CN113675602A - Antenna module, preparation method thereof and terminal - Google Patents
Antenna module, preparation method thereof and terminal Download PDFInfo
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- CN113675602A CN113675602A CN202110931322.8A CN202110931322A CN113675602A CN 113675602 A CN113675602 A CN 113675602A CN 202110931322 A CN202110931322 A CN 202110931322A CN 113675602 A CN113675602 A CN 113675602A
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- 238000002360 preparation method Methods 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 190
- 230000005855 radiation Effects 0.000 claims abstract description 155
- 239000002184 metal Substances 0.000 claims abstract description 58
- 229910052751 metal Inorganic materials 0.000 claims abstract description 58
- 230000005540 biological transmission Effects 0.000 claims description 49
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 238000005553 drilling Methods 0.000 description 7
- 230000010354 integration Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000001808 coupling effect Effects 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- PEZNEXFPRSOYPL-UHFFFAOYSA-N (bis(trifluoroacetoxy)iodo)benzene Chemical compound FC(F)(F)C(=O)OI(OC(=O)C(F)(F)F)C1=CC=CC=C1 PEZNEXFPRSOYPL-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
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Abstract
The invention discloses an antenna module, a preparation method thereof and a terminal. The antenna module includes: the circuit comprises a first substrate, a second substrate and a third substrate, wherein one side of the first substrate is provided with a grounding metal layer, a first signal pin and a second signal pin which are mutually insulated; the surface of the second substrate is provided with at least one first ultra-wideband radiating part and at least one first millimeter wave radiating part; one side of the second substrate, which is far away from the first substrate, is provided with at least one millimeter wave decoupling part corresponding to the first millimeter wave radiation part; one side of the third substrate is provided with at least one second ultra-wideband radiating part and at least one second millimeter wave radiating part; the ultra-wideband grounding via hole is electrically connected with the corresponding first ultra-wideband radiating part, the corresponding second ultra-wideband radiating part and the corresponding grounding metal layer; the ultra-wideband feed through hole is connected with the corresponding second ultra-wideband radiation part and the corresponding first signal pin; and the millimeter wave feed through hole is connected with the corresponding first millimeter wave radiation part and the corresponding second signal pin. The invention integrates a millimeter wave antenna and an ultra-wideband antenna.
Description
Technical Field
The embodiment of the invention relates to an antenna technology, in particular to an antenna module and a preparation method and a terminal thereof.
Background
With the rapid development of the 5G technology, the application of the antenna module is also more and more extensive.
Modern electronic devices generally need to integrate multiple antennas, such as millimeter wave antennas and Ultra Wide Band (UWB) antennas, however, UWB antennas and millimeter wave antennas are generally designed as independent modules in communication products, which brings challenges to the design space of the whole device and has high production cost.
Disclosure of Invention
The invention provides an antenna module, a preparation method thereof and a terminal, wherein a millimeter wave antenna and an ultra-wideband antenna are organically integrated on one module, the development requirement that the space of the whole machine is reduced can be met, the production process is simple, and the production cost is greatly reduced.
In a first aspect, an embodiment of the present invention provides an antenna module, where the antenna module is integrated with an ultra-wideband antenna and a millimeter wave antenna, and the antenna module includes:
the circuit comprises a first substrate, a second substrate and a third substrate, wherein one side of the first substrate is provided with a ground metal layer, a first signal pin and a second signal pin which are mutually insulated;
the second substrate is arranged on one side, away from the grounding metal layer, of the first substrate; the surface of the second substrate, which is close to the first substrate, is provided with at least one first ultra-wideband radiating part and at least one first millimeter wave radiating part; one side of the second substrate, which is far away from the first substrate, is provided with at least one millimeter wave decoupling part corresponding to the first millimeter wave radiation part;
the third substrate is arranged on one side, far away from the first substrate, of the second substrate, and at least one second ultra-wideband radiation part in one-to-one correspondence with the first ultra-wideband radiation part and at least one second millimeter wave radiation part in correspondence with the first millimeter wave radiation part are arranged on one side, far away from the second substrate, of the third substrate;
the ultra-wideband grounding via hole is electrically connected with the corresponding first ultra-wideband radiating part, the corresponding second ultra-wideband radiating part and the corresponding grounding metal layer; the ultra-wideband feed through hole is connected with the corresponding second ultra-wideband radiation part and the corresponding first signal pin; the millimeter wave feed through hole is connected with the corresponding first millimeter wave radiation part and the corresponding second signal pin;
and the radio frequency shielding part is arranged around the millimeter wave antenna and around the ultra-wideband antenna.
Optionally, an orthographic projection of the second ultra-wideband radiating part on the first substrate covers an orthographic projection of the corresponding ultra-wideband ground via hole on the first substrate and an orthographic projection of the corresponding ultra-wideband feed via hole on the first substrate.
Optionally, an opening is formed in the first ultra-wideband radiating portion, and the ultra-wideband feed via hole penetrates through the opening and is insulated from the first ultra-wideband radiating portion.
Optionally, each of the first ultra-wideband radiating portions corresponds to a plurality of ultra-wideband ground vias, a metal sheet is arranged on the surface of the second substrate far away from the first substrate, and the plurality of ultra-wideband ground vias corresponding to the first ultra-wideband radiating portions penetrate through the metal sheet and are electrically connected with the metal sheet.
Optionally, a gap is arranged in the center of the first millimeter wave radiation part;
each millimeter wave decoupling portion comprises four millimeter wave sub-decoupling portions, and orthographic projections of the four millimeter wave sub-decoupling portions on the first substrate surround orthographic projections of the corresponding first millimeter wave radiation portions on the first substrate.
Optionally, the antenna module further includes:
the first transmission line and the second transmission line are arranged between the fourth substrate and the fifth substrate; the fourth substrate is arranged in contact with the first substrate, and the fifth substrate is in contact with the first ultra-wideband radiating part and the first millimeter wave radiating part;
the ultra-wideband feed through hole comprises a first ultra-wideband feed through hole and a second ultra-wideband feed through hole, the first end of the first ultra-wideband feed through hole is electrically connected with the corresponding second ultra-wideband radiating part, the second end of the first ultra-wideband feed through hole is electrically connected with one end of the corresponding first transmission line, the other end of the first transmission line is electrically connected with the first end of the second ultra-wideband feed through hole, and the second end of the second ultra-wideband feed through hole is electrically connected with the corresponding first signal pin;
the millimeter wave feed via hole comprises a first millimeter wave feed via hole and a second millimeter wave feed via hole, the first end of the first millimeter wave feed via hole is electrically connected with the corresponding first millimeter wave radiation part, the second end of the first millimeter wave feed via hole is electrically connected with one end of the corresponding second transmission line, the other end of the second transmission line is electrically connected with the first end of the second millimeter wave feed via hole, and the second end of the second millimeter wave feed via hole is electrically connected with the corresponding second signal pin.
Optionally, the radio frequency shielding part comprises a plurality of first shielding holes and a plurality of second shielding holes;
the plurality of first shielding holes surround the corresponding first ultra-wideband radiation part and the corresponding second ultra-wideband radiation part;
the plurality of second shielding holes surround the corresponding first millimeter wave radiation part, millimeter wave decoupling part and second millimeter wave radiation part.
In a second aspect, an embodiment of the present invention further provides a terminal, where the terminal includes the antenna module according to the first aspect.
In a third aspect, an embodiment of the present invention further provides a method for manufacturing an antenna module, including:
providing a first module to be pressed, wherein the first module to be pressed comprises a first substrate, and a ground metal layer, a first signal pin and a second signal pin which are formed on a first surface of the first substrate and are insulated from each other;
providing a second module to be laminated, wherein the second module to be laminated comprises a second substrate, at least one first ultra-wideband radiating part and at least one first millimeter wave radiating part which are formed on the first surface of the second substrate, and at least one millimeter wave decoupling part which is formed on the second surface of the second substrate, and the second module to be laminated further comprises a radio frequency shielding part which is formed around the first ultra-wideband radiating part, around an area corresponding to the second ultra-wideband radiating part, and around the millimeter wave decoupling part;
providing a third module to be laminated, wherein the third module to be laminated comprises a third substrate, at least one second ultra-wideband radiation part and at least one second millimeter wave radiation part, and the at least one second ultra-wideband radiation part is formed on the first surface of the third substrate;
forming an A ultra-wideband grounding via hole and an A ultra-wideband feeding via hole on the second module to be pressed, wherein the A ultra-wideband grounding via hole is electrically connected with the corresponding first millimeter wave radiation part, and the A ultra-wideband feeding via hole is insulated from the corresponding first millimeter wave radiation part;
pressing the first module to be pressed, the second module to be pressed and the third module to be pressed;
forming a second ultra-wideband grounding via hole, a second ultra-wideband feeding via hole and a millimeter wave feeding via hole on the first module to be pressed; forming a third ultra-wideband grounding through hole and a third ultra-wideband feeding through hole on the third module to be pressed; the second ultra-wideband grounding via hole, the first ultra-wideband grounding via hole and the third ultra-wideband grounding via hole are electrically connected in sequence so as to connect the corresponding first ultra-wideband radiating part, the second ultra-wideband radiating part and the grounding metal layer in series; the second ultra-wideband feed through hole, the first ultra-wideband feed through hole and the third ultra-wideband feed through hole are electrically connected in sequence to connect the second ultra-wideband radiation part and the corresponding first signal pin in series; the millimeter wave feed through hole is connected with the corresponding first millimeter wave radiation part and the second signal pin in series.
In a fourth aspect, an embodiment of the present invention further provides a method for manufacturing an antenna module, including:
providing a first module to be pressed, wherein the first module to be pressed comprises a first substrate, and a ground metal layer, a first signal pin and a second signal pin which are formed on a first surface of the first substrate and are insulated from each other; the first module to be pressed is also provided with an A ultra-wideband grounding through hole, an A ultra-wideband feed through hole and an A millimeter wave feed through hole;
providing a fourth module to be laminated, wherein the fourth module to be laminated comprises a fourth substrate, and a first transmission line and a second transmission line which are formed on the first surface of the fourth substrate; the fourth module to be pressed also comprises a second ultra-wideband grounding through hole, a second ultra-wideband feeding through hole and a second millimeter wave feeding through hole; the fourth module to be laminated further comprises a first sub radio frequency shielding part formed around the first transmission line and around the second transmission line;
providing a fifth module to be laminated, wherein the fifth module to be laminated comprises a fifth substrate, at least one first ultra-wideband radiation part and at least one first millimeter wave radiation part which are formed on the first surface of the fifth substrate; a third ultra-wideband grounding through hole, a third ultra-wideband feeding through hole and a third millimeter wave feeding through hole are also formed on the fifth substrate to be laminated;
providing a second module to be laminated, wherein the second module to be laminated comprises a second substrate and at least one millimeter wave decoupling part formed on the first surface of the second substrate; the second module to be pressed also comprises a T ultra-wideband grounding through hole and a T ultra-wideband feeding through hole; the second module to be laminated further comprises a second sub radio frequency shielding part formed around the first ultra wide band radiation part, around an area corresponding to the second ultra wide band radiation part and around the millimeter wave decoupling part;
providing a third module to be laminated, wherein the third module to be laminated comprises a third substrate, at least one second ultra-wideband radiation part and at least one second millimeter wave radiation part, and the at least one second ultra-wideband radiation part is formed on the first surface of the third substrate; the third module to be pressed also comprises a penta ultra-wideband grounding via hole and a penta ultra-wideband feeding via hole;
pressing the first module to be pressed, the second module to be pressed, the third module to be pressed, the fourth module to be pressed and the fifth module to be pressed; the first ultra-wideband grounding via hole, the corresponding second ultra-wideband grounding via hole, the corresponding third ultra-wideband grounding via hole, the corresponding fourth ultra-wideband grounding via hole and the corresponding fifth ultra-wideband grounding via hole are electrically connected in sequence so as to connect the corresponding first ultra-wideband radiation part, the corresponding second ultra-wideband radiation part and the grounding metal layer in series; the first ultra-wideband feed through hole and the second ultra-wideband feed through hole are electrically connected to connect a corresponding first signal pin and a first transmission line in series; the third ultra-wideband feed through hole, the corresponding third ultra-wideband feed through hole and the corresponding fifth ultra-wideband feed through hole are electrically connected in sequence so as to connect the corresponding first transmission line and the corresponding second ultra-wideband radiation part in series; the first millimeter wave feed through hole is electrically connected with the second millimeter wave feed through hole so as to electrically connect the second signal pin with the corresponding second transmission line; the third millimeter wave feed through hole connects the corresponding first millimeter wave radiating part in series with the corresponding second transmission line.
According to the technical scheme of the embodiment of the invention, the millimeter wave antenna and the ultra-wideband antenna are innovatively designed, and the millimeter wave antenna and the ultra-wideband antenna are organically integrated together through the plurality of substrates to form the composite antenna module, the ultra-wideband antenna part and the millimeter wave antenna part in the antenna module are not interfered with each other and are organically combined, the space occupancy rate is small, and the development requirement that the space of the whole machine is reduced can be better met. Wherein, the ultra wide band antenna is including setting up the second ultra wide band radiation portion and the first ultra wide band radiation portion of setting on first base plate that keep away from first base plate one side at the third base plate, first ultra wide band radiation portion and second ultra wide band radiation portion are established ties, for example, first ultra wide band radiation portion is 8.0G frequency channel antenna output, second ultra wide band radiation portion is 6.5G frequency channel antenna output, first ultra wide band radiation portion establishes ties with second ultra wide band radiation portion and can form PIFA antenna form, thereby, realize dual-frenquency single feed point output, reach and reduce antenna size, reduce the mesh of part overall dimension. The millimeter wave antenna comprises a first millimeter wave radiation part arranged on a first substrate, a millimeter wave decoupling part arranged on a second substrate and a second millimeter wave radiation part arranged on a third substrate, wherein the millimeter wave antenna is provided with an upper layer and a lower layer, the output bandwidth and the gain of the millimeter wave antenna can be increased, when the millimeter wave antenna is fed through a feed network, the magnetic field of the first millimeter wave radiation part of the first layer is radiated and the magnetic field of the second millimeter wave radiation part of the third layer is excited to be integrally resonant, and the decoupling part of the second layer can remove the coupling effect in a resonant circuit to realize impedance matching. The periphery of the ultra-wideband antenna and the periphery of the millimeter wave antenna surround the radio frequency shielding part, and the adjacent ultra-wideband antenna and the adjacent millimeter wave antenna can be isolated. The radiation interference generated by mutual coupling between the radiation parts of two adjacent antennas is prevented, and the radiation parts of the millimeter wave antennas are ensured to be in a stable working state. The manufacturing method of the antenna module comprises the steps of designing the components of the ultra-wideband antenna and the millimeter wave antenna on different substrates in a layered mode, and then pressing the substrates to form the whole composite antenna module integrating the ultra-wideband antenna and the millimeter wave antenna, so that the two independent and non-interfering antennas are integrated and manufactured, the production process is simple, the production cost is greatly reduced, and the purposes of minimizing the size of the antenna module occupying the space of the whole antenna and minimizing the cost are achieved.
Drawings
Fig. 1 is a schematic structural diagram of an antenna module according to an embodiment of the present invention;
fig. 2 is a top view of a layer where a second millimeter wave radiation part and a second ultra-wideband radiation part are located in the antenna module according to the embodiment of the present invention;
fig. 3 is a top view of a layer where a millimeter wave decoupling portion is located in the antenna module according to the embodiment of the present invention;
fig. 4 is a top view of a layer where a first ultra-wideband radiating portion and a first millimeter wave radiating portion are located in the antenna module according to the embodiment of the present invention;
fig. 5 is a schematic structural diagram of another antenna module according to an embodiment of the present invention;
fig. 6 is a return loss curve diagram of a millimeter wave antenna in the antenna module according to the embodiment of the present invention at a low frequency;
fig. 7 is a return loss curve diagram of a millimeter wave antenna in the antenna module according to the embodiment of the present invention when the millimeter wave antenna is at a high frequency;
fig. 8 is a return loss curve diagram of an ultra-wideband antenna in the antenna module according to the embodiment of the present invention;
fig. 9 is a flowchart of a method for manufacturing an antenna module according to an embodiment of the present invention;
FIGS. 10-12 are schematic views of the product structure formed by the main flow of the method shown in FIG. 9;
fig. 13 is a flowchart of a method for manufacturing an antenna module according to another embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of an antenna module according to an embodiment of the present invention, fig. 2 is a top view of a layer where a second millimeter wave radiation portion and a second ultra-wideband radiation portion are located in the antenna module according to the embodiment of the present invention, fig. 3 is a top view of a layer where a millimeter wave decoupling portion is located in the antenna module according to the embodiment of the present invention, fig. 4 is a top view of a layer where a first ultra-wideband radiation portion and a first millimeter wave radiation portion are located in the antenna module according to the embodiment of the present invention, and with reference to fig. 1 to 4, the antenna module is integrated with an ultra-wideband antenna 1 and a millimeter wave antenna 2, and the antenna module includes: a first substrate 11, wherein a ground metal layer 111, a first signal pin 112 and a second signal pin 113 which are insulated from each other are arranged on one side of the first substrate 11; the second substrate 12, the second substrate 12 is disposed on one side of the first substrate 11 away from the ground metal layer 111; the surface of the second substrate 12 close to the first substrate 11 is provided with at least one first ultra-wideband radiating part 121 and at least one first millimeter wave radiating part 122; a millimeter wave decoupling part 123 corresponding to at least one first millimeter wave radiation part 122 is arranged on one side of the second substrate 12 away from the first substrate 11; a third substrate 13, wherein the third substrate 13 is disposed on a side of the second substrate 12 away from the first substrate 11, and one side of the third substrate 13 away from the second substrate 12 is provided with at least one second ultra-wideband radiating part 131 corresponding to the first ultra-wideband radiating part 121 one by one and at least one second millimeter-wave radiating part 132 corresponding to the first millimeter-wave radiating part 122; the ultra-wideband grounding via 21 is electrically connected with the corresponding first ultra-wideband radiating part 121 and the corresponding second ultra-wideband radiating part 131 level grounding metal layer 111; the ultra-wideband feed via hole 22 is connected with the corresponding second ultra-wideband radiating part 131 and the corresponding first signal pin 112 through the ultra-wideband feed via hole 22; the millimeter wave feed through hole 23 is connected with the corresponding first millimeter wave radiation part 122 and the corresponding second signal pin 113; and the radio frequency shielding part 80 is arranged around the millimeter wave antenna 2 and around the ultra-wideband antenna 1.
Specifically, the first substrate 11, the second substrate 12, and/or the third substrate 13 may be, for example, a PCB (Printed Circuit Board) hard Board material or a dielectric substrate composed of ceramics having characteristics such as a high dielectric constant and a low thermal expansion coefficient; the material of the ground metal layer 111 may be, for example, copper, and the ground metal layer 111 is used to provide a ground connection for the entire antenna module; the antenna module of this embodiment is integrated with at least one ultra-wideband antenna 1 and at least one millimeter wave antenna 2, as shown in fig. 1, the antenna module is integrated with two ultra-wideband antennas 1 and one millimeter wave antenna 2 for description, but it can be understood by those skilled in the art that the number and position of the ultra-wideband antennas and the number and position of the millimeter wave antennas are not particularly limited in this embodiment. Each ultra-wideband antenna 1 comprises a first ultra-wideband radiation part 121 positioned on the first substrate 11 and a second ultra-wideband radiation part 131 positioned on the third substrate 13, and each ultra-wideband antenna 1 corresponds to at least one ultra-wideband grounding via hole 21, the ultra-wideband grounding via hole 21 connects the first ultra-wideband radiation part 121 and the second ultra-wideband radiation part 131 in series and is electrically connected to the grounding metal layer 111, each ultra-wideband antenna 1 also corresponds to at least one ultra-wideband feed via hole 22, the ultra-wideband feed via hole 22 electrically connects the first signal pin 112 with the second ultra-wideband radiation part 131, and the ultra-wideband feed via hole 22 is insulated from the first ultra-wideband radiation part 121 in the corresponding ultra-wideband antenna 1, that is, because the second ultra-wideband radiation part 131 is positioned outside the antenna module, the first ultra-wideband radiation part 121 is positioned inside the antenna module, and directly electrically connects the first signal pin 112 with the second ultra-wideband radiation part 131, signals received by the second ultra-wideband radiating part 131 can be directly fed into the first signal pin 112, and two ultra-wideband antennas are connected in series to form a planar inverted f (pifa) antenna through an ultra-wideband grounding via hole, so that dual-frequency single-feed-point output is realized, the size of the ultra-wideband antenna is reduced, and the integration is facilitated; in this embodiment, the second ultra-wideband radiating portion corresponding to the first ultra-wideband radiating portion may be understood as a first ultra-wideband radiating portion and a second ultra-wideband radiating portion in the same ultra-wideband antenna, that is, the first ultra-wideband radiating portion and the second ultra-wideband radiating portion are electrically connected through corresponding ultra-wideband grounding vias;
the millimeter wave decoupling part corresponding to the first millimeter wave radiation part and the second millimeter wave radiation part corresponding to the first millimeter wave radiation part can be understood that the first millimeter wave radiation part, the millimeter wave decoupling part and the second millimeter wave radiation part all belong to the same millimeter wave antenna, and the millimeter wave decoupling part is used for removing the coupling effect in the antenna module to realize 50-ohm impedance matching; the second millimeter wave radiation part can be set to be square, so that electromagnetic fields radiated by the antenna in all directions are consistent, and output signals can be kept consistent; in this embodiment, the first millimeter wave radiation part 122 outputs a high-frequency signal and a low-frequency signal to the second signal pin 113 through the millimeter wave feed via hole 23, and excites the millimeter wave decoupling part 123 and the second millimeter wave radiation part 132 to synchronously operate through electromagnetic field radiation of the first millimeter wave radiation part 122, so as to realize synchronous output of high-frequency and low-frequency signals of the antenna, that is, realize dual polarization of the antenna in horizontal and vertical directions, which is beneficial to reducing the size of the millimeter wave antenna and is more beneficial to integration with the ultra-wideband antenna; the adoption of the three-layer millimeter wave antenna is beneficial to increasing the output bandwidth and the gain of the millimeter wave antenna, so that the size of the millimeter wave antenna can be reduced; meanwhile, by arranging the radio frequency shielding part, the adjacent ultra-wideband antenna and the millimeter wave antenna can be isolated, the radiation interference generated by mutual coupling between the radiation parts of the two adjacent antennas is prevented, and the radiation part of the millimeter wave antenna is ensured to be in a stable working state.
According to the technical scheme, the adopted antenna module integrates the millimeter wave antenna and the ultra-wideband antenna, each ultra-wideband antenna comprises a second ultra-wideband radiation part and a first ultra-wideband radiation part, the second ultra-wideband radiation part is arranged on one side, far away from the first substrate, of the third substrate, the first ultra-wideband radiation part is arranged on the first substrate, and the first ultra-wideband radiation part and the second ultra-wideband radiation part are connected in series, so that the size of the ultra-wideband antenna is greatly reduced; and each of the millimeter wave antennas includes a first millimeter wave radiating section provided on the first substrate, a millimeter wave decoupling section provided on the second substrate, and a second millimeter wave radiating section provided on the third substrate, thereby greatly reducing the size of the millimeter wave antenna; by providing the radio frequency shielding portion, the millimeter wave antenna and the ultra wide band antenna in the antenna module of the present embodiment can not interfere with each other, so that the ultra wide band antenna and the millimeter wave antenna can be integrated into one antenna module.
Optionally, with continued reference to fig. 1, the orthographic projection of the second ultra-wideband radiating portion 131 on the first substrate 11 covers the orthographic projection of the corresponding ultra-wideband ground via 21 on the first substrate 11 and the orthographic projection of the corresponding ultra-wideband feed via 22 on the first substrate 11.
By the arrangement, on one hand, the space occupied by the ultra-wideband antenna can be reduced, and the integration level is further improved; on the other hand, when the ultra-wideband grounding via hole and the ultra-wideband feeding via hole are manufactured, wires do not need to be wound on the first substrate, the second substrate or the third substrate, the ultra-wideband grounding via hole and the ultra-wideband feeding via hole can be manufactured by punching and metalizing the antenna module in the thickness direction, and the manufacturing difficulty of the antenna module is greatly reduced.
Optionally, with reference to fig. 1 to 4, an opening 1211 is disposed on the first ultra-wideband radiating portion 121, and the ultra-wideband feed via 22 penetrates through the opening 1211 and is insulated from the first ultra-wideband radiating portion 121.
Specifically, in the same ultra-wideband antenna, the shapes of the second ultra-wideband radiating part 131 and the first ultra-wideband radiating part 121 may be the same, for example, both may be quadrilateral, and the orthographic projection of the second ultra-wideband radiating part 131 on the first substrate 11 may cover the orthographic projection of the first ultra-wideband radiating part 121 on the first substrate 11; an opening 1211 may be provided in the first ultra-wideband radiating portion 121 to prevent the ultra-wideband feed via 22 from shorting to the first ultra-wideband radiating portion and the second ultra-wideband radiating portion.
Optionally, as shown in fig. 3, each of the first ultra-wideband radiating portions corresponds to a plurality of ultra-wideband ground vias, a metal sheet 31 is disposed on a surface of the second substrate away from the first substrate, and the plurality of ultra-wideband ground vias corresponding to the first ultra-wideband radiating portions all penetrate through the metal sheet 31 and are electrically connected to the metal sheet 31.
Specifically, the plurality of ultra-wideband ground vias are arranged in the embodiment, so that more uniform ground signals can be provided for the first ultra-wideband radiating part and the second ultra-wideband radiating part; meanwhile, the metal sheet 31 is arranged, so that the heat dissipation capacity of the ultra-wideband antenna can be improved.
Alternatively, as shown in fig. 4, the center of each first millimeter-wave radiation section 122 is provided with a slit 1221; the millimeter wave decoupling portion includes four millimeter wave sub-decoupling portions (1231, 1232, 1233, and 1234) whose orthographic projections on the first substrate 11 surround the orthographic projection of the first millimeter wave radiating portion on the first substrate 11.
Specifically, the first millimeter wave radiation part is, for example, a rectangle, and a "cross" slit is provided in the center thereof, so that the first millimeter wave radiation part radiates a signal of a corresponding frequency; the orthographic projections of the four millimeter wave sub-decoupling parts on the first substrate are respectively positioned on four side edges of the orthographic projection of the first millimeter wave radiation part on the first substrate, the millimeter wave sub-decoupling parts can realize impedance matching between the first millimeter wave radiation part and the second millimeter wave radiation part, so that the coupling effect in the resonant circuit is removed, and the space occupied by the millimeter wave sub-decoupling parts is small, so that the miniaturization of the millimeter wave antenna is facilitated; meanwhile, the cross gap can also change the phase of the transmission output of the electromagnetic waves of the millimeter wave antenna, so that the horizontal and vertical polarization synchronous output is realized, the resonant frequency is also reduced, the size of the millimeter wave antenna is reduced, and the integration with the ultra-wideband antenna is facilitated.
Optionally, fig. 5 is a schematic structural diagram of another antenna module according to an embodiment of the present invention, and referring to fig. 5, the antenna module further includes: a fourth substrate 14, a fifth substrate 15, and a first transmission line 141 and a second transmission line 142 disposed between the fourth substrate 14 and the fifth substrate 15; the fourth substrate 14 is arranged in contact with the first substrate 11, and the fifth substrate 15 is arranged in contact with the first ultra-wideband radiating part 121-level first millimeter-wave radiating part 122; the ultra-wideband feed through hole comprises a first ultra-wideband feed through hole 221 and a second ultra-wideband feed through hole 222, wherein a first end of the first ultra-wideband feed through hole 221 is electrically connected with the corresponding second ultra-wideband radiating part 131, a second end of the first ultra-wideband feed through hole 221 is electrically connected with one end of the corresponding first transmission line 141, the other end of the first transmission line 141 is electrically connected with a first end of the second ultra-wideband feed through hole 222, and a second end of the second ultra-wideband feed through hole 222 is electrically connected with the corresponding first signal pin 112; the millimeter wave feed via hole includes a first millimeter wave feed via hole 231 and a second millimeter wave feed via hole 232, a first end of the first millimeter wave feed via hole 231 is electrically connected to the corresponding first millimeter wave radiating portion 122, a second end of the first millimeter wave feed via hole 231 is electrically connected to one end of the corresponding second transmission line 142, the other end of the second transmission line 142 is electrically connected to a first end of the second millimeter wave feed via hole 232, and a second end of the second millimeter wave feed via hole 232 is electrically connected to the corresponding second signal pin 113.
Specifically, in the embodiment, the second ultra-wideband radiating part 131 is not directly electrically connected to the first signal pin 112, but is electrically connected to the first signal pin 121 through the first transmission line 141, and the first transmission line 141 can provide impedance matching for the ultra-wideband antenna, so that the loss of the ultra-wideband antenna is reduced; the first millimeter wave radiator 122 is not directly electrically connected to the second signal pin 113, but is electrically connected to the second signal pin 113 through the second transmission line 142, and the second transmission line 142 can provide impedance matching for the millimeter wave antenna, thereby reducing the loss of the millimeter wave antenna.
Optionally, the radio frequency shield comprises a plurality of first shield holes and a plurality of second shield holes; the plurality of first shielding holes surround the corresponding first ultra-wideband radiation part and the corresponding second ultra-wideband radiation part; the plurality of second shielding holes surround the corresponding first millimeter wave radiation part, the millimeter wave decoupling part and the second millimeter wave radiation part.
Specifically, in the embodiment, the periphery of each ultra-wideband antenna can surround a plurality of first shielding holes, so that the ultra-wideband antennas are isolated, and the ultra-wideband antennas are prevented from being interfered; and meanwhile, a plurality of second shielding holes are surrounded around each millimeter wave antenna, so that the millimeter wave antennas are isolated, and the millimeter wave antennas are prevented from being interfered.
As shown in fig. 6 and 7, fig. 6 is a return loss curve diagram of a millimeter wave antenna in an antenna module according to an embodiment of the present invention at a low frequency, fig. 7 is a return loss curve diagram of a millimeter wave antenna in an antenna module according to an embodiment of the present invention at a high frequency, the present embodiment exemplarily includes 8 millimeter wave antennas, and it can be seen from fig. 6 that a return loss S11 of the millimeter wave antenna can reach-19 db to-28 db at a low frequency of 24G to 30G, a bandwidth of the millimeter wave antenna can also reach a fluctuation range of 3 GHZ, and a bandwidth of the millimeter wave antenna is wide; as shown in fig. 7, at a high frequency of 36-40G, the return loss S11 of the millimeter wave antenna can reach-22 db to-30 db, the bandwidth thereof can also reach a fluctuation range of 3 GHZ, and the bandwidth of the millimeter wave antenna is wide. As shown in fig. 8, fig. 8 is a return loss graph of an ultra-wideband antenna in the antenna module according to the embodiment of the present invention, and it can be seen from fig. 8 that the return loss of the ultra-wideband antenna is S11-7db at 6.5G, and the bandwidth is 380 MHZ; at 8.0G return loss S11-14db, bandwidth 640 MHz.
The embodiment of the present invention further provides a terminal, where the terminal includes the antenna module provided in any embodiment of the present invention, and the terminal may be, for example, a mobile phone, a tablet computer, and the like.
Fig. 9 is a flowchart of a method for manufacturing an antenna module according to an embodiment of the present invention, and as shown in fig. 9, the method for manufacturing an antenna module according to the embodiment is suitable for manufacturing the antenna module shown in fig. 1, and the method for manufacturing an antenna module includes:
step S501, providing a first module to be pressed, wherein the first module to be pressed comprises a first substrate, and a ground metal layer, a first signal pin and a second signal pin which are formed on a first surface of the first substrate and are insulated from each other;
specifically, fig. 10-12 are schematic structural diagrams of a product correspondingly formed by the main flow of the method shown in fig. 9, as shown in fig. 10, the first substrate includes a first surface and a second surface opposite to each other, and the first surface is provided with a ground metal layer 111, a first signal pin 112 and a second signal pin 113, which are insulated from each other; the ground metal layer 111, the first signal pins 112, and the second signal pins 113 may be formed by first pressing an ultra-thin metal layer on the surface of the first substrate 11, then etching the ultra-thin metal layer to form patterns of the ground metal layer 111, the first signal pins 112, and the second signal pins 113, and then copper plating for thickening to thicken the ground metal layer 111, the first signal pins 112, and the second signal pins 113 to a predetermined thickness.
Step S502, providing a second module to be laminated, wherein the second module to be laminated comprises a second substrate, at least one first ultra-wideband radiating part and at least one first millimeter wave radiating part which are formed on the first surface of the second substrate, and at least one millimeter wave decoupling part which is formed on the second surface of the second substrate; the second module to be laminated also comprises a radio frequency shielding part which is formed around the first ultra-wideband radiation part, around the area corresponding to the second ultra-wideband radiation part and around the millimeter wave decoupling part;
specifically, as shown in fig. 11, the second substrate 12 includes a first surface and a second surface opposite to each other, and a forming method of the second module to be bonded is similar to that of the first module to be bonded, that is, an ultra-thin metal layer is bonded on the first surface and the second surface of the second substrate, and then the ultra-thin metal layer is etched to etch a pattern of the first ultra-wideband radiation portion 121, the first millimeter wave radiation portion 122, and the millimeter wave decoupling portion 123, and then copper plating and thickening are performed to thicken the first ultra-wideband radiation portion 121, the first millimeter wave radiation portion 122, and the millimeter wave decoupling portion 123 to a specified thickness; the radio frequency shielding part 80 may be a shielding hole, for example.
Step S503, providing a third module to be laminated, wherein the third module to be laminated comprises a third substrate, at least one second ultra-wideband radiation part and at least one second millimeter wave radiation part, and the at least one second ultra-wideband radiation part is formed on the first surface of the third substrate;
specifically, as shown in fig. 12, the third substrate 13 includes a first surface and a second surface opposite to each other, and a forming method of the third module to be bonded is similar to that of the first module to be bonded, that is, an ultra-thin metal layer is bonded on the first surface of the third substrate, then the ultra-thin metal layer is etched, patterns of the second ultra-wide band radiation portion 131 and the second millimeter wave radiation portion 132 are etched, and then copper plating and thickening are performed to thicken the second ultra-wide band radiation portion 131 and the second millimeter wave radiation portion 132 to a specified thickness.
The sequence of step S501, step S502, and step S503 is not particularly limited.
Step S504, forming an A ultra-wideband grounding via hole and an A ultra-wideband feeding via hole on the second module to be pressed, wherein the A ultra-wideband grounding via hole is electrically connected with the corresponding first millimeter wave radiation part, and the A ultra-wideband feeding via hole is insulated from the corresponding first millimeter wave radiation part;
specifically, in this embodiment, the holes may be drilled by a mechanical drilling method or a laser method, and then metalized to form an ultra-wideband a ground via and an ultra-wideband a feed via; the first ultra-wideband grounding via hole is used as a part, corresponding to the second module to be pressed, of the subsequently formed ultra-wideband grounding via hole in the structure shown in the figure 1; the first ultra-wideband feed through hole is used as a part corresponding to the second module to be laminated in the subsequently formed ultra-wideband feed through hole in the structure shown in the figure 1;
step S505, pressing the first module to be pressed, the second module to be pressed, and the third module to be pressed;
specifically, the first module to be bonded, the second module to be bonded, and the third module to be bonded are bonded according to the structure shown in fig. 1, that is, after bonding, the second module to be bonded is between the first module to be bonded and the third module to be bonded, and the first surface of the first substrate is a surface far away from the second substrate, the first surface of the second substrate is a surface close to the first substrate, the second surface of the second substrate is a surface close to the third substrate, and the first surface of the third substrate is a surface far away from the second substrate.
Step S506, forming a second ultra-wideband grounding via hole, a second ultra-wideband feeding via hole and a millimeter wave feeding via hole on the first module to be pressed; forming a third ultra-wideband grounding through hole and a third ultra-wideband feeding through hole on the third module to be pressed; the second ultra-wideband grounding via hole, the first ultra-wideband grounding via hole and the third ultra-wideband grounding via hole are electrically connected in sequence so as to connect the corresponding first ultra-wideband radiating part, the second ultra-wideband radiating part and the grounding metal layer in series; the second ultra-wideband feed through hole, the first ultra-wideband feed through hole and the third ultra-wideband feed through hole are electrically connected in sequence to connect the second ultra-wideband radiation part and the corresponding first signal pin in series; the millimeter wave feed through hole is connected with the corresponding first millimeter wave radiation part and the second signal pin in series.
Specifically, holes can be drilled on the first module to be pressed and the third module to be pressed by a mechanical drilling or laser method, and then metallization is carried out to form a second ultra-wideband grounding via hole, a second ultra-wideband feeding via hole, a millimeter wave feeding via hole, a third ultra-wideband grounding via hole and a third ultra-wideband feeding via hole; the ultra-wideband grounding via hole B is used as a part, corresponding to the first module to be laminated, of the ultra-wideband grounding via hole in the structure shown in the subsequently formed figure 1, and the ultra-wideband grounding via hole C is used as a part, corresponding to the third module to be laminated, of the ultra-wideband grounding via hole in the structure shown in the subsequently formed figure 1; the second ultra-wideband feed through hole is used as a part, corresponding to the first module to be laminated, of the subsequently formed ultra-wideband feed through hole in the structure shown in the figure 1, and the third ultra-wideband feed through hole is used as a part, corresponding to the third module to be laminated, of the subsequently formed ultra-wideband feed through hole in the structure shown in the figure 1.
According to the method, the antenna module is divided into the first module to be pressed, the second module to be pressed and the third module to be pressed, and the three modules to be pressed are pressed to form the antenna module, so that two independent and non-interfering antennas are integrated and manufactured, the production process is simple, the production cost is greatly reduced, and the purposes of minimizing the size of the antenna module occupying the space of the whole machine and minimizing the cost are achieved.
Fig. 13 is a flowchart of a method for manufacturing an antenna module according to another embodiment of the present invention, where the method for manufacturing an antenna module according to the present embodiment can be used to manufacture the antenna module shown in fig. 5, and referring to fig. 13, the method includes:
step S601, providing a first module to be pressed, wherein the first module to be pressed comprises a first substrate, and a ground metal layer, a first signal pin and a second signal pin which are formed on a first surface of the first substrate and are insulated from each other; the first module to be pressed is also provided with an A ultra-wideband grounding through hole, an A ultra-wideband feed through hole and an A millimeter wave feed through hole;
specifically, as shown in fig. 5, the first module to be bonded may include a first substrate 11, a ground metal layer 111, a first signal pin 112, and a second signal pin 113; the first ultra-wideband grounding via hole is a part of the ultra-wideband grounding via hole 21 in the first module to be pressed, the first ultra-wideband feeding via hole is a part of the ultra-wideband feeding via hole in the first module to be pressed, and the first millimeter wave feeding via hole is a part of the millimeter wave feeding via hole in the first module to be pressed; the first module to be pressed is formed by, for example, pressing an ultra-thin metal layer on one surface of a first substrate, etching the ultra-thin metal layer to form patterns of a ground metal layer, a first signal pin and a second signal pin, plating copper on the formed patterns to thicken the patterns to a corresponding thickness, mechanically drilling or laser-radiating the first module to be pressed to form a plurality of holes, and metallizing the formed holes to form an ultra-wideband first ground via, an ultra-wideband first feed via and an ultra-wideband first feed via.
Step S602, providing a fourth module to be bonded, where the fourth module to be bonded includes a fourth substrate, and a first transmission line and a second transmission line formed on a first surface of the fourth substrate; the fourth module to be pressed also comprises a second ultra-wideband grounding through hole, a second ultra-wideband feeding through hole and a second millimeter wave feeding through hole; the fourth module to be pressed also comprises a first sub radio frequency shielding part formed around the first transmission line and the second transmission line;
specifically, the forming method of the fourth module to be laminated is similar to that of the first module to be laminated, namely, an ultrathin metal layer is laminated on the first surface of the fourth substrate, then the ultrathin metal layer is etched to form the patterns of the first transmission line and the second transmission line, then copper plating is carried out on the formed patterns to be thickened to the corresponding thickness, then mechanical drilling or laser is carried out on the fourth module to be laminated to form a plurality of holes, and then the formed holes are metalized to form a second ultra-wideband grounding through hole, a second ultra-wideband feeding through hole and a second millimeter wave feeding through hole. The second ultra-wideband feed via hole is a part of the ultra-wideband feed via hole in the fourth module to be laminated, the second ultra-wideband ground via hole is a part of the ultra-wideband ground via hole in the fourth module to be laminated, and the second millimeter wave feed via hole is a part of the millimeter wave feed via hole in the fourth module to be laminated. The first sub-rf shield is used to form the rf shield 80 together with the second sub-rf shield.
Step S603, providing a fifth module to be bonded, where the fifth module to be bonded includes a fifth substrate, at least one first ultra-wideband radiating part and at least one first millimeter-wave radiating part formed on a first surface of the fifth substrate; a third ultra-wideband grounding through hole, a third ultra-wideband feeding through hole and a third millimeter wave feeding through hole are formed in the fifth substrate to be laminated;
specifically, the forming method of the fifth module to be pressed is similar to that of the first module to be pressed, namely, an ultrathin metal layer is pressed on the first surface of the fifth substrate, then the ultrathin metal layer is etched to form a pattern of a first ultra-wideband radiation part and a first millimeter wave radiation part, then copper plating is carried out on the formed pattern to be thickened to the corresponding thickness, then mechanical drilling or laser is carried out on the fifth module to be pressed to form a plurality of holes, and then the formed holes are metalized to form a third ultra-wideband grounding via hole, a third ultra-wideband feeding via hole and a third millimeter wave feeding via hole. The third ultra-wideband feed via hole is a part of the ultra-wideband feed via hole in the fifth module to be pressed, the third ultra-wideband ground via hole is a part of the ultra-wideband ground via hole in the fifth module to be pressed, and the third millimeter wave feed via hole is a part of the millimeter wave feed via hole in the fifth module to be pressed.
Step S604, providing a second module to be laminated, wherein the second module to be laminated comprises a second substrate and at least one millimeter wave decoupling part formed on the first surface of the second substrate; the second module to be pressed also comprises a T ultra-wideband grounding through hole and a T ultra-wideband feeding through hole; the second module to be laminated also comprises a second sub radio frequency shielding part which is formed around the first ultra-wideband radiation part, around the area corresponding to the second ultra-wideband radiation part and around the millimeter wave decoupling part;
specifically, the forming method of the second module to be laminated is similar to that of the first module to be laminated, namely, an ultrathin metal layer is laminated on the first surface of the second substrate, then the ultrathin metal layer is etched to form a millimeter wave decoupling portion, then copper plating is performed on a formed pattern to thicken the formed pattern to a corresponding thickness, then mechanical drilling or laser is performed on the second module to be laminated to form a plurality of holes, and then the formed holes are metalized to form a butyl ultra wideband grounding via hole and a butyl ultra wideband feeding via hole. The third ultra-wideband feed through hole is a part of the ultra-wideband feed through hole in the second module to be pressed, and the third ultra-wideband ground through hole is a part of the ultra-wideband ground through hole in the second module to be pressed. The size and the position of the second sub radio frequency shielding part correspond to those of the first sub radio frequency shielding part, namely, the orthographic projection of the first sub radio frequency shielding part is superposed with that of the second sub radio frequency shielding part along the thickness direction of the antenna module after lamination.
Step S605, providing a third module to be laminated, wherein the third module to be laminated comprises a third substrate, at least one second ultra-wideband radiation part and at least one second millimeter wave radiation part, and the at least one second ultra-wideband radiation part is formed on the first surface of the third substrate; the third module to be pressed also comprises a penta ultra-wideband grounding via hole and a penta ultra-wideband feeding via hole;
specifically, the forming method of the third module to be pressed is similar to that of the first module to be pressed, namely, an ultrathin metal layer is pressed on the first surface of the third substrate, then the ultrathin metal layer is etched to form patterns of the second ultra-wideband radiation part and the second millimeter wave radiation part, then copper plating is carried out on the formed patterns to be thickened to the corresponding thickness, then mechanical drilling or laser is carried out on the third module to be pressed to form a plurality of holes, and then the formed holes are metalized to form a penta-ultra-wideband grounding via hole and a penta-ultra-wideband feeding via hole. And the E-UWB grounding via hole is a part of the UWB grounding via hole positioned in the third module to be pressed.
The specific sequence of step S601, step S602, step S603, step S604, and step S605 is not limited.
Step S606, pressing the first module to be pressed, the second module to be pressed, the third module to be pressed, the fourth module to be pressed and the fifth module to be pressed; the first ultra-wideband grounding via hole, the corresponding second ultra-wideband grounding via hole, the corresponding third ultra-wideband grounding via hole, the corresponding fourth ultra-wideband grounding via hole and the corresponding fifth ultra-wideband grounding via hole are electrically connected in sequence to connect the corresponding first ultra-wideband radiation part, the corresponding second ultra-wideband radiation part and the grounding metal layer in series; the first ultra-wideband feed through hole and the second ultra-wideband feed through hole are electrically connected to connect the corresponding first signal pin and the first transmission line in series; the third ultra-wideband feed through hole, the corresponding third ultra-wideband feed through hole and the corresponding fifth ultra-wideband feed through hole are electrically connected in sequence so as to connect the corresponding first transmission line with the corresponding second ultra-wideband radiation part in series; the first millimeter wave feed through hole is electrically connected with the second millimeter wave feed through hole so as to electrically connect the second signal pin with the corresponding second transmission line; the third millimeter wave feed through hole connects the corresponding first millimeter wave radiating part in series with the corresponding second transmission line.
According to the technical scheme, the antenna module is divided into the first module to be pressed, the second module to be pressed, the third module to be pressed, the fourth module to be pressed and the fifth module to be pressed, the modules to be pressed are manufactured respectively, and then the modules to be pressed are pressed, so that two independent and non-interfering antennas are integrated and manufactured, the production process is simple, the production cost is greatly reduced, the purpose of minimizing the size of the antenna module occupying the space of the whole machine and minimizing the cost is achieved.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. The utility model provides an antenna module, its characterized in that, antenna module is integrated with ultra wide band antenna and millimeter wave antenna, antenna module includes:
the circuit comprises a first substrate, a second substrate and a third substrate, wherein one side of the first substrate is provided with a ground metal layer, a first signal pin and a second signal pin which are mutually insulated;
the second substrate is arranged on one side, away from the grounding metal layer, of the first substrate; the surface of the second substrate, which is close to the first substrate, is provided with at least one first ultra-wideband radiating part and at least one first millimeter wave radiating part; one side of the second substrate, which is far away from the first substrate, is provided with at least one millimeter wave decoupling part corresponding to the first millimeter wave radiation part;
the third substrate is arranged on one side, far away from the first substrate, of the second substrate, and at least one second ultra-wideband radiation part in one-to-one correspondence with the first ultra-wideband radiation part and at least one second millimeter wave radiation part in correspondence with the first millimeter wave radiation part are arranged on one side, far away from the second substrate, of the third substrate;
the ultra-wideband grounding via hole is electrically connected with the corresponding first ultra-wideband radiating part, the corresponding second ultra-wideband radiating part and the corresponding grounding metal layer;
the ultra-wideband feed through hole is connected with the corresponding second ultra-wideband radiation part and the corresponding first signal pin;
the millimeter wave feed through hole is connected with the corresponding first millimeter wave radiation part and the corresponding second signal pin;
and the radio frequency shielding part is arranged around the millimeter wave antenna and around the ultra-wideband antenna.
2. The antenna module of claim 1, wherein an orthographic projection of the second ultra-wideband radiating portion on the first substrate covers an orthographic projection of the corresponding ultra-wideband ground via on the first substrate and an orthographic projection of the corresponding ultra-wideband feed via on the first substrate.
3. The antenna module of claim 2, wherein the first ultra-wideband radiating portion has an opening therein, and the ultra-wideband feed via extends through the opening and is insulated from the first ultra-wideband radiating portion.
4. The antenna module of claim 2, wherein each of the first ultra-wideband radiating portions corresponds to a plurality of ultra-wideband ground vias, a metal sheet is disposed on a surface of the second substrate away from the first substrate, and the plurality of ultra-wideband ground vias corresponding to the first ultra-wideband radiating portions all penetrate through the metal sheet and are electrically connected with the metal sheet.
5. The antenna module according to claim 1, wherein a slot is provided at the center of the first millimeter wave radiation part;
each millimeter wave decoupling portion comprises four millimeter wave sub-decoupling portions, and orthographic projections of the four millimeter wave sub-decoupling portions on the first substrate surround orthographic projections of the corresponding first millimeter wave radiation portions on the first substrate.
6. The antenna module of claim 1, further comprising:
the first transmission line and the second transmission line are arranged between the fourth substrate and the fifth substrate; the fourth substrate is arranged in contact with the first substrate, and the fifth substrate is in contact with the first ultra-wideband radiating part and the first millimeter wave radiating part;
the ultra-wideband feed through hole comprises a first ultra-wideband feed through hole and a second ultra-wideband feed through hole, the first end of the first ultra-wideband feed through hole is electrically connected with the corresponding second ultra-wideband radiating part, the second end of the first ultra-wideband feed through hole is electrically connected with one end of the corresponding first transmission line, the other end of the first transmission line is electrically connected with the first end of the second ultra-wideband feed through hole, and the second end of the second ultra-wideband feed through hole is electrically connected with the corresponding first signal pin;
the millimeter wave feed via hole comprises a first millimeter wave feed via hole and a second millimeter wave feed via hole, the first end of the first millimeter wave feed via hole is electrically connected with the corresponding first millimeter wave radiation part, the second end of the first millimeter wave feed via hole is electrically connected with one end of the corresponding second transmission line, the other end of the second transmission line is electrically connected with the first end of the second millimeter wave feed via hole, and the second end of the second millimeter wave feed via hole is electrically connected with the corresponding second signal pin.
7. The antenna module of claim 1, wherein the radio frequency shield includes a plurality of first shield holes and a plurality of second shield holes;
the plurality of first shielding holes surround the corresponding first ultra-wideband radiation part and the corresponding second ultra-wideband radiation part;
the plurality of second shielding holes surround the corresponding first millimeter wave radiation part, millimeter wave decoupling part and second millimeter wave radiation part.
8. A terminal, characterized in that the terminal comprises an antenna module according to any of claims 1-7.
9. A method for manufacturing an antenna module is characterized by comprising the following steps:
providing a first module to be pressed, wherein the first module to be pressed comprises a first substrate, and a ground metal layer, a first signal pin and a second signal pin which are formed on a first surface of the first substrate and are insulated from each other;
providing a second module to be laminated, wherein the second module to be laminated comprises a second substrate, at least one first ultra-wideband radiating part and at least one first millimeter wave radiating part which are formed on the first surface of the second substrate, and at least one millimeter wave decoupling part which is formed on the second surface of the second substrate, and the second module to be laminated further comprises a radio frequency shielding part which is formed around the first ultra-wideband radiating part, around an area corresponding to the second ultra-wideband radiating part, and around the millimeter wave decoupling part;
providing a third module to be laminated, wherein the third module to be laminated comprises a third substrate, at least one second ultra-wideband radiation part and at least one second millimeter wave radiation part, and the at least one second ultra-wideband radiation part is formed on the first surface of the third substrate;
forming an A ultra-wideband grounding via hole and an A ultra-wideband feeding via hole on the second module to be pressed, wherein the A ultra-wideband grounding via hole is electrically connected with the corresponding first millimeter wave radiation part, and the A ultra-wideband feeding via hole is insulated from the corresponding first millimeter wave radiation part;
pressing the first module to be pressed, the second module to be pressed and the third module to be pressed;
forming a second ultra-wideband grounding via hole, a second ultra-wideband feeding via hole and a millimeter wave feeding via hole on the first module to be pressed; forming a third ultra-wideband grounding through hole and a third ultra-wideband feeding through hole on the third module to be pressed; the second ultra-wideband grounding via hole, the first ultra-wideband grounding via hole and the third ultra-wideband grounding via hole are electrically connected in sequence so as to connect the corresponding first ultra-wideband radiating part, the second ultra-wideband radiating part and the grounding metal layer in series; the second ultra-wideband feed through hole, the first ultra-wideband feed through hole and the third ultra-wideband feed through hole are electrically connected in sequence to connect the second ultra-wideband radiation part and the corresponding first signal pin in series; the millimeter wave feed through hole is connected with the corresponding first millimeter wave radiation part and the second signal pin in series.
10. A method for manufacturing an antenna module is characterized by comprising the following steps:
providing a first module to be pressed, wherein the first module to be pressed comprises a first substrate, and a ground metal layer, a first signal pin and a second signal pin which are formed on a first surface of the first substrate and are insulated from each other; the first module to be pressed is also provided with an A ultra-wideband grounding through hole, an A ultra-wideband feed through hole and an A millimeter wave feed through hole;
providing a fourth module to be laminated, wherein the fourth module to be laminated comprises a fourth substrate, and a first transmission line and a second transmission line which are formed on the first surface of the fourth substrate; the fourth module to be pressed also comprises a second ultra-wideband grounding through hole, a second ultra-wideband feeding through hole and a second millimeter wave feeding through hole; the fourth module to be laminated further comprises a first sub radio frequency shielding part formed around the first transmission line and around the second transmission line;
providing a fifth module to be laminated, wherein the fifth module to be laminated comprises a fifth substrate, at least one first ultra-wideband radiation part and at least one first millimeter wave radiation part which are formed on the first surface of the fifth substrate; a third ultra-wideband grounding through hole, a third ultra-wideband feeding through hole and a third millimeter wave feeding through hole are also formed on the fifth substrate to be laminated;
providing a second module to be laminated, wherein the second module to be laminated comprises a second substrate and at least one millimeter wave decoupling part formed on the first surface of the second substrate; the second module to be pressed also comprises a T ultra-wideband grounding through hole and a T ultra-wideband feeding through hole; the second module to be laminated further comprises a second sub radio frequency shielding part formed around the first ultra wide band radiation part, around an area corresponding to the second ultra wide band radiation part and around the millimeter wave decoupling part;
providing a third module to be laminated, wherein the third module to be laminated comprises a third substrate, at least one second ultra-wideband radiation part and at least one second millimeter wave radiation part, and the at least one second ultra-wideband radiation part is formed on the first surface of the third substrate; the third module to be pressed also comprises a penta ultra-wideband grounding via hole and a penta ultra-wideband feeding via hole;
pressing the first module to be pressed, the second module to be pressed, the third module to be pressed, the fourth module to be pressed and the fifth module to be pressed; the first ultra-wideband grounding via hole, the corresponding second ultra-wideband grounding via hole, the corresponding third ultra-wideband grounding via hole, the corresponding fourth ultra-wideband grounding via hole and the corresponding fifth ultra-wideband grounding via hole are electrically connected in sequence so as to connect the corresponding first ultra-wideband radiation part, the corresponding second ultra-wideband radiation part and the grounding metal layer in series; the first ultra-wideband feed through hole and the second ultra-wideband feed through hole are electrically connected to connect a corresponding first signal pin and a first transmission line in series; the third ultra-wideband feed through hole, the corresponding third ultra-wideband feed through hole and the corresponding fifth ultra-wideband feed through hole are electrically connected in sequence so as to connect the corresponding first transmission line and the corresponding second ultra-wideband radiation part in series; the first millimeter wave feed through hole is electrically connected with the second millimeter wave feed through hole so as to electrically connect the second signal pin with the corresponding second transmission line; the third millimeter wave feed through hole connects the corresponding first millimeter wave radiating part in series with the corresponding second transmission line.
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| CN202110931322.8A CN113675602B (en) | 2021-08-13 | 2021-08-13 | Antenna module, preparation method thereof and terminal |
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| CN114597633A (en) * | 2022-04-18 | 2022-06-07 | 高创(苏州)电子有限公司 | Equipment mainboard and electronic equipment |
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| CN113675602B (en) | 2024-03-26 |
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