CN113015325A

CN113015325A - PCB and electric potential side metallization process thereof

Info

Publication number: CN113015325A
Application number: CN202110027170.9A
Authority: CN
Inventors: 宁娜; 张玉财; 许剑明; 黄军辉; 钟秀霞; 卢龙
Original assignee: Countcash Ltd
Current assignee: Countcash Ltd
Priority date: 2021-01-09
Filing date: 2021-01-09
Publication date: 2021-06-22
Anticipated expiration: 2041-01-09
Also published as: CN113015325B

Abstract

The application relates to the technical field of circuit boards, in particular to a PCB and a metallization process for the side surface of the PCB connected with a power potential, wherein the PCB comprises a base material, two circuit layers which are respectively arranged on two opposite sides of the base material, and a connecting piece arranged on one end of the base material facing a socket, wherein two opposite ends of the connecting piece are respectively connected with the two circuit layers; through the circuit layer and the connecting piece that link together for the circuit board is when inserting the socket, if the circuit board does not aim at with the opening of socket, the connecting piece can conflict with socket opening border earlier, then make the circuit board insert in the socket, and then avoid the condition of circuit layer and socket opening border contact, play the effect of protection to the circuit layer, and can not lead to the condition emergence of circuit layer and substrate separation, make the circuit board insert behind the socket, can keep normal work, and then improved the suitability of circuit board.

Description

PCB and electric potential side metallization process thereof

Technical Field

The application relates to the field of circuit boards, in particular to a PCB and a power connection potential side surface metallization process thereof.

Background

At present, a printed circuit board (pcb), also called printed circuit board (pcb), is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components.

There is a circuit board including a base material, and copper layers plated on opposite sides of the base material, on which circuits are arranged, and which is inserted from a socket of a socket when the circuit board is mounted.

With respect to the related art in the above, the inventors consider that: when actually connecting the circuit board with the socket, the copper layer on the substrate in the circuit board is easily extruded by the edge of the opening of the socket, so that the copper layer is separated from the circuit board, and the normal operation of the circuit board is further influenced.

Disclosure of Invention

In order to avoid the situation that a copper layer is easy to separate from a base material after being stressed, the application provides a PCB and a process for metalizing the side face of the PCB connected with a power potential.

The PCB board that this application provided adopts following technical scheme:

the utility model provides a circuit board, includes the substrate, and set up respectively in two circuit layers on the relative both sides of substrate still include the substrate is towards the one connector of serving of socket, the relative both ends of connector respectively with two circuit layer connection.

By adopting the technical scheme, the circuit layer and the connecting piece are connected together, so that when the circuit board is inserted into the socket, if the circuit board is not aligned with the opening of the socket, the connecting piece can firstly abut against the edge of the opening of the socket, then the circuit board is inserted into the socket, the condition that the circuit layer is contacted with the edge of the opening of the socket is further avoided, the circuit layer is protected, the circuit layer is not separated from the base material, and the circuit board can keep normal work after being inserted into the socket; on the other hand, the applicability of the circuit board is further improved.

A PCB board connects electric potential side metallization technology adopts following technical scheme:

a process for metalizing the side surface of PCB connected with electric potential includes such steps as providing a PCB with a metal layer,

s1, opening holes: providing a base material, and arranging abdication holes penetrating through two sides of the base material at one end of the base material;

s2, copper deposition: arranging a chemical copper layer on the exposed surface of the base material;

s3, electroplating: electroplating the surface of the electroless copper layer to form a first plating layer;

s4, molding: etching the surface of the chemical copper layer to form a circuit layer;

s5, cutting: and cutting the base material and the electroless copper layer simultaneously, so that a tangent plane formed by the removed base material is flush with one side of the base material abutted against the electroless copper layer.

Through adopting above-mentioned technical scheme, be connected with the circuit layer through the first cladding material on the hole of stepping down, and then increase the stability of being connected on first cladding material and circuit layer, reduce the circuit layer and receive external force and take place with the condition of substrate separation, and then prolonged the life of circuit board.

Preferably, the electroless copper layer surface of step S2 is electroplated with a first copper layer, and the first plating layer is located on the first copper layer surface.

By adopting the technical scheme, the chemical copper layer on the base material is thickened through the first copper layer, the condition that the chemical copper layer is etched by a subsequent process to cause circuit board scrapping is reduced due to the fact that the chemical copper layer is small in thickness, and meanwhile the conductivity and the mechanical strength of the chemical copper layer and the first copper layer are improved; on the other hand, the situation that the chemical copper layer is oxidized in the air is reduced, and the yield of the circuit board is improved.

Preferably, a photosensitive film is disposed on the first copper layer, and the photosensitive film is exposed to light so that the electroless copper layer forms a first region having an imprint and a second region having no imprint.

By adopting the technical scheme, the circuit diagram appears on the first copper layer through exposure treatment, so that the circuit layer is conveniently formed in the subsequent process.

Preferably, the surface of the first region is provided with a barrier layer resistant to alkaline etching.

By arranging the barrier layer on the first plating layer, the situation that the circuit layer is etched away in the subsequent process is reduced.

Preferably, the barrier layer is a tin layer.

By adopting the technical scheme, the barrier layer is the tin layer, and the tin layer can prevent the first plating layer from being exposed in the air hole and oxidized.

Preferably, step S4, after forming first cladding material, the substrate surface mills out with the excision hole of abdicating the hole part coincidence, is forming the in-process of excision hole will be located abdicating downthehole and keeping away from the part on circuit layer the chemic copper layer with first cladding material mills away together to make not milled away first cladding material be on a parallel with the abdicating the hole is close to the inner wall on circuit layer.

By adopting the technical scheme, the redundant part of the base material is removed, so that the product structure is more compact; on the other hand, by milling off part of the first plating layer, the occurrence of burrs formed on the first plating layer can be reduced, and the connection stability of the first plating layer can be increased.

Preferably, the barrier layer on the second region is removed after the cut-out hole is milled out.

By adopting the technical scheme, the barrier layer on the first area is removed, so that the required circuit is exposed.

In summary, the present application includes at least one of the following beneficial technical effects:

1. due to the existence of the connecting piece, the connecting piece can collide with the socket firstly, and the situation that the circuit layer is separated from the base material due to the fact that the circuit layer impacts on the socket is further reduced;

2. the manufacturing method of the process is simple, and the production efficiency of the circuit board is high.

Drawings

Fig. 1 is a flow chart of an embodiment of the present application.

Fig. 2 is a schematic diagram for illustrating the step S1 in the embodiment of the present application.

Fig. 3 is a schematic diagram for illustrating the step S2 according to the embodiment of the present application.

Fig. 4 is a schematic diagram for illustrating the step S3 according to the embodiment of the present application.

Fig. 5 is a schematic diagram for illustrating the step S5 according to the embodiment of the present application.

Description of reference numerals: 1. a substrate; 11. cutting off the hole; 2. a hole of abdication; 3. a electroless copper layer; 4. a first region; 41. a second region; 5. a first plating layer; 6. a first copper layer; 7. and a barrier layer.

Detailed Description

The present application is described in further detail below with reference to figures 1-5.

In a first aspect: the embodiment of the application discloses a PCB board.

Referring to fig. 5, a PCB includes a substrate 1, two circuit layers 11 respectively disposed on two opposite sides of the substrate 1, and a connecting member connected to the two circuit layers 11, in this embodiment, the connecting member is a first plating layer 5 formed by a copper plating method, two opposite ends of the first plating layer 5 are respectively connected to the two circuit layers 11, and the first plating layer 5 is attached to a sidewall of the substrate 1 near one end of the socket.

In a second aspect, an embodiment of the application discloses a metallization process for a side surface of a PCB connected to a potential.

A metallization process of a side surface of a PCB connected with a power supply potential is disclosed, referring to FIG. 1, which comprises the following steps,

s1, opening holes: the method comprises the following steps that the abdicating holes 2 penetrating through two sides of the base material 1 are formed in one end of the base material 1 through a numerical control machine tool, and the roughness range of the inner wall surfaces of the abdicating holes 2 is 0-25 micrometers, so that the copper plating effect in the subsequent working procedures is improved;

s2, copper deposition: referring to fig. 2, an electroless copper layer 3 is formed on the exposed surface of the substrate 1 by electroless plating, so that the electroless copper layer 3 has a minimum thickness capable of flowing through a circuit;

s21, board power: forming a first copper layer 6 on the surface of the electroless copper layer 3 in an electroplating mode, so as to achieve the purpose of thickening the electroless copper layer 3;

s22, pattern transfer: referring to fig. 4, a photosensitive film is attached to the first copper layer 6 on two opposite sides of the substrate 1, the photosensitive film is cured when exposed to light, and a protective film is formed on the first copper layer 6, and during manufacturing, the photosensitive film may be a dry film or a wet film according to actual requirements; in practice, the photosensitive film on the first copper layer 6 is exposed by an automatic exposure machine, the photosensitive film is cured to form the first region 4 with print, and the first copper layer 6 at the position where the photosensitive film is not cured forms the second region 41 without print;

s3, electroplating: referring to fig. 3, the surface of the first copper layer 6 in the first region 4 is electroplated with a first plating layer 5 by electroplating to enhance the purpose of thickening the thickness of the first copper layer 6;

s31, tinning: a barrier layer 7 which is resistant to alkaline etching is electroplated on the first copper layer 6 of the first region 4, in this embodiment, the barrier layer 7 is a tin layer for the purpose of protecting the first region 4;

s32, a gong: after the first plating layer 5 is formed, a cutting hole 11 partially overlapped with the abdicating hole 2 is milled on the surface of the substrate 1 through a numerical control milling machine, in the process of forming the cutting hole 11, part of the chemical copper layer 3, the first plating layer 5 and the first copper layer 6 which are positioned in the abdicating hole 2 and far away from the circuit layer are milled together, and the first plating layer 5 which is not milled is parallel to the abdicating hole 2 and close to the inner wall of the circuit layer, so that burrs cannot appear on the surface of the first plating layer 5, and the yield of the product is improved;

s4, molding: referring to fig. 4, the product is placed into the etching solution, and the first plating layer 5 and the first copper layer 6 on the second region 41 are etched away to form a circuit layer;

s41, removing tin: washing away the barrier layer 7 and the photosensitive film to expose the desired wiring layer;

s5, cutting: referring to fig. 5, removing a portion of the substrate 1 on one end of the substrate 1 close to the socket by an automatic punch press, so that a tangent plane formed by the removed substrate 1 is flush with one side of the substrate 1 to which the first copper layer 6 is attached, thereby removing the redundant place of the substrate 1 and improving the structural compactness of the circuit board; when the circuit board is inserted into the socket, the first copper layer 6 positioned on one end of the substrate 1 can firstly abut against the socket, so that the situation that the circuit layers positioned on the two opposite sides of the base groove are separated is reduced, and the normal use of the circuit board is ensured.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a PCB board, includes substrate (1), and set up respectively in two circuit layers on the relative both sides of substrate (1), its characterized in that: the socket is characterized by further comprising a connecting piece arranged at one end, facing the socket, of the base material (1), wherein the two opposite ends of the connecting piece are respectively connected with the two circuit layers.

2. A PCB board connects electric potential side metallization technology which characterized in that: comprises the following steps of (a) carrying out,

s1, opening holes: providing a base material (1), and arranging abdicating holes (2) penetrating through two sides of the base material (1) at one end of the base material (1);

s2, copper deposition: arranging a chemical copper layer (3) on the exposed surface of the base material (1);

s3, electroplating: electroplating the surface of the electroless copper layer (3) to form a first plating layer (5);

s4, molding: etching the surface of the electroless copper layer (3) to form a circuit layer;

s5, cutting: and cutting the base material (1) and the electroless copper layer (3) simultaneously, so that a tangent plane formed by the removed base material (1) is flush with one side of the base material (1) against which the electroless copper layer (3) abuts.

3. The process of claim 2, wherein the metallization process of the side of the PCB connected to the electrical potential comprises: the electroless copper layer (3) of the step S2 is electroplated with a first copper layer (6), and the first plating layer (5) is located on the surface of the first copper layer (6).

4. The process of claim 3, wherein the metallization process of the side of the PCB connected with the potential comprises: a layer of photosensitive film is arranged on the first copper layer (6), and the photosensitive film is exposed to light so that the electroless copper layer (3) is formed with a first region (4) with print and a second region (41) without print.

5. The process of claim 4, wherein the metallization process of the side of the PCB connected with the potential comprises: and a barrier layer (7) resisting alkaline etching is arranged on the surface of the first region (4).

6. The process of claim 5, wherein the metallization process of the side of the PCB connected with the potential comprises: the barrier layer (7) is a tin layer.

7. The process of claim 5, wherein the metallization process of the side of the PCB connected with the potential comprises: step S3, form behind first cladding material (5) substrate (1) surface mill with the excision hole (11) of abdicating hole (2) partial coincidence is forming the in-process of excision hole (11) will be located abdicating in hole (2) and keeping away from the part on circuit layer electroless copper layer (3) with first cladding material (5) mill away together to the messenger is not milled first cladding material (5) are on a parallel with abdicating hole (2) are close to the inner wall on circuit layer.

8. The process of claim 6, wherein the metallization process comprises: -removing said barrier layer (7) from said second region (41) after milling said cut-out hole (8).