CN220674012U - Composite structure for module power supply - Google Patents
Composite structure for module power supply Download PDFInfo
- Publication number
- CN220674012U CN220674012U CN202322129609.6U CN202322129609U CN220674012U CN 220674012 U CN220674012 U CN 220674012U CN 202322129609 U CN202322129609 U CN 202322129609U CN 220674012 U CN220674012 U CN 220674012U
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- circuit board
- power supply
- composite structure
- component
- module
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- 239000002131 composite material Substances 0.000 title claims abstract description 31
- 238000004891 communication Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 5
- 238000004804 winding Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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Abstract
The utility model discloses a composite structure for a module power supply, which relates to the field of module power supplies and comprises a first circuit board, a second circuit board, a link pin, a module power supply and components; the second circuit board is provided with mounting notches, first ends of two magnetic elements of the module power supply are fixedly mounted on the first side surface of the first circuit board, and second ends of the two magnetic elements are respectively positioned at the two mounting notches; under the condition that the same transformer area occupies, the composite structure can obtain a larger effective device mounting area. Conversely, the composite structure can obtain the largest magnetic device area under the condition of the same number of circuit devices. The present composite structure thus provides a new solution for maximizing the magnetic elements and power devices over the conventional structure 1 and the conventional structure 2 under the same design and technical conditions. Compared with the existing structure, the structure can greatly improve the volume of the power device of the module under the same condition, and meanwhile, the power density of the module is obviously improved.
Description
Technical Field
The utility model relates to the field of module power supplies, in particular to a composite structure for a module power supply.
Background
The power density of the current module power supply is limited by the traditional structure and process, and the volume of the transformer and the effective mounting area of the board are limited, so that the power density is difficult to further improve on the basis of the prior art, and a bottleneck period is achieved.
Disclosure of Invention
The utility model aims to solve the problems and design a composite structure for a module power supply.
The utility model realizes the above purpose through the following technical scheme:
a composite structure for a modular power supply, comprising:
a first circuit board;
a second circuit board; two mounting notches are formed in the second circuit board;
a plurality of link pins; the plurality of connection pins are used for fixed connection and communication connection between the first circuit board and the second circuit board;
a module power supply; the first ends of the two magnetic elements of the module power supply are fixedly arranged on the first side face of the first circuit board, the second ends of the two magnetic elements are respectively positioned at the two mounting notches, and the distance between the first circuit board and the second circuit board is smaller than the thickness of the magnetic elements;
a plurality of components; the thickness of the component is larger than a first preset threshold value and is used as a first component, the thickness of the component is larger than the first preset threshold value and is used as a second component, the first component is fixedly arranged on the first side face of the first circuit board or the first side face of the second circuit board, the first component is fixedly arranged on the second side face of the first circuit board or the second side face of the second circuit board, and the first side face of the first circuit board and the first side face of the second circuit board are opposite.
The utility model has the beneficial effects that: under the condition that the same transformer area occupies, the composite structure can obtain a larger effective device mounting area. Conversely, the composite structure can obtain the largest magnetic device area under the condition of the same number of circuit devices. The present composite structure thus provides a new solution for maximizing the magnetic elements and power devices over the conventional structure 1 and the conventional structure 2 under the same design and technical conditions. Compared with the existing structure, the structure can greatly improve the volume of the power device of the module under the same condition, and meanwhile, the power density of the module is obviously improved.
Drawings
FIG. 1 is a schematic structural view of a composite structure for a modular power supply of the present utility model;
FIG. 2 is a schematic illustration of an active mounting face of a composite structure for a modular power supply of the present utility model;
FIG. 3 is a schematic illustration of the shadow areas measured in CAD of the active mounting face of a composite structure for a modular power supply of the present utility model;
FIG. 4 is a schematic illustration of an effective mounting surface of a conventional structure 1;
FIG. 5 is a schematic illustration of an effective mounting surface of a conventional structure 2;
wherein corresponding reference numerals are as follows:
1-first circuit board, 2-second circuit board, 3-link pin, 4-magnetic element, 5-third component, 6-second component, 7-fourth component, 8-semiconductor component, 9-magnetic element winding.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships conventionally put in place when the inventive product is used, or the directions or positional relationships conventionally understood by those skilled in the art are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, terms such as "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
The following describes specific embodiments of the present utility model in detail with reference to the drawings.
A composite structure for a modular power supply, comprising:
a first circuit board;
a second circuit board; two mounting notches are formed in the second circuit board;
a plurality of link pins; the plurality of connection pins are used for fixed connection and communication connection between the first circuit board and the second circuit board;
a module power supply; the first ends of the two magnetic elements of the module power supply are fixedly arranged on the first side face of the first circuit board, the second ends of the two magnetic elements are respectively positioned at the two mounting notches, and the distance between the first circuit board and the second circuit board is smaller than the thickness of the magnetic elements;
a plurality of components; the thickness of the component is larger than a first preset threshold value and is used as a first component, the thickness of the component is larger than the first preset threshold value and is used as a second component, the first component is fixedly arranged on the first side face of the first circuit board or the first side face of the second circuit board, the first component is fixedly arranged on the second side face of the first circuit board or the second side face of the second circuit board, and the first side face of the first circuit board and the first side face of the second circuit board are opposite.
The first circuit board and the second circuit board are both PCBs, and a shielding layer is arranged between the first side surface and the second side surface of the PCBs.
The shielding layer is made of copper.
The thickness of the first component is larger than a second preset threshold value to be used as a third component, the third component is fixedly arranged on the first side face of the second circuit board, the thickness of the first component is smaller than the second preset threshold value to be used as a fourth component, the fourth component is fixedly arranged on the first side face of the first circuit board, and the first preset threshold value is smaller than the second preset threshold value. The second preset threshold is 3mm and the first preset threshold is 1.5mm.
The second component includes a semiconductor device fixedly mounted on the second side of the second circuit board.
And a second circuit board: having an AB mounting area
The a-side (second side) is a heat radiation surface of the module, and is used for a mounting surface of the power semiconductor device.
The B side (first side) is used for a device mounting side having a height higher than 3 mm. The remaining space of the magnetic device is effectively utilized.
The thickness of the second circuit board is lower than 0.8mm, and the middle part is connected with the wiring integrated winding through the magnetic element to meet the circuit requirement
A first circuit board: having an AC mounting area
The A surface (first side surface) is a device mounting surface and can be matched with a device with higher mounting height.
The C surface (first side surface) is a device mounting surface with the height of the control circuit lower than 1.5mm.
The thickness of the first circuit board is lower than 0.8mm, and the interlayer is plated with copper as a shielding layer, so that the interference of the power part on the control part is reduced
The magnetic element is positioned at the middle position of the first side surface of the first circuit board. The second circuit board is closely attached to the magnetic element.
The magnetic element winding can be independently wound or manufactured by using a multi-layer PCB, and the mode is flexible, changeable and high in adaptability.
The first circuit board and the second circuit board ensure sufficient mechanical strength through hard stitch linking.
The composite structure of the utility model is shown in figures 2 and 3, and the device mounting surface is decomposed into four effective mounting surfaces of ABAC
Let the C-plane area be 10 units.
The area of B was measured by CAD software to be about 3.9
The area of A as measured by CAD software was about 4.7
The effective mounting area is a+b+a+c=4.7+3.9+4.7+10=23.3
As shown in FIG. 4, the conventional structure 1 is characterized in that the device mounting surface is decomposed into three effective BBA mounting surfaces
The effective mounting area is that B+B+A=3.9+3.9+4.7=12.5
Conventional structure 2 as shown in fig. 5, the device mounting surface is decomposed into three effective AA mounting surfaces
The effective mounting area is a+A=4.7+4.7=9.4
The composite structure has an effective device mounting area increased by about 86.4% over conventional structure 1
The composite structure has an effective device mounting area of about 147.8% greater than that of conventional structure 2
Under the condition that the same transformer area occupies, the composite structure can obtain a larger effective device mounting area. Conversely, the composite structure can obtain the largest magnetic device area under the condition of the same number of circuit devices. The present composite structure thus provides a new solution for maximizing the magnetic elements and power devices over the conventional structure 1 and the conventional structure 2 under the same design and technical conditions. Compared with the existing structure, the structure can greatly improve the volume of the power device of the module under the same condition, and meanwhile, the power density of the module is obviously improved.
The calculation of the effective mounting area above can show that the C surface also has a large number of vacant areas to expand functions under the condition that the area is the same or even larger than the area of the magnetic element, and the volume utilization rate is improved under the strict design. It can be seen that the method can significantly improve the power density of the module and expand the circuit function of the module under the same conditions. And the core competitiveness of the product is improved.
The power and control circuit of the composite structure can be separated, and interference is reduced, and reliability is improved.
The effective surface of the pasting device of the composite structure is provided with at least two surfaces, and the control of a complex circuit can be easily realized.
The independent multi-layer transformer with the composite structure can be flexibly changed and replaced according to the situation, and the investment of research, development and production is reduced.
The volume utilization rate of the composite structure is remarkably improved, and higher power density is realized.
The technical scheme of the utility model is not limited to the specific embodiment, and all technical modifications made according to the technical scheme of the utility model fall within the protection scope of the utility model.
Claims (5)
1. A composite structure for a modular power supply, comprising:
a first circuit board;
a second circuit board; two mounting notches are formed in the second circuit board;
a plurality of link pins; the plurality of connection pins are used for fixed connection and communication connection between the first circuit board and the second circuit board;
a module power supply; the first ends of the two magnetic elements of the module power supply are fixedly arranged on the first side face of the first circuit board, the second ends of the two magnetic elements are respectively positioned at the two mounting notches, and the distance between the first circuit board and the second circuit board is smaller than the thickness of the magnetic elements;
a plurality of components; the thickness of the component is larger than a first preset threshold value and is used as a first component, the thickness of the component is larger than the first preset threshold value and is used as a second component, the first component is fixedly arranged on the first side face of the first circuit board or the first side face of the second circuit board, the first component is fixedly arranged on the second side face of the first circuit board or the second side face of the second circuit board, and the first side face of the first circuit board and the first side face of the second circuit board are opposite.
2. The composite structure for a modular power supply of claim 1, wherein the first circuit board and the second circuit board are both PCB boards, and a shielding layer is disposed between the first side and the second side of the PCB boards.
3. The composite structure for a modular power supply of claim 2, wherein the shielding layer is made of copper.
4. A composite structure for a modular power supply according to any one of claims 1 to 3, wherein the first component has a thickness greater than a second predetermined threshold as a third component fixedly mounted on the first side of the second circuit board, the first component has a thickness less than the second predetermined threshold as a fourth component fixedly mounted on the first side of the first circuit board, and the first predetermined threshold is less than the second predetermined threshold.
5. A composite structure for a modular power supply as claimed in any one of claims 1 to 3 wherein the second component comprises a semiconductor device fixedly mounted to the second side of the second circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322129609.6U CN220674012U (en) | 2023-08-09 | 2023-08-09 | Composite structure for module power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322129609.6U CN220674012U (en) | 2023-08-09 | 2023-08-09 | Composite structure for module power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220674012U true CN220674012U (en) | 2024-03-26 |
Family
ID=90327178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322129609.6U Active CN220674012U (en) | 2023-08-09 | 2023-08-09 | Composite structure for module power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220674012U (en) |
-
2023
- 2023-08-09 CN CN202322129609.6U patent/CN220674012U/en active Active
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