CN113490349A - Preparation process of multilayer thick-copper large-size back plate - Google Patents
Preparation process of multilayer thick-copper large-size back plate Download PDFInfo
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- CN113490349A CN113490349A CN202110822734.8A CN202110822734A CN113490349A CN 113490349 A CN113490349 A CN 113490349A CN 202110822734 A CN202110822734 A CN 202110822734A CN 113490349 A CN113490349 A CN 113490349A
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- copper
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- copper plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a preparation process of a multilayer thick copper large-size back plate, relates to a large-size back plate prepared by a core plate by adopting multilayer thick copper in the middle and a preparation process thereof, and belongs to the field of circuit elements. The copper back plate is prepared by fusing a multilayer structure and adopting an integral gradual pressing mode, and comprises a core plate and a plurality of layers of copper foils, wherein the copper foils with multiple interlayers are respectively pressed on two sides of the core plate of the back plate through prepregs, the thickness of the copper foils is 12 or 17.5 mu m, a plurality of layers of thick copper plates can be formed on the core part, the supporting strength of a large-size back plate is improved, and the integral performance is improved.
Description
Technical Field
The invention provides a preparation process of a multilayer thick copper large-size back plate, relates to a large-size back plate prepared by a core plate by adopting multilayer thick copper in the middle and a preparation process thereof, and belongs to the field of circuit elements.
Background
The main task of the backplane is to carry the daughter boards and distribute power to the functional devices for electrical connections and signal transmission. The method is characterized by high thickness-diameter ratio, high-density wiring, large size and thickness, and special back drilling and copper embedding processes; the power of part of the back plate is larger, and the heat generated by operation is more and is not easy to dissipate, so that the reliability defects of the PCB such as high temperature rise, reduced performance of the whole machine, frequency drift, increased noise and the like are overcome, particularly in a high-power and large current-carrying module, the defect of failure caused by local overheating is particularly obvious, and therefore, a back plate product with large current carrying and high heat dissipation performance is gradually required;
the process method adopted in the existing industry is mainly carried out through one-time pressing, and the structure at each part is balanced and stable, and the structure is lack of change, so that efficient heat dissipation cannot be formed;
publication No. CN112867286A discloses a preparation method of an embedded large copper plate back plate, wherein a groove is formed in the copper at the position of a dense hole by depth control of a numerical control machine according to the hole distribution condition of a product; according to the connection condition of the holes and the copper plate, pre-drilling the copper plate to realize the isolation requirement of the copper plate and the metal holes; the blind grooves and the pre-drilled holes are filled in a mode of filling glue of the high-glue-content prepreg, and the core plate and the copper plate are pressed to form the back plate.
Disclosure of Invention
The invention discloses a preparation process of a multilayer thick copper large-size back plate, and provides a method for preparing a copper back plate by fusing a multilayer structure and adopting an integral gradual pressing mode. Simple structure and convenient use.
The invention relates to a multi-layer thick copper large-size back plate which comprises the following components in parts by weight: the back plate comprises a core plate and a plurality of layers of copper foils, wherein the two sides of the back plate core plate are respectively laminated with a plurality of interlayer copper foils through prepregs, the thickness of the copper foils is 12-17.5 mu m, textures are etched on the surfaces of the copper foils, the thickness of the prepregs is 74 mu m and 135 mu m, the thickness intervals of the prepregs are selected, namely 74 mu m, 135 mu m, 74 mu m and 135 mu m … are selected at intervals, the core plate comprises three copper plates from top to bottom, and the thickness of the middle copper plate is 2 mm; the thickness of the upper copper plate and the lower copper plate is 1mm or 1.2mm, grooves are etched on the surfaces of two sides of the middle copper plate, the residual thickness of the middle copper plate at the etching position is 80-100 mu m, a curing glue hole is formed in the bottom of each groove, the grooves are etched on the bottom surface of the upper copper plate, the depth of each groove is 20 mu m, the grooves etched on the bottom of the upper copper plate correspond to the non-etching surface of the top surface of the middle copper plate, the grooves etched on the top surface of the lower copper plate correspond to the non-etching surface of the bottom surface of the middle copper plate, the multilayer lining foil layers are stacked in the grooves, glass fiber prepregs are arranged between the inner sides of the grooves in the same ratio, and the through holes penetrate through the copper foil and the core plate;
the glass fiber prepreg is a high-gel-content prepreg;
the filling rate of the prepreg is 1.08, namely the volume-to-volume ratio of the prepreg to the filling space is 1.08;
the through holes are connected and combined through prepregs;
the preparation process of the multilayer thick copper large-size back plate comprises the following steps:
OP 1: according to the distribution condition of product holes, depth-controlling processing of the copper at the position of the dense holes by using a numerical control machine tool to form through holes;
OP 1: machining and milling grooves in the upper, middle and lower layer structures of the core plate in advance, roughly machining the grooves, and then etching the surfaces to form grooves with required sizes;
OP 2: pressing the lining foil once through a glass fiber prepreg to form a lining plate, curing and cutting the lining plate, wherein the cut lining plate corresponds to the groove;
OP 3: embedding the inner lining plate in the groove of the middle copper plate through a glass fiber prepreg, and pressing and curing to form a whole;
OP 4: pressing an upper copper plate on the top of the middle copper plate through a prepreg, and pressing a lower copper plate on the bottom of the middle copper plate through the prepreg;
OP 5: and filling the blind groove and the pre-drilled hole by using a high-gel-content prepreg glue filling mode, and pressing the core plate and the copper foil to form the back plate.
The middle plate is of a multilayer structure, and the lining plate is of multiple layers and can be matched with etching to form a required multilayer circuit;
the prepreg and the copper foil are pressed, and a multi-layer copper foil pressing structure is formed through synchronous symmetrical pressing of an upper group and a lower group for multiple times;
the pressing temperature is 135-185 ℃.
Has the advantages that:
firstly, a multi-layer thick copper plate can be formed on a core part, so that the supporting strength of a large-size back plate is improved;
secondly, forming a whole by adopting a plurality of layers of lining foils to form a multi-layer circuit structure;
thirdly, the structure is simple and the use is convenient.
Drawings
FIG. 1 is a schematic structural diagram of a multi-layer thick copper large-sized back plate according to the present invention.
Fig. 2 is a schematic structural disassembly diagram of a core plate of a multi-layer thick copper large-size back plate according to the present invention.
In the drawings:
1. copper foil; 2. a prepreg; 3. an upper copper plate; 4. a middle copper plate; 5. a lower copper plate; 6. a liner foil; 7. a glass fiber prepreg; 8. a through hole; 9. and curing the glue holes.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
The invention relates to a multi-layer thick-copper large-size back plate which comprises a core plate and a plurality of layers of copper foils 1, wherein the multi-interlayer copper foils 1 are respectively pressed on two sides of the core plate of the back plate through prepregs 2, the thickness of the copper foils 1 is 12 or 17.5 mu m, textures are etched on the surfaces of the copper foils, the thickness of the prepregs 2 is 74 mu m and 135 mu m, the thickness intervals of the prepregs 2 are selected, namely 74 mu m, 135 mu m, 74 mu m and 135 mu m … are selected at intervals, the core plate comprises an upper copper plate, a middle copper plate and a lower copper plate, and the thickness of the middle copper plate 4 is 2 mm; the thickness of the upper copper plate 3 and the lower copper plate 5 is 1mm or 1.2mm, grooves are etched on the surfaces of two sides of the middle copper plate 4, the residual thickness of the middle copper plate 4 at the etching position is 80-100 mu m, a curing glue hole 9 is arranged at the bottom of each groove, a groove is etched in the bottom surface of the upper copper plate 3, the depth of each groove is 20 mu m, the etched groove in the bottom of the upper copper plate 3 corresponds to the non-etched surface on the top surface of the middle copper plate 4, the etched groove in the top surface of the lower copper plate 5 corresponds to the non-etched surface on the bottom surface of the middle copper plate 4, the multilayer lining foils 6 are stacked in the grooves, glass fiber prepregs 7 are arranged between the inner sides of the grooves in the same ratio, and the through holes 8 penetrate through the copper foil 1 and the core plate;
the glass fiber prepreg 7 is a high-gel-content prepreg;
the filling rate of the prepreg 2 is 1.08, namely the volume-to-volume ratio of the prepreg 2 to the filling space is 1.08;
the through holes 8 are connected and combined through prepregs 2;
the preparation process of the multilayer thick copper large-size back plate comprises the following steps:
OP 1: according to the distribution condition of product holes, the copper at the position of the dense holes is subjected to depth control processing of a through hole 8 by using a numerical control machine;
OP 1: machining and milling grooves in the upper, middle and lower layer structures of the core plate in advance, roughly machining the grooves, and then etching the surfaces to form grooves with required sizes;
OP 2: carrying out primary pressing on the lining foil 6 through the glass fiber prepreg 7 to form a lining plate, then curing and cutting the lining plate, wherein the cut lining plate corresponds to the groove;
OP 3: embedding the inner lining plate in the groove of the middle copper plate 4 through a glass fiber prepreg 7, and pressing and curing to form a whole;
OP 4: an upper copper plate 3 is arranged at the top of a middle copper plate 4 in a pressing mode through a prepreg 2, and a lower copper plate 5 is arranged at the bottom of the middle copper plate 4 in a pressing mode through the prepreg 2;
OP 5: and (3) filling the blind grooves and the pre-drilled holes by filling the high-gel-content prepreg 2 with gel, and laminating the core plate and the copper foil to form the back plate.
The middle plate is of a multilayer structure, and the lining plate is of multiple layers and can be matched with etching to form a required multilayer circuit;
the prepreg 2 and the copper foil 1 are pressed, and a multi-layer copper foil 1 pressing structure is formed by pressing an upper group and a lower group synchronously and symmetrically for multiple times;
the pressing temperature is 135-185 ℃.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A multilayer thick copper large-size backplate which characterized in that: the composite board comprises a core board and a plurality of layers of copper foils (1), wherein the copper foils (1) with multiple interlayers are respectively pressed on two sides of the core board of a back board through prepregs (2), the thickness of the copper foils (1) is 12-17.5 mu m, textures are etched on the surfaces of the copper foils, the thickness of the prepregs (2) is 74-135 mu m, the core board comprises an upper copper plate, a middle copper plate and a lower copper plate, and the thickness of a middle copper plate (4) is 2 mm; the copper plate (3) is arranged on the upper portion of the copper plate, the thickness of the lower copper plate (5) is 1mm or 1.2mm, grooves are etched in the surfaces of two sides of the middle copper plate (4), the thickness of the middle copper plate (4) in the etching position is 80-100 mu m, a curing glue hole (9) is formed in the bottom of each groove, grooves are etched in the bottom of the upper copper plate (3), the depth of each groove is 20 mu m, the grooves etched in the bottom of the upper copper plate (3) correspond to the top surface non-etching face of the middle copper plate (4), the grooves etched in the top of the lower copper plate (5) correspond to the bottom surface non-etching face of the middle copper plate (4), a multilayer foil lining (6) is arranged in each groove in a stacked mode, a glass fiber prepreg (7) is arranged between the same proportion of the inner sides of the grooves, and a through hole (8) penetrates through the copper foil (1) and the core board.
2. A multi-layer thick copper large size backplane according to claim 1, wherein: the thickness intervals of the prepregs (2) are selected, namely 74 mu m, 135 mu m, 74 mu m and 135 mu m … intervals.
3. A multi-layer thick copper large size backplane according to claim 1, wherein: the glass fiber prepreg (7) is a high-gel-content prepreg.
4. A multi-layer thick copper large size backplane according to claim 1, wherein: the filling rate of the prepreg (2) is 1.08, namely the volume-to-volume ratio of the prepreg (2) to the filling space is 1.08.
5. A multi-layer thick copper large size backplane according to claim 1, wherein: the through holes (8) are connected and combined through prepregs (2).
6. A multi-layer thick copper large size backplane according to claim 1, wherein: a preparation process of a multilayer thick copper large-size back plate comprises the following steps:
OP 1: according to the distribution condition of product holes, the copper at the position of the dense holes is subjected to depth control processing of through holes (8) by using a numerical control machine;
OP 1: machining and milling grooves in the upper, middle and lower layer structures of the core plate in advance, roughly machining the grooves, and then etching the surfaces to form grooves with required sizes;
OP 2: carrying out primary pressing on the lining foil (6) through a glass fiber prepreg (7) to form a lining plate, then solidifying and cutting the lining plate, wherein the cut lining plate corresponds to the groove;
OP 3: embedding the inner lining plate in the groove of the middle copper plate (4) through a glass fiber prepreg (7), and pressing and curing to form a whole;
OP 4: pressing an upper copper plate (3) on the top of a middle copper plate (4) through a prepreg (2), and pressing a lower copper plate (5) on the bottom of the middle copper plate (4) through the prepreg (2);
OP 5: and (3) filling the blind grooves and the pre-drilled holes by filling the high-gel-content prepreg (2) with gel, and laminating the core plate and the copper foil to form the back plate.
7. A multi-layer thick copper large size backplane according to claim 6, wherein: the middle plate is of a multilayer structure, and the lining plate is of multiple layers and can be matched with etching to form a required multilayer circuit.
8. A multi-layer thick copper large size backplane according to claim 6, wherein: the prepreg (2) and the copper foil (1) are pressed together, an upper group of synchronous symmetrical pressing and a lower group of synchronous symmetrical pressing are carried out, a pressing structure of the multilayer copper foil (1) is formed for multiple times, and the pressing temperature is 135-185 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110822734.8A CN113490349B (en) | 2021-07-21 | 2021-07-21 | Preparation process of multilayer thick-copper large-size backboard |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110822734.8A CN113490349B (en) | 2021-07-21 | 2021-07-21 | Preparation process of multilayer thick-copper large-size backboard |
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| Publication Number | Publication Date |
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| CN113490349A true CN113490349A (en) | 2021-10-08 |
| CN113490349B CN113490349B (en) | 2022-07-22 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007109706A (en) * | 2005-10-11 | 2007-04-26 | Matsushita Electric Ind Co Ltd | Process for producing multilayer printed wiring board |
| CN105208796A (en) * | 2015-09-14 | 2015-12-30 | 上海美维电子有限公司 | Super-thick copper circuit board fabrication method and super-thick copper circuit board |
| CN109219275A (en) * | 2018-10-23 | 2019-01-15 | 珠海杰赛科技有限公司 | High-level, the thick thin core layer of copper of one kind covers type method and pcb board |
| CN112672546A (en) * | 2020-12-28 | 2021-04-16 | 珠海市深联电路有限公司 | Processing method for printing multilayer board by ultra-thick copper foil |
| CN112867286A (en) * | 2020-12-28 | 2021-05-28 | 珠海市深联电路有限公司 | Preparation method of embedded large copper plate back plate |
| CN112888171A (en) * | 2021-01-19 | 2021-06-01 | 中国电子科技集团公司第二十九研究所 | Method and device for processing blind slot of multilayer printed board |
-
2021
- 2021-07-21 CN CN202110822734.8A patent/CN113490349B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007109706A (en) * | 2005-10-11 | 2007-04-26 | Matsushita Electric Ind Co Ltd | Process for producing multilayer printed wiring board |
| CN105208796A (en) * | 2015-09-14 | 2015-12-30 | 上海美维电子有限公司 | Super-thick copper circuit board fabrication method and super-thick copper circuit board |
| CN109219275A (en) * | 2018-10-23 | 2019-01-15 | 珠海杰赛科技有限公司 | High-level, the thick thin core layer of copper of one kind covers type method and pcb board |
| CN112672546A (en) * | 2020-12-28 | 2021-04-16 | 珠海市深联电路有限公司 | Processing method for printing multilayer board by ultra-thick copper foil |
| CN112867286A (en) * | 2020-12-28 | 2021-05-28 | 珠海市深联电路有限公司 | Preparation method of embedded large copper plate back plate |
| CN112888171A (en) * | 2021-01-19 | 2021-06-01 | 中国电子科技集团公司第二十九研究所 | Method and device for processing blind slot of multilayer printed board |
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| CN113490349B (en) | 2022-07-22 |
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