by lamina rara externa, tool
By through-hole inner plating and the remaining inner plating of blind hole need not be made form；The preparation process includes the following steps：
By the lamina rara externa, the inner plating with through-hole and need not make blind hole remaining inner plating sequence overlapping press
Processing；The lead to the hole site that the inner plating with through-hole is corresponded in lamina rara externa drills to form blind hole；The heavy copper of outer layer, full plate electricity are carried out again
Plating, outer graphics, graphic plating, outer layer alkali etching, silk-screen welding resistance, silk-screen character, surface treatment, rear process；
When the inner plating with through-hole is 1 layer, the preparation process of the inner plating with through-hole includes the following steps：
S1, sawing sheet is carried out to the edges of boards of the inner plating with through-hole, then carries out subtracting Copper treatment；
S2, internal layer drilling processing is carried out to the inner plating with through-hole；
S3, the heavy copper of internal layer, inner plating electricity, slice analysis, inner figure, internal layer are carried out to the inner plating sequence with through-hole
Etching, internal layer inspection, brown, the processing of rear process；
When 1 layer of the inner plating ＞ with through-hole, the preparation process of the inner plating with through-hole includes the following steps：
S1, sawing sheet is carried out to the edges of boards of the inner plating with through-hole, then carries out subtracting Copper treatment；
S2, inner figure, internal layer etching are carried out to the inner plating with through-hole；
S3, brown processing is carried out to the inner plating with through-hole, is pressed together；
S4, the copper, inner plating electricity, slice analysis, inner figure, interior of sinking to the internal layer inner cord drilling with through-hole, internal layer
Layer etching, brown, rear process；
When the remaining remaining inner plating number of plies that need not make blind hole is equal to 1 layer in the HDI plates, need not needing to described
The remaining inner plating sequence for making blind hole is handled as follows：Edges of boards sawing sheet, inner figure processing, internal layer etching process, brown
Processing, the processing of rear process；
When the remaining inner plating number of plies ＞ 1 of blind hole need not be made in the HDI plates, need that described blind hole need not be made
Remaining inner plating sequence be handled as follows：Edges of boards sawing sheet, first time inner figure, the first secondary internal layer etching, brown, pressure
Conjunction, the etching of second of inner figure, the second secondary internal layer, brown processing, the processing of rear process.
2. the preparation process of plug-in type blind hole HDI plates as described in claim 1, which is characterized in that any inner plating
Electric treatment needs that disposably hole copper, table copper are electroplated.
3. the preparation process of plug-in type blind hole HDI plates as claimed in claim 2, which is characterized in that any drilling processing
In, aperture 0.20-5.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510690455.5A CN105246270B (en) | 2015-10-22 | 2015-10-22 | A kind of preparation process of plug-in type blind hole HDI plates |
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|---|---|---|---|
| CN201510690455.5A CN105246270B (en) | 2015-10-22 | 2015-10-22 | A kind of preparation process of plug-in type blind hole HDI plates |
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| CN105246270A CN105246270A (en) | 2016-01-13 |
| CN105246270B true CN105246270B (en) | 2018-09-04 |
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Families Citing this family (5)
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| CN109982509A (en) * | 2017-12-28 | 2019-07-05 | 北大方正集团有限公司 | The production method and pcb board for having the pcb board of stepped groove |
| CN108650808B (en) * | 2018-04-16 | 2022-08-19 | 惠州市纬德电路有限公司 | Production process of multilayer blind buried hole structure PCB |
| CN108925042A (en) * | 2018-06-01 | 2018-11-30 | 珠海崇达电路技术有限公司 | A kind of printed circuit board and preparation method thereof replacing back drill hole with blind hole |
| CN109444471A (en) * | 2018-11-22 | 2019-03-08 | 阔智科技（广州）有限公司 | A kind of detection method of blind hole black pad exception |
| CN112888199A (en) * | 2021-01-15 | 2021-06-01 | 浪潮电子信息产业股份有限公司 | Method for forming pin jack of multilayer PCB |
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