CN112018481B - Miniaturized integrated microwave power divider with asymmetric near-metal grating transmission line - Google Patents
Miniaturized integrated microwave power divider with asymmetric near-metal grating transmission line Download PDFInfo
- Publication number
- CN112018481B CN112018481B CN202010790102.3A CN202010790102A CN112018481B CN 112018481 B CN112018481 B CN 112018481B CN 202010790102 A CN202010790102 A CN 202010790102A CN 112018481 B CN112018481 B CN 112018481B
- Authority
- CN
- China
- Prior art keywords
- radio frequency
- laminated
- microstrip
- frequency circuit
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
Abstract
The invention discloses a transmission line asymmetric near-metal grid miniaturized integrated microwave power divider, which belongs to the technical field of microwave passive devices and comprises a plurality of groups of radio frequency circuits, a vertical interconnection structure, and a first laminated microstrip plate and a second laminated microstrip plate which are arranged from top to bottom, wherein the first laminated microstrip plate and the second laminated microstrip plate are formed by crimping two microstrip plates, the first laminated microstrip plate and the second laminated microstrip plate are crimped, and the plurality of groups of radio frequency circuits work independently. The invention integrates two power dividers which have the same function and can independently operate, and are formed by crimping four pieces of microstrip plates through prepregs so as to compress the plane size to the maximum extent; the two power dividers have independent telecommunication functions, and each port is in radio frequency matching connection with the SMP connector at the top layer or the bottom layer through a radio frequency vertical interconnection mechanism; the minimum distance between the edge of the radio frequency circuit and the metalized through hole grid is only half the thickness of the medium, and the radio frequency circuit is asymmetric, so that the layout and the performance design on the harsh transverse dimension are realized.
Description
Technical Field
The invention relates to the technical field of microwave passive devices, in particular to a miniaturized integrated microwave power divider with asymmetric near-metal gratings of transmission lines.
Background
Modern microwave integrated active phased array radar systems are developed vigorously, and in order to reduce the amount of front-end equipment and the volume and weight of the system, a novel microwave highly integrated structure needs to be adopted to replace a conventional brick type structure.
The front end of a modern microwave integrated active phased array radar system is usually composed of tens of thousands of antenna units to form a large power array surface, a radio frequency transceiving component, a correction module, a digital array DAM module, a frequency synthesis module, a feed network module, a power supply module, an environment control module and the like on the back, and the same scale is large and large. In modern radar systems, active phased array bodies are in the mainstream, and the enhancement of radar power mainly depends on three aspects: 1. power conversion and feed efficiency; 2. an individual unit transmit power; 3. system front scale. The improvement of power conversion and feed efficiency depends on the level improvement of microwave basic materials, basic processes, basic components and the like, and the emission power of the independent unit depends on the performance and power capacity of the microwave device. On the basis of the first two determinations, if the power of the radar system is further improved, only a means of increasing the size of the array plane, namely increasing the number of independent antenna units, can be adopted. In recent years, the development of large-scale radar is vigorous, and related research topics are also endless, thus presenting good industrial situation.
The vigorous development of the large array system continuously puts forward new development requirements on related device modules, and is embodied in higher integration level, smaller size, lighter weight, higher power, planar building block and seamless assembly conformality. The power divider is an important microwave device, is a distributed channel for various signals of a radar system, can realize distribution and synthesis of radio frequency signals, clock signals, local oscillator signals and the like, and the development direction of the power divider must also conform to the development direction of a large-array-face phased array system. The size requirement is smaller, the efficiency requirement is higher, and the structural space requirement is more rigorous. Therefore, an asymmetric near-grid small integrated microwave double-power divider of a radio frequency circuit is provided.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: how to satisfy the high integration and the little volume requirement of microwave integration active phased array radar system, and then satisfy the high integration structure requirement of synthesizing to radar system radio-frequency signal, clock signal, local oscillator signal etc. distribution, provide a transmission line asymmetric nearly metal grid miniaturized integrated microwave power divider.
The invention solves the technical problems through the following technical scheme, and the radio frequency microstrip patch comprises a plurality of groups of radio frequency circuits, a vertical interconnection structure, a first laminated microstrip plate and a second laminated microstrip plate which are arranged from top to bottom, wherein the first laminated microstrip plate and the second laminated microstrip plate are formed by crimping two microstrip plates, the first laminated microstrip plate and the second laminated microstrip plate are crimped, and the plurality of groups of radio frequency circuits work independently;
each group of radio frequency circuits comprises a total port radio frequency circuit, a power dividing radio frequency circuit and a dividing radio frequency circuit, wherein the power dividing radio frequency circuit and the dividing radio frequency circuit are arranged on an intermediate layer plane between two microstrip plates in a first laminated microstrip plate, the dividing radio frequency circuit extends to a top layer plane of the first laminated microstrip plate through the vertical interconnection structure, the total port radio frequency circuit is arranged on an intermediate layer plane between two microstrip plates in a second laminated microstrip plate, the total port radio frequency circuit is connected with the power dividing radio frequency circuit through the vertical interconnection structure, and the total port radio frequency circuit extends to a bottom layer surface of the second laminated microstrip plate through the vertical interconnection structure.
Furthermore, the vertical interconnection structure includes a plurality of vertical transition holes, the vertical transition holes vertically penetrate through the microstrip plates of the first stacked microstrip plate and the second stacked microstrip plate, the split rf circuit extends to the top plane of the first stacked microstrip plate through the vertical transition holes, the total rf circuit is connected to the power split rf circuit through the vertical transition holes, and the total rf circuit extends to the bottom surface of the second stacked microstrip plate through one vertical transition hole.
Furthermore, the microwave power divider further comprises a plurality of metallization grid holes, and the plurality of metallization grid holes simultaneously penetrate through the first lamination microstrip plate and the second lamination microstrip plate to achieve electromagnetic shielding.
Furthermore, the microwave power divider further includes a radio frequency ground, the radio frequency ground is disposed on the top plane of the first laminated microstrip board and/or the bottom plane of the second laminated microstrip board, and multiple sets of radio frequency grounds are connected through a metalized ground hole to form the same radio frequency ground.
Furthermore, the microwave power divider further comprises a plurality of metalized grounding holes, and the radio frequency circuit is connected with the radio frequency ground through the metalized grounding holes.
Furthermore, the copper foils on the middle layer plane between the two microstrip boards are all removed except the positions covered by the power dividing radio frequency circuit and the port dividing radio frequency circuit, the copper foils on the upper surface and the lower surface of the two laminated microstrip boards are all reserved, and the copper foils reserved on the upper surface and the lower surface and the radio frequency circuit on the middle layer plane form a strip line transmission main body structure.
Furthermore, the radio frequency ground is a copper foil reserved on the top plane of the first laminated micro-strip board and the bottom plane of the second laminated micro-strip board.
Furthermore, prepregs are arranged between the two microstrip plates and between the two laminated microstrip plates, and the two microstrip plates and the two laminated microstrip plates are pressed through the prepregs.
Furthermore, the microwave power divider further comprises a plurality of SMP connectors, the plurality of SMP connectors are respectively arranged at radio frequency connection points of the main port radio frequency circuit and the branch port radio frequency circuit, and each radio frequency connection point is connected with one SMP connector.
Furthermore, the microwave power divider works in the X and Ku frequency bands of the microwave.
Compared with the prior art, the invention has the following advantages: the transmission line asymmetric near-metal grid miniaturized integrated microwave power divider integrates two power dividers which have the same function and can independently operate, and is formed by crimping four micro-strip plates through prepregs so as to compress the plane size to the maximum extent; the two power dividers have independent telecommunication functions, and each port is in radio frequency matching connection with the SMP connector at the top layer or the bottom layer through a radio frequency vertical interconnection mechanism; the minimum distance between the edge of the radio frequency circuit and the metalized through hole grid is only half the thickness of the medium, and the radio frequency circuit is asymmetric, so that the layout and performance design on severe transverse dimension is realized, and the radio frequency circuit is worthy of popularization and application.
Drawings
Fig. 1 is a schematic structural diagram of a dual-in-four power divider of a dual-stacked microstrip plate according to a second embodiment of the present invention;
fig. 2 is a partial schematic view of a layered structure of a dual-in-four power divider of a dual-stacked microstrip board according to a second embodiment of the present invention;
FIG. 3 is a schematic plan view of an upper stacked circuit according to a second embodiment of the present invention;
FIG. 4 is a schematic plan view of a lower stacked circuit according to a second embodiment of the present invention;
FIG. 5 is a schematic illustration of the positions of an upper stacked circuit and a corresponding metalized through-hole grid according to a second embodiment of the present invention;
fig. 6 is a schematic view of the positions of a lower stacked circuit and a corresponding metalized through-hole grid according to a second embodiment of the invention.
Detailed Description
The following examples are given for the detailed implementation and specific operation of the present invention, but the scope of the present invention is not limited to the following examples.
Example one
The embodiment provides a technical scheme: a transmission line asymmetric near-metal grid miniaturized integrated microwave power divider comprises two groups of radio frequency circuits, a vertical interconnection structure, a first laminated microstrip plate and a second laminated microstrip plate, wherein the first laminated microstrip plate and the second laminated microstrip plate are arranged from top to bottom, the first laminated microstrip plate and the second laminated microstrip plate are formed by crimping two microstrip plates, the first laminated microstrip plate and the second laminated microstrip plate are crimped, the two groups of radio frequency circuits work independently, each group of radio frequency circuits comprises a main port and four branch ports, and therefore a 1-to-4 power divider is formed;
each group of radio frequency circuits comprises a total port radio frequency circuit, a power dividing radio frequency circuit and a dividing radio frequency circuit, wherein the power dividing radio frequency circuit and the dividing radio frequency circuit are arranged on an intermediate layer plane between two microstrip plates in a first laminated microstrip plate, the dividing radio frequency circuit extends to a top layer plane of the first laminated microstrip plate through the vertical interconnection structure, the total port radio frequency circuit is arranged on an intermediate layer plane between two microstrip plates in a second laminated microstrip plate, the total port radio frequency circuit is connected with the power dividing radio frequency circuit through the vertical interconnection structure, and the total port radio frequency circuit extends to a bottom layer surface of the second laminated microstrip plate through the vertical interconnection structure.
The vertical interconnection structure comprises a plurality of vertical metalized transition holes, the vertical metalized transition holes respectively vertically penetrate through the first laminated microstrip plate and each microstrip plate in the second laminated microstrip plate, the split radio frequency circuit extends to the top plane of the first laminated microstrip plate through 4 vertical metalized transition holes, the total radio frequency circuit is connected with the power split radio frequency circuit through a plurality of vertical metalized transition holes, and the total radio frequency circuit extends to the bottom surface of the second laminated microstrip plate through 1 vertical metalized transition hole.
The microwave power divider further comprises a plurality of metalized grating holes, and the plurality of metalized grating holes simultaneously penetrate through the first laminated microstrip plate and the second laminated microstrip plate to achieve electromagnetic shielding.
The microwave power divider further comprises a radio frequency ground, and the radio frequency ground is arranged on the top plane of the first laminated microstrip plate and the bottom plane of the second laminated microstrip plate.
The microwave power divider further comprises a plurality of metalized grounding holes, and the radio frequency circuit is connected with the radio frequency ground through the metalized grounding holes.
The copper foils on the middle layer plane between the two microstrip boards are all removed except the positions covered by the power dividing radio frequency circuit and the port dividing radio frequency circuit, the copper foils on the upper surface and the lower surface of the two laminated microstrip boards are all reserved, and the copper foils reserved on the upper surface and the lower surface and the radio frequency circuit on the middle layer plane form a strip line transmission main body structure.
The radio frequency ground is a copper foil reserved on the top plane of the first laminated micro-strip plate and the bottom plane of the second laminated micro-strip plate.
And prepregs are arranged between the two microstrip plates and between the two laminated microstrip plates, and the prepregs are pressed between the two microstrip plates and between the two laminated microstrip plates.
The microwave power divider further comprises a plurality of SMP connectors, the SMP connectors are respectively arranged at radio frequency connection points, namely ports, of the main port radio frequency circuit and the branch port radio frequency circuit, each radio frequency connection point is connected with one SMP connector, and the SMP connectors are connected with the radio frequency circuit through metallized vertical transition holes in a surface-mounted mode.
The microwave power divider works in the X and Ku frequency bands of microwaves.
Example two
As shown in fig. 1 to 6, the present embodiment is a dual-to-one-to-four power divider with dual-stacked microstrip boards, which includes two sets of radio frequency circuits 1, a stacked microstrip board 2, a stacked microstrip board 3, three prepregs 8, an SMP connector 7, a plurality of metalized ground holes 6, a plurality of metalized grid holes 5, and a plurality of metalized vertical transition holes 4.
The laminated micro-strip plate 2 and the laminated micro-strip plate 3 are both double-layer plates formed by compression-jointing two micro-strip plates through a prepreg 8.
The total number of the SMP connectors is 10, wherein 8 connectors are positioned on the top surface of the double-one-into-four power divider, and 2 connectors are positioned on the bottom surface of the double-one-into-four power divider and are surface-mounted and connected with the radio frequency circuit 1 through the metalized vertical transition holes 4. The copper foils of the top layer and the bottom layer of the laminated microstrip boards 2 and 3 are reserved and used as radio frequency grounds, and the radio frequency circuit 1 is reliably and electrically connected through a large number of metalized grounding holes 6 so as to realize radio frequency grounding.
The double-one-to-four power divider comprises two 1-to-4 power dividers capable of operating independently, a radio frequency circuit 1 is positioned at the top, the bottom and an intermediate layer plane of laminated micro-strip plates 2 and 3 (the intermediate layer plane is a connecting layer plane formed by crimping two micro-strip plates and a prepreg 8), a Wilkinson circuit is a common design form of the power divider, and the double-one-to-four power divider is simple in structure, good in telecommunication amplitude and phase consistency, high in isolation degree and widely applied to phased array radar feeders. The invention adopts a multi-stage Wilkinson radio frequency circuit to design laminated micro-strip plates 2 and 3, which are respectively formed by pressing two layers of dielectric plates (micro-strip plates) with the thickness of 0.508 by using a prepreg 8, wherein only a radio frequency circuit copper foil is reserved on the contact surface of the dielectric plates and the prepreg 8, and the rest of the copper foil is removed to form a dielectric strip line Wilkinson power divider structure, a plurality of metallized grid holes 5 which penetrate up and down are used for electrically shielding along a radio frequency circuit 1 at a certain distance, and the wavelength of a radio frequency signal is about 20mm and is far greater than the interval of the metallized grid holes by about 2mm, so the multi-stage Wilkinson radio frequency circuit has electromagnetic shielding function to inhibit multi-stage cavity resonance of a plurality of frequency points in a working frequency band.
Two groups of radio frequency circuits 1 of the double-one-into-four power divider respectively comprise a power dividing radio frequency circuit, a branch radio frequency circuit and a main port radio frequency circuit, wherein the power dividing radio frequency circuit and the branch radio frequency circuit are positioned on the plane of the middle layer of the laminated microstrip plate 2, the main port radio frequency circuit is positioned on the plane of the middle layer of the laminated microstrip plate 3, and the main port radio frequency circuit is connected with the power dividing radio frequency circuit.
The main port radio frequency circuit is transited to the end position of the middle layer plane of the laminated micro-strip plate 3 through the metalized vertical transition hole 4 on the lower micro-strip plate in the laminated micro-strip plate 2, is transited to the end position of the bottom layer plane of the laminated micro-strip plate 3 through the metalized vertical transition hole 4 on the lower micro-strip plate in the laminated micro-strip plate 3, and is led out by surface mounting of an SMP connector 7; similarly, the split radio frequency circuits of the double-split-four power divider are transited to the edge position of the top plane of the laminated microstrip plate 2 through the metalized vertical transition hole 4 on the upper microstrip plate in the laminated microstrip plate 2, and are also led out by the surface mounting of the SMP connector 7. Both power dividers can work in the X and Ku frequency bands of microwave. The upper end and the lower end of the metallized vertical transition hole 4 are electrically connected with the two layers of radio frequency circuits 1 reliably through a metallized through hole back drilling backfill technology.
Referring to fig. 1 and 2: the length dimension of each of the laminated micro-strip plates 2 and 3 is 210mm, the width dimension of each of the laminated micro-strip plates is 10mm, the thickness of each of the laminated micro-strip plates 2 and 3 is 1.12mm, and the thickness of the prepreg is 0.1 mm; the laminated micro tape plate 2 and the laminated micro tape plate 3 are laminated and pressure bonded via the prepreg 8, and the total thickness H is 2.4 mm. Referring to fig. 5 and 6: the distance d1 between the edge of the radio frequency circuit 1 and the metallized through hole grid wall is 0.6mm, d2 is 0.6mm, d3 is 1.5mm, and d4 is 0.6 mm.
It should be noted that, in the conventional power divider design, the distance between the edge of the rf circuit and the side shielding ground is generally required to be about 3 times of the thickness of the dielectric space, and two sides of the dielectric space are required to be symmetrical. The distance between the edge of the radio frequency circuit and the side shielding ground cannot be too far, so that the higher harmonic mode caused by the fact that the size of a cavity is far larger than the radio frequency wavelength is inhibited, the distance cannot be too close, the ideal circuit electric field characteristic of the strip transmission line is maintained, but the size is larger, and the use requirement of a radar system with higher integration cannot be met; in the power divider of the embodiment, the distances d1, d2, d3 and d4 between the edge of the radio frequency circuit 1 and the grid walls of the metallized through holes are only half of the thickness H of the medium at least, so that while a higher harmonic mode is inhibited, although the ideal circuit electric field characteristic of a strip line transmission line is damaged and a side capacitance effect is generated, the strip line is improved and designed by substituting the radio frequency model into the invention, the matching transmission of radio frequency energy in the whole power divider can be ensured, and the power divider has outstanding miniaturization efficiency. The existing advanced radar system has higher and higher integration level, a feed unit comprising a microwave power divider can only be a 'break pin' and is installed at the position of a gap of other modules, and the outline is often irregular, so that very strict requirements are provided for the layout and circuit design of the power divider, circuits in the modules are often dense, and the symmetrical arrangement of a radio frequency circuit and a metalized through hole shielding grid cannot be realized in many times. The invention is based on the asymmetrical design idea, adopts the asymmetrical design method, can realize more flexible radio frequency wiring, and particularly meets the increasingly rigorous miniaturization requirement of the development of a large array face high-integration radar system on a power divider module.
To sum up, the two groups of transmission line asymmetric near-metal grid miniaturized integrated microwave power dividers of the embodiments integrate two power dividers which have the same function and can independently operate, and are formed by crimping four pieces of microstrip plates through prepregs so as to compress the plane size to the maximum extent; the two power dividers have independent telecommunication functions, and each port is in radio frequency matching connection with the SMP connector at the top layer or the bottom layer through a radio frequency vertical interconnection mechanism; the minimum distance between the edge of the radio frequency circuit and the metalized through hole grid is only half the thickness of the medium, and the radio frequency circuit is asymmetric, so that the layout and performance design on severe transverse dimension is realized, and the radio frequency circuit is worthy of popularization and application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (9)
1. The utility model provides a miniaturized integrated microwave power divider of nearly metal grid of transmission line asymmetry which characterized in that: the radio frequency microstrip patch antenna comprises a plurality of groups of radio frequency circuits, a vertical interconnection structure, a first laminated microstrip plate and a second laminated microstrip plate which are arranged from top to bottom, wherein the first laminated microstrip plate and the second laminated microstrip plate are formed by crimping two microstrip plates, the first laminated microstrip plate and the second laminated microstrip plate are crimped, and the plurality of groups of radio frequency circuits work independently;
each group of radio frequency circuits comprises a main port radio frequency circuit, a power dividing radio frequency circuit and a branch port radio frequency circuit, wherein the power dividing radio frequency circuit and the branch port radio frequency circuit are arranged on an intermediate layer plane between two microstrip plates in the first laminated microstrip plate, the branch port radio frequency circuit extends to a top layer plane of the first laminated microstrip plate through the vertical interconnection structure, the main port radio frequency circuit is arranged on an intermediate layer plane between two microstrip plates in the second laminated microstrip plate, the main port radio frequency circuit is connected with the power dividing radio frequency circuit through the vertical interconnection structure, and the main port radio frequency circuit extends to a bottom layer surface of the second laminated microstrip plate through the vertical interconnection structure;
the vertical interconnection structure comprises a plurality of metallized vertical transition holes, and the metallized vertical transition holes respectively vertically penetrate through each microstrip plate in the first laminated microstrip plate and the second laminated microstrip plate;
the microwave power divider further comprises a plurality of metalized grating holes, and the plurality of metalized grating holes simultaneously penetrate through the first laminated microstrip plate and the second laminated microstrip plate.
2. The miniaturized integrated microwave power divider of asymmetric near-metal grating of transmission line of claim 1, wherein: the branch rf circuit extends to a top plane of the first stacked microstrip panel through the plurality of metallized vertical transition holes, the main rf circuit is connected to the power branch rf circuit through the plurality of metallized vertical transition holes, and the main rf circuit extends to a bottom surface of the second stacked microstrip panel through one metallized vertical transition hole.
3. The miniaturized integrated microwave power divider of asymmetric near-metal grating of transmission line of claim 1, wherein: the distance between the edge of the radio frequency circuit and the through hole grating wall formed by the plurality of the metalized grating holes is at least half of the thickness of the medium.
4. The miniaturized integrated microwave power divider of asymmetric near-metal grating of transmission line of claim 1, wherein: the microwave power divider further comprises a radio frequency ground, and the radio frequency ground is arranged on the top plane of the first laminated microstrip plate and/or the bottom plane of the second laminated microstrip plate.
5. The miniaturized integrated microwave power divider of asymmetric near-metal grating of transmission line of claim 4, wherein: the microwave power divider further comprises a plurality of metalized grounding holes, and the radio frequency circuit is connected with the radio frequency ground through the metalized grounding holes.
6. The miniaturized integrated microwave power divider of asymmetric near-metal grating of transmission line of claim 5, wherein: copper foils cover the positions, covered by the power dividing radio frequency circuit and the port dividing radio frequency circuit, of the middle layer plane between the two microstrip boards, copper foils cover the upper surface and the lower surface of the two laminated microstrip boards, and the copper foils on the upper surface and the lower surface and the radio frequency circuit on the middle layer plane form a strip line transmission main body structure.
7. The miniaturized integrated microwave power divider of asymmetric near-metal grating of transmission line of claim 6, wherein: the radio frequency ground is a copper foil covered on the top plane of the first laminated micro-strip plate and the bottom plane of the second laminated micro-strip plate.
8. The miniaturized integrated microwave power divider of asymmetric near-metal grating of transmission line of claim 1, wherein: and prepregs are arranged between the two microstrip plates and between the two laminated microstrip plates, and the prepregs are pressed between the two microstrip plates and between the two laminated microstrip plates.
9. The miniaturized integrated microwave power divider of asymmetric near-metal grating of transmission line of claim 1, wherein: the microwave power divider further comprises a plurality of SMP connectors, the SMP connectors are respectively arranged at radio frequency connection points of the main port radio frequency circuit and the branch port radio frequency circuit, and each radio frequency connection point is respectively connected with one SMP connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010790102.3A CN112018481B (en) | 2020-08-07 | 2020-08-07 | Miniaturized integrated microwave power divider with asymmetric near-metal grating transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010790102.3A CN112018481B (en) | 2020-08-07 | 2020-08-07 | Miniaturized integrated microwave power divider with asymmetric near-metal grating transmission line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112018481A CN112018481A (en) | 2020-12-01 |
| CN112018481B true CN112018481B (en) | 2021-07-23 |
Family
ID=73500257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010790102.3A Active CN112018481B (en) | 2020-08-07 | 2020-08-07 | Miniaturized integrated microwave power divider with asymmetric near-metal grating transmission line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112018481B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742776A (en) * | 2016-04-01 | 2016-07-06 | 中国电子科技集团公司第三十八研究所 | Tile-shaped multi-power divider integrated with multiple microstrips |
| CN206585048U (en) * | 2017-03-10 | 2017-10-24 | 南京汉瑞微波通信有限公司 | Small sized wide-band power splitter |
| CN108232396A (en) * | 2016-12-22 | 2018-06-29 | 上海航天科工电器研究院有限公司 | A kind of band-like power divider structure of miniaturization |
| CN108879058A (en) * | 2018-06-26 | 2018-11-23 | 北京无线电测量研究所 | A kind of broadband one, which is divided in 16, buries resistance multi-layer board power splitter and preparation method thereof |
| CN110167261A (en) * | 2019-06-26 | 2019-08-23 | 京信通信技术(广州)有限公司 | Interconnection structure between millimeter wave active antenna element and pcb board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000018202A1 (en) * | 1998-09-17 | 2000-03-30 | Ibiden Co., Ltd. | Multilayer build-up wiring board |
| US7439840B2 (en) * | 2006-06-27 | 2008-10-21 | Jacket Micro Devices, Inc. | Methods and apparatuses for high-performing multi-layer inductors |
| CN205067732U (en) * | 2015-10-22 | 2016-03-02 | 苏州博海创业微系统有限公司 | Stromatolite formula receiving and dispatching subassembly |
| US10320043B2 (en) * | 2017-05-23 | 2019-06-11 | Nanning Fugui Precision Industrial Co., Ltd. | Power distributing device |
-
2020
- 2020-08-07 CN CN202010790102.3A patent/CN112018481B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742776A (en) * | 2016-04-01 | 2016-07-06 | 中国电子科技集团公司第三十八研究所 | Tile-shaped multi-power divider integrated with multiple microstrips |
| CN108232396A (en) * | 2016-12-22 | 2018-06-29 | 上海航天科工电器研究院有限公司 | A kind of band-like power divider structure of miniaturization |
| CN206585048U (en) * | 2017-03-10 | 2017-10-24 | 南京汉瑞微波通信有限公司 | Small sized wide-band power splitter |
| CN108879058A (en) * | 2018-06-26 | 2018-11-23 | 北京无线电测量研究所 | A kind of broadband one, which is divided in 16, buries resistance multi-layer board power splitter and preparation method thereof |
| CN110167261A (en) * | 2019-06-26 | 2019-08-23 | 京信通信技术(广州)有限公司 | Interconnection structure between millimeter wave active antenna element and pcb board |
Non-Patent Citations (2)
| Title |
|---|
| 一种X 波段宽带一分六功分网络的研制;李伟 等;《信息通信》;20151231(第156期);第58-60页 * |
| 微波多层超宽带功率分配网络的研究与设计;杨洋;《万方学位论文》;20190114;第40-56页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112018481A (en) | 2020-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108649325B (en) | Broadband high-gain millimeter wave dielectric resonant antenna array | |
| CN100449864C (en) | Substrate integrated waveguide comb-shaped power distributor | |
| CN108432051B (en) | Array antenna system | |
| CN110797616B (en) | Multilayer digital-analog mixed pressing plate based on substrate integrated coaxial line structure | |
| CN111342227A (en) | Multilayer structure array antenna | |
| CN114256575A (en) | Multi-channel miniaturized microwave assembly and metal-based composite substrate structure thereof | |
| CN112018481B (en) | Miniaturized integrated microwave power divider with asymmetric near-metal grating transmission line | |
| CN112751580B (en) | P-waveband LTCC assembly based on clock shielding and power filtering | |
| CN111834735B (en) | Array antenna and base station equipment | |
| CN113675602A (en) | Antenna module, preparation method thereof and terminal | |
| CN115707171A (en) | Circuit board, antenna structure and electronic equipment | |
| CN211019430U (en) | 5G antenna integrated network device | |
| CN113794049A (en) | Three-dimensional substrate integrated antenna based on multilayer laminated dielectric integrated waveguide | |
| CN115494456B (en) | Radar transmitting/receiving device and radar device | |
| CN112533358A (en) | High-frequency microwave multilayer circuit board and high-frequency microwave assembly | |
| CN111613874A (en) | Three-mode OAM antenna based on triangular half module | |
| CN218827834U (en) | Multi-frequency multi-layer integrated power division feed network | |
| CN214203926U (en) | Multi-band power division switch assembly | |
| CN216750292U (en) | Radar antenna and radar antenna module | |
| CN219626873U (en) | High-density integrated multipath synthesized wilkinson power divider | |
| CN215933819U (en) | Antenna module and smart television | |
| CN116885444B (en) | Chip phased array antenna structure | |
| CN219350667U (en) | Millimeter wave medium buried series feed antenna | |
| CN212342794U (en) | Gold wire transition structure of Ka-band grounding coplanar waveguide | |
| CN111162362B (en) | Double-ridge substrate integrated waveguide broadband magic T |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |