KR101308485B1 - Copper-clad laminate manufacture method and printed circuit board using copper-clad laminate - Google Patents

Abstract

The present invention, in order to overcome the problem of difficult to form the aluminum surface layer on the copper circuit, the copper-clad laminate is subjected to a process such as cleaning, roughening, jinkate or copper sputtering, copper plating, blackening and resin pressing on the matt surface of the aluminum foil The present invention relates to a technology capable of manufacturing a printed circuit board which can have an aluminum surface layer and can induce high brightness of an LED through the glossy surface layer.

Description

Manufacturing method of copper clad laminate with aluminum surface layer and printed circuit board using copper clad laminate {COPPER-CLAD LAMINATE MANUFACTURE METHOD AND PRINTED CIRCUIT BOARD USING COPPER-CLAD LAMINATE}

The present invention has a method of manufacturing a copper clad laminate having an aluminum layer on the surface layer by plating copper on aluminum foil, which is widely used in homes or industries, and then attaching it to an insulating resin, and a high brightness aluminum surface layer using the copper clad laminate produced thereby. It is a technology related to a printed circuit board.

In general, a printed circuit disc is produced by attaching a resin such as epoxy, bakelite, polyimide, etc. as an insulating layer and attaching copper foil, which is a conductor, to one or both surfaces thereof.

First, an impregnating material such as epoxy resin, bakelite resin or polyimide resin is impregnated into glass fiber, paper, etc., and then copper foil is pressed on one side or both sides by high temperature and high pressure.

These general discs are mainly used for the manufacture of printed circuit boards, but there are limitations depending on the use. In particular, LED substrates require high-brightness metal surface treatment, of which aluminum is suitable, but there is no method of coating aluminum on copper circuits. The commonly used surface treatment method is plating on a copper circuit, but aluminum is a metal that cannot be plated or is very difficult.

In order to solve this problem, Korean Patent Registration No. 10-0371222 (registered on Jan. 23, 2003, hereinafter referred to as 'advanced technology') `` Copper plating method of aluminum- and silicon-based alloy powder '' has been proposed.

The prior art is to copper plating the aluminum (Al) -based and silicon (Si) -based alloy powder using an ion-substituted plating method of the plating solution for ion exchange of the aluminum (Al) -based and silicon (Si) -based alloy powder Although it is a technology characterized by using a hydrofluoric acid (HF) solution as the main additive,

Folic acid, the main additive, has a high safety accident rate, poor working environment, generation of hydrofluoric acid gas, excessive wastewater treatment cost, and wastewater treatment.

According to the present invention, copper plated on aluminum foil by copper plating after performing a process such as cleaning, roughening, quenching or copper sputtering on a matte surface of aluminum foil, in particular, it is possible to manufacture a copper clad laminate having an aluminum surface layer. It is an object of the present invention to provide a method for producing a copper clad laminate.

Another object of the present invention is to manufacture a printed circuit board for LED using the manufactured copper-clad laminate, and in particular, to provide a printed circuit board capable of inducing high brightness through a glossy surface of aluminum foil.

In order to solve the above problems, a method for manufacturing a copper clad laminate having an aluminum surface layer according to the present invention,

Preparing a metal foil having a matt surface on one surface and a glossy surface on the other surface;

Washing the matt surface of the metal foil with a degreasing agent;

Forming a roughened surface by soft etching on the cleaned matte surface;

Forming a zincate layer or a copper sputtering layer on the roughened surface by zincate or copper sputtering;

Forming a copper plating layer on the zincate layer or the copper sputtering layer by an electroless or electrolytic method;

Forming a blackening layer on the plating layer; And

Forming a resin layer by compressing the insulating resin at high temperature and high pressure on the blackening layer;

.

The metal foil is made of one selected from aluminum, iron, cadmium, magnesium, lithium, beryllium, titanium, zinc, chromium, cobalt, indium, bismuth or an alloy of one selected, preferably aluminum.

And prior to the cleaning step, the step of adhering the protective film on the glossy surface of the metal foil,

After the blackening layer forming step, characterized in that it further comprises the step of removing the protective film.

On the other hand, in order to solve the above problems, a printed circuit board using a copper clad laminate having an aluminum surface layer according to the present invention,

In the copper clad laminate according to the manufacturing method,

Forming a photoresist layer on the glossy surface of the metal foil;

Developing the photoresist layer in a predetermined pattern;

Etching the area available by the developing step;

Peeling off the photoresist layer of the insoluble region; And

Forming a solder resist layer on the resin layer;

.

The method of manufacturing a copper clad laminate having an aluminum surface layer and a printed circuit board using the copper clad laminate according to the present invention,

By plating copper on the aluminum foil and inducing high brightness of the LED by using the glossy surface of the aluminum foil, there is the greatest effect that can produce a printed circuit board for LED of excellent quality and high performance.

1 and 2 is a view showing a copper clad laminate manufacturing method according to the present invention,
Figure 3 is a view showing a printed circuit board manufacturing method using a copper clad laminate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately It should be interpreted in accordance with the meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and are not intended to represent all of the technical ideas of the present invention. Therefore, various equivalents It should be understood that water and variations may be present.

As shown in Fig. 1 to 2, the copper clad laminate manufacturing method having an aluminum surface layer according to the present invention,

It consists of a metal foil preparation step, a washing step, a roughened surface forming step, a zincate layer or a copper sputtering layer forming step, a copper plating layer forming step, a blackening layer forming step and a resin layer forming step.

Looking at each step,

The metal foil preparation step

As shown in [a] of FIG. 1,

It is a step of preparing a metal foil (1) having a matt surface on one surface and a glossy surface on the other surface.

The cleaning step

As shown in [I] of FIG. 1,

Prior to the rough surface forming step, it is a step of cleaning the matt surface of the metal foil 1 using a degreasing agent or the like.

The rough surface forming step

As shown in [C] of FIG. 1,

Forming a roughened surface 2 by soft etching on the washed matte surface,

The matte surface is etched with a liquid containing an oxidizing agent to cause surface roughening and chemical change, thereby improving the adhesion of plating.

The gating layer or copper sputtering layer forming step

As shown in [D] of FIG. 1,

Forming a relay layer (3) for enhancing the bonding force between the roughened surface (2) and the copper plating layer (4) to be described later,

The relay layer 3 is made of a zinc oxide layer or a copper sputtering layer formed on the roughened surface 2 by zincate or copper sputtering.

The quenching treatment is a pretreatment in the case of plating on an aluminum material, and refers to a treatment of depositing zinc by depositing the zinc quench solution [NaOH, ZnO (ZincO)]. In this case, nickel salt, copper salt, etc. may be blended to improve adhesion.

The copper sputtering process is a kind of vacuum deposition method that refers to a method of generating a film on a substrate in the vicinity of the target atom by ejecting a target atom by accelerating a gas such as argon ionized by generating a plasma at a relatively low vacuum degree and impinging on a target.

The copper plating layer forming step

As shown in [e] of FIG.

Forming a copper plating layer 4 on the relay layer 3 by an electroless or electrolytic method,

Electroless plating is a plating method in which a reducing agent component is included in a plating solution component so that the metal is plated while the metal is reduced by the reducing agent. In other words, unlike electroplating, it is a plating method using a chemical action that uses a reducing agent as a source of electrons instead of electricity without using electricity. It is more difficult to manage the solution than electrolytic plating, but there is an advantage that the thickness of the plating is constant.

Meanwhile, electroplating is an electroplating method in which an anode and a cathode are divided and plating while supplying electricity to an electrode continuously. In other words, it is an electroplating method in which a thin film of another metal is coated on the surface of a metal using the principle of electrolysis.

The blackening layer forming step

As shown in [bar] of FIG.

Forming a blackening layer 5 on the plating layer 4,

Here, the blackening treatment (Oxide) to improve the adhesion between the layers to provide durability to withstand thermal shock and physical shock,

The blackening treatment is a chemical treatment method for forming a roughness (blackening layer) on the surface of the plating layer 4.

That is, the surface of the copper plating layer 4 is oxidized to Cu2O and CuO. At this time, the roughness is formed and the surface area is increased to improve adhesion to the resin layer 6 which is a later process.

The resin layer forming step

As shown in [a] of Fig. 2,

The resin layer 6 is formed by compressing the insulating resin at high temperature and high pressure on the blackening layer 5.

In the method for manufacturing a copper clad laminate having an aluminum surface layer according to the present invention

The metal foil 1 may be one selected from aluminum, iron, cadmium, magnesium, lithium, beryllium, titanium, zinc, chromium, cobalt, indium, bismuth, or an alloy of one selected.

In particular, in the present invention, the printed circuit board for LED (LED) is manufactured using the copper-clad laminate, it is preferable that the metal foil (1) is aluminum so as to induce high brightness of the LED through the aluminum foil (aluminum foil).

In the method for manufacturing a copper clad laminate having an aluminum surface layer according to the present invention

Adhering the protective film 7 to the glossy surface of the metal foil 1 before the cleaning step as shown in [a] of FIG. 1;

After the blackening layer 5 forming step as shown in [g] of FIG. 2, the method further includes removing the protective film 7.

The protective film 7 adhered in the protective film adhesion step serves as a carrier to prevent damage to the glossy surface of the metal foil 1 and to proceed with the subsequent process.

On the other hand, a printed circuit board using a copper clad laminate having an aluminum surface layer according to the present invention,

As shown in Figure 3,

In the copper clad laminate (B),

Forming a photoresist layer 10 on the glossy surface of the metal foil 1,

Developing the photoresist layer 10 in a predetermined pattern;

Etching the area available by the developing step,

Peeling off the photoresist layer 10 in the insoluble region, and

Forming a solder resist layer 20 on the resin layer 6

.

As shown in [a] of FIG. 3, the photoresist layer forming step is a step of forming a photoresist layer 10, which is a mixture of a polymer and a photosensitizer, on the glossy surface of the metal foil 1.

As shown in [b] of FIG. 3, the developing step is a step in which a predetermined pattern is formed as the photoresist layer 10 is irradiated with light and the light-receiving portion becomes insoluble or soluble in the developing solution.

As shown in [c] of FIG. 3, the etching step is to etch the regions available by the developing step.

As shown in [d] of FIG. 3, the peeling step is a step of peeling the photoresist layer 10 in an insoluble region, and a solvent type resist is developed with 1,1,1-trichloroethane and methylene chloride. Or peeled off with a solvent of methylene chloride and methanol. The water-soluble resist is developed with an aqueous sodium carbonate solution and peeled off with sodium hydroxide or potassium hydroxide. In the present invention, since aluminum is etched even in acid and alkali, a solvent type resist and a stripping solution are used.

As shown in [ㅁ] of FIG. 3, the printing step is a step of forming a solder resist layer 20 on the resin layer 6,

Solder Resist is a layer of insulating permanent coating material that covers wiring circuits to prevent unintentional connections caused by soldering when the components are mounted. It is also called a solder mask because it shields all but the periphery.

Therefore, the solder resist layer 20 prevents short circuit, lamination, corrosion, and contamination of the printed circuit board, and remains as a film on the substrate even after fabrication of the printed circuit board to protect ash from external impact, moisture, and chemicals.

Meanwhile, after the soldering resist layer 20 forming step, a printing operation step may be further performed. In the printing operation step, a green color is typically used to protect a circuit formed on a substrate and to prevent short and interference occurring during post-working. As a process of applying the rest of the part except for the pad, hole, reference point on which the part is mounted, the method further includes a printing process such as a letter mark and a logo for indicating the position of the part, identifying the use.

Although not shown in the drawings, a hole for mounting a component such as an LED is further included between the peeling step and the solder resist layer forming and printing operation step.

Eventually, after the circuit is formed by etching, holes (holes) for mounting parts can be machined by a drill and a press.

In the above description, the present invention has been described with reference to the accompanying drawings based on "a method of manufacturing a copper-clad laminate having an aluminum surface layer and a printed circuit board using copper-clad laminates" having a specific shape and structure. And variations are possible, and such variations and modifications should be construed as falling within the protection scope of the present invention.

B: Copper Clad Laminate
1: metal foil
2: landscape
3: middle layer
4: plating layer
5: blackening layer
6: resin layer
7: protective film
10: photoresist layer
20: solder resist layer

Claims (5)

Preparing a metal foil having a matt surface on one surface and a glossy surface on the other surface;
Washing the matt surface of the metal foil with a degreasing agent;
Forming a roughened surface by soft etching on the cleaned matte surface;
Forming a zincate layer or a copper sputtering layer on the roughened surface by zincate or copper sputtering;
Forming a copper plating layer on the zincate layer or the copper sputtering layer by an electroless or electrolytic method;
Forming a blackening layer on the plating layer; And
Forming a resin layer by compressing the insulating resin at high temperature and high pressure on the blackening layer;
Copper clad laminate manufacturing method comprising a.
The method of claim 1,
The metal foil is a copper clad laminate manufacturing method, characterized in that made of one or selected alloys of aluminum, iron, cadmium, magnesium, lithium, beryllium, titanium, zinc, chromium, cobalt, indium, bismuth.
3. The method of claim 2,
The metal foil is a copper clad laminated board manufacturing method having an aluminum surface layer, characterized in that the aluminum.
The method of claim 3, wherein
Prior to the cleaning step, the step of adhering a protective film on the glossy surface of the metal foil,
After the blackening layer forming step, the method of manufacturing a copper clad laminate having an aluminum surface layer further comprising the step of removing the protective film.
Forming a photoresist layer on the metal foil glossy surface of the copper clad laminate according to any one of claims 1 to 4;
Developing the photoresist layer in a predetermined pattern;
Etching the area available by the developing step;
Peeling off the photoresist layer of the insoluble region; And
Forming a solder resist layer on the resin layer;
Printed circuit board using a copper clad laminate having an aluminum surface layer comprising a.

Images