CN111834735B - Array antenna and base station equipment - Google Patents
Array antenna and base station equipment Download PDFInfo
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- CN111834735B CN111834735B CN202010738504.9A CN202010738504A CN111834735B CN 111834735 B CN111834735 B CN 111834735B CN 202010738504 A CN202010738504 A CN 202010738504A CN 111834735 B CN111834735 B CN 111834735B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/08—Access point devices
Abstract
The invention relates to the technical field of communication, and discloses an array antenna and base station equipment, wherein the array antenna is arranged in the base station equipment, and comprises a plurality of radiation units arranged in an array manner and an outer cover, the radiation units comprise radiation circuits, the radiation circuits are arranged on the outer cover, and the outer cover is used as a shell of the base station equipment. According to the array antenna and the base station equipment, the radiation circuit is directly integrated on the shell of the base station equipment, so that antenna parts and welding spots can be reduced, the weight of the antenna can be reduced, and hidden dangers caused by poor welding process can be avoided; and the structure is simple, large-scale automatic production of the antenna is facilitated, the manufacturing cost is reduced, and the manufacturing efficiency is improved.
Description
Technical Field
The present invention relates to the field of communications technologies, and in particular, to an array antenna and a base station device.
Background
The 5 th generation mobile communication technology uses a large-scale array antenna technology, and an antenna array with the scale of tens of antennas or even hundreds of antennas is arranged at a base station end to improve the network capacity. The simplification of the antenna structure is the most difficult problem to be solved. Meanwhile, the large-scale array antenna has dense antenna array elements and a large number, so that the key is to improve the production efficiency.
The large-scale array antenna in the prior art is mainly designed in the following ways, the first and the most common scheme is that a plurality of metal or nonmetal radiating elements are welded on a power distribution circuit board, a metal plate is used as a reflecting plate in the middle, and a metal needle is used for connecting a coupling circuit board on the back after perforation, so that the number of the radiating elements is large, the weight is heavy, and the weight of the antenna cannot be reduced. The radiation part and the feed part are separated, so that the assembly is complex, the quality of a circuit board and the welding process influence the radiation part and the feed part, and the radiation part and the feed part are not suitable for large-scale automatic production. The second scheme adopts an integrated structure of the radiation part and the feed part, the radiation part and the feed part are formed by one material, and then the circuit is etched by using an LDS (laser direct structuring) process.
The existing large-scale array antenna has the problems of heavy weight, complex assembly and unsuitability for large-scale automatic production.
Disclosure of Invention
The embodiment of the invention provides an array antenna and base station equipment, which are used for solving or partially solving the problems that the existing large-scale array antenna is heavy in weight, complex in assembly and not suitable for large-scale automatic production.
The embodiment of the invention provides an array antenna which is arranged in base station equipment, comprises a plurality of radiation units arranged in an array manner and further comprises an outer cover, wherein each radiation unit comprises a radiation circuit, the radiation circuit is arranged on the outer cover, and the outer cover is used as a shell of the base station equipment.
On the basis of the scheme, the radiation circuit is integrally formed with the outer cover through metal insert injection molding; or the radiation circuit is electroplated on the outer cover.
On the basis of the scheme, an isolation circuit is arranged on the periphery of any radiation unit; and a boundary circuit is arranged on the periphery of the plurality of radiation units on the outer cover.
On the basis of the scheme, the periphery of any radiation unit on the outer cover is provided with a convex structure, and the isolation circuit is arranged on the convex structure.
On the basis of the scheme, the radiation unit is arranged on any side surface of the outer cover or embedded in the outer cover.
On the basis of the scheme, the power divider further comprises an integrated circuit board, wherein the integrated circuit board comprises an integrated multilayer circuit substrate, and a power dividing circuit and a coupling circuit which are arranged on the multilayer circuit substrate; and at least one grounding layer is arranged between the power dividing circuit and the coupling circuit.
On the basis of the scheme, the multilayer circuit substrate is provided with metalized through holes, and the power dividing circuit and the coupling circuit form radio frequency main feed connection through the metalized through holes.
On the basis of the above scheme, the multilayer circuit substrate is detachably connected to the housing, and the power dividing circuit faces the radiation unit.
On the basis of the scheme, the radiating units correspond to the oscillator units of the power dividing circuit one by one.
The embodiment of the invention also provides base station equipment, which comprises the array antenna, an equipment body and a transceiver, wherein the outer cover of the array antenna and the transceiver are respectively connected to the equipment body, and the coupling circuit of the array antenna is connected with the transceiver through a bonding pad.
According to the array antenna and the base station equipment provided by the embodiment of the invention, the radiation circuit is directly integrated on the shell of the base station equipment, so that antenna parts and welding spots can be reduced, the weight of the antenna can be reduced, and hidden dangers caused by poor welding process can be avoided; and the structure is simple, large-scale automatic production of the antenna is facilitated, the manufacturing cost is reduced, and the manufacturing efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of an arrangement of a radiation unit according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating the arrangement of the power dividing circuit and the coupling circuit according to the embodiment of the present invention;
fig. 3 is a schematic connection diagram of the power dividing circuit and the coupling circuit in the embodiment of the present invention;
FIG. 4 is a schematic view of the connection of the housing to the integrated circuit board in an embodiment of the present invention;
fig. 5 is a schematic diagram of a first partial opening of a housing in an antenna array according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a second partial opening of a housing in an antenna array according to an embodiment of the invention.
Description of the reference numerals:
100, an integrated housing for radiation; 200. an integrated circuit board; 101. a housing; 102. a radiation unit; 103. an isolation circuit; 104. a boundary circuit; 201. a multilayer circuit substrate; 202. a power dividing circuit; 203. a vibrator unit; 204. a ground plane; 205. metallizing the via hole; 206. a shielding hole; 207. a coupling circuit.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, an embodiment of the present invention provides an array antenna, where the array antenna is disposed in a base station device, and includes a plurality of radiation units 102 arranged in an array, and further includes a housing 101, where the radiation units 102 include radiation circuits, the radiation circuits are disposed on the housing 101, and the housing 101 is used as a housing of the base station device. The radiation circuit is directly arranged on the shell of the base station equipment, a base material for bearing the radiation circuit is not required to be additionally arranged, the radiation unit 102 can be directly fixed through the outer cover 101, and a plurality of connection structures of the radiation unit 102 are reduced.
According to the array antenna provided by the embodiment, the radiation circuit is directly integrated on the shell of the base station equipment, so that antenna parts and welding spots can be reduced, the weight of the antenna can be reduced, and hidden dangers caused by poor welding process can be avoided; and the structure is simple, large-scale automatic production of the antenna is facilitated, the manufacturing cost is reduced, and the manufacturing efficiency is improved.
On the basis of the above embodiment, further, the radiation circuit is integrally formed with the housing 101 by metal insert molding; or the radiation circuit is galvanically provided in the housing 101. The radiation unit 102 and the housing 101 can be combined together in a synchronous manner by metal insert injection molding for manufacturing; i.e. the radiation unit 102 may be integrally formed with the housing 101. The radiating element 102 may also be formed by local plating after the housing 101 is molded; and is not particularly limited.
The outer cover 101 may be formed by injection molding, compression molding or hot pressing, and the material may be formed by, but not limited to, a pultrusion process or compression molding of plastic or non-metal materials such as ASA, PC, PM, PVC, PP, etc. The whole size of the outer cover 101 is larger than or equal to the size of the front face of the base station equipment, meets the protection and sealing requirements of the base station equipment, and is directly used as a shell of the front face of the base station equipment.
On the basis of the above embodiment, further, an isolation circuit 103 is disposed at the periphery of any radiation unit 102; the outer cover 101 is provided with a boundary circuit 104 on the periphery of the plurality of radiation elements 102. The isolation circuit 103 plays an isolation role at the periphery of the radiation unit 102, which is beneficial to improving cross polarization and isolation indexes. The boundary circuit 104 facilitates optimizing the antenna radiation pattern indicators.
On the basis of the above embodiment, further, a protruding structure is provided on the outer cover 101 at the periphery of any radiation unit 102, and the isolation circuit 103 is provided on the protruding structure.
When the radiation units 102 are integrated on the outer surface of the housing 101, the isolation circuits 103 of the radiation units 102 are manufactured by the same process at the middle position of the plane of each adjacent radiation unit 102. The isolation circuit 103 is mainly but not limited to a stripe or a belt shape; and the cross polarization and isolation indexes can be effectively improved by forming a convex shape at a local part by attaching the base station equipment outer cover 101 on a convex structure. The isolation circuit 103 may be curved, uneven, etc. to achieve the isolation effect, and is not limited in particular.
When the radiating element 102 is integrated on the outer surface of the housing 101, the antenna radiation pattern index can be effectively optimized by manufacturing the boundary circuit 104 for radiation of the antenna according to the same process, synchronously at the peripheral position or other effective positions of the housing 101 of the base station device, including but not limited to the inner surface or the outer surface of the housing 101 of the base station device.
In addition to the above embodiments, the radiation unit 102 is disposed on either side of the housing 101 or embedded in the housing 101. The specific location of the radiation unit 102 on the housing 101 is not limited.
On the basis of the above embodiments, further, the array antenna provided by the present embodiment further includes an integrated circuit board 200. The integrated circuit board 200 includes an integrated multilayer circuit substrate 201, and a power dividing circuit 202 and a coupling circuit 207 provided on the multilayer circuit substrate 201. And at least one ground layer 204 is disposed between the power dividing circuit 202 and the coupling circuit 207.
Referring to fig. 2, the power dividing circuit 202 and the coupling circuit 207 are integrated to form an integrated circuit board 200 in this embodiment. In the laminated structure of the integrated circuit board 200, one or more metal-clad copper surfaces are inserted as a ground layer 204 (reflection circuit) between the power dividing circuit 202 and the coupling circuit 207 by using a multilayer circuit board 201 processing process, thereby isolating the power dividing circuit 202 from the coupling circuit 207, maintaining the microstrip line circuit characteristics, and realizing reflection of electromagnetic waves. Replace the effect of traditional antenna metal reflecting plate, reduce weight saves the material.
Specifically, the multilayer circuit board 201 is formed by integrally connecting a substrate provided with the power dividing circuit 202 and a substrate provided with the coupling circuit 207 through a process of processing the multilayer circuit board 201. Thereby integrating the power dividing circuit 202 and the coupling circuit 207 on one multi-layer circuit substrate 201; compared with the independent arrangement of the substrate of the conventional power distribution circuit 202 and the substrate of the coupling circuit 207, the antenna integrated level is improved, the space required by installation is reduced, the integrity of the antenna is improved, and the antenna index is improved. Further, by adopting the structure of the multilayer circuit substrate 201, a metal surface can be directly arranged in the middle of the multilayer circuit substrate 201 to serve as a ground plane, which can replace the traditional reflecting plate, and the reflecting plate is not required to be arranged, thereby playing the roles of reducing the weight of the antenna and saving materials.
Further, the integrated circuit board 200 in which the power dividing circuit 202 and the coupling circuit 207 are integrally disposed on the multilayer circuit substrate 201 in this embodiment is realized based on the arrangement structure in which the radiation unit 102 is disposed on the housing 101 in this embodiment, and the arrangement of the integrated circuit board 200 is not easy to realize in the conventional antenna array. Since the radiation unit 102 is disposed on the housing 101 in this embodiment, the fixing structure of the radiation unit 102 in the prior art can be eliminated, so that the strength requirement for the substrate of the power dividing circuit 202 can be reduced, and the integrated configuration of the power dividing circuit 202 and the coupling circuit 207 can be realized.
Specifically, referring to fig. 2, the present embodiment provides a specific arrangement structure of an integrated circuit board 200, where the integrated circuit board 200 includes two layers of circuit substrates, the power dividing circuit 202 and the coupling circuit 207 are respectively and correspondingly arranged on the two layers of circuit substrates, a metal surface substrate is arranged between the two layers of circuit substrates, and a metal surface is arranged on the metal surface substrate to form a ground layer 204; the power dividing circuit 202, the metal plane, and the coupling circuit 207 are separated from each other by a substrate, and the multilayer substrates are connected as a single body. The two substrates may also be connected, the power dividing circuit 202 and the coupling circuit 207 are disposed on two opposite surfaces of the two substrates, and the metal surface is disposed on the surface where the two substrates are connected to form the ground layer 204.
Fig. 2 only illustrates the components of the integrated circuit board 200 in the embodiment, and the specific positions and connections of the components are not limited. The number of the specific substrate of the integrated circuit board 200 and the number of the ground layers 204, and the specific locations of the power dividing circuit 202 and the coupling circuit 207 relative to the substrate may be flexibly set according to the actual situation, without limitation.
On the basis of the above embodiments, further referring to fig. 3, a metallized via 205 is provided on the multilayer circuit substrate 201, and the power dividing circuit 202 and the coupling circuit 207 form a radio frequency main feed connection through the metallized via 205. In this embodiment, the integrated circuit board 200 uses the metalized via 205 formed in the processing of the multi-layer circuit substrate 201 as the main feed metalized via 205, and the axes of the two sides respectively correspond to the corresponding holes of the power dividing circuit 202 and the coupling circuit 207 to form the radio frequency main feed connection.
Further, a shielding hole 206 is provided on the multilayer circuit substrate 201 at the periphery of the metalized via 205. A circle of shielding metalized ground vias are uniformly distributed around the periphery of the metalized via 205 along the axis to serve as shielding holes 206 for shielding, so that the circuit connection between the radiation and power dividing circuit 202 and the coupling circuit 207 is realized.
On the basis of the above embodiment, further, referring to fig. 4 and 5, the multilayer circuit substrate 201 is detachably connected to the housing 101, and the power dividing circuit 202 faces the radiation unit 102. That is, the components of the antenna from the housing 101 to the integrated circuit board 200 are sequentially located in the housing 101, the radiating element 102, the power dividing circuit 202, the ground layer 204 and the coupling circuit 207. The array antenna provided by the embodiment only comprises two parts, namely the outer cover 101 and the integrated circuit board 200, the whole structure of the antenna is simple, the circuits are connected through the metalized through holes 205, the number of welding points is greatly reduced, the reject ratio of the manufacturing process is favorably reduced, the automatic and intelligent manufacturing is more efficiently suitable, the bottleneck of capacity is solved, and the networking requirement of 5G large-scale commerce is met.
Further, the radiation unit 102 is located on the outer side surface of the base station equipment enclosure 101 in this embodiment; i.e. the side of the casing 101 facing away from the power dividing circuit 202; the radiating element 102 and the power dividing circuit 202 can also achieve better isolation through the housing 101. The radiation unit 102 may also be disposed on the inner side surface of the housing 101, and the isolation is achieved by air, which is not limited in particular.
Referring to fig. 5, the radiation units 102 are disposed on the surface of the housing 101 in an array form; the shape of the housing 101 is not limited to a plane, and may be a curved surface or other shapes; the radiating element 102 array is arranged along the curved surface or plane shape of the outer cover 101 to form a multi-element array. A plurality or single radiating elements 102 are grouped to form a plurality or single radiating array. Furthermore, the shape of the single radiation circuit can be in a square shape, so that the radiation area is increased, and the radiation efficiency is improved. The shape of the radiation circuit may be other shapes, and is not limited.
On the basis of the above-described embodiment, further, referring to fig. 4 and 6, the radiating elements 102 correspond to the oscillator elements 203 of the power dividing circuit 202 one to one. The single radiation units 102 in this embodiment are disposed on the outer side surface of the outer cover 101, and correspond to the centers of the oscillator units 203 connected to the power dividing circuit 202 in the power dividing coupling integrated circuit board 200 one by one; the middle of the single oscillator unit 203 and the middle of the radiation unit 102 are isolated through the thickness of the base station equipment outer cover 101 to form coupling feed of the radiation unit 102, and the oscillator unit 203, namely a feed circuit, is directly connected with a network port of the power dividing circuit 202 through the same plane circuit to realize signal excitation.
Further, in this embodiment, each single radiation circuit performs N-in-one array through the power division network, where N is greater than one.
On the basis of the foregoing embodiments, further, this embodiment provides a base station apparatus, which includes the array antenna described in any of the foregoing embodiments, and further includes an apparatus body and a transceiver, where the housing 101 and the transceiver of the array antenna are respectively connected to the apparatus body, and the coupling circuit 207 of the array antenna is connected to the transceiver through a pad.
In the integrated combination form of the antenna structure in this embodiment, the power division coupling integrated circuit board 200 may be fixed on the housing 101 by using multiple sets of screws or fasteners to form an antenna whole; the whole antenna is fixed on the base station equipment body through a plurality of groups of fastening screws; through the reasonable design of a plurality of fixed point positions and the guide post design, a plurality of metallized bonding pads on the coupling circuit 207 can be vertically butted with the elastic connector of the transceiver on the base station equipment body, so that the good combination tightness is ensured, and the vibration failure is prevented.
Based on the above embodiments, further, the present embodiment provides a low-profile 5G large-scale array antenna based on the application requirements of the large-scale array antenna, and in particular, relates to an integrated circuit board integrated with two circuits, namely a low-profile housing and a power-division coupling circuit, based on metal mold bonding. The low profile 5G large scale array antenna includes: an integrated enclosure for radiation 100, the integrated enclosure for radiation 100 including a base station equipment enclosure; a radiation unit; an isolation circuit; a boundary circuit; the power division coupling integrated circuit board comprises a laminated structure of circuit boards, a layering sequence of the circuit boards, a power division circuit mode and a power division circuit structure, a coupling circuit mode and a coupling circuit structure, and a standard bonding pad for electric signal connection; the integral combination form of the antenna structure comprises the combination of the radiation integrated outer cover and the power division coupling integrated circuit board and the installation of the integral antenna and the corresponding base station equipment.
The embodiment discloses a radiating element and a base station equipment outer cover which are integrated in a synchronous molding manufacturing mode, and a power dividing circuit and a coupling circuit are synthesized on a circuit board; the 5G large-scale array antenna using the welding pad to replace a blind-mate connector has the characteristics of low section, light weight, no welding spot, reliable structure, suitability for large-scale manufacturing and automatic production, and suitability for application of large-scale array antennas.
The embodiment provides a 5G large-scale array antenna with high integration and low profile, which comprises an integrated housing 100 for radiation, a power division coupling integrated circuit board and an assembly form thereof. The radiation integrated housing 100 integrates the radiation unit and the antenna housing together, and is formed by injection molding or compression molding; the power dividing circuit and the coupling circuit board are combined together through a multilayer circuit board process, and a reflection ground layer is sandwiched between the power dividing circuit and the coupling circuit board; together form a set of antenna system and form a large-scale array through multi-unit repetition. The design has few parts and basically has no welding spot, thereby avoiding hidden danger caused by poor welding process; the electrical performance index is better, and particularly the cross polarization and isolation index is better; the weight is light, the process steps are less, the assembly process is simple and convenient, the manufacturing cost can be effectively reduced, and the manufacturing efficiency is improved.
In the embodiment, the large-scale array antenna uses dense antenna array elements and is designed into an integrated antenna housing, so that the processing difficulty is simplified, the number of parts is reduced, and the weight of the whole antenna can be further reduced; the antenna has the advantages of less main body materials, basically no need of welding for realizing assembly, high processing precision, good strength, light weight, better index consistency due to no assembly reliability influence and obvious cost advantage of the whole machine.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (7)
1. An array antenna is arranged in base station equipment, comprises a plurality of radiation units arranged in an array manner, and is characterized by also comprising an outer cover, wherein each radiation unit comprises a radiation circuit;
an isolation circuit is arranged on the periphery of any radiation unit; a boundary circuit is arranged on the periphery of the plurality of radiation units on the outer cover;
a convex structure is arranged on the periphery of any one of the radiation units on the outer cover, and the isolation circuit is arranged on the convex structure;
the integrated circuit board comprises an integrated multilayer circuit substrate, and a power dividing circuit and a coupling circuit which are arranged on the multilayer circuit substrate; and at least one grounding layer is arranged between the power dividing circuit and the coupling circuit.
2. The array antenna of claim 1, wherein the radiating circuit is integrally formed with the housing by metal insert molding; or the radiation circuit is electroplated on the outer cover.
3. Array antenna according to claim 1 or 2, characterized in that the radiating elements are provided on either side of the housing or embedded inside the housing.
4. The array antenna of claim 1, wherein the multi-layer circuit substrate is provided with a metallized via hole, and the power dividing circuit and the coupling circuit form a radio frequency main feed connection through the metallized via hole.
5. The array antenna of claim 1, wherein the multi-layer circuit substrate is detachably connected to the housing, and the power dividing circuit faces the radiating element.
6. The array antenna of claim 1, wherein the radiating elements are in one-to-one correspondence with the element elements of the power dividing circuit.
7. A base station device comprising the array antenna according to any one of claims 1 to 6, further comprising a device body and a transceiver, wherein the housing of the array antenna and the transceiver are connected to the device body, respectively, and the coupling circuit of the array antenna is connected to the transceiver through a pad.
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| CN202010738504.9A CN111834735B (en) | 2020-07-28 | 2020-07-28 | Array antenna and base station equipment |
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| CN202010738504.9A CN111834735B (en) | 2020-07-28 | 2020-07-28 | Array antenna and base station equipment |
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| CN113285195A (en) * | 2021-06-11 | 2021-08-20 | 中电科技德清华莹电子有限公司 | Lumped parameter circulator and isolator |
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| CN111834735A (en) | 2020-10-27 |
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Effective date of registration: 20221208 Address after: 430205 No.1 tanhu 2nd Road, Canglong Island, Jiangxia District, Wuhan City, Hubei Province Patentee after: CITIC Mobile Communication Technology Co.,Ltd. Address before: 430205 No.1 tanhu 2nd Road, Canglong Island, Jiangxia District, Wuhan City, Hubei Province Patentee before: Wuhan Hongxin Technology Development Co.,Ltd. |