CN102573289A - Laminated printed circuit board module with conductive contact piece on side and manufacturing method thereof - Google Patents
Laminated printed circuit board module with conductive contact piece on side and manufacturing method thereof Download PDFInfo
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- CN102573289A CN102573289A CN2010106173203A CN201010617320A CN102573289A CN 102573289 A CN102573289 A CN 102573289A CN 2010106173203 A CN2010106173203 A CN 2010106173203A CN 201010617320 A CN201010617320 A CN 201010617320A CN 102573289 A CN102573289 A CN 102573289A
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Abstract
The invention provides a laminated printed circuit board module with a conductive contact piece on a side and a manufacturing method thereof. The laminated printed circuit board module comprises a circuit board module which is stacked by a plurality of layers of printed circuit boards; at least one side of the laminated printed circuit board module is provided with a plurality of conductive contact pieces, wherein all the conductive contact pieces are separated to form an insulated area. A plurality of contact pads are arranged in a peripheral area of one surface of the circuit board module, and are electrically connected with the conductive contact pieces.
Description
Technical field
The present invention relates to a kind of build-up printed circuit board module, particularly side has the build-up printed circuit board module and the manufacturing approach thereof of conductive contact piece.
Background technology
In advanced electronic assemblies technology, lamination type tellite and module can effectively reach the unit intensity that increases chip on the substrate, shorten the length that connects chip conductors, lower internetwork capacity effect, targets such as the performance of raising circuit and reliability.In prior art, the lamination type tellite mostly adopts the composite material laminated plates, plates one deck Copper Foil earlier, again through etch process to obtain required printed circuit board (PCB).When complicated application demand, circuit can be arranged to the structure of multilayer and press together, and builds each layer of through hole circuit communication circuit at interlayer cloth.By scolder or other materials that is used for the side connection one tellite module is packaged into another tellite motherboard.Therefore, connect, need on the side of tellite module, form a plurality of electric connections usually in order to reach effectively.
In disclosed correlation technique, U.S. Pat 6,675,472 and United States Patent (USP) in early days openly US 2004/0141299 disclose a kind of chip carrier of individual layer plastic cement, it has side contact of semicolumn and does not have burr and hinder electrical reliability.Moreover; U.S. Pat 7,246, but the build-up printed circuit board module of a kind of manufacturing of 434 announcements surface encapsulation; Form the fort type via (castellation vias) of protrusion in the bottom of printed circuit board (PCB) module, in the hope of increasing the packaging density on the printed circuit mother board.
With regard to practical application, what industry was needed various different kenels badly has a metallized build-up printed circuit board module of side, is easy to integrate and be encapsulated on various types of printed circuit mother boards, to promote the electrical reliability that side welding or side connect.
Summary of the invention
According to one embodiment of the invention; The build-up printed circuit board module that provides a kind of side to have conductive contact piece; Comprise: the circuit board module that multilayer board piles up, its at least one side has a plurality of conductive contact pieces, wherein is separated by between each conductive contact piece with an insulating regions; And a plurality of contact mats, be arranged at the neighboring area on a surface of circuit board module, and electrically connect with those conductive contact pieces.In an embodiment, each conductive contact piece comprises that a recessed zone of a semicircle orifice and a copper coating are formed at the surface in the recessed zone of this semicircle orifice, and wherein this insulating regions does not have the capillary copper limit in fact.In another embodiment, each conductive contact piece comprises that a flat edge regions and a copper coating are formed at the surface of this flat edge regions, and wherein those insulating regions inwardly concave in fact.In another embodiment, each conductive contact piece comprises that a recessed zone of a semicircle orifice and a solid semicircle copper post embed the recessed zone of this semicircle orifice, wherein those insulating regions and this solid semicircle copper post copline in fact.
According to another embodiment of the present invention, the manufacturing approach of the build-up printed circuit board module that a kind of side has conductive contact piece is provided, comprising: a plurality of substrates are provided; Make the different circuits structure respectively on those substrates; Those substrates of contraposition pressing become a build-up printed circuit board structure, and define a main region; Periphery along this main region forms a plurality of through holes and forms one first copper coating in the inwall of this through hole; Form an outer conductor structure and form synchronously a plurality of conductive contact pieces in the periphery of this main region, and electroplate one second copper coating and a protective coating on this first copper coating in this main region; Outer rim along each through hole forms a strip slotted eye; Make at least one side form to have a recessed zone of a semicircle orifice and an insulating regions, wherein make the residual capillary copper of the moulding limit of this insulating regions remove in the lump during with its residual capillary copper limit and circuit etching shaping through engraving method because of the protection of this protective coating; And this second copper coating of patterning and remove this protective coating.
According to another embodiment of the present invention, the manufacturing approach of the build-up printed circuit board module that a kind of side has conductive contact piece is provided, comprising: a plurality of substrates are provided; Make the different circuits structure respectively on those substrates; Those substrates of contraposition pressing become a build-up printed circuit board structure, and define a main region; Periphery along this main region forms a strip slotted eye and forms one first copper coating in the inwall of this strip slotted eye; Form an outer conductor structure and form synchronously a plurality of conductive contact pieces in the periphery of this main region, and electroplate one second copper coating and a protective coating on this first copper coating in this main region; Remove this first and second copper coating and this protective coating of the side wall upper part branch of this strip slotted eye, have a raised zones and an insulating regions of side conductive contact piece with formation; And this second copper coating of patterning and remove this protective coating.
According to further embodiment of this invention, the manufacturing approach of the build-up printed circuit board module that a kind of side has conductive contact piece is provided, comprising: a copper base is provided, has a plurality of Copper column structures; One Intermediate substrate is provided, and makes the different circuits structure respectively on those Intermediate substrates, wherein this Intermediate substrate has corresponding those Copper column structures of a plurality of perforations; This copper base of contraposition pressing, this Intermediate substrate and an outermost layer substrate become a build-up printed circuit board structure, and define a main region; Electroplate a copper coating and a tin coating on this outermost layer substrate; This copper coating of patterning also removes this tin coating; Process to form a build-up printed circuit board module along the periphery of this main region; Make it have a solid semicircle copper post and the adjacent insulation zone that embeds the recessed zone of a semicircle orifice, wherein this adjacent insulation zone and this solid semicircle copper post copline in fact.
According to yet another embodiment of the invention, the manufacturing approach of the build-up printed circuit board module that a kind of side has conductive contact piece is provided, comprises: a plurality of substrates are provided; Make the different circuits structure respectively on those substrates; Those substrates of contraposition pressing become a build-up printed circuit board structure, and define a main region; Form a patterning punching and form one first copper coating in the inwall of this patterning punching with the periphery of one first mould along this main region, wherein this patterning punching has a plurality of projections and extends from one first strip slotted eye and contact with the periphery of this main region; Form an outer conductor structure and form synchronously a plurality of conductive contact pieces in the periphery of this main region, and electroplate one second copper coating and a protective coating on this first copper coating in this main region; This second copper coating of patterning also removes this protective coating; Form one second strip slotted eye with one second mould along the outer rim of this patterning punching, make at least one side of this build-up printed circuit board module comprise the class lateral opening recessed zone of arc and an insulating regions of a conduction.
For making the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and conjunction with figs. elaborates as follows:
Description of drawings
Fig. 1 shows the manufacturing process sketch map of the build-up printed circuit board module of a specific embodiment.
The structural representation of the build-up printed circuit board module of Fig. 2 A-2F displayed map 1 specific embodiment.
Fig. 3 shows the manufacturing process sketch map of build-up printed circuit board module according to another embodiment of the present invention.
The structural representation of the build-up printed circuit board module of Fig. 4 A-4E displayed map 3 specific embodiments.
Fig. 5 shows the manufacturing process sketch map according to the build-up printed circuit board module of the tool side conductive contact piece of further embodiment of this invention.
The structural representation of the build-up printed circuit board module of Fig. 6 A-6F displayed map 5 specific embodiments.
Fig. 7 shows the manufacturing process sketch map according to the build-up printed circuit board module of the tool side conductive contact piece of further embodiment of this invention.
The structural representation of the build-up printed circuit board module of Fig. 8 A-8D displayed map 7 specific embodiments.The main element symbol description:
S10-S20: the fabrication steps of build-up printed circuit board module
100: the agent structure of build-up printed circuit board
100a-100d: build-up printed circuit board module
101: main region
105: the neighboring area
110: the insulated substrate of internal layer
112 and 114: the outer layer insulation substrate
113 and 115: internal layer circuit
111 and 117: attach Copper Foil
120: through hole
122: copper coating
122a: the side of copper coating
124: protective coating
128: conductive contact pad
130: the strip slotted eye
140a: the recessed zone of semicylindrical opening
140b: insulating regions
S30-S40: the fabrication steps of another build-up printed circuit board module
330: the strip slotted eye
322: copper coating
328: conductive contact pad
340a: conductive region
340b: the insulation layer of nick
S50-S60: the fabrication steps of another build-up printed circuit board module
610: thick copper coin
611: the copper base portion
615: the copper post
622,626: Copper Foil
624: Intermediate substrate
625: through hole
631: the fine pitch between copper column top and outermost layer substrate
632: outermost layer substrate
634: the outer-layer circuit Copper Foil
640: the conduction through hole
650: anti-welding green lacquer
655: conductive region
S70-S81: the fabrication steps of another build-up printed circuit board module
830: the first slotted eyes
832: projective structure
835: type arc limit
830 ': the second slotted eye
822: the first copper coatings
828: conductive contact pad
840a: the conductive region on type arc limit
840b: the insulation layer of nick
Embodiment
Below specify and be accompanied by the example of graphic explanation with each embodiment, as reference frame of the present invention.In graphic or specification were described, similar or identical part was all used identical figure number.And in graphic, the shape of embodiment or thickness can enlarge, and to simplify or convenient the sign.Moreover; The part of each element will be it should be noted that the element that does not show or describe among the figure to describe explanation respectively in graphic; The form of knowing for the those of ordinary skill in the affiliated technical field; In addition, certain embodiments is merely and discloses the ad hoc fashion that the present invention uses, and it is not in order to limit the present invention.
According to main embodiment of the present invention and appearance attitude, a kind of metallized technology of side of build-up printed circuit board module is provided, be used for side welding or side and be connected in printed circuit mother board.In an embodiment, form fort type semicircle orifice bound edge plating (castellation plating) structure that no copper layer is peeled off (copper peeling) or burr (copper burring), to promote the electrical reliability that side welding or side connect.In an embodiment, each conductive contact piece comprises that a recessed zone of a semicircle orifice and a solid semicircle copper post embed the recessed zone of this semicircle orifice, wherein those insulating regions and this solid semicircle copper post copline in fact.
Fig. 1 shows the manufacturing process sketch map of the build-up printed circuit board module of a specific embodiment.For content and each embodiment that can more be expressly understood this exposure, when narrating the manufacturing process of Fig. 1, should be aided with structural representation with reference to Fig. 2 A-2F.
At first; In the step S10 of Fig. 1; Multilager base plate is provided, for example is about 0.1 to 1.6mm glass epoxy resin (FR-4), benzene resin or span and comes acid amides triazine (bismaleimidetricaine the is called for short BT) insulated substrate that resin constituted by thickness.Stack one deck Copper Foil respectively on the surface of said insulated substrate becomes the copper-surfaced laminar substrate and as the parent material of present embodiment.Then, form the conduction through hole in the copper-surfaced laminar substrate of part, to form inner electric connection.Then, in step S11, make different internal circuit configurations respectively on the copper-surfaced laminar substrate of inside.In an embodiment, can select to implement steps such as brush mill, little erosion, plate face Copper Foil is done suitable roughening treatment, follow-uply the driving fit of dry film photoresistance is attached at its surface with suitable temperature and pressure.Then, the substrate that posts the dry film photoresistance is imposed patterning step such as exposure, development, erosion copper, the Copper Foil that then will expose out corrosion removes to form circuit, removes liquid (like the NaOH aqueous solution) with the eccysis of dry film photoresistance with photoresistance more at last.
Then, among the step S12, said copper-surfaced laminar substrate contraposition pressing is become a laminated substrate structure,, shown in Fig. 2 A, and define a main region 101 and a neighboring area 105 as the agent structure 100 of follow-up formation build-up printed circuit board module.See also Fig. 2 B; The agent structure 100 of this build-up printed circuit board module can comprise that insulated substrate 110 surfaces of an internal layer form the internal layer circuit 113 and 115 of patterning respectively, and outer layer insulation substrate 112 and 114 has attached the outside that Copper Foil 111 and 117 is arranged at the insulated substrate 110 of internal layer respectively.Its making step is described in detail as follows, for example will accomplish internal layer circuit plate and the outer layer insulation substrate pressing that attaches Copper Foil.Before carrying out the pressing step, the internal layer circuit plate can pass through melanism (being oxidation) earlier and handle, and makes the copper surface coarsening of internal layer circuit, so that ability and outer layer insulation substrate produce excellent adhesion performance.Afterwards, send in the vacuum pressing-combining machine with suitable temperature and pressure and make said laminated substrate sclerosis bonding.
Then, see also Fig. 2 C, form a plurality of through holes 120 (like the step S13 of Fig. 1) along the edge of main region 101, and form a copper coating 122 in the inwall of each through hole.In a specific embodiment, can select to get out a plurality of through holes at main region 101 edges of the agent structure 100 of build-up printed circuit board with laser through hole or computer Numerical Control processing (CNC) through hole machine.Subsequent implementation through hole copper facing (plating through hole; Be called for short PTH) processing procedure, in the step S14 of Fig. 1, circuit board is dipped in the chemical copper solution; Borrow the catalytic action of palladium metal that the copper ion reduce deposition in the solution is attached on the hole wall, forming the through hole circuit.Bathe the mode of electroplating with copper sulphate again and the copper layer in the via is thickeied the thickness of enough opposing following process and environmental impact.
Then, see also step S15 and Fig. 2 D of Fig. 1, outer conductor structure (not shown) is formed in the main region 101, and form a plurality of conductive contact pad 128 around main region.Follow-up secondary copper facing and the plating step (shown in the step S16 of Fig. 1) of carrying out again electroplated a copper coating 122 and a protective coating (for example tin coating) 124 on this copper coating 122.Protective coating 124 is coated in the secondary copper facing, really makes in follow-up slotted eye processing procedure, and no side reveals copper.Protective coating need meet electrodepositable and the characteristic that can in successive process, remove.In an embodiment, can form outer conductor structure by known image transfer technology, the fabrication steps with internal layer circuit on making step is identical.
Then, in the step S17 of Fig. 1,, form a plurality of strip slotted eyes 130 in the neighboring area 105 of build-up printed circuit board agent structure 100.For example; Outer rim along each through hole; For example by drilling, cutting, punch die or excavate the strip slotted eye, expose the side of said build-up printed circuit board module main region 101, make at least one side have the recessed zone and the insulating regions of a plurality of semicylindrical openings.See also Fig. 2 E, the sectional perspective sketch map that it shows the main region 101 of said build-up printed circuit board module comprises recessed regional 140a and the adjacent insulation zone 140b of semicylindrical opening.When forming the step of strip slotted eye 130, can produce residual capillary copper limit; Cause because of protective coating 124 coverings; Make the unlikely back processing procedure S18 that receives of copper plate 122 sidewalls be etched removal; But will not remove in the lump on the residual capillary copper limit of matcoveredn protection through its strip slotted eye side of S18 processing procedure, so the surface of this insulating regions 140b does not have the capillary copper limit in fact.It should be noted, under the covering of protective coating 124, because of etching is positioned at the side 122a of the secondary copper plate at semicylindrical opening edge, so can make it recessed slightly in the erosion copper coating.
Then, implement striping, etching, the stripping tin step shown in Fig. 1 step S18, with this second copper coating of patterning and remove tin coating.For example, attach a photoresistance dry film on second copper coating, and with micro-photographing process with this dry film patterning.After the dry film patterning step, with the ammoniacal liquor of alkalescence, copper chloride mixed solution the Copper Foil corrosion that reveals is removed, form line construction.Divesting liquid with tin lead more at last divests tin lead layer.
Then, carry out successive process, for example the anti-welding green lacquer of Fig. 1 step S19 is coated with and plating nickel/golden step of Fig. 1 step S20, the build-up printed circuit board module 100a of follow-up completion shown in Fig. 2 F.Follow-up step for example, after outer-layer circuit was accomplished, the coating insulating resin layer came protection circuit to avoid oxidation and solder shorts.Usually need steps such as warp brush mill, little erosion earlier before the application insulating resin layer, the wiring board copper face is done suitable alligatoring clean.By screen painting, curtain be coated with, electrostatic spraying ... etc. mode the green lacquer of liquid photosensitive is coated on the plate face, preliminary drying is dry again.In addition alternately, the green lacquer of dry film sensitization can be coated in its pressing on the plate face through the vacuum film pressing machine.Carry out step of exposure after cooling, green lacquer receives can produce polymerization reaction after the ultraviolet irradiation, will not receive the diaphragm area that is coated with of illumination to develop and remove with the for example Na2CO3 aqueous solution afterwards, last more in addition high-temperature baking the resin in the green lacquer is hardened fully.
Like above-mentioned announcement; The build-up printed circuit board module 100a that present embodiment provided has side conduction contact member, and on its at least one side, has the recessed regional 140a (claiming fort type bound edge plating (castellation plating) structure in addition) of a semicylindrical opening and the insulating regions 140b on a plane.Because the covering of protective coating 124, the step S17 of process Fig. 1 and S18 processing procedure make when forming the semicylindrical opening structure, unlikely formation burr or residual copper scale.Moreover, by microetch is carried out in exposed copper side, can really make inner copper plate 122 can not extend to the insulation division on plane, side welds or the electrical reliability of side connection to promote.
Fig. 3 shows the manufacturing process sketch map of build-up printed circuit board module according to another embodiment of the present invention.For content and each embodiment that can more be expressly understood this announcement, when narrating the manufacturing process of Fig. 3, should be aided with structural representation with reference to Fig. 4 A-4E.
In the step S30 of Fig. 3, multilager base plate is provided, for example come acid amides triazine (the being called for short BT) insulated substrate that resin constituted by glass epoxy resin (FR-4), benzene resin or span.Stack one deck Copper Foil respectively on the surface of said insulated substrate becomes the copper-surfaced laminar substrate and as the parent material of present embodiment.Then, form the conduction through hole in the copper-surfaced laminar substrate of part, to form inner the electric connection.Then, in step S31, make different internal circuit configurations respectively on the copper-surfaced laminar substrate of part.In an embodiment, can select to implement to brush steps such as mill, little erosion plate face Copper Foil is done suitable roughening treatment, follow-uply the driving fit of dry film photoresistance is attached at its surface with suitable temperature and pressure.Then, the substrate that posts the dry film photoresistance is made public, develops, loses patterning step such as copper, the Copper Foil corrosion of exposing is out removed the formation circuit, remove liquid (like the NaOH aqueous solution) with the eccysis of dry film photoresistance with photoresistance more at last.
Then, among the step S32, said copper-surfaced laminar substrate contraposition pressing is become a laminated substrate structure,,, and define a main region 101 and a neighboring area 105 thus please with reference to shown in Fig. 2 A as the agent structure 100 of follow-up formation build-up printed circuit board module.Its making step is described in detail as follows, for example will accomplish internal layer circuit plate and the outer layer insulation substrate pressing that attaches Copper Foil.Before carrying out the pressing step, the internal layer circuit plate can pass through melanism (being oxidation) earlier and handle, and makes the copper surface coarsening of internal layer circuit, so that ability and outer layer insulation substrate produce excellent adhesion performance.Afterwards, send in the vacuum pressing-combining machine with suitable temperature and pressure and make said laminated substrate sclerosis bonding.
Then, in the step S33 of Fig. 3, form the strip slotted eye.For example along the neighboring area 105 of the main region 101 of the agent structure 100 of build-up printed circuit board; Process methods such as for example drilling, cutting, punch die or excavation by laser processing or computer Numerical Control; Form the side that strip slotted eye 330 exposes said build-up printed circuit board module main region 101, shown in Fig. 4 A.Then, see also Fig. 4 B, the agent structure 100 of this build-up printed circuit board is dipped in the chemical copper solution, borrowing the catalytic action of palladium metal that the copper ion reduce deposition in the solution is attached on the sidewall of strip slotted eye 330, form the through hole circuit.Bathe the mode of electroplating with copper sulphate again the copper coating 322 in the strip slotted eye 330 is thickeied the thickness of enough opposing following process and environmental impact, shown in Fig. 3 step S34.
See also step S35 and Fig. 4 B of Fig. 3, outer conductor structure (not shown) is formed in the main region 101, and form a plurality of conductive contact pad 328 around main region.Follow-up secondary copper facing and the zinc-plated step (shown in the step S36 of Fig. 3) of carrying out again.In an embodiment, outer conductor structure can adopt the image transfer technology implementation, on making as the fabrication steps of internal layer circuit.
See also Fig. 4 C, optionally the conductive layer on the sidewall of strip slotted eye 330 is broken off, and form the insulation layer 340b of discontinuous conductive region 340a and nick by laser processing or CNC processing (step S37).See also Fig. 4 D, the sectional perspective sketch map that it shows the main region of said build-up printed circuit board module comprises the conductive region 340a on plane and the insulation layer 340b of adjacent nick.It should be noted that when implementing above-mentioned laser processing or CNC procedure of processing, may command is cut off the degree of depth of the conductive layer on the sidewall, to form the insulation layer 340b of nick.
Then, implement striping, etching, the stripping tin step shown in Fig. 3 step S38, with this second copper coating of patterning and remove tin coating.For example, attach a photoresistance dry film on second copper coating, and with micro-photographing process with this dry film patterning.After the dry film patterning step, remove with the ammoniacal liquor of alkalescence, the Copper Foil corrosion that the copper chloride mixed solution will expose out, form line construction.Divesting liquid with tin lead more at last divests tin lead layer.
Then, carry out successive process, for example the anti-welding green lacquer of Fig. 3 step S39 is coated with and plating nickel/golden step of Fig. 3 step S40, the build-up printed circuit board module 100b of follow-up completion shown in Fig. 4 E.Follow-up step for example after outer-layer circuit is accomplished, needs the coating insulating resin layer to come protection circuit to avoid oxidation and solder shorts again.
Like above-mentioned announcement; The build-up printed circuit board module 100b that present embodiment provided has side conduction contact member; And at least one side, have the conduction region on a plane and the insulation layer of a nick; Make it be easy to integrate and be packaged on the printed circuit mother board of various kenels, to promote the electrical reliability that side welding or side connect.
Fig. 5 shows the manufacturing process sketch map according to the build-up printed circuit board module of the tool side conductive contact piece of further embodiment of this invention.In order more to be expressly understood each embodiment of this disclosure, when narrating the manufacturing process sketch map of Fig. 5, should be aided with structural representation with reference to Fig. 6 A-6F.
See also step S50 and Fig. 6 A of Fig. 5, a thick copper coin 610 at first is provided.Then, in step S51, with these thick copper coin 610 patternings to form a plurality of copper posts 615 on copper base portion 611, shown in Fig. 6 B.
On the other hand, in step S52, the substrate of multilayer is provided, comprises Intermediate substrate 624 and outermost layer substrate 632.For example be about 0.2 to 0.8mm glass epoxy resin (FR-4), benzene resin or span and come acid amides triazine (the being called for short BT) insulated substrate that resin constituted by thickness.Difference stack Copper Foil 622,626 on the surface of said insulated substrate, becoming the copper-surfaced laminated board is parent material.
Then, in step S53, with Copper Foil 622,626 patternings, to make the different circuits structure respectively on this Intermediate substrate 624.In an embodiment, brush steps such as mill, little erosion earlier plate face Copper Foil is done suitable roughening treatment, with suitable temperature and pressure the driving fit of dry film photoresistance is attached on it again.Then, the substrate that posts the dry film photoresistance is made public, develops, loses steps such as copper, the Copper Foil erosion removal that exposes is out formed circuit, at last again with the NaOH aqueous solution with the eccysis of dry film photoresistance.Then, form through hole 625 in Intermediate substrate 624, the copper post 615 on the corresponding said copper base portion 611 in the size of said through hole 625 and position is shown in Fig. 6 C.
Then, see also step S54, the copper base portion 611 of those copper posts 615 of contraposition pressing, Intermediate substrate 624 and outermost layer substrate 632 become a build-up printed circuit board structure, and define a main region.For example, it is bonding with glass fiber resin film and outer-layer circuit Copper Foil 634 to accomplish the internal layer circuit plate.Before carrying out the pressing step, inner plating need be handled through melanism (being oxidation) earlier, makes the copper face passivation increase insulating properties, and makes the copper face alligatoring of internal layer circuit so that ability and film produce excellent adhesion performance.It should be noted copper post 615 diameters and height and position on the corresponding copper base portion 611 in the diameter of through hole 625 and height and position.Then, send in the vacuum pressing-combining machine with suitable temperature and pressure F and make the film sclerosis bonding.
See also Fig. 6 E, form conduction through hole 640 in the build-up printed circuit board structure, electrically connect to form.Then; In step S55, form the main region of outer conductor structure in said build-up printed circuit board, form the periphery of a plurality of conductive contact pieces synchronously in this main region; And electroplate second copper coating and tin coating on this first copper coating, shown in Fig. 5 step S56.
Then, patterning second copper coating and tin coating are shown in Fig. 5 step S57.For example, attach a photoresistance dry film on second copper coating, and, behind the dry film patterning,, form the outer-layer circuit structure with the ammoniacal liquor of alkalescence, the Copper Foil erosion removal that the copper chloride mixed solution will expose out with this dry film patterning.Divesting liquid with tin lead more at last divests tin lead layer.
Then, carry out successive process, for example anti-welding green lacquer 650 coatings of Fig. 5 step S58.For example, after outer-layer circuit is accomplished, need again the coating insulating resin layer to come protection circuit to avoid oxidation and solder shorts.Then; The moulding slotted eye processing of implementation step S59; For example by drilling, cutting, punch die or excavate the strip slotted eye, expose the side of said build-up printed circuit board module main region, make at least one side have a plurality of conductive regions 655 and adjacent insulation zone (not shown).In another embodiment, become build-up printed circuit board module block along the said build-up printed circuit board stacked structure of neighboring area K (shown in Fig. 6 E) cutting, shown in Fig. 6 E.Then, carry out plating nickel/golden step of step S60, the build-up printed circuit board module 100c of follow-up completion shown in Fig. 6 F.It should be noted that the height of said solid semicircle copper post is lower than the height of build-up printed circuit board module.Have fine pitch 631 between the top of copper post 615 and the outermost layer substrate 632, cause drop to be lower than in 10 microns.
Like above-mentioned announcement; The build-up printed circuit board module that present embodiment provided has the conduction region and the insulation layer on plane in fact at least one side; Make it be easy to integrate and be encapsulated on various types of printed circuit mother boards, to promote the electrical reliability that side welding or side connect.Only run through Intermediate substrate 624 structures though present embodiment discloses copper post 615, yet should be apprehensible be, the height that also can take to extend copper post 615 makes it run through outermost layer substrate 632 structures, makes the height of copper post equal the height of build-up printed circuit board module in fact.
Fig. 7 shows the manufacturing process sketch map according to the build-up printed circuit board module of the tool side conductive contact piece of further embodiment of this invention.In order more to be expressly understood each embodiment of this disclosure, when narrating the manufacturing process sketch map of Fig. 7, should be aided with structural representation with reference to Fig. 8 A-8D.
At first, in the step S70 of Fig. 7, the substrate of multilayer is provided, for example glass epoxy resin (FR-4), benzene resin or span come acid amides triazine (the being called for short BT) insulated substrate that resin constituted.Each stack Copper Foil on the surface of said insulated substrate becomes the copper-surfaced laminar substrate and as the parent material of present embodiment.Then, form the conduction through hole in the copper-surfaced laminar substrate of part, to form inner the electric connection.Then, in step S71, make different internal circuit configurations respectively on the copper-surfaced laminar substrate of part.In an embodiment, can select to implement to brush steps such as mill, little erosion plate face Copper Foil is done suitable roughening treatment, follow-uply the driving fit of dry film photoresistance is attached at its surface with suitable temperature and pressure.Then, the substrate that posts the dry film photoresistance is made public, develops, loses patterning step such as copper, the Copper Foil corrosion of exposing is out removed the formation circuit, remove liquid (like the NaOH aqueous solution) with the eccysis of dry film photoresistance with photoresistance more at last.
Then, among the step S72, said copper-surfaced laminar substrate contraposition pressing is become a laminated substrate structure,, and define a main region and a neighboring area thus as the agent structure of follow-up formation build-up printed circuit board module.Its making step is described in detail as follows, for example will accomplish internal layer circuit plate and the outer layer insulation substrate pressing that attaches Copper Foil.Before carrying out the pressing step, the internal layer circuit plate can pass through melanism (being oxidation) earlier and handle, and makes the copper surface coarsening of internal layer circuit, so that ability and outer layer insulation substrate produce excellent adhesion performance.Afterwards, send in the vacuum pressing-combining machine with suitable temperature and pressure and make said laminated substrate sclerosis bonding.
Then, in step S73, impose the first punching step, for example with the mould of first shape along these neighboring area 105 punching presses to form a plurality of first slotted eyes 830.See also Fig. 8 A, the mould of this first shape comprises a plurality of projective structures 832, and leading edge type of the having arc limit 835 of each projective structure 832 or type square brackets limit so not as limit, make main region 101 edges of build-up printed circuit board module form a plurality of recessed districts.Follow in step S74, and form one first copper coating 822 in the inwall of this slotted eye.In an embodiment, circuit board is dipped in the chemical copper solution, borrowing the catalytic action of palladium metal that the copper ion reduce deposition in the solution is attached on the inwall of first slotted eye 830, form the through hole circuit.Bathe the mode of electroplating with copper sulphate again and the copper layer in the via is thickeied the thickness of enough opposing following process and environmental impact.
Then, see also the step S75 of Fig. 7, outer conductor structure (not shown) is formed in the main region, and form a plurality of conductive contact pad 828 around main region.Follow-up secondary copper facing and the zinc-plated step (shown in the step S76 of Fig. 7) of carrying out again electroplated one second copper coating and tin coating on this first copper coating 822.In an embodiment, outer conductor structure can adopt the image transfer technology implementation, on making as the fabrication steps of internal layer circuit.
Then, implement striping, etching, the stripping tin step shown in Fig. 7 step S77, with this second copper coating of patterning and remove tin coating.For example, attach a photoresistance dry film on second copper coating, and with micro-photographing process with this dry film patterning.After the dry film patterning step, remove with the ammoniacal liquor of alkalescence, the Copper Foil corrosion that the copper chloride mixed solution will expose out, form line construction.Divesting liquid with tin lead more at last divests tin lead layer.
Then, carry out successive process, for example the anti-welding green lacquer coating of Fig. 7 step S78 and plating nickel/golden step of Fig. 7 step S79.For example, after outer-layer circuit is accomplished, need again the coating insulating resin layer to come protection circuit to avoid oxidation and solder shorts.
Then; Carry out the second punching step (step S80); With the mould of second shape along this neighboring area punching press to form a plurality of slotted eyes, overlapping in the position of the position of said second punching and first slotted eye, makes the main region edge of build-up printed circuit board module form a plurality of flat border areas thus.See also Fig. 8 C, it shows the sectional perspective sketch map of the main region 101 of said build-up printed circuit board module, the insulation layer 840b of the conductive region 840a on type of comprising arc limit and adjacent nick.
Then, separate (for example cutting) and, accomplish the build-up printed circuit board module 100d shown in Fig. 8 D to form independently build-up printed circuit board module monomer.
Like above-mentioned announcement, the build-up printed circuit board module that present embodiment provided has the current-carrying part (electroplating like the elliptical aperture bound edge) on an arc limit and the insulated part on plane at least one side.Contact area and angle when the current-carrying part on said type of arc limit can increase encapsulation make it be easy to integrate and be encapsulated on various types of printed circuit mother boards, to promote the electrical reliability that side welding or side connect.
Though the present invention discloses as above with various embodiment, so it is not in order to limiting scope of the present invention, any under the those of ordinary skill of technical field, when can doing a little change and retouching, and do not break away from the spirit and scope of the present invention.
Claims (14)
1. a side has the build-up printed circuit board module of conductive contact piece, comprising:
The circuit board module that multilayer board piles up, its at least one side has a plurality of conductive contact pieces, wherein is separated by between each conductive contact piece with an insulating regions; And
A plurality of contact mats are arranged at the neighboring area on a surface of circuit board module, and electrically connect with those conductive contact pieces.
2. side according to claim 1 has the build-up printed circuit board module of conductive contact piece; Wherein each conductive contact piece comprises that a recessed zone of a semicircle orifice and a copper coating are formed at the surface in the recessed zone of this semicircle orifice, and wherein this insulating regions does not have the capillary copper limit in fact.
3. side according to claim 1 has the build-up printed circuit board module of conductive contact piece, and wherein each conductive contact piece comprises that a flat edge regions and a copper coating are formed at the surface of this flat edge regions, and wherein those insulating regions inwardly concave in fact.
4. side according to claim 1 has the build-up printed circuit board module of conductive contact piece; Wherein each conductive contact piece comprises that a recessed zone of a semicircle orifice and a solid semicircle copper post embed the recessed zone of this semicircle orifice, wherein those insulating regions and this solid semicircle copper post copline in fact.
5. side according to claim 1 has the build-up printed circuit board module of conductive contact piece, and wherein each conductive contact piece comprises that a recessed zone of half elliptical aperture and a bronze medal layer are plated on the surface in the recessed zone of this semicircle orifice.
6. a side has the manufacturing approach of the build-up printed circuit board module of conductive contact piece, comprising:
A plurality of substrates are provided;
Make the different circuits structure respectively on those substrates;
Those substrates of contraposition pressing become a build-up printed circuit board structure, and define a main region;
Periphery along this main region forms a plurality of through holes and forms one first copper coating in the inwall of this through hole;
Form an outer conductor structure and form synchronously a plurality of conductive contact pieces in the periphery of this main region, and electroplate one second copper coating and a protective coating on this first copper coating in this main region;
Outer rim along each through hole forms a strip slotted eye, makes at least one side form and has a recessed zone of a semicircle orifice and an insulating regions, and wherein the protection because of this protective coating makes this insulating regions not have the capillary copper limit in fact; And
This second copper coating of patterning also removes this protective coating.
7. side according to claim 6 has the manufacturing approach of the build-up printed circuit board module of conductive contact piece; Wherein after the step that forms this bar shape trench hole; Also comprise imposing a microetch step, remove the side of this first and second copper coating that exposes.
8. side according to claim 6 has the manufacturing approach of the build-up printed circuit board module of conductive contact piece, and wherein this protective coating is a tin coating.
9. a side has the manufacturing approach of the build-up printed circuit board module of conductive contact piece, comprising:
A plurality of substrates are provided;
Make the different circuits structure respectively on those substrates;
Those substrates of contraposition pressing become a build-up printed circuit board structure, and define a main region;
Periphery along this main region forms a strip slotted eye and forms one first copper coating in the inwall of this strip slotted eye;
Form an outer conductor structure and form synchronously a plurality of conductive contact pieces in the periphery of this main region, and electroplate one second copper coating and a protective coating on this first copper coating in this main region;
Remove this first and second copper coating and this protective coating of the side wall upper part branch of this strip slotted eye, have a raised zones and an insulating regions of side conductive contact piece with formation; And
This second copper coating of patterning also removes this protective coating.
10. side according to claim 9 has the manufacturing approach of the build-up printed circuit board module of conductive contact piece, and the step that wherein removes this first and second copper coating and this protective coating of part comprises and imposes laser processing or the processing of computer Numerical Control.
11. a side has the manufacturing approach of the build-up printed circuit board module of conductive contact piece, comprising:
One copper base is provided, has a plurality of Copper column structures;
One Intermediate substrate is provided, and makes the different circuits structure respectively on those Intermediate substrates, wherein this Intermediate substrate has corresponding those Copper column structures of a plurality of perforations;
This copper base of contraposition pressing, this Intermediate substrate and an outermost layer substrate become a build-up printed circuit board structure, and define a main region;
Electroplate a copper coating and a tin coating on this outermost layer substrate;
This copper coating of patterning also removes this tin coating;
Process to form a build-up printed circuit board module along the periphery of this main region; Make it have a solid semicircle copper post and the adjacent insulation zone that embeds the recessed zone of a semicircle orifice, wherein this adjacent insulation zone and this solid semicircle copper post copline in fact.
12. side according to claim 11 has the manufacturing approach of the build-up printed circuit board module of conductive contact piece, wherein the height of this solid semicircle copper post is lower than the height of this build-up printed circuit board module.
13. a side has the manufacturing approach of the build-up printed circuit board module of conductive contact piece, comprising:
A plurality of substrates are provided;
Make the different circuits structure respectively on those substrates;
Those substrates of contraposition pressing become a build-up printed circuit board structure, and define a main region;
Form a patterning punching and form one first copper coating in the inwall of this patterning punching with the periphery of one first mould along this main region, wherein this patterning punching has a plurality of projections and extends from one first strip slotted eye and contact with the periphery of this main region;
Form an outer conductor structure and form synchronously a plurality of conductive contact pieces in the periphery of this main region, and electroplate one second copper coating and a protective coating on this first copper coating in this main region;
This second copper coating of patterning also removes this protective coating;
Form one second strip slotted eye with one second mould along the outer rim of this patterning punching, make at least one side of this build-up printed circuit board module comprise the class lateral opening recessed zone of arc and an insulating regions of a conduction.
14. side according to claim 13 has the manufacturing approach of the build-up printed circuit board module of conductive contact piece, wherein each projection comprises one type of arc limit, extends to the edge of this main region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106173203A CN102573289A (en) | 2010-12-15 | 2010-12-15 | Laminated printed circuit board module with conductive contact piece on side and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010106173203A CN102573289A (en) | 2010-12-15 | 2010-12-15 | Laminated printed circuit board module with conductive contact piece on side and manufacturing method thereof |
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| CN102573289A true CN102573289A (en) | 2012-07-11 |
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| CN2010106173203A Pending CN102573289A (en) | 2010-12-15 | 2010-12-15 | Laminated printed circuit board module with conductive contact piece on side and manufacturing method thereof |
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| CN103929886A (en) * | 2014-03-10 | 2014-07-16 | 淳华科技(昆山)有限公司 | Corrugated edge and copper scale preventing method suitable for divided cutting of flexible printed circuit board |
| CN105657992A (en) * | 2016-01-25 | 2016-06-08 | 东莞联桥电子有限公司 | Direct stamping process for PCB (Printed Circuit Board) with copper-plated half-hole design |
| CN106304639A (en) * | 2016-08-26 | 2017-01-04 | 广东冠锋科技股份有限公司 | A kind of method that high frequency Teflon circuit board removes edges of boards burr |
| CN112235938A (en) * | 2019-07-15 | 2021-01-15 | 中兴通讯股份有限公司 | PCB welding method and PCB castle plate |
| WO2021056427A1 (en) * | 2019-09-27 | 2021-04-01 | 庆鼎精密电子（淮安）有限公司 | Interposer, manufacturing method therefor, and circuit board assembly |
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| CN114451074B (en) * | 2019-09-27 | 2023-07-21 | 庆鼎精密电子（淮安）有限公司 | Interposer, manufacturing method of interposer and circuit board assembly |
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Application publication date: 20120711 |