CN104812158B - The substrate of the anti-method for being layered plate bursting of circuit board, the preparation method of circuit board and circuit board - Google Patents

The substrate of the anti-method for being layered plate bursting of circuit board, the preparation method of circuit board and circuit board Download PDF

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Publication number
CN104812158B
CN104812158B CN201410041078.8A CN201410041078A CN104812158B CN 104812158 B CN104812158 B CN 104812158B CN 201410041078 A CN201410041078 A CN 201410041078A CN 104812158 B CN104812158 B CN 104812158B
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CN
China
Prior art keywords
substrate
circuit board
isolation channel
base plate
stationary
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Expired - Fee Related
Application number
CN201410041078.8A
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Chinese (zh)
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CN104812158A (en
Inventor
李睿智
何国辉
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Hangzhou Fangzheng Su'neng Technology Co Ltd
Peking University Founder Group Co Ltd
Original Assignee
Hangzhou Fangzheng Su'neng Technology Co Ltd
Peking University Founder Group Co Ltd
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Priority to CN201410041078.8A priority Critical patent/CN104812158B/en
Publication of CN104812158A publication Critical patent/CN104812158A/en
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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Abstract

The invention provides method, a kind of preparation method of circuit board and a kind of substrate of circuit board of a kind of anti-layering plate bursting of circuit board.The method of the anti-layering plate bursting of circuit board includes:Isolation channel is opened up at base plate stationary part on the substrate of circuit board, isolation channel can be by base plate stationary part with being separated inside substrate.The method of the anti-layering plate bursting of circuit board provided by the invention, the isolation channel opened up on the substrate of circuit board is by base plate stationary part with being separated inside substrate, transmitted come stress caused by preventing at base plate stationary part to the inside of substrate, the problem of so as to effectively avoid occurring plate bursting layering.

Description

The anti-layering method of plate bursting of circuit board, the preparation method of circuit board and circuit board Substrate
Technical field
The present invention relates to printed circuit board (PCB) to manufacture field, in particular to a kind of anti-layering plate bursting of circuit board Method, comprising the circuit board it is anti-layering plate bursting method a kind of circuit board preparation method and a kind of substrate of circuit board.
Background technology
At present, after pressing making is carried out to multi-layer PCB (Printed Circuit Board, printed wiring board), need PCB is carried out spraying tin processing.When carrying out spray tin to PCB, each laminate by different degrees of thermal shock due to being produced not Same stress, the stress easily strut the Coating combination of circuit board, so as to cause to produce separation between PCB each layer, i.e., so-called Plate bursting layering.PCB has the part of fastening effect by multiple completion graphic makings when pressing making, using rivet etc. Straton plate and outer layer daughter board stake-fastening and then press to make by hot pressing and suppress PCB, the machine having due to rivet itself Tool intensity is supported to PCB, the insufficient pressure for causing the multi-layer sheet around rivet to be subject in heat cure in bonding processes, So as to influence the adhesion between each layer, the poor region of adhesion is extended from rivet hole to surrounding between each layer.Carry out spray tin During processing, in high temperature environments, due to the heated difference of PCB layers of materials(Outer layer is heated to be more than internal layer)Cause deformation different, shape It is just different to become the stress of different each interlayers, so, occurs lamination at the position of adhesion difference first and expands around rapidly Exhibition produces plate bursting layering, causes PCB to scrap.Prior art in order to overcome this problem using before tin is sprayed increase drying-plate stream Journey, PCB is preheated, be layered with reducing plate bursting caused by the shock heating caused unbalanced stresses of spray Xi Shiyin, but this method can increase Production procedure and extend the friendship phase.
The content of the invention
For solve above-mentioned technical problem or at least one, the invention provides a kind of circuit board it is anti-layering plate bursting side Method, by way of increasing isolation channel at base plate stationary part, transmitted come stress caused by preventing at substrate to the inside of substrate, The problem of so as to effectively avoid occurring plate bursting layering.
In view of this, the method that the embodiment of first aspect present invention provides a kind of anti-layering plate bursting of circuit board, including: Open up isolation channel at the base plate stationary part on the substrate of the circuit board, the isolation channel can by the base plate stationary part with Separated inside the substrate.
In the present embodiment, the isolation channel opened up on the substrate of circuit board separates base plate stationary part and substrate inside, to hinder Only at base plate stationary part caused by inside from stress to substrate transmit, so as to effectively avoid occur plate bursting layering the problem of.
Near base plate stationary part, on the one hand, due to the supporting role of base plate stationary part, the internal layer around base plate stationary part Daughter board and outer layer daughter board stress deficiency, adhesion is poor after pressing solidification, or even gap occurs.The substrate of circuit board work after warp Sequence is washed or during by other processing solution tank, gap existing at this may Residual water, if moisture is passing through anti-welding and word The baking of symbol process all fails fully volatilization and removed, and when having arrived spray tin process, the heated flash evapn of moisture remained in gap is Gas, it will be layered in the presence of expansion at base plate stationary part, serious meeting radiates out, and the design of isolation channel can The gas of flash evapn is set outwards to be volatilized away along isolation channel to prevent from spreading into the substrate of circuit board, so that protective substrate, The problem of preventing layering plate bursting.On the other hand, due to pressure between the internal layer daughter board and outer layer daughter board near base plate stationary part Each Coating combination point of deficiency is few, directly translates into internal layer daughter board and outer layer daughter board adhesion is poor, each when spray tin moment is heated Layer uneven heating, degrees of expansion is different, and caused stress is also different, after stress reaches to a certain degree, in base plate stationary part The worst place of neighbouring adhesion is layered first, and extends to surrounding rapidly, causes whole substrate to be scrapped.Isolation channel is set Meter can effectively obstruct the diffusion of layering plate bursting, protective substrate, to prevent the problem of being layered plate bursting.
The embodiment of second aspect of the present invention provides a kind of preparation method of circuit board, including:
Step 102, it is fixed after the internal layer daughter board of circuit board and outer layer daughter board being stacked by fixture, and to fixation The internal layer daughter board and the outer layer daughter board afterwards carries out hot pressing processing, and the substrate of circuit board is made;
Step 104, isolation channel is opened up at the fixture in the technique edges of the substrate;
Step 106, pattern transfer processing is carried out to the substrate, and electroplating processes are carried out after pattern transfer processing;
Step 108, the substrate of the circuit board is carried out spraying tin processing;
Step 110, the technique edges of the substrate after spray tin processing are removed, finished circuit board is made.
The preparation method for the circuit board that the present embodiment provides, can be avoided caused by the substrate upper substrate fixture of circuit board Stress transmits to the inside of substrate, and so as to effectively avoid occurring the problem of plate bursting is layered, manufactured circuit board intensity is high, reliability It is good.
The embodiment of third aspect present invention provides a kind of substrate of circuit board, close to base on the substrate of the circuit board The opening position of plate fixture is provided with isolation channel, the isolation channel can by the inside points of the base plate stationary part and the substrate every Open.
The substrate for the circuit board that the application provides, the isolation channel opened up on substrate is by base plate stationary part and substrate inside points Open, come prevent carry out spray tin processing when base plate stationary part at caused by inside from stress to substrate transmit the problem of, so as to have Effect avoids the substrate of circuit board that plate bursting layering occurs.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of substrate one of circuit board of the present invention;
Fig. 2 is Fig. 1 A portions partial enlargement structural representation;
Fig. 3 is the flow chart of the embodiment of preparation method one of circuit board of the present invention;
Fig. 4 is the flow chart of another embodiment of preparation method of circuit board of the present invention.
Wherein, the corresponding relation in Fig. 1 and Fig. 2 between reference and component names is:
1 substrate, 11 technique edges, inside 12 substrates, 13 mounting holes, 3 isolation channels.
Embodiment
It is below in conjunction with the accompanying drawings and specific real in order to be more clearly understood that the above objects, features and advantages of the present invention Mode is applied the present invention is further described in detail.It should be noted that in the case where not conflicting, the implementation of the application Feature in example and embodiment can be mutually combined.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still, the present invention may be used also By using other be different from it is described here in a manner of implement, therefore, protection scope of the present invention is not by following public tool The limitation of body embodiment.
The method of the anti-layering plate bursting of circuit board provided by the invention(Not shown in figure), including:In the base of the circuit board On plate 1 isolation channel 3 is opened up at base plate stationary part(As shown in Figure 3), the isolation channel 3 can be by the base plate stationary part and institute Substrate inside 12 is stated to separate.
In the present embodiment, the isolation channel opened up on the substrate of circuit board separates base plate stationary part and substrate inside, to hinder Only at base plate stationary part caused by inside from stress to substrate transmit, so as to effectively avoid occur plate bursting layering the problem of.
Near base plate stationary part, on the one hand, due to the supporting role of base plate stationary part, the internal layer around base plate stationary part Daughter board and outer layer daughter board stress deficiency, adhesion is poor after pressing solidification, or even gap occurs.The substrate of circuit board work after warp Sequence is washed or during by other processing solution tank, gap existing at this may Residual water, if moisture is passing through anti-welding and word The baking of symbol process all fails fully volatilization and removed, and when having arrived spray tin process, the heated flash evapn of moisture remained in gap is Gas, it will be layered in the presence of expansion at base plate stationary part, serious meeting radiates out, and the design of isolation channel can The gas of flash evapn is set outwards to be volatilized away along isolation channel to prevent from spreading into the substrate of circuit board, so that protective substrate, The problem of preventing layering plate bursting.On the other hand, due to pressure between the internal layer daughter board and outer layer daughter board near base plate stationary part Each Coating combination point of deficiency is few, directly translates into internal layer daughter board and outer layer daughter board adhesion is poor, each when spray tin moment is heated Layer uneven heating, degrees of expansion is different, and caused stress is also different, after stress reaches to a certain degree, in base plate stationary part The worst place of neighbouring adhesion is layered first, and extends to surrounding rapidly, causes whole substrate to be scrapped.Isolation channel is set Meter can effectively obstruct the diffusion of layering plate bursting, protective substrate, to prevent the problem of being layered plate bursting.
Wherein, internal substrate is core material, and outer layer daughter board is prepreg and copper foil basic unit, and base plate stationary part is riveting Nail.
Preferably, the base plate stationary part is located on the technique edges 11 of the substrate 1, and the isolation channel 3 is opened in described In technique edges, and between the inside of the substrate 1 and the base plate stationary part, to avoid influenceing the property of manufactured circuit board Energy.
Wherein, be provided with mounting hole 13 on internal layer daughter board and outer layer daughter board, after internal layer daughter board and the pressing of outer layer daughter board its On mounting hole 13 overlap, base plate stationary part(I.e.:Rivet)It is fixed on the mounting hole.
In one embodiment of the present of invention, the isolation channel 3 mills out simultaneously after the substrate 1 lamination during milling frame, can Simplify production technology, to reach the purpose for shortening the circuit board making cycle.
Wherein, the semi-circular groove is that the groove of another plate face is extended to from a plate face of the substrate 1, so, can be entered One step ensures that the moisture that circuit board memory stays quickly volatilizees and shed.
It is as depicted in figs. 1 and 2, close on the substrate 1 of the circuit board present invention also offers a kind of substrate of circuit board The opening position of base plate stationary part is provided with isolation channel 3, and the isolation channel 3 can be by the base plate stationary part and the substrate 1 Spaced-apart.
The substrate for the circuit board that the application provides, the isolation channel opened up on substrate is by base plate stationary part and substrate inside points Open, come prevent carry out spray tin processing when base plate stationary part at caused by inside from stress to substrate transmit the problem of, so as to have Effect avoids the substrate of circuit board that plate bursting layering occurs.
Preferably, the fixture is located on the technique edges of the substrate 1, and the isolation channel 3 is located in the technique edges, And be arranged between the inside of the substrate 1 and the fixture of the substrate 1, so, it can avoid the occurrence of because in the inside of circuit board The problem of opening up isolation channel 3 and influenceing circuit board performance, finished circuit board normal use made of guarantee.
In one embodiment of the present of invention, as depicted in figs. 1 and 2, between isolation channel 33 and the substrate 1 fixture Distance be not less than 5.6mm(The distance between semi-circular groove and the fixture of substrate 1 a are 6mm in the present embodiment), the isolation channel 3 are not less than 2.5mm with the distance of the inward flanges of the technique edges(In the present embodiment the inward flange of semi-circular groove and technique edges away from It is 3mm from b), to ensure to open the intensity of the fixture opening position of 1 upper substrate of substrate 1 of circuit board after isolation channel 33, avoid circuit board The opening position of the fixture of substrate 1 fractures damage during the fixture of installation base plate 1.
Wherein, the isolation channel 33 is the semi-circular groove that central angle is 180 °, the axis of the semi-circular groove and the base The axis of the mounting hole of the fixture of plate 1 overlaps, and the width of the semi-circular groove is not more than 2.4mm(Semicircle in the present embodiment The width c of shape groove is 2.0mm).
Semi-circular groove covers the region of same area compared to the isolation channel of other shapes, and the length of semi-circular groove is shorter, One shifts beneficial to outer graphics(I.e.:Outer layer figure turns)When the operation of dry film sealing of hole;Furthermore retain the connection position compared with multi circuit board, make The integral rigidity for obtaining edges of boards is preferable.
Moreover, the isolation channel of other shapes, on the one hand in electroplating hanging-plate, folder point may be located exactly in isolation channel, held It is in uneven thickness to easily cause copper facing;On the other hand it is broken that substantial amounts of dry film can be produced when outer graphics shift, after electroplating processes Easily produce open circuit to scrap, though can realize the purpose of the application, its effect is not fine, and milling arc-shaped slot can then advise yet Keep away these defects.
Certainly, isolation channel can also be the deep-slotted chip breaker that outer arc radius is more than 9mm, can also realize the purpose of the application.
Present invention also offers a kind of preparation method of circuit board, as shown in figure 3, including:
Step 102, it is fixed after the internal layer daughter board of circuit board and outer layer daughter board being stacked by fixture, and to fixation The internal layer daughter board and the outer layer daughter board afterwards carries out hot pressing processing, and the substrate 1 of circuit board is made;
Step 104, isolation channel 3 is opened up at the fixture in the technique edges of the substrate 1;
Step 106, pattern transfer processing is carried out to the substrate 1, and carried out after being handled for pattern transfer at plating Reason;
Step 108, the substrate 1 of the circuit board is carried out spraying tin processing;
Step 110, the technique edges of the substrate 1 after spray tin processing are removed, finished circuit board is made.
The preparation method for the circuit board that the present embodiment provides, can be avoided caused by the substrate upper substrate fixture of circuit board Stress transmits to the inside of substrate, and so as to effectively avoid occurring the problem of plate bursting is layered, manufactured circuit board intensity is high, reliability It is good.
In the step 104, using the housing milling tape program and isolation channel 3 that the substrate 1 is inputted in numerical control device Milling tape program, the isolation is opened up by way of the numerical control device carries out milling edges of boards and milling isolation channel 3 to the substrate 1 Groove 3, so, production technology can be simplified, and reach the purpose for shortening the circuit board making cycle.
Wherein, more preferably, in the step 106, outer graphics transfer processing is carried out to the substrate, and in outer layer figure Electroplating processes are carried out after increasing the windowing pattern identification of the isolation channel on the film drawing of shape transfer processing, in order to isolation channel The dry film of position fully exposes, and the part is covered by dry film after development, so can then prevent from plating metallic copper in isolation channel, isolation Although can play a part of radiating after metallic copper is plated on groove, the effect of internal moisture volatilization is not had yet, therefore is provided with Pattern identification open a window to solve the problems, such as copper facing in isolation channel.
" increase the windowing figure of the isolation channel on the film drawing at the inner figure transfer it is of course also possible to be Mark ", it can also realize the purpose of the application.
As shown in figure 4, the preparation method of circuit board provided by the invention is specially:
Step 202, it is fixed after the internal layer daughter board of circuit board and outer layer daughter board being stacked by fixture, and to fixation The internal layer daughter board and the outer layer daughter board afterwards carries out hot pressing processing, and the substrate 1 of circuit board is made;
Step 204, isolation channel 3 is opened up at the fixture in the technique edges of the substrate 1;
Step 206, outer graphics transfer processing is carried out to the substrate 1, and in the phenanthrene for outer graphics transfer processing Electroplating processes are carried out after increasing the windowing pattern identification of the isolation channel 3 on woods drawing;
Step 208, the substrate 1 of the circuit board is carried out spraying tin processing;
Step 210, the technique edges of the substrate 1 after spray tin processing are removed, finished circuit board is made.
In summary, the method for the anti-layering plate bursting of circuit board provided by the invention, the isolation opened up on the substrate of circuit board Groove will separate inside base plate stationary part and substrate, come inside transmission of the stress to substrate caused by preventing at base plate stationary part, from And the problem of effectively avoiding that plate bursting layering occurs.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies Change, equivalent substitution, improvement etc., should be included in the scope of the protection.

Claims (10)

  1. A kind of 1. method of the anti-layering plate bursting of circuit board, it is characterised in that including:
    Isolation channel is opened up at base plate stationary part on the substrate of the circuit board, the isolation channel can fix the substrate Part inside the substrate with separating;
    The isolation channel is the peace of the semi-circular groove that central angle is 180 °, the axis of the semi-circular groove and the base plate stationary part The axis for filling hole overlaps, and the width of the semi-circular groove is not more than 2.4mm.
  2. 2. the method for the anti-layering plate bursting of circuit board according to claim 1, it is characterised in that
    The base plate stationary part is located on the technique edges of the substrate, and the isolation channel is opened in the technique edges, and is located at Between the inside of the substrate and the base plate stationary part.
  3. 3. the method for the anti-layering plate bursting of circuit board according to claim 1 or 2, it is characterised in that
    The isolation channel mills out simultaneously after the substrate lamination during milling frame.
  4. 4. the method for the anti-layering plate bursting of circuit board according to claim 2, it is characterised in that
    The distance between the isolation channel and the base plate stationary part are not less than 5.6mm, the isolation channel and the technique edges The distance of inward flange is not less than 2.5mm.
  5. 5. the method for the anti-layering plate bursting of circuit board according to claim 4, it is characterised in that
    The semi-circular groove is that the groove of another plate face is extended to from a plate face of the substrate.
  6. A kind of 6. preparation method of circuit board, it is characterised in that including:
    Step 102, be fixed after the internal layer daughter board of circuit board and outer layer daughter board being stacked by fixture, and to fixation after The internal layer daughter board and the outer layer daughter board carry out hot pressing processing, and the substrate of circuit board is made;
    Step 104, isolation channel is opened up at the fixture in the technique edges of the substrate;
    Step 106, pattern transfer processing is carried out to the substrate, and electroplating processes are carried out after pattern transfer processing;
    Step 108, the substrate of the circuit board is carried out spraying tin processing;
    Step 110, the technique edges of the substrate after spray tin processing are removed, finished circuit board is made;
    In the step 106, outer graphics transfer processing is carried out to the substrate, and in the film of outer graphics transfer processing Electroplating processes are carried out after increasing the windowing pattern identification of the isolation channel on drawing.
  7. 7. the preparation method of circuit board according to claim 6, it is characterised in that
    In the step 104, using the housing milling tape program and isolation channel milling tape program that the substrate is inputted in numerical control device, The isolation channel is opened up by way of the numerical control device carries out milling edges of boards and milling isolation channel to the substrate.
  8. A kind of 8. substrate of circuit board, it is characterised in that
    Opening position on the substrate of the circuit board close to base plate stationary part is provided with isolation channel, and the isolation channel can be by the base The inside of plate fixture and the substrate separates;
    The isolation channel is the peace of the semi-circular groove that central angle is 180 °, the axis of the semi-circular groove and the base plate stationary part The axis for filling hole overlaps, and the width of the semi-circular groove is not more than 2.4mm.
  9. 9. the substrate of circuit board according to claim 8, it is characterised in that
    The fixture is located on the technique edges of the substrate, and the isolation channel is located in the technique edges, and is arranged on described Between the inside of substrate and the base plate stationary part.
  10. 10. the substrate of circuit board according to claim 9, it is characterised in that
    The distance between the isolation channel and the base plate stationary part are not less than 5.6mm, the isolation channel and the technique edges The distance of inward flange is not less than 2.5mm.
CN201410041078.8A 2014-01-28 2014-01-28 The substrate of the anti-method for being layered plate bursting of circuit board, the preparation method of circuit board and circuit board Expired - Fee Related CN104812158B (en)

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CN201410041078.8A CN104812158B (en) 2014-01-28 2014-01-28 The substrate of the anti-method for being layered plate bursting of circuit board, the preparation method of circuit board and circuit board

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Application Number Priority Date Filing Date Title
CN201410041078.8A CN104812158B (en) 2014-01-28 2014-01-28 The substrate of the anti-method for being layered plate bursting of circuit board, the preparation method of circuit board and circuit board

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105215443B (en) * 2015-10-26 2017-12-29 江苏弘信华印电路科技有限公司 A kind of method of quick milling substrate frame
CN105916313A (en) * 2016-06-17 2016-08-31 景旺电子科技(龙川)有限公司 Method for preventing sprayed tin from layering
CN106304638A (en) * 2016-08-15 2017-01-04 梅州市志浩电子科技有限公司 The processing method of printed circuit board forming
CN210120704U (en) * 2019-06-26 2020-02-28 昆山首源电子科技有限公司 Circuit board punching structure capable of preventing copper sheet from warping
CN112739075A (en) * 2020-12-08 2021-04-30 深圳市祺利电子有限公司 Manufacturing method for preventing tin spraying and explosion of circuit board

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CN102036462A (en) * 2010-08-31 2011-04-27 北大方正集团有限公司 Printed circuit board and protection method thereof
CN102821551A (en) * 2012-08-28 2012-12-12 沪士电子股份有限公司 Manufacturing method for heavy-copper printed circuit boards
CN202998677U (en) * 2012-12-12 2013-06-12 广东生益科技股份有限公司 Structural component for improving PCB edge delamination and PCB comprising the same

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
CN102036462A (en) * 2010-08-31 2011-04-27 北大方正集团有限公司 Printed circuit board and protection method thereof
CN102821551A (en) * 2012-08-28 2012-12-12 沪士电子股份有限公司 Manufacturing method for heavy-copper printed circuit boards
CN202998677U (en) * 2012-12-12 2013-06-12 广东生益科技股份有限公司 Structural component for improving PCB edge delamination and PCB comprising the same

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