CN111162362B - Double-ridge substrate integrated waveguide broadband magic T - Google Patents
Double-ridge substrate integrated waveguide broadband magic T Download PDFInfo
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- CN111162362B CN111162362B CN201911372362.2A CN201911372362A CN111162362B CN 111162362 B CN111162362 B CN 111162362B CN 201911372362 A CN201911372362 A CN 201911372362A CN 111162362 B CN111162362 B CN 111162362B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/19—Conjugate devices, i.e. devices having at least one port decoupled from one other port of the junction type
- H01P5/20—Magic-T junctions
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Abstract
The invention discloses a multilayer circuit of a double-ridge waveguide broadband magic T, wherein five layers are interconnected through metallized holes to form a substrate integrated waveguide, a first layer and a second layer and a fourth layer and a fifth layer are interconnected through metallized holes to form a double ridge of the substrate integrated waveguide, the second layer comprises an input and output microstrip port in gradual change line transition, the fourth layer comprises another input port, and the third layer realizes the output of a strip line through step change or gradual change line transition. Compared with the waveguide magic T, the waveguide magic T has small size and light weight, is beneficial to integration, has wider bandwidth compared with micro-strips and strip line magic T, further improves the integration level of the comprehensive network of the array surface, widens the working frequency band, and realizes the miniaturization and the light weight of the array surface.
Description
Technical Field
The invention belongs to the technical field of microwave antennas, and particularly relates to a design of an integrated broadband magic T.
Background
With the continuous improvement of the radar working bandwidth, the bandwidths of various devices of a radar feeder system also need to be widened, and the working frequency band also needs to be widened as an important component and a difference network for beam forming. The magic T is a core device of a sum-difference network, the design of the broadband magic T is mainly realized in a ridge waveguide mode, the size is large, the weight is heavy, and the working bandwidth of the magic T designed by microstrip lines and strip lines is narrow.
By utilizing the integrated design of the multilayer board technology, the bandwidth of the integrated hybrid multi-beam hybrid network can be widened, the size is reduced, the weight is reduced, the working bandwidth of the hybrid multi-beam hybrid network is widened, the integrated design of the hybrid multi-beam hybrid network is realized, and the design requirements of wide bandwidth, light weight and miniaturization of the array surface comprehensive network are met.
Disclosure of Invention
The invention provides a double-ridge substrate integrated waveguide broadband magic T for solving the problems in the prior art, and adopts the following technical scheme for achieving the purpose.
The broadband magic T comprises: copper cortex, microwave dielectric slab, metallization hole, the copper cortex is the rectangle, has the gradual change line, and copper cortex and microwave dielectric slab form through integrated design manufacturing, and the metallization hole is arranged into certain interval and shape according to certain diameter, and the copper cortex is connected to the metallization hole.
The copper sheet and the microwave dielectric plate include: the microwave dielectric plate comprises a first copper sheet layer, a second copper sheet layer, a third copper sheet layer, a fourth copper sheet layer, a fifth copper sheet layer, a first microwave dielectric plate, a second microwave dielectric plate, a third microwave dielectric plate and a fourth microwave dielectric plate, wherein the first microwave dielectric plate is arranged between the first copper sheet layer and the second copper sheet layer, the second microwave dielectric plate is arranged between the second copper sheet layer and the third copper sheet layer, the third microwave dielectric plate is arranged between the third copper sheet layer and the fourth copper sheet layer, and the fourth microwave dielectric plate is arranged between the fourth copper sheet layer and the fifth copper sheet layer.
The metallized hole includes: the first metallization hole is connected with the first copper layer and the second copper layer, the second metallization hole is connected with the first copper layer and the third copper layer, the third metallization hole is connected with the fourth copper layer and the fifth copper layer, and the fourth metallization hole is connected with the first copper layer, the second copper layer, the fourth copper layer and the fifth copper layer.
Copper is spread to first copper skin layer large tracts of land, adopt coaxial interconnect as external interface, the impedance matching of second copper skin layer adoption gradual change line as input-output, the limit that adopts the rectangle is as the limit of a spine, the impedance matching of third copper skin layer adoption gradual change line or multistage ladder transform as the beam transmission, the stripline is connected to perpendicular transition hole and is realized signal surface output, fourth copper skin layer adopts the gradual change line as the impedance matching of input, the limit that adopts the rectangle is as the limit of another spine, contain another input port, the fifth copper skin layer, adopt the large tracts of land to spread the copper as shielding ground connection.
The first metalized holes and the third metalized holes are arranged in two rows and used as the edges of the ridges to form double ridges of the substrate integrated waveguide, and the fourth metalized holes are arranged in two rows and a circle.
The invention realizes the functions of broadband and difference, adopts multilayer microwave plates to integrate design by hot pressing or co-firing, widens the working frequency band, ensures the broadband of sum-beam signals by multistage impedance conversion, widens the working frequency bands of all channels, realizes high reliability, has the same thermal expansion coefficient of all materials, does not generate layering, is an integral product, improves the reliability of the product, realizes easy integration, belongs to a planar circuit, is easy to integrate and manufacture with other planar circuits, realizes light weight, adopts multilayer printed board integration lamination, avoids various interconnection structure accessories adopted in conventional integration, and reduces the integral weight.
Drawings
Fig. 1 is a perspective view of the present invention, fig. 2 is a side view of the present invention, fig. 3 is a first copper layer, fig. 4 is a second copper layer, fig. 5 is a third copper layer, fig. 6 is a fourth copper layer, fig. 7 is a fifth copper layer, fig. 8 is a first plated hole, fig. 9 is a second plated hole, fig. 10 is a third plated hole, and fig. 11 is a fourth plated hole.
The reference numbers are: 21-a first copper layer, 22-a second copper layer, 23-a third copper layer, 24-a fourth copper layer, 25-a fifth copper layer, 31-a first microwave dielectric plate, 32-a second microwave dielectric plate, 33-a third microwave dielectric plate, 34-a fourth microwave dielectric plate, 41-a first metalized hole, 42-a second metalized hole, 43-a third metalized hole and 44-a fourth metalized hole.
Detailed Description
The technical scheme of the invention is specifically explained in the following by combining the attached drawings.
An integral structure of a double-ridge substrate integrated waveguide broadband magic T is shown in figure 1, and is manufactured by integrally designing five layers of copper skins and four layers of microwave dielectric plates through high-temperature hot pressing or co-firing, prepreg hot pressing or co-firing aiming at ceramic materials, wherein the layers are interconnected through metallized holes, and the transmission of signals among different layers is realized through the metallized holes, so that the substrate integrated waveguide is formed.
The copper sheet layer and the microwave dielectric plate are spaced from each other, as shown in fig. 2, from top to bottom, the copper sheet layer comprises 21-a first copper sheet layer, 31-a first microwave dielectric plate, 22-a second copper sheet layer, 32-a second microwave dielectric plate, 23-a third copper sheet layer, 33-a third microwave dielectric plate, 24-a fourth copper sheet layer, 34-a fourth microwave dielectric plate, 25-a fifth copper sheet layer, 41-a first metallized hole penetrates through 21-the first copper sheet layer, 31-the first microwave dielectric plate, 22-a second copper sheet layer to connect 21-the first copper sheet layer and 22-the second copper sheet layer, 42-a second metallized hole penetrates through 21-the first copper sheet layer, 31-the first microwave dielectric plate, 22-the second copper sheet layer, 32-the second microwave dielectric plate, 23-a third copper sheet layer, connecting 21-a first copper layer and 23-a third copper layer, wherein 43-a third metallized hole penetrates through 24-a fourth copper layer, 34-a fourth microwave dielectric slab and 25-a fifth copper layer, connecting 24-the fourth copper layer and 25-the fifth copper layer, and 44-a fourth metallized hole penetrates through all the copper layers and the microwave dielectric slab, and connecting 21-the first copper layer, 22-the second copper layer, 24-the fourth copper layer and 25-the fifth copper layer.
A first copper sheath, shown in fig. 3, is extensively copper clad and interconnected to the output connector through a coaxial hole in the surface.
The second copper layer, as shown in fig. 4, implements impedance matching of the input and output signals through a gradient line, and implements the edge of one of the ridges by using a rectangular copper layer.
The third copper layer, as shown in fig. 5, achieves impedance matching and broadband characteristics with respect to beam signal transmission through multi-step transformation or a gradual change.
The fourth copper layer, as shown in fig. 6, implements impedance matching of the input signal through a gradient line, and implements an edge of another ridge using a rectangular copper layer, and further includes another input port.
And a fifth copper layer, as shown in fig. 7, is used for realizing shielding grounding of signals by laying the copper layer in a large area.
The first metalized holes are arranged in two rows according to a certain diameter and a certain distance as shown in fig. 8, and the first copper layer and the second copper layer are connected to form an end ridge, so that the forming of the wide-side direction ridge of the substrate integrated waveguide is realized.
The second metallized hole, as shown in fig. 9, connects the first copper layer and the third copper layer according to a certain diameter, so as to realize the vertical transition from the inside to the surface layer of the substrate integrated waveguide and the beam signal.
The third metalized holes are arranged in two rows according to a certain diameter and a certain distance as shown in fig. 10, and the fourth copper skin layer and the fifth copper skin layer are connected to form the ridge at the other end, so that the formation of the ridge at the other broadside direction of the substrate integrated waveguide is realized.
As shown in fig. 11, the fourth metalized holes are arranged in two rows according to a certain diameter and a certain distance to form the substrate integrated waveguide, and are arranged in a circle to realize vertical transition grounding with the beam, so as to realize the formation of the substrate integrated waveguide and the shielding of the beam signal.
The above-described embodiments are not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present invention are included in the scope of the present invention.
Claims (3)
1. A double-ridge substrate integrated waveguide broadband magic T comprises: the microwave dielectric board comprises a copper sheet layer, a microwave dielectric board and metallization holes, wherein the copper sheet layer is rectangular and has a gradient line;
the copper sheet layer comprises a first copper sheet layer, a second copper sheet layer, a third copper sheet layer, a fourth copper sheet layer and a fifth copper sheet layer, the microwave dielectric plate comprises a first microwave dielectric plate, a second microwave dielectric plate, a third microwave dielectric plate and a fourth microwave dielectric plate, the first microwave dielectric plate is arranged between the first copper sheet layer and the second copper sheet layer, the second microwave dielectric plate is arranged between the second copper sheet layer and the third copper sheet layer, the third microwave dielectric plate is arranged between the third copper sheet layer and the fourth copper sheet layer, and the fourth microwave dielectric plate is arranged between the fourth copper sheet layer and the fifth copper sheet layer;
the metallized holes comprise a first metallized hole, a second metallized hole, a third metallized hole and a fourth metallized hole, the first metallized hole is connected with the first copper layer and the second copper layer, the second metallized hole is connected with the first copper layer and the third copper layer, the third metallized hole is connected with the fourth copper layer and the fifth copper layer, and the fourth metallized hole is connected with the first copper layer, the second copper layer, the fourth copper layer and the fifth copper layer;
the first copper layer is paved with copper in a large area, and coaxial interconnection is adopted as an external interface;
a fifth copper layer, which adopts large-area copper paving as shielding grounding;
it is characterized by comprising:
the second copper layer adopts a gradient line as the impedance matching of input and output, and adopts the edge of a rectangle as the edge of a ridge;
the third copper layer adopts gradual change line or multi-stage step transformation as impedance matching of beam transmission;
and the fourth copper layer adopts the gradient line as the input impedance matching and adopts the rectangular side as the ridge side.
2. The double-ridged-substrate-integrated-waveguide broadband magic T according to claim 1, wherein said first and third metallized holes are arranged in two rows as the sides of the ridge.
3. The double-ridged-substrate-integrated-waveguide broadband magic T according to claim 1, wherein said fourth metallized holes are arranged in two rows and a circle.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911372362.2A CN111162362B (en) | 2019-12-27 | 2019-12-27 | Double-ridge substrate integrated waveguide broadband magic T |
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| CN201911372362.2A CN111162362B (en) | 2019-12-27 | 2019-12-27 | Double-ridge substrate integrated waveguide broadband magic T |
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| CN111162362B true CN111162362B (en) | 2021-10-01 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107331934A (en) * | 2017-07-02 | 2017-11-07 | 中国航空工业集团公司雷华电子技术研究所 | A kind of ultra wide band combiner network and its processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010273151A (en) * | 2009-05-22 | 2010-12-02 | Furuno Electric Co Ltd | Mode converter, power synthesizer/distributor and plane magic t |
| CN105024129B (en) * | 2015-07-21 | 2017-08-25 | 南京邮电大学 | Planar Magic-T based on folded form substrate integration wave-guide |
| CN106711568A (en) * | 2016-11-24 | 2017-05-24 | 南京邮电大学 | Planar magic T based on substrate integration technology |
| CN206490161U (en) * | 2016-12-08 | 2017-09-12 | 江苏贝孚德通讯科技股份有限公司 | A kind of novel planar waveguide magic T |
| EP3695456B1 (en) * | 2017-10-13 | 2023-07-26 | Commscope Technologies LLC | Power couplers and related devices having antenna element power absorbers |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107331934A (en) * | 2017-07-02 | 2017-11-07 | 中国航空工业集团公司雷华电子技术研究所 | A kind of ultra wide band combiner network and its processing method |
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