CN208273348U - Printed circuit board with three-dimensional gold-plating plug - Google Patents
Printed circuit board with three-dimensional gold-plating plug Download PDFInfo
- Publication number
- CN208273348U CN208273348U CN201820560377.6U CN201820560377U CN208273348U CN 208273348 U CN208273348 U CN 208273348U CN 201820560377 U CN201820560377 U CN 201820560377U CN 208273348 U CN208273348 U CN 208273348U
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- gold
- plating
- plating plug
- plug
- circuit board
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Abstract
The utility model discloses a kind of printed circuit boards of band solid gold-plating plug, several gold-plating plugs including printed board ontology and in described printed board a side, the gold-plating plug exposes successively is electroplate with layers of copper, nickel layer and layer gold on the part outside described printed board a side from inside to outside, and the gold-plating plug is made to become three-dimensional gold-plating plug.The printed circuit board of band solid gold-plating plug is integrated the three-dimensional gold-plating plug of electric conductor by being provided with end face and four sides, when so that the printed circuit board being connected with another printed circuit board, the five face solids for forming three-dimensional gold-plating plug and socket connect, not only greatly increase connection reliability, and it is easy to disassemble in installation and maintenance, it can be used in the equipment with particular/special requirement, have a extensive future.
Description
Technical field
The utility model belongs to circuit board making technical field, particularly relates to a kind of print of band solid gold-plating plug
Circuit board processed.
Background technique
With the continuous development of electronic technology, the function of electronic equipment is stronger and stronger, and an electronic system needs several
Block realizes that the module board of different function is combined to tens pieces, could operate normally, the power of embodiment device.
Connection between one piece of circuit board and another piece of circuit board is connected by gold-plating plug in many cases, is especially needed
Want quick-change module, the product of rapid-maintenance failure, realized using gold-plating plug between plate and plate, mother matrix and daughter board it
Between connection.However, in mobile device, or the equipment used in the larger occasion of vibration, due to common gold-plating plug and insert
Connection between seat only leans on a face to be in contact, and generates after vibration and compresses reed loosening or circuit board displacement, causes gold-plated
There is the failure being electrically connected in poor contact between plug and socket.
Summary of the invention
In order to overcome drawbacks described above, the utility model provides a kind of printed circuit board of band solid gold-plating plug, can fit
For the equipment that special occasions requires, guarantee equipment connection stability and reliability.
The utility model is to solve technical solution used by its technical problem: a kind of print of band solid gold-plating plug
Circuit board processed, several gold-plating plugs including printed board ontology and in described printed board a side, the gold-plating plug
Expose and be successively electroplate with layers of copper, nickel layer and layer gold from inside to outside on the part outside described printed board a side, makes described gold-plated slotting
Head becomes three-dimensional gold-plating plug.
As a further improvement of the utility model, the layers of copper of the three-dimensional gold-plating plug with a thickness of 25um~35um,
Nickel layer with a thickness of 5um~8um, the thickness of layer gold is greater than 0.075um.
The inner end of the three-dimensional gold-plating plug and printed board ontology one as a further improvement of the utility model,
Molding, the solid gold-plating plug expose the part outside the printed board side by milling out molding.
The three-dimensional gold-plating plug is rectangular parallelepiped structure as a further improvement of the utility model,.
As a further improvement of the utility model, the printed board ontology include insulating substrate and be set to the insulation base
Conductive pattern on material, each conductive pattern are connected respectively the three-dimensional gold-plating plug.
The beneficial effects of the utility model are: the printed circuit board of band solid gold-plating plug is by being provided with end face and four
A side is integrated the three-dimensional gold-plating plug of electric conductor, when so that the printed circuit board being connected with another printed circuit board, shape
It is connected at five face solids of three-dimensional gold-plating plug and socket, not only greatly increases connection reliability, but also in installation and maintenance
When it is easy to disassemble, can be used with particular/special requirement equipment on, have a extensive future.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the schematic diagram of the section structure of three-dimensional gold-plating plug described in the utility model.
In conjunction with attached drawing, make the following instructions:
1 --- printed board ontology；2 --- three-dimensional gold-plating plug；
3-insulating substrates；4 --- conductive pattern；
21 --- layers of copper；22 --- nickel layer；
23 --- layer gold.
Specific embodiment
Below in conjunction with attached drawing, elaborate to a preferred embodiment of the utility model.But the guarantor of the utility model
Shield range is not limited to following embodiments, i.e., in every case with simple made by present utility model application the scope of the patents and description
Equivalent changes and modifications all still belong within the utility model patent covering scope.
It refering to fig. 1-2, is a kind of printed circuit board of band solid gold-plating plug described in the utility model, including printed board
Ontology 1 and several gold-plating plugs in described printed board a side, the gold-plating plug expose the printed board side
Layers of copper 21, nickel layer 22 and layer gold 23 are successively electroplate on part outside side from inside to outside, the gold-plating plug is made to become three-dimensional plating
Golden plug 2.
Wherein, the layers of copper of the three-dimensional gold-plating plug 2 with a thickness of 25um~35um, nickel layer with a thickness of 5um~8um,
The thickness of layer gold is greater than 0.075um.The inner end of the solid gold-plating plug 2 and the printed board ontology 1 are integrally formed, described vertical
Body gold-plating plug 2 exposes the part outside the printed board side by milling out molding.The solid gold-plating plug 2 is cuboid knot
Structure.The printed board ontology includes insulating substrate 3 and the conductive pattern 4 on the insulating substrate, each conductive pattern
Shape is connected respectively the three-dimensional gold-plating plug 2.
The printed circuit board of band solid gold-plating plug is cooperatively connected with the socket of another printed circuit board when in use,
Therebetween five face solid connection structures are formed, in this way, regardless of gold-plating plug moves in socket, it can be effective with socket
The abnormal problem of electrical connection will not occur in equipment use process in contact.It can also make that there is gold-plating plug connection simultaneously
Electronic equipment will not make connecting portion open a way, to ensure the normal operation of equipment, reduce because of vibration or external impacts
Equipment failure rate.
In addition, the gold-plating plug of the printed circuit board first mills out plug one by one by plug requirements with milling machine in production,
Then electroless copper plating is carried out, heavy upper conductive copper layer on the insulating medium layer of plug is made, and by plating thickening processing, is made gold-plated slotting
The top of head and four faces become a monolithic conductive body.Then side operation is milled again, it will be between gold-plating plug and gold-plating plug
It is milled in the layers of copper that edges of boards are connected, each gold-plating plug is made to become an independent electric conductor, it is finally independent to these again
Electric conductor carries out first nickel plating gold-plated operation again, to form three-dimensional gold-plating plug.
The band solid gold-plating plug printed circuit board can with military vehicle carry equipment on and air compressor machine, dislocation generation
In the equipment of the particular surroundings such as machine, marine generator, it is able to satisfy the job requirement of product long time stability, application prospect ten
Divide wide.
It can be seen that the printed circuit board of band solid gold-plating plug is integrated by being provided with end face and four sides
The three-dimensional gold-plating plug of electric conductor when so that the printed circuit board being connected with another printed circuit board, forms three-dimensional gold-plating plug
It is connect with five face solids of socket, not only greatly increases connection reliability, but also easy to disassemble in installation and maintenance, can make
With in the equipment with particular/special requirement, have a extensive future.
Claims (5)
1. a kind of printed circuit board of band solid gold-plating plug, including printed board ontology (1) and it is set to described printed board a side
On several gold-plating plugs, it is characterised in that: the gold-plating plug exposes on the part outside described printed board a side from interior
To layers of copper (21), nickel layer (22) and layer gold (23) is successively electroplate with outside, the gold-plating plug is made to become three-dimensional gold-plating plug (2).
2. the printed circuit board of band solid gold-plating plug according to claim 1, it is characterised in that: the solid is gold-plated to insert
The layers of copper of head (2) with a thickness of 25um~35um, nickel layer with a thickness of 5um~8um, the thickness of layer gold is greater than 0.075um.
3. the printed circuit board of band solid gold-plating plug according to claim 1, it is characterised in that: the solid is gold-plated to insert
The inner end of head (2) and the printed board ontology (1) are integrally formed, and the solid gold-plating plug (2) exposes the printed board side
Outer part is by milling out molding.
4. the printed circuit board of band solid gold-plating plug according to claim 1, it is characterised in that: the solid is gold-plated to insert
Head (2) is rectangular parallelepiped structure.
5. the printed circuit board of band solid gold-plating plug according to claim 1, it is characterised in that: the printed board ontology
Conductive pattern (4) including insulating substrate (3) and on the insulating substrate, each conductive pattern are connected respectively
One three-dimensional gold-plating plug (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820560377.6U CN208273348U (en) | 2018-04-19 | 2018-04-19 | Printed circuit board with three-dimensional gold-plating plug |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820560377.6U CN208273348U (en) | 2018-04-19 | 2018-04-19 | Printed circuit board with three-dimensional gold-plating plug |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208273348U true CN208273348U (en) | 2018-12-21 |
Family
ID=64679393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820560377.6U Active CN208273348U (en) | 2018-04-19 | 2018-04-19 | Printed circuit board with three-dimensional gold-plating plug |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208273348U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113015325A (en) * | 2021-01-09 | 2021-06-22 | 勤基电路板（深圳）有限公司 | PCB and electric potential side metallization process thereof |
-
2018
- 2018-04-19 CN CN201820560377.6U patent/CN208273348U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113015325A (en) * | 2021-01-09 | 2021-06-22 | 勤基电路板（深圳）有限公司 | PCB and electric potential side metallization process thereof |
| CN113015325B (en) * | 2021-01-09 | 2022-09-20 | 勤基电路板（深圳）有限公司 | PCB and electric potential side metallization process thereof |
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