CN104902728A - Electronic equipment and heat-radiating member - Google Patents
Electronic equipment and heat-radiating member Download PDFInfo
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- CN104902728A CN104902728A CN201410074834.7A CN201410074834A CN104902728A CN 104902728 A CN104902728 A CN 104902728A CN 201410074834 A CN201410074834 A CN 201410074834A CN 104902728 A CN104902728 A CN 104902728A
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Abstract
The invention discloses electronic equipment. The electronic equipment comprises at least one heating electronic device, a heat-radiating member, a conduction member and an airflow acceleration device. The heat-radiating member is made of heat-conducting material. The heat-radiating member comprises a substrate, a first heat-radiating fin group and a second heat-radiating fin group. The first heat-radiating fin group and the second heat-radiating fin group are arranged on the first surface of the substrate side by side. The conduction member is arranged between the electronic device and the heat-radiating member and used for conducting heat generated by the electronic device to the heat-radiating member to be radiated. Airflow flowing out of the air outlet of the airflow acceleration device covers the first heat-radiating fin group. Height of the first heat-radiating fin group relative to the substrate is greater than height of the second heat-radiating fin group relative to the substrate.
Description
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of electronic equipment and heat sink.
Background technology
Along with the development of science and technology and the progress of society, electronic equipment such as computer, mobile phone, TV have become an indispensable part in people's live and work.
In order to ensure that the electronic device in electronic equipment can normally work, in electronic equipment, be usually provided with heat dissipation element.Particularly, described electronic equipment comprises: the heater members (as central processing unit, heat-generating electronic elements etc.) of evolution of heat during work, distribute as described in the heat sink and being arranged at of heat to be passed to for the heat that heater members is sent between heater members, heat sink as described in heat sink carry out the conducting piece that distributes and the airflow accelerator of heat sink ambient air flowing velocity as described in being used for accelerating.
But find in the process used, because the height of multiple fin of described heat sink is identical, and described heat sink upper part region can be covered by the air-flow that the air outlet of described flow accelerator flows out, therefore, when dispelling the heat to described heater members, the speed that described heat sink is not distributed by the heat in region that the air-flow that the air outlet of described flow accelerator flows out covers is comparatively slow, causes with the case temperature of the electronic equipment of this part contact higher, affects Consumer's Experience.
Summary of the invention
The application provides a kind of electronic equipment and heat sink, the height improving the multiple fin because of described heat sink in prior art is identical, and described heat sink upper part region can be covered by the air-flow that the air outlet of described flow accelerator flows out, when dispelling the heat to described heater members, the speed that described heat sink is not distributed by the heat in region that the air-flow that the air outlet of described flow accelerator flows out covers is slower, cause with the case temperature of the electronic equipment of this part contact higher, affect the technical problem of Consumer's Experience, reach the temperature of the housing reducing described electronic equipment, improve the technique effect of Consumer's Experience.
The application provides a kind of electronic equipment, described electronic equipment comprises the electronic device of at least one heating, heat sink, heat sink and conducting piece flow accelerator, described heat sink is made up of Heat Conduction Material, described heat sink comprises substrate, the first groups of fins and the second groups of fins, and described first groups of fins and described second groups of fins are juxtaposed on the first surface of described substrate; Described conducting piece is arranged between described electronic device and described heat sink, distributes to described heat sink for the heat conduction produced by described electronic device; The air-flow that the air outlet of described flow accelerator flows out covers described first groups of fins; Wherein, described first groups of fins is greater than the height of described second groups of fins relative to described substrate relative to the height of described substrate.
Preferably, described first groups of fins comprises multiple first fin be arranged at abreast on described first surface, and described second groups of fins comprises multiple second fin be arranged at abreast on described first surface.
Preferably, the interval in described multiple first fin between adjacent two the first fin is less than the interval in described multiple second fin between adjacent two the second fin.
Preferably, described heat sink also comprises the first cover plate and the second cover plate, described first cover plate is fixedly connected with the one end away from described substrate on described multiple first fin, and described second cover plate is fixedly connected with the one end away from described substrate on described multiple second fin.
Preferably, described flow accelerator is specially vibration of thin membrane fan.
Preferably, described electronic equipment also comprises controller and temperature-detecting device, described temperature-detecting device is for detecting the temperature of described electronic device, and described controller, according to the temperature of described detection, controls the gas source temperature of described airflow accelerator or flow velocity or rotating speed.
Preferably, described electronic equipment also comprises actuator, and described actuator vibrates for driving described heat sink, to improve radiating efficiency.
Preferably, the piezoelectric ceramic that described actuator comprises oscillating circuit and is electrically connected with described oscillating circuit, described heat sink is fixed on described piezoelectric ceramic, when described oscillating circuit passes into electric current, described piezoelectric ceramic can produce vibration, vibrates to drive described heat sink.
Preferably, the shell fragment that described actuator involving vibrations motor is connected with described vibrating motor, described heat sink is fixed on described shell fragment, and described vibrating motor vibrates for driving described shell fragment, vibrates to drive described heat sink.
The application also provides a kind of heat sink, described heat sink is made up of Heat Conduction Material, described heat sink comprises substrate, multiple first fin and multiple second fin, described multiple first fin and described multiple second fin are arranged on a surface of described substrate abreast, and described multiple first fin is different relative to the height of described substrate from described second fin relative to the height of described substrate.
Preferably, the interval in the interval in described multiple first fin between adjacent two the first fin and described multiple second fin between adjacent two the second fin is unequal.
The application's beneficial effect is as follows:
By the first groups of fins of the air-flow that described heat sink can be flowed out by the air outlet of described flow accelerator covering to be set to the height of the second groups of fins being greater than described heat sink relative to the height of described substrate, thus avoid the body contact of described second groups of fins and described electronic equipment, reduce the temperature of the housing of described electronic equipment, simultaneously, also undertaken dispelling the heat timely by described first groups of fins, thus the height improving the multiple fin because of described heat sink in prior art is identical, and described heat sink upper part region can be covered by the air-flow that the air outlet of described flow accelerator flows out, when dispelling the heat to described heater members, the speed that described heat sink is not distributed by the heat in region that the air-flow that the air outlet of described flow accelerator flows out covers is slower, cause with the case temperature of the electronic equipment of this part contact higher, affect the technical problem of Consumer's Experience, reach the temperature of the housing reducing described electronic equipment, improve the technique effect of Consumer's Experience.
Arrange described first cover plate by the one end away from described substrate on described multiple first fin, the one end away from described substrate on described multiple second fin arranges described second cover plate, to increase the area of dissipation of described heat sink, improving heat radiation efficiency.
Vibrate to drive described heat sink by arranging actuator, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink and ambient air, thus raising radiating rate, the heat improving the generation of heater members described in prior art can not be conducted timely, thus cause the temperature of described heater members higher, affect the technical problem of the work of heater members, reach the technique effect improving described electronic equipment dissipating heat efficiency.
By arranging described oscillating circuit and being fixed on the piezoelectric ceramic be connected on described heat sink and with described oscillating circuit, when described oscillating circuit passes into electric current, described oscillating circuit can produce oscillating current, described piezoelectric ceramic can vibrate under the excitation of described oscillating current, thus drive described heat sink to vibrate, ambient air flowing velocity is accelerated, thus improves the rate of heat exchange between described heat sink and ambient air, thus improve radiating rate.
By arranging described vibrating motor and being fixed on the shell fragment be connected on described heat sink and with described vibrating motor, when described vibrating motor starts, described vibrating motor drives described shell fragment to vibrate, thus drive described heat sink to vibrate, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink and ambient air, thus improve radiating rate.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described by the accompanying drawing used required in describing embodiment below, apparently, the accompanying drawing in the following describes is only some embodiments of the present invention.
Fig. 1 is the structural representation of the application one better embodiment electronic equipment;
Fig. 2 is the structural representation of the another better embodiment electronic equipment of the application;
Fig. 3 is the structural representation of the application's better embodiment heat sink again.
Embodiment
The embodiment of the present application is by providing a kind of electronic equipment and heat sink, the height improving the multiple fin because of described heat sink in prior art is identical, and described heat sink upper part region can be covered by the air-flow that the air outlet of described flow accelerator flows out, when dispelling the heat to described heater members, the speed that described heat sink is not distributed by the heat in region that the air-flow that the air outlet of described flow accelerator flows out covers is slower, cause with the case temperature of the electronic equipment of this part contact higher, affect the technical problem of Consumer's Experience, reach the temperature of the housing reducing described electronic equipment, improve the technique effect of Consumer's Experience.
Technical scheme in the embodiment of the present application is for solving the problems of the technologies described above, and general thought is as follows:
A kind of electronic equipment, described electronic equipment comprises the electronic device of at least one heating, heat sink, heat sink and conducting piece flow accelerator, described heat sink is made up of Heat Conduction Material, described heat sink comprises substrate, the first groups of fins and the second groups of fins, and described first groups of fins and described second groups of fins are juxtaposed on the first surface of described substrate; Described conducting piece is arranged between described electronic device and described heat sink, distributes to described heat sink for the heat conduction produced by described electronic device; The air-flow that the air outlet of described flow accelerator flows out covers described first groups of fins; Wherein, described first groups of fins is greater than the height of described second groups of fins relative to described substrate relative to the height of described substrate.
A kind of heat sink, described heat sink is made up of Heat Conduction Material, described heat sink comprises substrate, multiple first fin and multiple second fin, described multiple first fin and described multiple second fin are arranged on a surface of described substrate abreast, and described multiple first fin is different relative to the height of described substrate from described second fin relative to the height of described substrate.
By the first groups of fins of the air-flow that described heat sink can be flowed out by the air outlet of described flow accelerator covering to be set to the height of the second groups of fins being greater than described heat sink relative to the height of described substrate, thus avoid the body contact of described second groups of fins and described electronic equipment, reduce the temperature of the housing of described electronic equipment, simultaneously, also undertaken dispelling the heat timely by described first groups of fins, thus the height improving the multiple fin because of described heat sink in prior art is identical, and described heat sink upper part region can be covered by the air-flow that the air outlet of described flow accelerator flows out, when dispelling the heat to described heater members, the speed that described heat sink is not distributed by the heat in region that the air-flow that the air outlet of described flow accelerator flows out covers is slower, cause with the case temperature of the electronic equipment of this part contact higher, affect the technical problem of Consumer's Experience, reach the temperature of the housing reducing described electronic equipment, improve the technique effect of Consumer's Experience.
In order to better understand technique scheme, below in conjunction with Figure of description and concrete execution mode, technique scheme is described in detail.
Embodiment one
As shown in Figure 1, be the structural representation of a better embodiment electronic equipment 100.Described electronic equipment 100 can be mobile phone, panel computer, notebook computer, game machine etc.Described electronic equipment 100 comprises the electronic device 10 of at least one heating, heat sink 20, conducting piece 30 and flow accelerator 40.
Described electronic device 10 can be any electronic device of heating, as chip etc.
Described heat sink 20 is made up of Heat Conduction Material, and as aluminium, copper, aluminium alloy etc., the heat absorbed and week can be carried out exchange heat along air by described heat sink 20, to realize heat radiation.Described heat sink 20 comprises substrate 23, first groups of fins 21 and the second groups of fins 22, and described first groups of fins 21 and described second groups of fins 22 are juxtaposed on the first surface 231 of described substrate 23.Described first groups of fins 21 is greater than the height of described second fin 22 groups relative to described substrate 23 relative to the height of described substrate 23.
Described conducting piece 30 is arranged between described electronic device 10 and described heat sink 20, distributes to described heat sink 20 for the heat conduction produced by described electronic device 10.Described conducting piece 30 is made up of highly heat-conductive material, in order to improve the pyroconductivity between described electronic device 10 and described heat sink 20.Described heat-conducting piece 30 can be made up of materials such as Graphene, heat conductive silica gel, heat-conducting creams.By arranging described heat-conducting piece 30, the gap between described heat sink 30 and described electronic device 10 can not only be filled, to improve the efficiency of described heat trnasfer, the effect such as damping, insulation can also be played simultaneously.
Described flow accelerator 40 is for accelerating the flowing velocity of air-flow.The air-flow that the air outlet 41 of described flow accelerator 40 flows out can cover described first groups of fins 21.Therefore, when dispelling the heat, what the speed of distributing of the heat in described first groups of fins 21 was greater than Sohu second of Soviet Union groups of fins 22 distributes speed.Described airflow accelerator 40 is specifically as follows fan or air pump.Particularly, in order to reduce the size of described electronic equipment 100, described airflow accelerator 40 can be specially vibration film fan.
By the first groups of fins 21 of the air-flow that the heat sink 20 of described electronic equipment 100 can be flowed out by the air outlet of described flow accelerator 40 covering to be set to the height of the second groups of fins 22 being greater than described heat sink 20 relative to the height of described substrate 23, thus avoid the body contact of described second groups of fins 22 and described electronic equipment 100, reduce the temperature of the housing of described electronic equipment, simultaneously, also undertaken dispelling the heat timely by described first groups of fins 21, thus the height improving the multiple fin because of described heat sink in prior art is identical, and described heat sink upper part region can be covered by the air-flow that the air outlet of described flow accelerator flows out, when dispelling the heat to described heater members, the speed that described heat sink is not distributed by the heat in region that the air-flow that the air outlet of described flow accelerator flows out covers is slower, cause with the case temperature of the electronic equipment of this part contact higher, affect the technical problem of Consumer's Experience, reach the temperature of the housing reducing described electronic equipment, improve the technique effect of Consumer's Experience.
Particularly, described first groups of fins 21 comprises multiple first fin 211 be arranged at abreast on described first surface 231, described second groups of fins 22 comprises multiple second fin 221 be arranged at abreast on described first surface 231, and described multiple first fin 211 is greater than the height of described second fin 221 relative to described substrate 22 relative to the height of described substrate 22.And the height of each first fin can be identical in multiple first fin 211, also can be different; In like manner, in described multiple second fin 221, the height of each second fin can be identical, also can be different.
Further, in order to improve radiating effect, the interval be less than in described multiple second fin 221 between adjacent two the second fin 221 will be set between two the first fin 211 adjacent in described multiple first fin 211.That is; increase the quantity of described first fin 211; reduce the quantity of described second fin 221; thus increase the caloric receptivity of described first fin 211; improve described radiating efficiency, reduce the caloric receptivity of described second fin 221, reduce the heat that described second fin 221 stores up; avoid the temperature in region relative with described second fin 221 on described electronic device 10 too high, protect described electronic device 10.
In order to increase the area of dissipation of described heat sink 20, described heat sink 20 also comprises the first cover plate 24 and the second cover plate 25, described first cover plate 24 is fixedly connected with the one end away from described substrate 23 on described multiple first fin 211, and described second cover plate 25 is fixedly connected with the one end away from described substrate 23 on described multiple second fin 221.By the one end away from described substrate 23 on described multiple first fin 211, described first cover plate 24 is set, one end away from described substrate 23 on described multiple second fin 221 arranges described second cover plate 25, to increase the area of dissipation of described heat sink 20, improving heat radiation efficiency.
Particularly, in order to further improve described conduction efficiency, described electronic equipment 100 also comprises controller 50 and temperature-detecting device 60, described temperature-detecting device 60 is for detecting the temperature of described electronic device 10, described controller 50, according to the temperature of described detection, controls the gas source temperature of described flow accelerator 40 or flow velocity or rotating speed.As: as described in the temperature of electronic device 10 reach alarm temperature time; described controller 50 can be individual according to described temperature; the gas source temperature controlling described airflow accelerator 40 reduces; or flow velocity increases; or rotating speed increases; to accelerate the exchange velocity of the heat distributed with described electronic device 10, in time the heat that described electronic device 10 produces is conducted, protect described electronic device 10.Again, when the temperature of described electronic device 10 is lower than safe temperature, described controller 50 can according to this temperature, and the flow velocity or the rotating speed that control described airflow accelerator 40 reduce, and to improve the utilance of resource, avoid the waste of the energy.
Further, described electronic equipment 100 also comprises actuator 70, and described actuator 70 vibrates for driving described heat sink 20, to improve radiating efficiency.When described heat sink 20 vibrates, ambient air flowing velocity can be accelerated, thus improve the rate of heat exchange between described heat sink 20 and ambient air, thus improve radiating rate.Vibrate to drive described heat sink 20 by arranging actuator 70, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink 20 and ambient air, thus raising radiating rate, the heat improving the generation of heater members described in prior art can not be conducted timely, thus cause the temperature of described heater members higher, affect the technical problem of the work of heater members, reach the technique effect improving described electronic equipment dissipating heat efficiency.
The first: driven by oscillating circuit and piezoelectric ceramic.
As shown in Figure 1, the piezoelectric ceramic 72 that described actuator 70 comprises oscillating circuit 71 and is electrically connected with described oscillating circuit 71, described heat sink 20 is fixed on described piezoelectric ceramic 72, when described oscillating circuit 71 passes into electric current, described piezoelectric ceramic 72 can produce vibration, vibrates to drive described heat sink 20.
Described piezoelectric ceramic 72 is a kind of ceramic materials mechanical energy and electric energy can changed mutually, belongs to Inorganic Non-metallic Materials, is specifically as follows the one in the piezoelectric ceramic such as barium titanate series, lead zirconate titanate binary system, metaniobate system.
Described oscillating circuit 71 is a kind of circuit that can produce oscillating current, and described oscillating circuit is that a kind of size and Orientation is all with the electric current that the cycle changes.Described oscillating circuit 71 can be LC oscillating circuit, quartz crystal oscillator circuit and RC oscillating circuit etc.
By arranging described oscillating circuit 71 and being fixed on the piezoelectric ceramic 72 be connected on described heat sink 20 and with described oscillating circuit 71, when described oscillating circuit 71 passes into electric current, described oscillating circuit 71 can produce oscillating current, described piezoelectric ceramic 72 can vibrate under the excitation of described oscillating current, thus drive described heat sink 20 to vibrate, ambient air flowing velocity is accelerated, thus improves the rate of heat exchange between described heat sink 20 and ambient air, thus improve radiating rate.
The second: driven by vibrating motor and shell fragment.
As shown in Figure 2, the shell fragment 74 that described actuator 70 involving vibrations motor 73 is connected with described vibrating motor 73, described heat sink 20 is fixed on described shell fragment 74, and described vibrating motor 73 vibrates for driving described shell fragment 74, vibrates to drive described heat sink 20.
Vibrating motor 73 is exciting sources that power source and vibration source are combined as a whole, and vibrating motor 73 respectively installs one group of adjustable eccentric block at armature spindle two ends, and the centrifugal force utilizing axle and eccentric block High Rotation Speed to produce obtains exciting force.The exciting force utilance of vibrating motor 73 is high, energy consumption is little, noise is low, the life-span is long.
By arranging described vibrating motor 73 and being fixed on the shell fragment 74 be connected on described heat sink 20 and with described vibrating motor 73, when described vibrating motor 73 starts, described vibrating motor 73 drives described shell fragment 74 to vibrate, thus drive described heat sink 20 to vibrate, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink 20 and ambient air, thus improve radiating rate.
By the first groups of fins 21 of the air-flow that the heat sink 20 of described electronic equipment 100 can be flowed out by the air outlet of described flow accelerator 40 covering to be set to the height of the second groups of fins 22 being greater than described heat sink 20 relative to the height of described substrate 23, thus avoid the body contact of described second groups of fins 22 and described electronic equipment 100, reduce the temperature of the housing of described electronic equipment, simultaneously, also undertaken dispelling the heat timely by described first groups of fins 21, thus the height improving the multiple fin because of described heat sink in prior art is identical, and described heat sink upper part region can be covered by the air-flow that the air outlet of described flow accelerator flows out, when dispelling the heat to described heater members, the speed that described heat sink is not distributed by the heat in region that the air-flow that the air outlet of described flow accelerator flows out covers is slower, cause with the case temperature of the electronic equipment of this part contact higher, affect the technical problem of Consumer's Experience, reach the temperature of the housing reducing described electronic equipment, improve the technique effect of Consumer's Experience.
By the one end away from described substrate 23 on described multiple first fin 211, described first cover plate 24 is set, one end away from described substrate 23 on described multiple second fin 221 arranges described second cover plate 25, to increase the area of dissipation of described heat sink 20, improving heat radiation efficiency.
Vibrate to drive described heat sink 20 by arranging actuator 70, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink 20 and ambient air, thus raising radiating rate, the heat improving the generation of heater members described in prior art can not be conducted timely, thus cause the temperature of described heater members higher, affect the technical problem of the work of heater members, reach the technique effect improving described electronic equipment dissipating heat efficiency.
By arranging described oscillating circuit 71 and being fixed on the piezoelectric ceramic 72 be connected on described heat sink 20 and with described oscillating circuit 71, when described oscillating circuit 71 passes into electric current, described oscillating circuit 71 can produce oscillating current, described piezoelectric ceramic 72 can vibrate under the excitation of described oscillating current, thus drive described heat sink 20 to vibrate, ambient air flowing velocity is accelerated, thus improves the rate of heat exchange between described heat sink 20 and ambient air, thus improve radiating rate.
By arranging described vibrating motor 73 and being fixed on the shell fragment 74 be connected on described heat sink 20 and with described vibrating motor 73, when described vibrating motor 73 starts, described vibrating motor 73 drives described shell fragment 74 to vibrate, thus drive described heat sink 20 to vibrate, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink 20 and ambient air, thus improve radiating rate.
Embodiment two
Based on same inventive concept, the application also improves a kind of heat sink 200.As shown in Figure 3, be the structural representation of the application's better embodiment heat sink 200 again.Described heat sink 200 is made up of Heat Conduction Material.
Described heat sink 200 comprises substrate 203, multiple first fin 201 and multiple second heat radiation 202, described multiple first fin 201 and described multiple second fin 202 are arranged on a surface of described substrate 203 abreast, and described multiple first fin 201 is greater than the height of described second fin 202 relative to described substrate 201 relative to the height of described substrate 206.And the height of each first fin can be identical in multiple first fin 211, also can be different; In like manner, in described multiple second fin 221, the height of each second fin can be identical, also can be different.
Particularly, the interval in described multiple first fin 201 between adjacent two the first fin 201 is less than the interval in described multiple second fin 202 between adjacent two the second fin 20.
By the first groups of fins 21 on described heat sink 200 to be set to the height of the second groups of fins 22 being greater than described heat sink 20 relative to the height of described substrate 23, thus reduce the height of described second fin 22, avoid the body contact of described second groups of fins 22 and described electronic equipment, reduce the temperature of the housing of described electronic equipment, thus the height improving the multiple fin because of described heat sink in prior art is identical, and described heat sink upper part region can be covered by the air-flow that the air outlet of described flow accelerator flows out, when dispelling the heat to described heater members, the speed that described heat sink is not distributed by the heat in region that the air-flow that the air outlet of described flow accelerator flows out covers is slower, cause with the case temperature of the electronic equipment of this part contact higher, affect the technical problem of Consumer's Experience, reach the temperature of the housing reducing described electronic equipment, improve the technique effect of Consumer's Experience.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (11)
1. an electronic equipment, described electronic equipment comprises:
The electronic device of at least one heating;
Heat sink, is made up of Heat Conduction Material, and described heat sink comprises substrate, the first groups of fins and the second groups of fins, and described first groups of fins and described second groups of fins are juxtaposed on the first surface of described substrate;
Conducting piece, is arranged between described electronic device and described heat sink, distributes to described heat sink for the heat conduction produced by described electronic device;
Flow accelerator, the air-flow that the air outlet of described flow accelerator flows out covers described first groups of fins;
Wherein, described first groups of fins is greater than the height of described second groups of fins relative to described substrate relative to the height of described substrate.
2. electronic equipment as claimed in claim 1, it is characterized in that, described first groups of fins comprises multiple first fin be arranged at abreast on described first surface, and described second groups of fins comprises multiple second fin be arranged at abreast on described first surface.
3. electronic equipment as claimed in claim 2, it is characterized in that, the interval in described multiple first fin between adjacent two the first fin is less than the interval in described multiple second fin between adjacent two the second fin.
4. the electronic equipment as described in claim arbitrary in claim 1-3, it is characterized in that, described heat sink also comprises the first cover plate and the second cover plate, described first cover plate is fixedly connected with the one end away from described substrate on described multiple first fin, and described second cover plate is fixedly connected with the one end away from described substrate on described multiple second fin.
5. the electronic equipment as described in claim arbitrary in claim 1-3, is characterized in that, described flow accelerator is specially vibration of thin membrane fan.
6. the electronic equipment as described in claim arbitrary in claim 1-3, it is characterized in that, described electronic equipment also comprises controller and temperature-detecting device, described temperature-detecting device is for detecting the temperature of described electronic device, described controller, according to the temperature of described detection, controls the gas source temperature of described airflow accelerator or flow velocity or rotating speed.
7. the electronic equipment as described in claim arbitrary in claim 1-3, is characterized in that, described electronic equipment also comprises actuator, and described actuator vibrates for driving described heat sink, to improve radiating efficiency.
8. electronic equipment as claimed in claim 7, it is characterized in that, the piezoelectric ceramic that described actuator comprises oscillating circuit and is electrically connected with described oscillating circuit, described heat sink is fixed on described piezoelectric ceramic, when described oscillating circuit passes into electric current, described piezoelectric ceramic can produce vibration, vibrates to drive described heat sink.
9. electronic equipment as claimed in claim 7, it is characterized in that, the shell fragment that described actuator involving vibrations motor is connected with described vibrating motor, described heat sink is fixed on described shell fragment, described vibrating motor vibrates for driving described shell fragment, vibrates to drive described heat sink.
10. a heat sink, described heat sink is made up of Heat Conduction Material, described heat sink comprises substrate, multiple first fin and multiple second fin, described multiple first fin and described multiple second fin are arranged on a surface of described substrate abreast, and described multiple first fin is different relative to the height of described substrate from described second fin relative to the height of described substrate.
11. heat sinks as claimed in claim 10, is characterized in that, the interval in the interval in described multiple first fin between adjacent two the first fin and described multiple second fin between adjacent two the second fin is unequal.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410074834.7A CN104902728B (en) | 2014-03-03 | 2014-03-03 | A kind of electronic equipment and radiating piece |
| US14/495,117 US9532485B2 (en) | 2014-02-21 | 2014-09-24 | Heat dissipating device and electronic apparatus |
| DE102014113888.0A DE102014113888B8 (en) | 2014-02-21 | 2014-09-25 | Heat dissipation device and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410074834.7A CN104902728B (en) | 2014-03-03 | 2014-03-03 | A kind of electronic equipment and radiating piece |
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| Publication Number | Publication Date |
|---|---|
| CN104902728A true CN104902728A (en) | 2015-09-09 |
| CN104902728B CN104902728B (en) | 2019-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410074834.7A Active CN104902728B (en) | 2014-02-21 | 2014-03-03 | A kind of electronic equipment and radiating piece |
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| CN107197608A (en) * | 2017-05-25 | 2017-09-22 | 东莞合安机电有限公司 | Four direction piezoelectricity heat radiation modules |
| CN107291197A (en) * | 2017-07-31 | 2017-10-24 | 合肥千奴信息科技有限公司 | A kind of Novel laptop heat radiation rack |
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| CN111526676A (en) * | 2019-02-01 | 2020-08-11 | 深圳市理邦精密仪器股份有限公司 | Heat radiation structure and medical equipment with same |
| CN113552391A (en) * | 2020-04-24 | 2021-10-26 | 鸿劲精密股份有限公司 | Temperature conduction device and crimping mechanism, precooler and test classification equipment thereof |
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