SUMMERY OF THE UTILITY MODEL
The present application is directed to solving at least one of the problems in the prior art. Therefore, a loop filter module is provided, which can reduce the insertion loss of the loop filter module and reduce the power consumption.
A loop filter assembly according to an embodiment of the present application, comprising:
a dielectric filter;
the dielectric waveguide circulator is provided with at least 3 end parts, one end of the dielectric filter is connected with one of the end parts, and a cascade matching window is arranged at the joint of the dielectric filter and the end part and used for adjusting the impedance of the annular filter component; the dielectric waveguide circulator and the dielectric filter are integrally formed.
According to the above embodiments of the present application, the present application has at least the following beneficial effects: the dielectric waveguide circulator and the dielectric filter are integrally formed, so that the connecting pieces between the dielectric waveguide circulator and the dielectric filter can be reduced; however, the standing wave index of the ring filter component obtained by integrating the dielectric filter and the dielectric waveguide circulator does not meet the requirement, so that the impedance adjustment is performed by adding the cascade matching window to meet the required standing wave index. At this moment, compared with a traditional filtering component obtained by connecting a circulator and a dielectric filter through a connector, the loop filtering component has the advantages of smaller insertion loss and lower power consumption.
According to the ring filter assembly of some embodiments of the present application, the other two ends of the dielectric waveguide circulator are respectively provided with a first feeding blind hole, and the dielectric filter is provided with a second feeding blind hole; the two first feeding blind holes and the second feeding blind holes are respectively positioned on the same surface or different surfaces of the annular filtering component. Therefore, through different arrangement modes of the first feeding blind hole and the second feeding blind hole, the annular filtering component can be applied to a scene that one side of the annular filtering component is connected with the antenna and the other side of the annular filtering component is connected with the TR component, and can also be applied to a scene that the whole annular filtering component is directly welded on a TR component plate (namely an AAU scene).
According to some embodiments of the present disclosure, the dielectric filter includes two first resonant cavities, two second resonant cavities, a first T-shaped through slot, and a first coupling hole, where the two first resonant cavities and the two second resonant cavities are located at two ends of the dielectric filter, respectively, and the two second resonant cavities are located at one end far away from the cascade matching window; the first T-shaped through groove comprises a first through groove and a second through groove, and the second through groove separates the two first resonant cavities; the first through slot separates the first resonant cavity from the second resonant cavity; one end of the second through groove is connected with the first through groove; the first coupling hole is positioned between the two second resonant cavities, and a tuning blind hole is formed in the same first surface of each first resonant cavity and the same first surface of each second resonant cavity; the annular filtering component is provided with a second surface opposite to the first surface, and the second feeding blind hole is located on the second surface. The dielectric filter is divided into a plurality of first resonant cavities and second resonant cavities through the first T-shaped through grooves and the first coupling holes to form a single-layer dielectric filter, so that the annular filter component can keep the same overall thickness, and the installation is more convenient.
According to some embodiments of the present disclosure, the dielectric filter further comprises a second T-shaped through slot and two third resonant cavities; the second T-shaped through groove is positioned between the first T-shaped through groove and the first coupling hole; the second T-shaped through groove comprises a third through groove and a fourth through groove; the third through groove is arranged in parallel with the first through groove; the fourth through groove and the second through groove are arranged in parallel; the fourth through groove is positioned between the two third resonant cavities; the third via is located between the third resonant cavity and the second resonant cavity.
According to the annular filter assembly of some embodiments of the present application, the second coupling holes are disposed at two ends of the first through groove of the second T-shaped through groove.
According to the annular filtering component of some embodiments of the present application, the outer edges of the first feeding blind hole and the second feeding blind hole are both provided with an electrode metal layer; and the electrode metal layer is connected with the metalized area of the corresponding first feeding blind hole or the second feeding blind hole. The electrode metal layer is connected with the metalized area of the feed blind hole, so that when the bonding pad on the PCB is connected with the electrode metal layer, the risk of the contact between the metalized area of the dielectric filter or the dielectric waveguide circulator and the bonding pad is reduced, and meanwhile, the bonding pad can be conducted with the feed blind hole through the electrode.
According to the ring filter assembly of some embodiments of the present application, the width of the electrode metal layer is set to 0.3mm to 1 mm. Therefore, the electrode metal layer is set to be 0.3 mm-1 mm wide, and can be adapted to the pad size of most of the existing PCB boards.
According to the ring filter assembly of some embodiments of the present application, the dielectric waveguide circulator is provided with a matching step and a blind mounting hole, the matching step is disposed on the surface of the dielectric waveguide circulator, and the matching step is provided with a plurality of grooves disposed corresponding to the end of the dielectric waveguide circulator; the groove is circumferentially arranged around the mounting blind hole; the mounting blind hole is used for mounting the magnetic component.
According to the ring filter assembly of some embodiments of the present application, two adjacent grooves are communicated with each other. Through communicating the grooves with each other, a matching step matched with the outer contour of the dielectric waveguide circulator can be processed and formed during processing, and then the blind hole is processed and installed in the matching step, so that the convenience of manufacturing the annular filter assembly can be improved.
According to some embodiments of the present application, the ring filter assembly further comprises a magnetic assembly, the magnetic assembly comprising a ferrite substrate, a samarium-cobalt magnet, and a cover plate disposed in this order; the cover plate is far away from the bottom of the mounting blind hole relative to the ferrite substrate; the cover plate is detachably arranged on the mounting blind hole. The samarium cobalt magnet through magnetic component can provide external magnetic field, and the apron can provide certain packing force and give ferrite substrate, samarium cobalt magnet to make magnetic component's better fixing in the installation blind hole.
According to the ring filter assembly of some embodiments of the present application, the dielectric waveguide circulator and the dielectric filter are integrally formed by a dry pressing process or an injection process and are obtained by metallization.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the positional descriptions, such as the directions of up, down, front, rear, left, right, etc., referred to herein are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.
In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions.
With the construction of 5G base stations around the world, the application of Massive MIMO and dielectric waveguide filters in the 5G base stations is becoming popular, and the AAU is a more prominent feature of the 5G era. Under the system architecture of the very simple antenna, as shown in fig. 1, the general layout of the rf front end is to arrange a filter array behind an antenna 510 array, then each dielectric waveguide filter 100 is connected to one port of a circulator 520 through a connector, the other two ports of the circulator 520 are respectively connected to a transmitter and a receiver, and the circulator 520 is attached to a board of the TR module.
Under the structure, because the dielectric waveguide filter 100 and the circulator 520 are interconnected by the connector, the loss of the connector is increased, so that the insertion loss of the whole machine is increased, the power consumption of the equipment is increased, and meanwhile, the connector can also cause uncertain influence on the performance of a loop filtering component formed by the dielectric waveguide filter and the circulator 520.
Therefore, to solve the above problems, the present application provides a loop filter assembly. The purpose is to integrate the dielectric filter 100 and the dielectric waveguide circulator 200, so that the circulator filter assembly does not contain the insertion loss of a connector, thereby reducing the overall loss of wireless equipment and optimizing the layout of a wireless system.
As shown in fig. 2, the loop filter module of the present application includes:
a dielectric filter 100;
the dielectric waveguide circulator 200, the dielectric waveguide circulator 200 has at least 3 end parts 210, one end of the dielectric filter 100 is connected with one end part 210, the connection of the dielectric filter 100 and the end part 210 is provided with a cascade matching window 300, the cascade matching window 300 is used for adjusting the impedance of the loop filter assembly; the dielectric waveguide circulator 200 is formed integrally with the dielectric filter 100.
Therefore, by integrally molding the dielectric waveguide circulator 200 and the dielectric filter 100, the number of connections between the dielectric waveguide circulator 200 and the dielectric filter 100 can be reduced, but the dielectric filter 100 and the dielectric waveguide circulator 200 are integrated to form a loop filter assembly; the standing wave index of the annular filter component can not meet the requirement; therefore, the cascade matching window 300 is added to adjust the impedance, so as to obtain the standing wave index meeting the requirement. At this time, compared with the traditional mode of connecting the dielectric waveguide circulator 200 and the circulator through the connector, the performance of the ring filter assembly is met, and meanwhile the insertion loss of the ring filter assembly is smaller and the power consumption is lower.
It should be noted that the dielectric filter 100 and the dielectric waveguide circulator 200 are obtained by integrally molding a dielectric material (such as a ceramic powder) and then metallizing the molded dielectric material. It should be noted that, since the dielectric waveguide circulator 200 and the dielectric filter 100 are integrally formed, a component such as a connector is not required to connect the dielectric waveguide circulator 200 and the dielectric filter 100, and the cost of the circulator filter component can be further reduced.
Note that the cascade matching window 300 is a groove, and the impedance can be adjusted by adjusting the depth and width of the groove.
It should be noted that, during the simulation design, the waveguide circulator 200 and the dielectric filter 100 may be simulated separately, and then one of the ports of the two devices is integrated into a cascade simulation, and the impedance change of the integrated ring filter assembly is improved by adjusting the cascade matching window 300, so as to improve the standing wave index of the ring filter assembly, thereby obtaining the ring filter assembly meeting the requirement.
At this time, it can be understood that the dielectric waveguide circulator 200 and the dielectric filter 100 are formed integrally by a dry pressing process or an injection process and are metallized.
It can be understood that, as shown in fig. 2, 3, and 5, the other two end portions 210 of the dielectric waveguide circulator 200 are respectively provided with a first feeding blind hole 220, and the dielectric filter 100 is provided with a second feeding blind hole 110; the two first feeding blind holes 220 and the second feeding blind holes 110 are respectively located on the same surface (as shown in fig. 2 and fig. 3) or different surfaces (as shown in fig. 5, respectively located on the upper and lower surfaces of the ring filter assembly). Therefore, through different arrangement modes of the first feeding blind hole 220 and the second feeding blind hole 110, the loop filter assembly can be applied to a scene that one side of the loop filter assembly is connected with the antenna 510 and the other side of the loop filter assembly is connected with the TR assembly, and can also be applied to a scene that the whole loop filter assembly is directly welded on the TR assembly plate (namely, an AAU scene).
It should be noted that, as shown in fig. 2 and fig. 3, when the first feeding blind via 220 and the second feeding blind via 110 are both disposed on the same lower surface, in an AAU scenario, the thickness of the entire assembled AAU may be reduced by the thickness of one interconnection mechanism.
It can be understood that, as shown in fig. 2, the dielectric filter 100 includes two first resonant cavities, two second resonant cavities, a first T-shaped through slot 120 and a first coupling hole 130, the two first resonant cavities and the two second resonant cavities are respectively located at two ends of the dielectric filter 100, and the two second resonant cavities are located at one end far away from the cascade matching window 300; the first T-shaped through slot 120 includes a first through slot 121 and a second through slot 122, and the second through slot 122 separates the two first resonant cavities; the first through groove 121 separates the first resonant cavity from the second resonant cavity; one end of the second through groove 122 is connected to the first through groove 121; the first coupling hole 130 is located between two second resonant cavities, and a tuning blind hole 140 is disposed on the same first surface (i.e., the upper surface of the ring filter assembly shown in fig. 2) of each of the first and second resonant cavities; the ring filter assembly is provided with a second surface (i.e. the lower surface of the ring filter assembly as shown in fig. 2) opposite to the first surface, and the second blind feeding hole 110 is located at the second surface. The dielectric filter 100 is divided into a plurality of first resonant cavities and second resonant cavities by the first T-shaped through slots 120 and the first coupling holes 130 to form a single-layer dielectric filter 100, so that the thickness of the ring filter assembly is kept the same, and the ring filter assembly is more convenient to install.
It should be noted that, when the dielectric filter only has two second resonant cavities and two first resonant cavities, the second feeding blind hole 110 is located on the lower surface of the second resonant cavity (i.e. the second feeding blind hole 110 and the first tuning blind hole 170 are located on the lower surface and the upper surface of the second resonant cavity, respectively). When the dielectric filter 100 is provided with other resonant cavities, the second feeding blind hole 110 is located on the lower surface of the ring filter assembly and the lower surface of the other resonant cavity adjacent to the first resonant cavity.
It should be noted that all the tuning blind holes 140 are disposed on the same surface of the dielectric filter 100 on the dielectric filter 100, and therefore, the dielectric filter 100 in this application is a single-layer dielectric filter 100.
It should be noted that, according to the simulation result of the dielectric filter 100, the size of the first through groove 121 and the distance between the two ends of the first through groove 121 and the connection of the second through groove 122 may be adjusted.
It is understood that the dielectric filter 100 further includes a second T-shaped through slot 150 and two third resonant cavities; the second T-shaped through slot 150 is located between the first T-shaped through slot 120 and the first coupling hole 130; the second T-shaped through slot 150 includes a third through slot 151 and a fourth through slot 152; the third through groove 151 is arranged in parallel with the first through groove 121; the fourth through groove 152 and the second through groove 122 are arranged in parallel; the fourth through groove 152 is located between the two third resonant cavities; the third through-slot 151 is located between the third resonant cavity and the second resonant cavity.
Note that, as shown in fig. 2, the second feeding blind hole 110 is located on the lower surface of the third resonant cavity.
It should be noted that multiple sets of the second T-shaped through slots 150 and the two third resonant cavities may be provided, and the multiple sets of the second T-shaped through slots 150 and the two third resonant cavities are both provided between the first T-shaped through slot 120 and the first coupling hole 130. When the plurality of second T-shaped through slots 150 are provided, the second feeding blind hole 110 is located at the lower surface of the third resonant cavity closest to the first T-shaped through slot 120. The third through-slots 151 separate two adjacent third resonant cavities.
As shown in fig. 2, when a signal enters the second blind feeding hole 110 from the antenna, the signal goes as shown by the arrow in fig. 2. The signal is input through the third resonant cavity where the first tuning blind hole 170 is located, sequentially passes through the second resonant cavity, the other third resonant cavity, and the two first resonant cavities, and is output to the dielectric waveguide circulator 200. When a signal goes from the dielectric waveguide circulator 200 to the dielectric filter 100, the signal goes in the opposite direction to the arrow in fig. 2 and is output from the third resonant cavity where the first tuning blind hole 170 is located.
It can be understood that both ends of the first through groove 121 of the second T-shaped through groove 150 are provided with the second coupling holes 160.
It can be understood that the outer edges of the first feeding blind via 220 and the second feeding blind via 110 are both provided with the electrode metal layer 230; and the electrode metal layer 230 is connected with the metalized area of the corresponding first feeding blind via 220 or second feeding blind via 110. The electrode metal layer 230 is connected with the metalized area of the feed blind hole, so that when the pad on the PCB board is connected through the electrode metal layer 230, the risk of the contact between the metalized area of the dielectric filter 100 or the dielectric waveguide circulator 200 and the pad is reduced, and the pad can be conducted with the feed blind hole through the electrode.
It can be understood that the width of the electrode metal layer 230 is set to 0.3mm to 1mm, and thus, the electrode metal layer 230 is set to a width of 0.3mm to 1mm, which can be adapted to the pad size of most existing PCB boards.
Note that 0.3mm to 1mm includes 0.3mm, 1mm, and values between 0.3mm and 1 mm.
It should be noted that the second blind feed hole 110 is a cylindrical slot body with one open end, and therefore, the metalized area of the second blind feed hole 110 can be understood as a slot body side surface and a bottom surface of the cylindrical slot body.
Note that a non-metalized region 240 is also provided on the outer edge of the electrode metal layer 230, so as to further reduce the risk of the dielectric filter 100 or the dielectric waveguide circulator 200 contacting the PCB board.
It can be understood that the dielectric waveguide circulator 200 is provided with a matching step 250 and a mounting blind hole 260, the matching step 250 is arranged on the surface of the dielectric waveguide circulator 200, and the matching step 250 is provided with a plurality of grooves arranged corresponding to the end of the dielectric waveguide circulator 200; the grooves are circumferentially arranged around the mounting blind holes 260; the blind mounting holes 260 are used for mounting the magnetic assembly 400.
It is understood that adjacent two grooves communicate with each other. By communicating the grooves with each other, the matching step 250 matched with the outer contour of the dielectric waveguide circulator 200 can be formed by processing first during processing, and then the blind hole 260 is processed and installed in the matching step 250, so that the convenience of manufacturing the annular filter assembly can be improved.
It should be noted that the magnetic assembly 400 has a conductive function, and therefore, the bottom and the side of the blind mounting hole 260 are insulated.
It should be noted that, when the upper and lower surfaces of the dielectric waveguide circulator 200 are both provided with the matching steps 250; the matching step 250 has a shallower depth than a case where the matching step 250 is provided only on one surface of the dielectric waveguide circulator 200
It is to be understood that, as shown in fig. 4, the ring filter assembly further includes a magnetic assembly 400, the magnetic assembly 400 including a ferrite substrate 410, a samarium-cobalt magnet 420, and a cover plate 430 arranged in this order; the cover plate 430 is away from the bottom of the mounting blind hole 260 relative to the ferrite substrate 410; the cover plate 430 is detachably disposed on the mounting blind hole 260. An external magnetic field may be provided by the samarium cobalt magnet 420 of the magnetic assembly 400 and the cover plate 430 may provide a compressive force to the ferrite substrate 410 and the samarium cobalt magnet 420 to better secure the magnetic assembly 400 within the blind mounting holes 260.
It should be noted that when the dielectric waveguide circulator 200 is provided with one matching step 250, the thickness of the ferrite substrate 410 needs to be set thicker than when two matching steps 250 are provided. The specific thickness, and the depth of the matching step 250, may be set according to the simulation results.
It should be noted that, the cover plate 430 may be fixed on the blind mounting hole 260 by a clamping manner, and after the fixing, the cover plate 430 may be further fixed with the blind mounting hole 260 by glue or a welding manner.
A loop filter assembly according to an embodiment of the present application is described in detail in a specific embodiment with reference to fig. 2 to 4. It is to be understood that the following description is illustrative only and is not intended to be in any way limiting.
As shown in fig. 2, the loop filter assembly of the present application includes a dielectric filter 100; the dielectric waveguide circulator 200, the dielectric waveguide circulator 200 has 3 end 210, one end of the dielectric filter 100 connects with one end 210, there is cascade matching window 300 in the junction of the dielectric filter 100 and end 210, the cascade matching window is used for adjusting the impedance of the loop filter assembly; the dielectric waveguide circulator 200 is formed integrally with the dielectric filter 100.
Specifically, the dielectric filter 100 and the dielectric waveguide circulator 200 are integrally formed by using a dielectric material obtained by metallizing ceramic powder and an injection process.
As shown in fig. 2 and fig. 3, the other two end portions 210 of the dielectric waveguide circulator 200 are respectively provided with a first feeding blind hole 220, and the dielectric filter 100 is provided with a second feeding blind hole 110; the two first feeding blind holes 220 and the second feeding blind hole 110 are respectively located on the lower surface of the ring filter assembly.
Further, as shown in fig. 2, the dielectric filter 100 includes two first resonant cavities, two second resonant cavities, a first T-shaped through slot 120 and a first coupling hole 130, where the two first resonant cavities and the two second resonant cavities are located at two ends of the dielectric filter 100, respectively, and the two second resonant cavities are located at one end far away from the cascade matching window 300; the first T-shaped through slot 120 includes a first through slot 121 and a second through slot 122, and the second through slot 122 separates the two first resonant cavities; the first through groove 121 separates the first resonant cavity from the second resonant cavity; one end of the second through groove 122 is connected to the first through groove 121; the first coupling hole 130 is located between two second resonant cavities, and a tuning blind hole 140 is disposed on the same upper surface of each of the first and second resonant cavities.
Further, as shown in fig. 2, the dielectric filter 100 further includes 1 second T-shaped through slot 150 and 2 third resonant cavities, where the second T-shaped through slot 150 is located between the first T-shaped through slot 120 and the first coupling hole 130; the second T-shaped through slot 150 includes a third through slot 151 and a fourth through slot 152; the third through groove 151 is arranged in parallel with the first through groove 121; the fourth through groove 152 and the second through groove 122 are arranged in parallel; the fourth through groove 152 is used for separating two third resonant cavities, and the third through groove 151 separates the third resonant cavity from the second resonant cavity; the second blind feed hole 110 is located on the lower surface of the third resonant cavity.
Specifically, when a signal is input from one end 210 of the dielectric waveguide circulator 200 shown in fig. 2, the signal passes through the end 210 connected to the dielectric filter 100 and sequentially passes through two first resonant cavities, one third resonant cavity, two second resonant cavities, and the third resonant cavity provided with the second feeding blind hole 110 in the opposite direction shown by the arrow in fig. 2, and then is output to form a ring. When a signal is input from the second feeding blind hole 110, it is output from the dielectric filter 100 to the dielectric waveguide circulator 200 from the direction as shown in fig. 2.
Further, the second coupling holes 160 are disposed at both ends of the first through groove 121 of the second T-shaped through groove 150.
Further, the outer edges of the first feeding blind via 220 and the second feeding blind via 110 are both provided with an electrode metal layer 230; the width of the electrode metal layer 230 is set at 0.3mm, and the electrode metal layer 230 is connected to the metalized region of the corresponding first feeding blind via 220 or second feeding blind via 110.
Further, a non-metalized area 240 is further disposed at the outer edge of the electrode metal layer 230, so as to further reduce the risk of the dielectric filter 100 or the dielectric waveguide circulator 200 contacting the PCB board.
Further, the dielectric waveguide circulator 200 is provided with two matching steps 250 and a mounting blind hole 260, the two matching steps 250 are respectively arranged on the upper surface and the lower surface of the dielectric waveguide circulator 200, and the matching steps 250 are provided with 3 grooves arranged corresponding to the end of the dielectric waveguide circulator 200; the grooves are circumferentially arranged around the mounting blind holes 260; two adjacent grooves are communicated with each other to form a Y-shaped shape which is the same as the outer contour of the dielectric waveguide circulator 200; the blind mounting holes 260 are used for mounting the magnetic assembly 400.
Further, as shown in fig. 4, the ring filter assembly further includes a magnetic assembly 400, where the magnetic assembly 400 includes a ferrite substrate 410, a samarium-cobalt magnet 420, and a cover plate 430, which are sequentially disposed; the cover plate 430 is away from the bottom of the mounting blind hole 260 relative to the ferrite substrate 410; the cover plate 430 is detachably disposed on the mounting blind hole 260.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present application.