CN216958462U - Novel low-pass filter - Google Patents
Novel low-pass filter Download PDFInfo
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- CN216958462U CN216958462U CN202220995076.2U CN202220995076U CN216958462U CN 216958462 U CN216958462 U CN 216958462U CN 202220995076 U CN202220995076 U CN 202220995076U CN 216958462 U CN216958462 U CN 216958462U
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- additional capacitance
- pass filter
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- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000003990 capacitor Substances 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
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Abstract
The utility model discloses a novel low-pass filter, which comprises a metal container and a printed circuit board arranged in a cavity of the metal container, wherein: the printed circuit board comprises a micro-strip layer, wherein a micro-strip is arranged on the micro-strip layer and comprises a plurality of high-impedance lines and low-impedance lines, and the high-impedance lines and the low-impedance lines are alternately connected end to end; the printed circuit board further comprises a first additional capacitance layer and a second additional capacitance layer, wherein the first additional capacitance layer and the second additional capacitance layer are respectively covered on the microstrip layer at two sides of the microstrip layer.
Description
Technical Field
The utility model relates to the technical field of microwave communication, in particular to a novel low-pass filter.
Background
The low-pass filter is a common device of microwave communication equipment, can effectively improve the anti-interference capability of the equipment, is mostly realized by etching a microstrip layer with high and low impedance lines on a printed circuit board, however, if the existing printed circuit board low-pass filter is only provided with the microstrip layer and a grounding layer, the whole size of the existing printed circuit board low-pass filter is larger, and the requirement of high density and small integration cannot be met.
Therefore, the utility model provides a novel low-pass filter which can well solve the problems.
SUMMERY OF THE UTILITY MODEL
In order to realize the purpose of the utility model, the following technical scheme is adopted for realizing the purpose:
a novel low pass filter comprises a metal container and a printed circuit board installed in the cavity of the metal container, wherein: the printed circuit board comprises a micro-strip layer, a micro-strip is distributed on the micro-strip layer, the micro-strip comprises a plurality of high-impedance lines and low-impedance lines, and the high-impedance lines and the low-impedance lines are alternately connected end to end; the printed circuit board further comprises a first additional capacitance layer and a second additional capacitance layer, wherein the first additional capacitance layer and the second additional capacitance layer are respectively covered on the microstrip layer at two sides of the microstrip layer.
The novel low-pass filter, wherein: two rows of grounding holes are densely arranged on the edges of two sides of the micro-strip layer, and the micro-strips are arranged at the centers of the two rows of grounding holes.
The novel low-pass filter, wherein: the first additional capacitance layer and the second additional capacitance layer each include a plurality of metal strips disposed in parallel with each other at a predetermined distance.
The novel low-pass filter, wherein: the metal strap has a width that extends across the width of the first and second additional capacitive layers and a height that is the same as the height of the low impedance line in the microstrip layer.
The novel low-pass filter, wherein: the plurality of metal strips on the first additional capacitance layer and the second additional capacitance layer are sequentially overlapped with the plurality of low impedance lines on the microstrip layer.
The novel low-pass filter, wherein: and two side edges of the first additional capacitor layer and the second additional capacitor layer are respectively densely provided with a row of grounding holes.
The novel low-pass filter, wherein: the novel low-pass filter also comprises a first grounding layer and a second grounding layer, wherein the first grounding layer covers the first additional capacitance layer outside the first additional capacitance layer, the second grounding layer covers the second additional capacitance layer outside the second additional capacitance layer, and two side edges of the first grounding layer and the second grounding layer are respectively densely arranged with a row of grounding holes; the first ground layer and/or the second ground layer are soldered to the metal container.
The novel low-pass filter, wherein: the first ground layer, the first additional capacitance layer, the micro-strip layer, the second additional capacitance layer and the second ground layer are electrically connected with each other through a ground hole penetrating from top to bottom.
The novel low-pass filter, wherein: the two ends of the microstrip layer are high-impedance lines.
The novel low-pass filter, wherein: and connecting terminals are arranged at two ends of the metal container and are electrically connected with the microstrip layer.
Drawings
FIG. 1 is a schematic diagram of a novel low-pass filtering structure;
FIG. 2 is a schematic diagram of a microstrip layer structure;
FIG. 3 is a schematic diagram of a capacitor layer structure;
fig. 4 is a schematic diagram of a ground layer structure.
Detailed Description
The following detailed description of the present invention will be made with reference to the accompanying drawings 1-4.
As shown in fig. 1, the novel low-pass filter includes a metal container 1 and a printed circuit board 2 installed in a cavity of the metal container 1, the printed circuit board 2 includes a microstrip layer, the microstrip layer is provided with a microstrip, the microstrip layer includes a plurality of high impedance lines 4 and low impedance lines 3, the high impedance lines 4 and the low impedance lines 3 are alternately connected end to end, and both ends of the microstrip layer are provided with the high impedance lines 4; the two ends of the metal container 1 are provided with connecting terminals 5 which are electrically connected with the microstrip layer.
The printed circuit board 2 of the present invention comprises the following 5 layers: the printed circuit board comprises a micro-strip layer positioned in the center of the printed circuit board 2, a first additional capacitor layer and a second additional capacitor layer which are respectively covered on the micro-strip layer at two sides of the micro-strip layer, a first grounding layer covering the first additional capacitor layer at the outer side of the first additional capacitor layer and a second grounding layer covering the second additional capacitor layer at the outer side of the second additional capacitor layer.
As shown in fig. 2, two side edges of the microstrip layer are densely arranged with a row of grounding holes 6, and the microstrip is disposed at the center of the two rows of grounding holes.
The first additional capacitance layer and the second additional capacitance layer have the same structure, as shown in fig. 3, the additional capacitance layer comprises a plurality of metal strips 7, the metal strips 7 are formed by copper-clad layers, the metal strips 7 are arranged in parallel at a predetermined distance, the width of the metal strips 7 traverses the width of the whole additional capacitance layer, the height of the metal strips is the same as the height of the low impedance line 3 in the microstrip layer, and after the first additional capacitance layer and the second additional capacitance layer are covered on both sides of the microstrip layer, the metal strips 7 are sequentially overlapped with the low impedance line 3; and a row of grounding holes 6 are densely arranged on the two side edges of the additional capacitance layer.
The first ground plane and the second ground plane have the same structure, and as shown in fig. 4, a row of ground holes 6 is densely arranged on both side edges of the ground plane. The grounding layer is a whole copper-clad layer, and the grounding hole is directly formed on the copper-clad layer. The ground plane is eventually soldered to the housing of the metal container.
The grounding holes of the first grounding layer, the first additional capacitance layer, the micro-strip layer, the second additional capacitance layer and the second grounding layer in the printed circuit board 2 are respectively opposite in sequence to form a grounding hole which is penetrated up and down, and a copper layer is plated in the grounding hole which is penetrated up and down to electrically connect the layers.
According to the utility model, the capacitance value can be further increased by adding the additional capacitance layer at the low-resistance part with high and low impedance to be grounded, so that the integral miniaturization of the low-pass filter is realized.
Claims (10)
1. The utility model provides a novel low pass filter, includes metal container and installs the printed circuit board in the metal container cavity, its characterized in that: the printed circuit board comprises a micro-strip layer, a micro-strip is distributed on the micro-strip layer, the micro-strip comprises a plurality of high-impedance lines and low-impedance lines, and the high-impedance lines and the low-impedance lines are alternately connected end to end; the printed circuit board further comprises a first additional capacitance layer and a second additional capacitance layer, wherein the first additional capacitance layer and the second additional capacitance layer are respectively covered on the microstrip layer at two sides of the microstrip layer.
2. The novel low pass filter of claim 1, characterized in that: two rows of grounding holes are densely arranged on the edges of two sides of the micro-strip layer, and the micro-strips are arranged at the centers of the two rows of grounding holes.
3. The novel low pass filter of claim 1, characterized in that: the first additional capacitance layer and the second additional capacitance layer each include a plurality of metal strips disposed in parallel with each other at a predetermined distance.
4. A novel low-pass filter according to claim 3, characterized in that: the metal strap has a width that extends across the width of the first and second additional capacitive layers and a height that is the same as the height of the low impedance line in the microstrip layer.
5. A novel low-pass filter according to claim 3, characterized in that: the plurality of metal strips on the first additional capacitance layer and the second additional capacitance layer are sequentially overlapped with the plurality of low impedance lines on the microstrip layer.
6. A novel low-pass filter according to claim 3, characterized in that: and two side edges of the first additional capacitor layer and the second additional capacitor layer are respectively densely provided with a row of grounding holes.
7. A novel low-pass filter according to any one of claims 1 to 3, characterized in that: the novel low-pass filter also comprises a first grounding layer and a second grounding layer, wherein the first grounding layer covers the first additional capacitance layer outside the first additional capacitance layer, the second grounding layer covers the second additional capacitance layer outside the second additional capacitance layer, and two side edges of the first grounding layer and the second grounding layer are respectively densely arranged with a row of grounding holes; the first ground plane and/or the second ground plane are soldered to the metal container.
8. The novel low pass filter of claim 7, characterized in that: the first ground layer, the first additional capacitance layer, the micro-strip layer, the second additional capacitance layer and the second ground layer are electrically connected with each other through a ground hole penetrating from top to bottom.
9. The novel low pass filter of claim 1, characterized in that: the two ends of the microstrip layer are high-impedance lines.
10. A novel low-pass filter according to claim 1, characterized in that: and the two ends of the metal container are provided with connecting terminals which are electrically connected with the microstrip layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220995076.2U CN216958462U (en) | 2022-04-27 | 2022-04-27 | Novel low-pass filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220995076.2U CN216958462U (en) | 2022-04-27 | 2022-04-27 | Novel low-pass filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216958462U true CN216958462U (en) | 2022-07-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220995076.2U Active CN216958462U (en) | 2022-04-27 | 2022-04-27 | Novel low-pass filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216958462U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116666928A (en) * | 2023-07-26 | 2023-08-29 | 成都世源频控技术股份有限公司 | Mixed resonance adjustable microstrip low-pass filter |
-
2022
- 2022-04-27 CN CN202220995076.2U patent/CN216958462U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116666928A (en) * | 2023-07-26 | 2023-08-29 | 成都世源频控技术股份有限公司 | Mixed resonance adjustable microstrip low-pass filter |
| CN116666928B (en) * | 2023-07-26 | 2023-10-13 | 成都世源频控技术股份有限公司 | Mixed resonance adjustable microstrip low-pass filter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new type of low-pass filter Granted publication date: 20220712 Pledgee: Bank of Shanghai Limited by Share Ltd. Qingpu branch Pledgor: Shanghai Yibo Yili Technology Co.,Ltd. Registration number: Y2024310000395 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |