CN219628004U - Integrated circuit and electronic device - Google Patents

Abstract

The embodiment of the utility model provides an integrated circuit and electronic equipment, and relates to the technical field of servers. The integrated circuit comprises a circuit board, a plug-in module and at least two pins; the at least two pins are arranged on the plug-in module at intervals, the plug-in module is plugged on the circuit board through the at least two pins, and a space is reserved between the plug-in module and the circuit board; the length direction of the pins is greater than the thickness direction of the pins, and an included angle is formed between the length directions of at least two pins. Therefore, at least two pins can resist loads in different directions, and the reliability of the plug-in module, which is fixed on a bottom layer circuit board in a plugging manner, is improved, and the reliability of the integrated circuit in the processes of falling, transportation and the like is improved.

Description

Integrated circuit and electronic device

Technical Field

The embodiment of the utility model relates to the technical field of servers, in particular to an integrated circuit and electronic equipment.

Background

With the rise of big data, cloud computing and artificial intelligence (Artificial intelligence, abbreviated as AI), the computing demands of data centers and servers are higher and higher, the number of components arranged on a server single board is more and more, and the integration level is higher and higher.

In order to ensure the smooth layout of components on the server single board, in the related art, part of components are made into a plug-in module, and the plug-in module can be fixed on the bottom layer circuit board through pin insertion, and a space is reserved between the plug-in module and the bottom layer circuit board, so that the components can be laid out between the bottom layer circuit board and the plug-in module, and the layout space of the server single board can be enlarged.

However, the reliability of the plug-in module inserted and fixed on the bottom circuit board is low.

Disclosure of Invention

The embodiment of the utility model provides an integrated circuit and electronic equipment, which are beneficial to solving the problem of low reliability of the plug-in module which is fixedly plugged on a bottom circuit board.

In a first aspect, an embodiment of the present utility model provides an integrated circuit, including: the circuit board, the plug-in module and at least two pins; the at least two pins are arranged on the plug-in module at intervals, the plug-in module is plugged on the circuit board through the at least two pins, and a space is reserved between the plug-in module and the circuit board; the length direction of the pins is larger than the thickness direction of the pins, and an included angle is formed between at least two of the pins in the length direction.

The integrated circuit provided by the embodiment of the utility model comprises a circuit board, a plug-in module and at least two pins. Through setting up at least two pin intervals on the plug-in components module, make the plug-in components module peg graft on the circuit board through at least two pins, on the one hand, the pin is convenient for not only with the fixed setting of plug-in components module on the circuit board, the location of the plug-in components module of being convenient for moreover to be favorable to improving the installation effectiveness of plug-in components module. On the other hand, the pins can support the plug-in modules, so that the plug-in modules and the circuit board have a distance, components and parts can be distributed between the circuit board and the plug-in modules, the layout space of the circuit board can be enlarged, and the high-density distribution requirement of the circuit board is met.

In addition, the length direction dimension of the pin is larger than the thickness direction dimension of the pin, so that the load resistance of the pin in the length direction is relatively strong. Through setting up the contained angle that has between the length direction of two at least pins to make two at least pins can resist the load of different directions, and then not only be favorable to improving the plug-in components module and peg graft the reliability of fixing on the bottom circuit board, be favorable to improving the integrated circuit and fall, the reliability of transportation scheduling in-process moreover.

In one possible implementation, the included angle ranges from 15 ° to 90 °.

Through setting up the contained angle scope between the length direction of at least two pins to be 15 ~ 90 to not only can guarantee that the contained angle between the length direction of at least two pins is in suitable range, with the effect of two at least pins anti not equidirectional load of improvement.

In one possible implementation, the angle is 90 °.

Through setting up the contained angle between the length direction of at least two pins to be 90, thereby make at least two pins can anti mutually perpendicular's load of two directions, and then be favorable to improving the reliability in integrated circuit fall, transportation etc..

In one possible implementation manner, the pins include at least a first pin and a second pin, an included angle is formed between a length direction of the first pin and a length direction of the second pin, and the number of the first pins is equal to the number of the second pins.

Through setting up the pin and including first pin and second pin at least, make the length direction of first pin and the length direction of second pin between have the contained angle to make the quantity of first pin and the quantity of second pin equal, thereby not only can adjust the contained angle between length direction of first pin and the length direction of second pin according to the load direction that integrated circuit needs to bear, can guarantee moreover that the integrated circuit's the ability of anti different direction loads is the same.

In one possible implementation, the first pins and the second pins are alternately arranged.

The first pins and the second pins are alternately arranged, so that the effect of the integrated circuit on resisting loads in different directions is improved.

In one possible implementation, the dimension of the pins in the thickness direction ranges from 0.3mm to 0.7mm.

Through setting up the size scope of the thickness direction of pin to be 0.3mm to 0.7mm to not only can guarantee that the thickness of pin is in suitable scope, in order to guarantee the intensity of pin, can select the pin of different thickness according to actual need moreover, in order to improve the flexibility of product design.

In one possible implementation, the length direction of the pins ranges from 5mm to 15mm.

The length direction of the pins is set to be 5mm to 15mm, so that the length of the pins can be ensured to be in a proper range, the load resistance of the length direction of the pins can be ensured, and the pins with different lengths can be selected according to actual needs, so that the flexibility of product design is improved.

In one possible implementation, the pins are metal pieces, and the card module and the circuit board are electrically connected through the pins.

The pins are metal pieces, and the plug-in module and the circuit board are electrically connected through the pins, so that power supply transmission and information exchange between the plug-in module and the circuit board can be realized, and the structural strength and the structural reliability of the pins are guaranteed.

In one possible implementation, the pins include at least one of copper pins, copper alloy pins, aluminum pins, or aluminum alloy pins.

The pins comprise at least one of copper pins, copper alloy pins, aluminum pins or aluminum alloy pins, so that pins with different materials can be selected according to actual needs, and the flexibility of product design is improved.

In one possible implementation, the pitch ranges from 20mm to 30mm.

Through setting up the scope of interval between plug-in components module and the circuit board to be 20mm to 30mm, thereby can guarantee that the interval between plug-in components module and the circuit board is in suitable scope, not only can guarantee between circuit board and the plug-in components module and lay out components and parts smoothly, can guarantee the stability of plug-in components module grafting on the circuit board moreover, and then can enlarge the layout space of circuit board, satisfy the high dense layout demand of circuit board.

In one possible implementation manner, the circuit board is provided with a jack, an orifice of the jack is positioned on one surface of the circuit board facing the plug-in module, and the pin is inserted into the jack near one end of the circuit board and welded in the jack; the periphery of pin is provided with the spacing face, spacing face with the drill way edge butt of jack.

Through setting up the jack on the circuit board, make the drill way of jack lie in the circuit board towards the one side of plug-in components module, make the one end that the pin is close to the circuit board insert and weld in the jack to be convenient for not only fix the setting of plug-in components module on the circuit board, the location of plug-in components module of being convenient for moreover, thereby be favorable to improving the installation effectiveness of plug-in components module. Through setting up spacing face at the periphery of pin, make spacing face and the drill way edge butt of jack to can spacing pin insert the degree of depth in the jack, guarantee the interval between plug-in components module and the circuit board, and then be favorable to protecting the components and parts between circuit board and the plug-in components module.

In one possible implementation manner, a reinforcement portion is disposed at an end of the pin near the card module, and the reinforcement portion is located at least one side of the thickness direction of the pin.

The reinforcing part is arranged at one end of the pin, which is close to the plug-in module, and the reinforcing part is positioned at least one side of the thickness direction of the pin, so that the stability and the reliability of the pin arranged on the plug-in module are improved.

In one possible implementation, the integrated circuit further includes a first component disposed on the circuit board, at least a portion of the first component being located between the circuit board and the interposer module.

The integrated circuit further comprises first components, the first components are arranged on the circuit board, at least part of the first components are located between the circuit board and the plug-in module, and therefore the space between the circuit board and the plug-in module can be utilized, more components can be distributed on the circuit board, and the requirement of high-density layout is met.

In one possible implementation, the card module includes a module circuit board and a second component disposed on a first of the opposite sides of the module circuit board, and the pins are disposed on a second of the opposite sides of the module circuit board.

The plug-in module comprises a module circuit board and second components, the second components are arranged on the first surfaces of the two opposite surfaces of the module circuit board, and the pins are arranged on the second surfaces of the two opposite surfaces of the module circuit board, so that the second components can be prevented from occupying the space between the module circuit board and the circuit board, and more components can be conveniently distributed on the module circuit board.

In one possible implementation, the first component includes at least one of a fuse, a varistor, an electromagnetic interference filter, a relay, a power factor correction module, a high voltage capacitor, a slow start circuit, a control circuit, or an auxiliary power supply; the second component comprises at least a transformer.

The first component comprises at least one of a fuse, a piezoresistor, an electromagnetic interference filter, a relay, a power factor correction module, a high-voltage electrolytic capacitor, a slow start circuit, a control circuit or an auxiliary power supply, and the second component at least comprises a transformer, so that the integrated circuit can be used as a power supply module of a server or other electronic equipment, and the layout space of the server or other electronic equipment is saved.

In a second aspect, an embodiment of the present utility model provides an electronic device, including a motherboard and an integrated circuit as set forth in any one of the preceding claims, where the integrated circuit is disposed near the motherboard, and the integrated circuit is electrically connected to the motherboard.

The electronic equipment provided by the embodiment of the utility model comprises the main board and the integrated circuit, and the integrated circuit is arranged close to the main board and is electrically connected with the main board, so that the integrated circuit can supply power to the main board or can exchange information with the main board.

In addition, since the electronic device provided in the embodiment of the present utility model includes the integrated circuit, the integrated circuit has the beneficial effects, and the electronic device in the embodiment of the present utility model also has the beneficial effects, and is not described herein again.

In addition to the technical problems, technical features constituting the technical solutions, and beneficial effects caused by the technical features of the technical solutions described above, other technical problems that can be solved by the integrated circuit and the electronic device provided by the embodiments of the present utility model, other technical features included in the technical solutions, and beneficial effects caused by the technical features are described in detail in the detailed description.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an integrated circuit according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a plug-in module of an integrated circuit according to an embodiment of the present utility model;

FIG. 3 is a schematic diagram of a pin of an integrated circuit according to an embodiment of the present utility model;

fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present utility model.

Reference numerals illustrate:

a 100-integrated circuit; 110-a circuit board; 111-a first component; 120-plug-in modules; 121-a module circuit board; 122-a second component; 130-pins; 131-first pins; 132-a second pin; 133-limit surface; 134-reinforcement; 140-conductor columns;

200-an electronic device; 210-a housing; 220-motherboard.

Detailed Description

The terminology used in the description of the embodiments of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model, as will be described in detail with reference to the accompanying drawings.

A printed circuit board (Printed circuit boards, abbreviated as PCB), also known as a circuit board or printed circuit board, is a provider of electrical connections for electronic passive components. With the rapid development of electronic technology, printed circuit boards are widely used in various fields, and almost all computing devices include corresponding printed circuit boards. The adoption of the printed circuit board has the main advantages of greatly reducing wiring and assembly errors and improving the automation level and the production labor rate.

As described in the background art, more and more components are arranged on the server board, and the integration level is higher and higher. Taking a primary power supply (220V of commercial power is converted into 48V direct current) of a server as an example, the layout size of the primary power supply is 58mm X mm (the value range of X is 200-300), and the primary power supply comprises a plurality of devices such as a fuse, a piezoresistor, an electromagnetic interference filter, a relay, a power factor correction module, a direct current-direct current converter module, a high-voltage capacitor, a slow start circuit, a control circuit, an auxiliary power supply and the like. So many devices are very difficult to complete layout on a single board with a size of not more than 58mm by 300 mm. In the related art, in order to ensure the smooth layout of devices on a board, part of the devices are made into a plug-in module, and the plug-in module is fixed on the board by pin insertion, and has a space with the board, so that the devices can be laid out between the board and the plug-in module, thereby enlarging the layout space of the board.

However, the length direction of the pins is greater than the thickness direction of the pins, and the arrangement directions of the pins are consistent, so that the load resistance of the pins in the thickness direction is weaker, the reliability of the plug-in module inserted and fixed on the bottom circuit board is low, and the reliability of the integrated circuit in the processes of falling, transportation and the like is low.

Based on the above, the embodiment of the utility model provides an integrated circuit and an electronic device comprising the integrated circuit. The integrated circuit comprises a circuit board, a plug-in module and at least two pins. Through setting up at least two pins on the plug-in components module, make the plug-in components module peg graft on the circuit board through at least two pins, on the one hand, the pin is convenient for not only with the fixed setting of plug-in components module on the circuit board, the location of the plug-in components module of being convenient for moreover to be favorable to improving the installation effectiveness of plug-in components module. On the other hand, the pins can support the plug-in modules, so that the plug-in modules and the circuit board have a distance, components and parts can be distributed between the circuit board and the plug-in modules, the layout space of the circuit board can be enlarged, and the high-density distribution requirement of the circuit board is met.

In addition, the length direction dimension of the pin is larger than the thickness direction dimension of the pin, so that the load resistance of the pin in the length direction is relatively strong. Through setting up the contained angle that has between the length direction of two at least pins to make two at least pins can resist the load of different directions, and then not only be favorable to improving the plug-in components module and peg graft the reliability of fixing on the bottom circuit board, be favorable to improving the integrated circuit and fall, the reliability of transportation scheduling in-process moreover.

The specific structure of the integrated circuit and the electronic device will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic diagram of an integrated circuit 100 according to an embodiment of the utility model. Referring to fig. 1, an embodiment of the present utility model provides an integrated circuit 100, the integrated circuit 100 including, but not limited to, a power module. The embodiment of the utility model takes a power module as an example, and the power module can be used for direct current power supply, slow power start and the like in electronic equipment 200 such as a server, a switch, a computer and the like.

The integrated circuit 100 of the embodiment of the present utility model includes a circuit board 110, a card module 120, and at least two pins 130. The at least two pins 130 are disposed on the card module 120 at intervals, and illustratively, first ends of the at least two pins 130 may be fixedly connected to a surface of the card module 120 facing the circuit board 110 by a soldering manner. The plug-in module 120 is plugged on the circuit board 110 through at least two pins 130, and illustratively, a jack can be arranged on the circuit board 110, an orifice of the jack is positioned on one surface of the circuit board 110 facing the plug-in module 120, and a second end of the pins 130, namely, one end of the pins 130 close to the circuit board 110, can be inserted into the jack for positioning and then welded, so that the connection reliability of the pins 130 and the circuit board 110 is ensured.

In one aspect, the pins 130 not only can fix the card module 120 on the circuit board 110, but also facilitate positioning of the card module 120, thereby facilitating improvement of the installation efficiency of the card module 120. On the other hand, the pins 130 can support the card module 120, so that a space is reserved between the card module 120 and the circuit board 110, and components can be arranged between the circuit board 110 and the card module 120, so that the layout space of the circuit board 110 can be enlarged, and the high-density layout requirement of the circuit board 110 can be met.

In one possible implementation, the pins 130 may be metal pieces, and the card module 120 and the circuit board 110 may be electrically connected through the pins 130, so that not only power transmission and information exchange between the card module 120 and the circuit board 110 may be achieved, but also structural strength and structural reliability of the pins 130 are guaranteed.

In one possible implementation, the pins 130 may include at least one of copper pins, copper alloy pins, aluminum pins, or aluminum alloy pins. In other possible implementations, the pins 130 may also include pins made of other metal materials with good electrical conductivity and high structural strength, so long as the requirements of the present embodiment can be met, which are not listed here. During application, pins with different materials can be selected according to actual needs, so that flexibility of product design is improved.

In one possible implementation, the spacing H between the card module 120 and the circuit board 110 may range from 20mm to 30mm. Illustratively, the spacing H between the card module 120 and the circuit board 110 may be set to be 20mm, 22mm, 24mm, 25mm, 26mm, 28mm, 30mm, or any value between 20mm and 30mm according to actual needs. So that the distance H between the card module 120 and the circuit board 110 can be ensured to be within a proper range.

On the one hand, the distance H between the plug-in module 120 and the circuit board 110 is prevented from being too small, which is beneficial to ensuring that components and devices can be smoothly laid out between the circuit board 110 and the plug-in module 120; on the other hand, the distance H between the card module 120 and the circuit board 110 is prevented from being too large, which is beneficial to ensuring the stability of the card module 120 inserted on the circuit board 110. Further, the layout space of the circuit board 110 can be enlarged, so that the circuit board 110 can meet the requirement of high-density layout.

In one possible implementation, integrated circuit 100 may further include a first component 111, and first component 111 may be disposed on circuit board 110. For example, the first component 111 may be disposed on the circuit board 110 by soldering, or the first component 111 may be disposed on the circuit board 110 by plugging a connector. The first component 111 may be disposed on a side of the circuit board 110 facing the card module 120, or the first component 111 may be disposed on a side of the circuit board 110 facing away from the card module 120.

In some examples, the first components 111 may include a plurality of numbers and a plurality of types, and the plurality of numbers and the plurality of types of first components 111 may be arranged on a surface of the circuit board 110 facing the card module 120 according to actual needs. At least a portion of the first components 111 may be located between the circuit board 110 and the card module 120, and illustratively, at least one first component 111 of the plurality of first components 111 may be located between the circuit board 110 and the card module 120, or a portion of one first component 111 may extend between the circuit board 110 and the card module 120. Therefore, the space between the circuit board 110 and the plug-in module 120 can be utilized, so that more components can be laid out on the circuit board 110, and the requirement of high-density layout is met.

In one possible implementation, the card module 120 may include a module circuit board 121 and a second component 122, and the second component 122 may be disposed on a first of opposite sides of the module circuit board 121. The second component 122 may be disposed on the first surface of the opposite sides of the module circuit board 121 by soldering, or the second component 122 may be disposed on the first surface of the opposite sides of the module circuit board 121 by plugging in a connector.

The second components 122 may include a plurality of numbers and types, and the plurality of numbers and types of second components 122 may be arranged on the first surfaces of the opposite sides of the module circuit board 121 according to actual needs. Therefore, a plurality of second components 122 with different numbers and types can be modularized into a plug-in module 120, so as to be plugged on the circuit board 110 and have a distance from the circuit board 110, and further, the circuit board 110 can be provided with more components, thereby realizing the requirement of high-density layout.

The pins 130 are disposed on a second surface of the opposite surfaces of the module circuit board 121, and the pins 130 are connected with the circuit board 110 in a plugging manner so as to fix the card module 120 on the circuit board 110. So that it is ensured that the second components 122 located at the first of the opposite sides of the module circuit board 121 do not occupy the space between the module circuit board 121 and the circuit board 110.

In one possible implementation, the first component 111 may include at least one of a fuse, a varistor, an electromagnetic interference filter, a relay, a power factor correction module, a high voltage capacitor, a slow start circuit, a control circuit, or an auxiliary power supply. The second component 122 may include at least a transformer. Illustratively, the first component 111 may include a fuse, a varistor, an electromagnetic interference filter, a relay, a power factor correction module, a high voltage electrolytic capacitor, a slow start circuit, a control circuit, and an auxiliary power supply; the second component 122 may include a transformer, a resonant inductance, and a capacitance. Thus, the integrated circuit 100 can be used as a power module of the server or other electronic devices 200, which is beneficial to saving layout space of the server or other electronic devices 200.

Fig. 2 is a schematic structural diagram of a plug-in module 120 of an integrated circuit 100 according to an embodiment of the utility model. Referring to fig. 2, an embodiment of the present utility model provides a card module 120, where the card module 120 includes a module circuit board 121 and a second component 122, and the second component 122 may be disposed on a first surface of two opposite surfaces of the module circuit board 121. The second component 122 may be disposed on the first surface of the opposite sides of the module circuit board 121 by soldering, or the second component 122 may be disposed on the first surface of the opposite sides of the module circuit board 121 by plugging in a connector.

The second components 122 may include a plurality of numbers and types, and the plurality of numbers and types of second components 122 may be arranged on the first surfaces of the opposite sides of the module circuit board 121 according to actual needs. Therefore, a plurality of second components 122 with different numbers and types can be modularized into a plug-in module 120, so as to be plugged on the circuit board 110 and have a distance from the circuit board 110, and further, the circuit board 110 can be provided with more components, thereby realizing the requirement of high-density layout.

At least two pins 130 are disposed on the second of the opposite sides of the module circuit board 121, and illustratively, first ends of the pins 130 in the height direction (see fig. 3) may be soldered to the second of the opposite sides of the module circuit board 121, and second ends of the pins 130 in the height direction may be plugged and soldered to the circuit board 110 to secure the card module 120 to the circuit board 110.

The length direction (see fig. 3) of the pin 130 according to the embodiment of the present utility model is greater than the thickness direction (see fig. 3) of the pin 130, so that the load-resisting capacity of the pin 130 in the length direction is relatively strong. The at least two pins 130 in the embodiment of the present utility model have an included angle between the length directions, so that the at least two pins 130 can resist loads in different directions, which is beneficial to improving the reliability of the plug-in module 120 inserted and fixed on the bottom circuit board 110, and improving the reliability of the integrated circuit 100 in the processes of dropping, transporting, etc.

In one possible implementation, the second of the opposite sides of the module circuit board 121 may further be provided with a conductor post 140, and an end of the conductor post 140 remote from the module circuit board 121 may be connected to and in communication with the circuit board 110, and the conductor post 140 may function not only to support the card module 120, but also to conduct current and signals.

In one possible implementation, the included angle between the length directions of at least two pins 130 may range from 15 ° to 90 °. For example, the included angle between the length directions of the at least two pins 130 may be set to be 15 °, 30 °, 45 °, 60 °, 75 °, 90 °, or any value between 15 ° and 90 ° according to the stress sensitive direction source in the application scenario. Therefore, the included angle between the length directions of the at least two pins 130 can be ensured to be in a proper range, so that the too small included angle between the length directions of the at least two pins 130 can be avoided, and the effect of resisting loads in different directions of the at least two pins 130 can be ensured.

In an implementation manner of the embodiment of the present utility model, as shown in fig. 2, the pins 130 may include four first pins 131 and four second pins 132, the length directions of the four first pins 131 are parallel to each other, the length directions of the four second pins 132 are parallel to each other, and an included angle between the length directions of the first pins 131 and the length directions of the second pins 132 is 90 °. So that at least two pins 130 can resist loads in two directions perpendicular to each other, thereby facilitating improvement of reliability in dropping, transportation, etc. of integrated circuit 100.

In the related art, the length direction of the second pin is identical to the length direction of the first pin. By simulating and comparing the capability of the related technology and the embodiment of the utility model for resisting the free vibration load of the first pin in the thickness direction, the pin stress of the related technology is 85MPa, and the pin stress of the embodiment of the utility model is reduced to 4MPa, so that the capability of the embodiment of the utility model for resisting the free vibration load of the first pin in the thickness direction is greatly improved.

In one possible implementation, the pins 130 may include a plurality of first pins 131 and a plurality of second pins 132, where an angle is formed between a length direction of the first pins 131 and a length direction of the second pins 132, and the number of the first pins 131 and the number of the second pins 132 may be equal or unequal. Therefore, not only the included angle between the length direction of the first pin 131 and the length direction of the second pin 132 can be adjusted according to the load direction to be borne by the integrated circuit 100, but also the number of the first pin 131 and the second pin 132 can be distributed according to the load intensities of different directions to be borne by the integrated circuit 100.

In one possible implementation, the first pins 131 and the second pins 132 may be alternately arranged, thereby facilitating an increase in the effect of the integrated circuit 100 against loads in different directions. For example, one, two or more second pins 132 may be arranged between two adjacent first pins 131. Alternatively, one, two or more first pins 131 may be arranged between two adjacent second pins 132. Alternatively, the first pins 131 and the second pins 132 may be alternately arranged in a loop shape in order of two. In addition, the number and arrangement of the first pins 131 and the second pins 132 may be set according to actual needs, and are not particularly limited herein.

In one possible implementation, the dimension of the pins 130 in the thickness direction may range from 0.3mm to 0.7mm. Illustratively, the dimension of the thickness direction of the pins 130 may be set to be 0.3mm, 0.5mm, 0.7mm or any value between 0.3mm and 0.7mm, usually 0.5mm, according to actual needs. Therefore, the thickness of the pins 130 can be ensured to be in a proper range so as to ensure the strength of the pins 130, and the pins 130 with different thicknesses can be selected according to actual needs so as to improve the flexibility of product design.

In one possible implementation, the length of the pins 130 may range in size from 5mm to 15mm. Illustratively, the length dimension of the pins 130 may be set to 5mm, 7mm, 10mm, 13mm, 15mm, or any value between 5mm and 15mm, as desired. Therefore, the length of the pins 130 can be ensured to be in a proper range, so that the load resistance of the pins 130 in the length direction is ensured, and the pins 130 with different lengths can be selected according to actual needs, so that the flexibility of product design is improved.

Fig. 3 is a schematic diagram of a structure of a pin 130 of an integrated circuit 100 according to an embodiment of the utility model. Referring to fig. 3, an embodiment of the present utility model provides a pin 130, wherein a first end of two opposite ends of the pin 130 in a height direction is fixedly connected with a card module 120, and a second end (an end close to the circuit board 110) of the two opposite ends of the pin 130 in the height direction can be inserted into and soldered to a socket of the circuit board 110.

The outer circumference of the pin 130 may be provided with a limiting surface 133, the limiting surface 133 facing the circuit board 110, and the limiting surface 133 may abut against an aperture edge of the receptacle when the second end of the pin 130 is inserted into the receptacle of the circuit board 110. Therefore, the depth of the pins 130 inserted into the jacks can be limited, the distance between the plug-in module 120 and the circuit board 110 is ensured, and the protection of components between the circuit board 110 and the plug-in module 120 is facilitated.

In one possible implementation, the first end (the end near the card module 120) of the pin 130 may be provided with a reinforcement portion 134, and the reinforcement portion 134 may be located on one side of the thickness direction of the pin 130, or the reinforcement portion 134 may be located on opposite sides of the thickness direction of the pin 130, so as to facilitate improving stability and reliability of the placement of the pin 130 on the card module 120. Illustratively, the pins 130 and the reinforcement 134 may be an integral piece.

Fig. 4 is a schematic structural diagram of an electronic device 200 according to an embodiment of the utility model. Referring to fig. 4, an embodiment of the present utility model provides an electronic device 200, where the electronic device 200 includes, but is not limited to, a server, a switch, a computer, and the like.

The electronic device 200 according to the embodiment of the present utility model may include the motherboard 220 and the above-mentioned integrated circuit 100, and the integrated circuit 100 may be disposed near the motherboard 220, and for example, the integrated circuit 100 may be disposed on the upper side, the lower side, the left side, or the right side of the motherboard 220 according to actual needs. The integrated circuit 100 is electrically connected to the motherboard 220, and the integrated circuit 100 may be electrically connected to the motherboard 220 by a cable, for example.

In one possible implementation, the electronic device 200 of the embodiment of the present utility model may further include a housing 210, and the motherboard 220 and the integrated circuit 100 may be disposed in the housing 210, so that the housing 210 may form protection for the motherboard 220 and the integrated circuit 100.

In the electronic device 200 provided by the embodiment of the utility model, the integrated circuit 100 is disposed close to the motherboard 220, and the integrated circuit 100 is electrically connected with the motherboard 220, so that the integrated circuit 100 can supply power to the motherboard 220, or the integrated circuit 100 can perform signal mutual transmission with the motherboard 220.

In addition, since the electronic device 200 provided in the embodiment of the present utility model includes the integrated circuit 100, the integrated circuit 100 has the beneficial effects, and the electronic device 200 in the embodiment of the present utility model also has the beneficial effects, and is not described herein again.

It should be noted that, the parallel, vertical, numerical and numerical ranges related to the embodiments of the present utility model are approximate values, and may have a certain range of errors under the influence of the manufacturing process, and those errors may be considered to be negligible by those skilled in the art.

In the description of the present utility model, it should be noted that the positional or positional relationship indicated by "top", "bottom", "upper", "lower", "left", "right", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience in describing the embodiments of the present disclosure and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present disclosure.

In describing embodiments of the present utility model, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "coupled" should be construed broadly, and may be, for example, fixedly coupled, indirectly coupled through an intermediary, in communication between two elements, or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.

The terms "comprises," "comprising," "includes," "including," "having," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.

The terms first, second, third, fourth and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the embodiments of the present utility model, and are not limited thereto. Although embodiments of the present utility model have been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments may be modified or some or all of the technical features may be replaced with equivalents. Such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present utility model.

Claims (14)

1. An integrated circuit, comprising: the circuit board, the plug-in module and at least two pins;

the at least two pins are arranged on the plug-in module at intervals, the plug-in module is plugged on the circuit board through the at least two pins, and a space is reserved between the plug-in module and the circuit board;

the length direction of the pins is larger than the thickness direction of the pins, and an included angle is formed between at least two of the pins in the length direction.

2. The integrated circuit of claim 1, wherein the included angle is in a range of 15 ° to 90 °.

3. The integrated circuit of claim 1, wherein the pins comprise at least a first pin and a second pin, an included angle is formed between a length direction of the first pin and a length direction of the second pin, and a number of the first pins is equal to a number of the second pins.

4. The integrated circuit of claim 3, wherein the first pins and the second pins are arranged alternately.

5. The integrated circuit of claim 1, wherein the dimension of the pins in the thickness direction ranges from 0.3mm to 0.7mm;

and/or the size range of the length direction of the pin is 5mm to 15mm.

6. The integrated circuit of claim 1, wherein the pins are metal pieces, and the card module and the circuit board are electrically connected through the pins.

7. The integrated circuit of claim 6, wherein the pins comprise at least one of copper pins, copper alloy pins, aluminum pins, or aluminum alloy pins.

8. The integrated circuit of claim 1, wherein the pitch ranges from 20mm to 30mm.

9. The integrated circuit of any one of claims 1-8, wherein the circuit board is provided with a jack, an aperture of the jack is positioned on a face of the circuit board facing the plug-in module, and the pin is inserted into and soldered in the jack near an end of the circuit board;

the periphery of pin is provided with the spacing face, spacing face with the drill way edge butt of jack.

10. The integrated circuit of any one of claims 1-8, wherein an end of the pin adjacent to the interposer module is provided with a stiffener portion, the stiffener portion being located on at least one side of the pin in a thickness direction.

11. The integrated circuit of any of claims 1-8, further comprising a first component disposed on the circuit board, at least a portion of the first component being located between the circuit board and the interposer module.

12. The integrated circuit of claim 11, wherein the interposer module includes a module circuit board and a second component disposed on a first one of opposite sides of the module circuit board, the pin disposed on a second one of opposite sides of the module circuit board.

13. The integrated circuit of claim 12, wherein the first component comprises at least one of a fuse, a varistor, an electromagnetic interference filter, a relay, a power factor correction module, a high voltage electrolytic capacitor, a slow start circuit, a control circuit, or an auxiliary power supply; the second component comprises at least a transformer.

14. An electronic device comprising a motherboard and an integrated circuit as claimed in any one of claims 1 to 13, said integrated circuit being disposed adjacent to said motherboard and said integrated circuit being electrically connected to said motherboard.