CN112542703A - 5G millimeter wave resonator antenna module - Google Patents
5G millimeter wave resonator antenna module Download PDFInfo
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- CN112542703A CN112542703A CN202011327571.8A CN202011327571A CN112542703A CN 112542703 A CN112542703 A CN 112542703A CN 202011327571 A CN202011327571 A CN 202011327571A CN 112542703 A CN112542703 A CN 112542703A
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- antenna module
- wave resonator
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- 239000000758 substrate Substances 0.000 claims abstract description 38
- 239000011247 coating layer Substances 0.000 claims description 24
- 239000000919 ceramic Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 abstract description 7
- 238000004891 communication Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003031 feeding effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0075—Stripline fed arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
- H01Q5/28—Arrangements for establishing polarisation or beam width over two or more different wavebands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/50—Feeding or matching arrangements for broad-band or multi-band operation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Waveguide Aerials (AREA)
Abstract
The invention discloses a 5G millimeter wave resonator antenna module, which comprises a substrate, a feed unit and an antenna unit, wherein the feed unit is arranged on the substrate; the antenna unit is hourglass-shaped in a overlooking angle; the antenna unit is integrated on the substrate and electrically connected with the substrate through the feed unit. The invention can enlarge the bandwidth of the antenna module, enables the antenna module to cover the frequency bands of n257 and n260, and meets the requirements of the 5G module on small volume and high-speed transmission.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a 5G millimeter wave resonator antenna module.
Background
5G is the focus of research and development in the world, and 5G standard has become common in the industry by developing 5G technology. The international telecommunications union ITU identified three major application scenarios for 5G at ITU-RWP5D meeting No. 22 held 6 months 2015: enhanced mobile broadband, large-scale machine communication, and high-reliability low-latency communication. The 3 application scenes correspond to different key indexes respectively, wherein the peak speed of a user in the enhanced mobile bandwidth scene is 20Gbps, and the lowest user experience rate is 100 Mbps. The unique high carrier frequency and large bandwidth characteristics of millimeter waves are the main means for realizing 5G ultrahigh data transmission rate. In addition, the space reserved for the 5G antenna in future mobile phones is small, and the number of selectable positions is small, so that a miniaturized antenna module needs to be designed.
According to the technical specification of 3GPP TS 38.101-25G terminal radio frequency and the report of TR38.817 terminal radio frequency, the 5 GmWave antenna needs to cover N257(26.5-29.5GHz) N258(24.25-27.25GHz) N260(37-40GHz) N261(27.5-28.35GHz), so that the ultra-wideband antenna is required to be designed into a 5G millimeter wave module.
No matter the antenna form is PATCH, dipole, slot and the like, the thickness of the PCB can be increased because the bandwidth requirement covers N257N 258N 260, the number of layers is increased at the moment, the occupied space is increased, and the machining difficulty is high because the precision requirements of the multilayer PCB on hole, line width and line distance are high in the millimeter frequency band.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the utility model provides a 5G millimeter wave resonator antenna module, reduces the processing degree of difficulty of ultra wide band antenna.
In order to solve the technical problems, the invention adopts the technical scheme that:
A5G millimeter wave resonator antenna module comprises a substrate, a feed unit and an antenna unit;
the antenna unit is hourglass-shaped in a overlooking angle;
the antenna unit is integrated on the substrate and electrically connected with the substrate through the feed unit.
Further, the feed unit comprises a coating layer and a microstrip assembly;
the coating layer covers any side of the antenna unit;
the microstrip assembly is integrated on the substrate and electrically connected with the coating layer.
The invention has the beneficial effects that: arranging an hourglass-shaped antenna unit in a overlooking angle, exciting a TE111 mode, an HEM11 mode or other modes with higher orders, connecting various excited modes on working frequency to form ultra-wideband parameters, enabling the antenna module to cover n257 and n260 frequency bands, and finally forming an ultra-wideband antenna; and the feed component is used for coupling and feeding the antenna component. Compared with the prior art, the ultra-wideband antenna is formed by changing the structure of the antenna unit, and the requirement of high-speed transmission of 5G millimeter waves is met.
Drawings
FIG. 1 is a schematic structural diagram of a 5G millimeter wave resonator antenna module according to the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a perspective view of a 5G millimeter wave resonator antenna module according to the present invention;
FIG. 4 shows the impedance bandwidth of a 5G millimeter wave resonator antenna module according to the present invention;
FIG. 5 is a 28GHz beam pattern of a 5G millimeter wave resonator antenna module according to the invention;
fig. 6 is a beam pattern of a 5G millimeter wave resonator antenna module at 38.5GHz in accordance with the present invention.
Description of reference numerals:
1. a substrate; 11. a via hole; 2. a power feeding unit; 21. a coating layer; 22. a microstrip assembly; 3. an antenna unit; 31. a groove; 4. a chip assembly; 5. a strip line.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 6, a 5G millimeter wave resonator antenna module includes a substrate, a feeding unit, and an antenna unit;
the antenna unit is hourglass-shaped in a overlooking angle;
the antenna unit is integrated on the substrate and electrically connected with the substrate through the feed unit.
The working principle of the invention is as follows: the antenna unit which is hourglass-shaped in the overlooking angle is adopted to excite more modes, so that an ultra-wideband antenna is formed, and high-speed transmission of 5G millimeter waves is realized.
From the above description, the beneficial effects of the present invention are: arranging an hourglass-shaped antenna unit in a overlooking angle, exciting a TE111 mode, an HEM11 mode or other modes with higher orders, connecting various excited modes on working frequency to form ultra-wideband parameters, enabling the antenna module to cover n257 and n260 frequency bands, and finally forming an ultra-wideband antenna; and the feed component is used for coupling and feeding the antenna component. Compared with the prior art, the ultra-wideband antenna is formed by changing the structure of the antenna unit, and the requirement of high-speed transmission of 5G millimeter waves is met.
Further, the feed unit comprises a coating layer and a microstrip assembly;
the coating layer covers any side of the antenna unit, which is perpendicular to the substrate;
the microstrip assembly is integrated on the substrate and electrically connected with the coating layer.
As can be seen from the above description, the coating layer and the microstrip assembly are used for coupling and feeding the antenna unit, so as to facilitate chip integration on the substrate.
Further, the coating layer is made of gold, silver or copper.
From the above description, the material of the coating layer is gold, silver or copper, so that the feeding effect is optimal.
Further, the coating layer is welded with the microstrip assembly.
According to the above description, the coating layer is welded to the microstrip assembly, so that the connection stability between the coating layer and the microstrip assembly can be improved.
Furthermore, two sides of the antenna unit in the X-axis direction are provided with grooves which are isosceles trapezoid in a top view angle.
As can be seen from the above description, the grooves in the shape of an isosceles trapezoid can form a plane at multiple angles on the surface of the antenna unit, so as to excite more modes for increasing the bandwidth.
Further, the antenna units are provided in plurality;
the antenna units are uniformly distributed on the substrate along the Y-axis direction.
As can be seen from the above description, the antenna units are provided in plurality, so as to further improve the gain of the antenna.
Further, the dielectric constant of the substrate is 14.
From the above description, the dielectric constant of the substrate is 14, which can be adjusted to just meet the bandwidth of 26-40GHZ, and meet the requirement of high-speed data transmission.
Further, the antenna unit is a ceramic body.
As can be seen from the above description, the ceramic body is adopted as the antenna unit, so that the size is small, the number of layers of the PCB board can be reduced, and the overall size of the antenna module is reduced.
Further, the chip component is also included;
the chip component is integrated on one side of the substrate, which is far away from the antenna unit, and is electrically connected with the antenna unit through the feed unit.
As can be seen from the above description, various functions can be integrated in the chip assembly to improve the performance of the antenna unit.
The invention is suitable for handheld communication equipment, such as a mobile phone.
Example one
Referring to fig. 1-2, a 5G millimeter wave resonator antenna module includes a substrate 1, a feed unit 2, and an antenna unit 3; the antenna unit 3 has an hourglass shape in a top view; the antenna element 3 is integrated on the substrate 1 and electrically connected to the substrate 1 through the feeding element 2. Preferably, the antenna element 3 is a ceramic body. Preferably, the substrate 1 is a PCB board.
Example two
The present embodiment differs from the first embodiment in that the specific structures of the feed unit 2 and the antenna unit 3 are defined.
Referring to fig. 1, the feeding unit 2 includes a coating layer 21 and a microstrip assembly 22; the coating layer 21 covers any side of the antenna unit 3, which is perpendicular to the substrate 1; the microstrip assembly 22 is integrated on the substrate 1 and electrically connected to the coating layer 21. Specifically, the coating layer 21 covers the surface of the antenna unit 3 by adopting a metal spraying or sputtering process, and the coating layer 21 is used for feeding; the substrate 1 is also provided with a through hole 11, and the through hole 11 is used for shielding during signal transmission; referring to fig. 3, a strip line 5 for impedance matching and signal transmission is further disposed in the substrate 1, and the strip line 5 is used to electrically connect two adjacent antenna elements 3.
Referring to fig. 1, the coating layer 21 is made of gold, silver, or copper. Preferably, silver is used as a material of the coating layer 21.
Preferably, the coating layer 21 is welded to the microstrip assembly 22.
Referring to fig. 2, the antenna unit 3 has grooves 31 having an isosceles trapezoid shape in a plan view on both sides in the X-axis direction.
Referring to fig. 1, the antenna unit 3 is provided in plurality; the plurality of antenna elements 3 are disposed on the substrate 1 so as to be evenly distributed in the Y-axis direction. Preferably, four antenna elements 3 are provided.
Preferably, the substrate 1 has a dielectric constant of 14.
Referring to fig. 1, a chip assembly 4 is further included; the chip component 4 is integrated on the side of the substrate 1 facing away from the antenna element 3 and is electrically connected to the antenna element 3 via the feed element 2. Specifically, the chip assembly 4 comprises a radio frequency chip, a digital integrated circuit chip and a power supply chip, wherein the digital integrated circuit chip is electrically connected with the radio frequency chip, the digital integrated circuit chip controls the output power and the output phase of the radio frequency chip, the power supply chip is electrically connected with the digital integrated circuit chip and the radio frequency chip respectively, and the radio frequency chip, the digital integrated circuit chip and the power supply chip are integrated on the PCB; the power chip is used for providing power for the radio frequency chip, and the radio frequency chip is used for providing signals for the microstrip; the radio frequency chip comprises a phase shifter and an amplifier, wherein the phase shifter provides phase difference among units to realize beam scanning capability, and the amplifier is used for compensating loss of the phase shifter.
In summary, according to the 5G millimeter wave resonator antenna module provided by the invention, the ceramic antenna unit which is hourglass-shaped in the overlooking angle is arranged, so that the number of layers of the PCB is reduced, the occupied space is reduced, the production cost is lower, the antenna unit is integrated on the PCB, a chip is conveniently integrated on the PCB in the follow-up process, the bandwidth is simultaneously expanded, the antenna module integrally covers the frequency bands of n257 and n260, and the high-speed transmission requirement of 5G millimeter waves is met.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (9)
1. A5G millimeter wave resonator antenna module is characterized by comprising a substrate, a feed unit and an antenna unit;
the antenna unit is hourglass-shaped in a overlooking angle;
the antenna unit is integrated on the substrate and electrically connected with the substrate through the feed unit.
2. The antenna module of the 5G millimeter wave resonator of claim 1, wherein the feed unit comprises a coating layer and a microstrip assembly;
the coating layer covers any side of the antenna unit, which is perpendicular to the substrate;
the microstrip assembly is integrated on the substrate and electrically connected with the coating layer.
3. The antenna module of claim 2, wherein the coating is made of gold, silver or copper.
4. The antenna module of claim 2, wherein the coating is welded to the microstrip assembly.
5. The antenna module of claim 1, wherein the antenna unit has grooves in the shape of an isosceles trapezoid in a top view on two sides in the X-axis direction.
6. The antenna module of the 5G millimeter-wave resonator according to claim 1, characterized in that a plurality of antenna units are provided;
the antenna units are uniformly distributed on the substrate along the Y-axis direction.
7. The antenna module of claim 1, wherein the substrate has a dielectric constant of 14.
8. The antenna module of claim 1, wherein the antenna element is a ceramic body.
9. The antenna module of the 5G millimeter wave resonator of claim 1, characterized by further comprising a chip assembly;
the chip component is integrated on one side of the substrate, which is far away from the antenna unit, and is electrically connected with the antenna unit through the feed unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011327571.8A CN112542703A (en) | 2020-11-24 | 2020-11-24 | 5G millimeter wave resonator antenna module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011327571.8A CN112542703A (en) | 2020-11-24 | 2020-11-24 | 5G millimeter wave resonator antenna module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112542703A true CN112542703A (en) | 2021-03-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011327571.8A Pending CN112542703A (en) | 2020-11-24 | 2020-11-24 | 5G millimeter wave resonator antenna module |
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| Country | Link |
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| CN (1) | CN112542703A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113437489A (en) * | 2021-06-07 | 2021-09-24 | 深圳市信维通信股份有限公司 | Ultra-wideband dielectric resonator antenna module and electronic equipment |
| CN113640894A (en) * | 2021-06-29 | 2021-11-12 | 博微太赫兹信息科技有限公司 | Double-view-angle millimeter wave transceiving array |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113437489A (en) * | 2021-06-07 | 2021-09-24 | 深圳市信维通信股份有限公司 | Ultra-wideband dielectric resonator antenna module and electronic equipment |
| CN113640894A (en) * | 2021-06-29 | 2021-11-12 | 博微太赫兹信息科技有限公司 | Double-view-angle millimeter wave transceiving array |
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