KR100917777B1 - Method of manufacturing a printed circuit boardPCB, method of forming a pattern on a base board and PCB - Google Patents

Abstract

In the method of manufacturing a printed circuit board, a first electrode circuit layer having a first pattern using a conductive ink including a component capable of maintaining adhesiveness with the base substrate by a screen printing method using a first screen plate on a base substrate. Forming a second pattern using an insulating ink including a component capable of maintaining adhesiveness with the first electrode circuit layer in a screen printing method using a second screen plate on the upper surface of the first electrode circuit layer; Forming a first insulating layer having;

Description

Method of manufacturing a printed circuit board (PCB), method of forming a pattern on a base board and PCB}

The present invention relates to a method for manufacturing a printed circuit board, and more particularly, to a method for manufacturing a single layer or a multilayer printed circuit board by screen printing.

In recent years, the electronic industry has been increasingly adopting a mounting technology using multilayer printed circuit boards, which are capable of high density, high precision, and high integration, in order to reduce the size and thickness of electronic devices. Recently, as the miniaturization and thinning of the mobile communication device and the digital home appliance market have progressed rapidly, the demand for multilayer printed circuit boards is rapidly increasing.

The process of manufacturing the multilayer printed circuit board goes through a process similar to that of a conventional single-sided or double-sided printed circuit board. That is, after forming a conductive layer through copper foil or plating, unwanted portions are removed using an etching process so that only desired circuit portions remain.

When there are not many layers, a double-sided printed circuit board may be manufactured by stacking double-sided printed circuit boards. Common to these processes is that a multi-layer printed circuit board is manufactured by stacking new layers on top and bottom of the core based on a core. However, in the case of using the core in this way, if the electrical connection is required on the upper and lower surfaces, there is a restriction. In addition, it is basically manufactured including a number of processes such as plating, exposure, etching, peeling, and washing. Therefore, the manufacturing method of this method is complicated and the pattern is formed by plating, exposing, etching, peeling and cleaning the metal, so most of the metal to be plated is etched. Problems such as this occur.

Therefore, there is a need for a method of manufacturing a printed circuit board that can solve such problems.

Accordingly, it is an object of the present invention to provide a method for manufacturing a printed circuit board which is simple in processing and prevents environmental pollution.

Another object of the present invention is to provide a method of forming a pattern on a base substrate which is simple in processing and prevents environmental pollution.

Still another object of the present invention is to provide a printed circuit board having a simple process and preventing environmental pollution.

In order to achieve the above object of the present invention, a method of manufacturing a printed circuit board according to an embodiment of the present invention can maintain adhesiveness with the base substrate by a screen printing method using a first screen plate on the base substrate. Forming a first electrode circuit layer having a first pattern by using a conductive ink including a component having a component present therein and screen printing using a second screen plate on an upper surface of the first electrode circuit layer. And forming a first insulating layer having a second pattern using an insulating ink comprising a component capable of maintaining adhesiveness.

In example embodiments, the first insulating layer may be formed on the top surface of the first electrode circuit layer except for through holes at regular intervals.

The resistivity of the conductive ink may be 1 × 10 [Ωm] to 1.59 × 10 ⁻⁸ [Ωm] and the viscosity may be 1000 cps (absolute viscosity) to 30000 cps.

The first electrode circuit layer may have a fine pattern of 30um to 300um.

The thickness of the first insulating layer may be 10um to 50um.

The insulating ink may be a thermosetting type or an ultraviolet curing type.

The base substrate may be flexible or rigid. The base substrate may be one of glass, acrylic resin (PMMA), polyethylene resin (PET), polycarbonate (Poly Carbonate) and polyimide (Poly-imid).

The method of manufacturing the printed circuit board may include forming a second electrode circuit layer on the top surface of the first insulating layer by a screen printing method using the first screen plate, and the second screen on the top surface of the second electrode circuit layer. The method may further include forming a second insulating layer by screen printing using a plate.

Method of forming a pattern on a base substrate according to another embodiment of the present invention for achieving the above object is, in accordance with an embodiment of the present invention, the step of applying an emulsion to a plate of 300 to 800 mesh, the emulsion is applied Drying the plate, forming a pattern of an electrode layer on the dried plate using a master film, placing a substrate on the bottom of the plate on which the pattern is formed, and applying ink to the plate by using a scrubber and squeegee. By pressurizing Forming a pattern of the electrode layer on the substrate.

In an embodiment, the method of forming a pattern on the base substrate may be performed at room temperature (error ± ± 2 ℃) of 20 ℃, relative humidity of 50 to 60%, environmental conditions of a clean room of less than 1000 class.

In an embodiment, the squeegee speed is 50 to 100cm / sec, the squeegee angle is 60 to 85 degrees, the squeegee pressure is 50 to 80kg / m ² , the squeegee hardness is 70 to 95, the screed The lever angle is 60 to 85 degrees, the scrubber speed is 50 to 100 cm / sec, the scrubber pressure is 50 to 80 kg / m ² , and the tension of the plate is 0.75 to 1.1 mm / kgf. The distance between the substrate and the substrate may be 3 to 6 mm.

The printed circuit board according to another embodiment of the present invention for achieving the above object includes a base substrate, an electrode circuit layer and an insulating layer. The electrode circuit layer is formed on the base substrate by using a conductive ink including a component capable of maintaining adhesiveness with the base substrate in a screen printing method using a first screen plate and has a first pattern. The insulating layer is formed on the upper surface of the base electrode circuit layer by using an insulating ink including a component capable of maintaining adhesiveness with the electrode circuit layer in a screen printing method using a second screen plate and has a second pattern.

In an embodiment, the insulating layer includes a through hole in which the insulating ink is deficient at regular intervals on an upper surface of the electrode circuit layer.

According to the present invention, when manufacturing a single layer or multi-layer printed circuit board, screen ink is used, so that a more flexible pattern can be formed than the conventional copper film method, and since the substrate is not required for each layer, the thickness is reduced. It can also be applied to slimming. In addition, the production cost can be reduced by simplifying the process, and environmental pollution can be prevented because no etching is required.

Hereinafter, a method of manufacturing a semiconductor device in accordance with embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments, and has ordinary skill in the art. It will be apparent to those skilled in the art that the present invention may be embodied in various other forms without departing from the spirit of the invention.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof that is described, and that one or more other features or numbers are present. It should be understood that it does not exclude in advance the possibility of the presence or addition of steps, actions, components, parts or combinations thereof. Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and, unless expressly defined in this application, are construed in ideal or excessively formal meanings. It doesn't work.

On the other hand, when an embodiment is otherwise implemented, a function or operation specified in a specific block may occur out of the order specified in the flowchart. For example, two consecutive blocks may actually be performed substantially simultaneously, and the blocks may be performed upside down depending on the function or operation involved. Like reference numerals in the drawings denote like elements.

1 is a flowchart illustrating a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

FIG. 2 is an enlarged photograph of a printed circuit board manufactured by the method of manufacturing the printed circuit board of FIG. 1.

3 is a cross-sectional view of the printed circuit board of FIG. 2.

1 to 3, a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention is first bonded to the base substrate 100 by a screen printing method using a first screen plate on the base substrate 100. The first electrode circuit layer 200 having the first pattern is formed by using a conductive ink including a component capable of maintaining the castle (S10). The first screen plate has a circuit form indicated by the first electrode circuit layer 200. Next, an insulating ink including a component capable of maintaining adhesiveness with the first electrode circuit layer 200 by a screen printing method using a second screen plate on the upper surface of the first electrode circuit layer 200 is used. A first insulating layer 300 having a second pattern is formed (S20). The second screen plate has a form indicated by the first insulating layer 300. That is, the first insulating layer 300 is formed on the top surface of the first electrode circuit layer 200 including a through hole 310 through which the first insulating layer is deficient at regular intervals. Wiring and the like is made through the through hole 310.

The resistivity value of the conductive ink used to form the first electrode circuit layer 200 may be 0 [Ωm] to 1.59 × 10 ⁻⁸ [Ωm] and the viscosity may be 1000 cps (absolute viscosity) to 30000 cps. In addition, the first electrode circuit layer 200 may have a fine pattern of 30um to 300um.

The first insulating layer 300 may have a thickness of about 10 μm to about 50 μm, and the insulating ink used to form the first insulating layer 300 may be of a thermosetting type or an ultraviolet curing type. That is, the insulating ink may be cured when heat is applied or may be cured when ultraviolet light is applied. .

2 is an enlarged photograph of a printed circuit in which a fine pattern of 30 μm is formed using an ink having a viscosity of about 1000 to 30000 cps according to one embodiment of the present invention. The pitch of each pattern is separated by about 40-50 um, and the thickness of each pattern layer shows about 3-30 um.

Although it will be described later, the pattern used for the electrode circuit layer uses an ink having a viscosity of about 1000 to 30000 cps, and the plate making mesh is dried by applying an oil agent using 300 to 500 mesh (20 ° C. to 20 ° C.) 30 to 60 minutes) using the master film vacuum exposure, development, and then to form a pattern of the electrode circuit layer on the plate-making network and then using the patterned plate-making squeegee angle, squeegee speed, squeegee pressure, scrubber angle The pattern is formed on the substrate after adjusting conditions such as the scrab speed, the scrubber pressure, the tension of the plate, the gap between the plate and the substrate, and the ink viscosity according to the pattern size.

3 is a screen printing method using insulating ink on the first electrode circuit layer 200 formed by screen printing using conductive ink on the base substrate 100 in FIG. 2. ) Is a cross-sectional view. In accordance with the land position and the electrode position of the electrode circuit except for the through-hole 310 by using an insulating ink that maintains adhesiveness with the top surface of the first electrode circuit layer 200 and is insulated and moisture-proof. The first insulating layer 300 is formed by screen printing.

FIG. 4 is an enlarged photograph of the case where the first insulating layer 300 is formed except for the through hole 310 of the upper surface of the first electrode circuit layer 200 in FIG. 3. Here, the land size of the electrode circuit is 208 to 300um and the size of the through hole 310 is 70 to 80um. The first insulating layer 300 should be formed by adjusting the conditions of the screen printing method according to the size of the through hole 310. The thickness of the first insulating layer 300 using the insulating ink is about 10 to 50 μm, and the insulating ink uses a thermosetting type or ultraviolet curing type ink as described above.

As for the solvent ratio with respect to an insulating ink, about 5 to 20% may be suitable.

5 illustrates a case in which an electrode circuit layer and an insulating layer are repeatedly formed in the method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention. Thus, the printed circuit board formed by repeatedly forming the electrode circuit layer and the insulating layer can function as both sides and multiple layers.

1 and 5, a second electrode circuit layer 250 is formed on an upper surface of the first insulating layer 300 (S30). Similarly to the first electrode circuit layer 200, the second electrode circuit layer 250 may be formed by a screen printing method using the first screen plate. Also, the same conductive ink as when using the first screen plate may be used, and other conductive ink may be used. The screen ink used in forming the second electrode circuit layer 250 may of course contain a component capable of maintaining adhesiveness with the first insulating layer 300. The second insulating layer 350 is formed on the upper surface of the second electrode circuit layer 250. The second insulating layer 350 is also formed by a screen printing method using the second screen plate. Also, the same conductive ink as when using the second screen plate may be used, and other conductive ink may be used. The screen ink used in forming the second insulating layer 350 also includes a component capable of maintaining adhesiveness with the second electrode circuit layer 250. In addition, the through hole 360 is also included in the second insulating layer 350.

Figure 6 is a table comparing the manufacturing process including the conventional printed circuit board manufacturing process of the copper film method and the printed circuit board manufacturing method according to an embodiment of the present invention.

In Figure 6, 401 is a drawing design, 402 is cutting 403 is drill 404 is copper plating 405 is low salt 406 is D / F, 407 is exposure 408 is phenomenon 409 is corrosion 410 is peeling 411 is coverlay punching 412 is temporary 413 is hot press 414 is post-processing 415 is surface treatment 416 is resist 417 is STF 418 is short cut 419 is BBT 420 is final inspection 500 is screen electronic printing 501 is a drying process. The printed circuit board manufacturing method according to the embodiment of the present invention corresponds to screen electronic printing in step 500.

Referring to Figure 6, the manufacturing process including a printed circuit board manufacturing method according to an embodiment of the present invention is simplified compared to the conventional manufacturing process of the copper film method, the number of steps in the manufacturing process is reduced and simplified, and environmental pollution does not occur. It can be seen that.

Referring back to Figure 3 will be described a printed circuit board according to an embodiment of the present invention.

Referring to FIG. 3, a printed circuit board according to an embodiment of the present invention includes a base substrate 100, an electrode circuit layer 200, and an insulating layer 300.

The electrode circuit layer 200 is formed on the base substrate 100 by using a conductive ink including a component capable of maintaining adhesion with the base substrate 100 by a screen printing method using the first screen plate. And has a first pattern. The insulating layer 300 is a screen printing method using a second screen plate on the upper surface of the electrode circuit layer 200 using an insulating ink containing a component capable of maintaining adhesion with the electrode circuit layer 200. Formed and has a second pattern. The first screen plate may have a circuit form indicated by the first electrode circuit layer 200. The second screen plate may have a form indicated by the first insulating layer 300. The insulating layer 300 may include a through hole 310 on which the insulating ink is deficient at regular intervals on the upper surface of the electrode circuit layer 200.

The base substrate 100 may be flexible or rigid. The base substrate 100 may be one of glass, acrylic resin (PMMA), polyethylene resin (PET), polycarbonate, and polyimide.

In the method of manufacturing a printed circuit board and a printed circuit board according to an exemplary embodiment of the present invention, a component capable of maintaining adhesiveness included in the conductive ink may vary depending on the type of the base substrate.

7 is a flowchart illustrating a method of forming a pattern on a base substrate according to an embodiment of the present invention.

Referring to FIG. 7, the method of forming a pattern on a base substrate according to an embodiment of the present invention includes applying an oil to a plate of 300 to 800 mesh (S510), and drying the plate coated with the oil ( S520), forming a pattern of an electrode circuit layer on the dried plate using a master film (S530), placing a substrate on the lower portion of the plate formed with the pattern (S540) and the scrubber to the plate by Applying an ink and applying pressure to a squeegee to form a pattern of an electrode layer on the substrate (S550).

The method of forming a pattern on the base substrate according to an embodiment of the present invention can be made at room temperature of 20 ℃ (error ± 2 ℃), relative humidity of 50 to 60%, environmental conditions of a clean room of less than 1000 class.

The emulsion may be photosensitive ultraviolet light. Drying conditions in step (S520) may be about 30 to 60 minutes at 20 ℃ to 20 ℃. In general, the squeegee speed is 50 to 100 cm / sec, the squeegee angle is 60 to 85 degrees, the squeegee pressure is 50 to 80kg / m ² , the squeegee hardness is 70 to 95 and the screbar angle is 60 to 85 degrees, the scrubber speed is 50 to 100cm / sec, the scrubber pressure is 50 to 80kg / m ² , the tension of the plate making is 0.75 to 1.1mm / kgf, the gap between the plate and the substrate May be 3 to 6 mm. The method of forming a pattern on the base substrate of FIG. 7 may be applied to form the electrode circuit layer 200 and the insulating layer 300 of FIG. 3 by different ink and screen patterns.

According to the present invention, when manufacturing a single layer or multilayer printed circuit board, screen ink is used, so that a more flexible pattern can be formed than the conventional copper film method, and since the substrate is not required for each layer, the thickness is reduced. It can also be applied to slimming. In addition, the production cost can be reduced by simplifying the process, and environmental pollution can be prevented since no etching is required.

As described above, the present invention has been described with reference to a preferred embodiment of the present invention, but those skilled in the art may vary the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. It will be understood that modifications and changes can be made.

1 is a flowchart illustrating a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

FIG. 2 is an enlarged photograph of a printed circuit board manufactured by the method of manufacturing the printed circuit board of FIG. 1.

FIG. 3 is a cross-sectional view of the first insulating layer and the through hole formed by the screen printing method using the insulating ink on the first electrode circuit layer formed by the screen printing method using the conductive ink on the base substrate of FIG. 2.

FIG. 4 is an enlarged photograph of the case where the first insulating layer is formed except for the through hole in the upper surface of the first electrode circuit layer in FIG. 3.

5 illustrates a case in which an electrode circuit layer and an insulating layer are repeatedly formed in the method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

Figure 6 is a table comparing the manufacturing process including the conventional printed circuit board manufacturing process of the copper film method and the printed circuit board manufacturing method according to an embodiment of the present invention.

7 is a flowchart illustrating a method of forming a pattern on a base substrate according to an embodiment of the present invention.

Description of the main parts of the drawing

100: base substrate 200: electrode circuit layer

300: insulating layer 310: through hole

Claims (14)

A first electrode circuit having a first pattern using a conductive ink having a viscosity of 1000 cps (absolute viscosity) to 30000 cps, which can maintain adhesiveness with the base substrate by screen printing using a first screen plate on a base substrate. Forming a layer; And First insulation having a second pattern using an ultraviolet curing type insulating ink capable of maintaining adhesiveness with the first electrode circuit layer by a screen printing method using a second screen plate on the upper surface of the first electrode circuit layer. Method of manufacturing a printed circuit board comprising the step of forming a layer. The printed circuit board of claim 1, wherein the first insulating layer includes a through hole on the top surface of the first electrode circuit layer, the through ink having a predetermined gap therebetween. Manufacturing method. The method of claim 1, wherein the resistivity of the conductive ink is 1 × 10 [Ωm] to 1.59 × 10 ⁻⁸ [Ωm]. The method of claim 1, wherein the first electrode circuit layer has a fine pattern of 30 μm to 300 μm. The method of claim 1, wherein the first insulating layer has a thickness of about 10 μm to about 50 μm. delete The method of claim 1, wherein the base substrate is flexible or rigid. The method of claim 7, wherein the base substrate is glass, acrylic resin (PMMA), polyethylene resin (PET), polycarbonate (Poly Carbonate) and polyimide (Poly-imid) manufacturing of a printed circuit board Way. The method of claim 1, Forming a second electrode circuit layer on a top surface of the first insulating layer by a screen printing method using the first screen plate; And And forming a second insulating layer on the upper surface of the second electrode circuit layer by screen printing using the second screen plate. Applying an emulsion to a plate of 300 to 800 mesh; Drying the plate coated with the emulsion; Forming a pattern of an electrode layer on the dried plate using a master film; Placing a substrate under the patterned plate; And A method of forming a pattern on a base substrate, comprising: applying an ink capable of maintaining adhesion with the substrate to the plate by a scrubber and applying a pressure to a squeegee to form a pattern of the electrode layer on the substrate. The method of claim 10, wherein the squeegee speed is 50 to 100cm / sec, the squeegee angle is 60 to 85 degrees, the squeegee pressure is 50 to 80kg / m ² , the squeegee hardness is 70 to 95, The scrubber angle is 60 to 85 degrees, the scrubber speed is 50 to 100 cm / sec, the scrubber pressure is 50 to 80 kg / m ² , the tension of the plate making is 0.75 to 1.1 mm / kgf, The distance between the plate and the substrate is a method of forming a pattern on the base substrate, characterized in that 3 to 6mm. The method of claim 11, wherein the method of forming an electrode pattern on the substrate is characterized in that the room temperature (error ± 2 ℃) of 20 ℃, relative humidity of 50 to 60%, environmental conditions of a clean room of less than 1000 class A method of forming a pattern on a base substrate. A base substrate; An electrode having a first pattern formed on the base substrate by using a conductive ink having a viscosity of 1000 cps (absolute viscosity) to 30000 cps, which can maintain adhesiveness with the base substrate by screen printing using a first screen plate. Circuit layer; And And an insulating layer having a second pattern formed on the upper surface of the electrode circuit layer by using a UV curing type insulating ink capable of maintaining adhesiveness with the electrode circuit layer by a screen printing method using a second screen plate. Printed circuit board. The printed circuit board of claim 13, wherein the insulating layer comprises a through hole in which the insulating ink is deficient at regular intervals on an upper surface of the electrode circuit layer.

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