CN111526676B - Heat radiation structure and medical equipment with same - Google Patents
Heat radiation structure and medical equipment with same Download PDFInfo
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- CN111526676B CN111526676B CN201910106720.9A CN201910106720A CN111526676B CN 111526676 B CN111526676 B CN 111526676B CN 201910106720 A CN201910106720 A CN 201910106720A CN 111526676 B CN111526676 B CN 111526676B
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- heat dissipation
- air
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses heat radiation structure and have this heat radiation structure's medical equipment, heat radiation structure includes: the air conditioner comprises a shell, a fan and a control device, wherein the shell comprises a bottom wall and a side wall surrounding the bottom wall, the bottom wall and the side wall surround to form an accommodating cavity, the shell is provided with an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are arranged oppositely; the mainboard is accommodated in the accommodating cavity; the heat dissipation assembly is arranged on the mainboard; in the working process of the heat dissipation structure, air enters the accommodating cavity from the air inlet hole and flows through the heat dissipation assembly and then is discharged from the air outlet hole to the accommodating cavity. The application provides a heat radiation structure and medical equipment with the same, and aims to solve the problems that in the prior art, the heat radiation structure is poor in ventilation effect and low in heat radiation efficiency.
Description
Technical Field
The application relates to the field of medical equipment, in particular to a heat dissipation structure and medical equipment with the same.
Background
With the improvement of the performance of electronic devices, higher and higher requirements are placed on the performance of chips in the electronic devices, and high-power chips generally have higher heat productivity. For example, for medical equipment, in the prior art, a heat dissipation assembly composed of a single heat sink, a heat dissipation fan and a heat dissipation channel is generally adopted for the medical equipment, and a good heat dissipation path cannot be formed in the heat dissipation process, so that the problems of poor ventilation effect and low heat dissipation efficiency of the medical equipment occur.
Disclosure of Invention
The main purpose of this application is to provide a heat radiation structure and have this heat radiation structure's medical equipment, aims at solving among the prior art problem that heat radiation structure ventilation effect is poor, and the radiating efficiency is low.
In order to achieve the above object, the present application proposes a heat dissipation structure, which includes: the air conditioner comprises a shell, a fan and a control device, wherein the shell comprises a bottom wall and a side wall surrounding the bottom wall, the bottom wall and the side wall surround to form an accommodating cavity, the shell is provided with an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are arranged oppositely; the mainboard is accommodated in the accommodating cavity; the heat dissipation assembly is arranged on the mainboard; in the working process of the heat dissipation structure, air enters the accommodating cavity from the air inlet hole and flows through the heat dissipation assembly and then is discharged from the air outlet hole to the accommodating cavity.
Optionally, the heat dissipation assembly comprises a guide air plate, the guide air plate is fixedly connected with the shell and is arranged on one side, close to the air inlet hole, of the accommodating cavity.
Optionally, the extending direction of the guiding air plate is deviated to one side of the heat dissipation assembly, and the guiding air plate is used for guiding air from the air inlet hole to the heat dissipation assembly.
Optionally, the heat dissipation assembly includes a heat sink, and the heat sink is disposed on the motherboard and is disposed in the extending direction of the guiding air plate; the radiator comprises a radiating base and first fins, wherein the first fins are connected with the radiating base, and a first ventilation air channel is formed between each first fin and the adjacent first fin.
Optionally, the heat sink further includes a second fin, the second fin is fixedly disposed on the main board, the first fin and the second fin are disposed at an interval, the extending directions of the first fin and the second fin are the same, and a second ventilation duct is formed between the first fin and the second fin.
Optionally, a groove is formed in one side, close to the bottom wall, of the heat dissipation base, and the heat sink further comprises a heat conduction block, and the heat conduction block is contained in the groove.
Optionally, the heat dissipation structure further includes a shielding cover, the shielding cover is disposed on the motherboard and is disposed on a side of the heat sink away from the air inlet; the periphery of the shielding cover is provided with a first through hole.
Optionally, a second through hole is formed in one side, away from the motherboard, of the shielding case.
Optionally, the heat dissipation structure further comprises a battery compartment, and the battery compartment is arranged on one side of the motherboard far away from the air inlet; a notch is formed in one side, far away from the bottom wall, of the battery compartment, and the opening direction of the notch is the same as the opening direction of the air outlet.
Optionally, the battery compartment is provided with a vent hole penetrating through the battery compartment along the air outlet direction of the air outlet hole, and the distance between the vent hole and the bottom wall is greater than the distance between the motherboard and the bottom wall.
In order to achieve the above object, the present application proposes a medical apparatus including a heat dissipation structure as described in any one of the above embodiments.
In the technical scheme that this application provided, heat radiation structure includes the casing, host board and radiator unit, the casing includes the diapire and follows the diapire edge is seted up to one side the lateral wall, the diapire with the lateral wall encloses to close and forms the holding chamber, the casing still includes fresh air inlet and exhaust vent, the fresh air inlet with the exhaust vent sets up relatively, radiator unit locates on the host board, and with the host board accept jointly in the holding intracavity in the heat radiation structure working process, the air is followed the fresh air inlet gets into the holding intracavity, the holding intracavity forms the wind channel, and the air current flows through take away behind the radiator unit the heat that radiator unit produced, and finally follow the exhaust vent discharges the holding chamber. Through the fresh air inlet, the exhaust vent forms the ventilation duct, makes the air can the holding intracavity flows and takes away the produced heat of holding intracavity to improve heat radiation structure's ventilation effect improves and gets into the radiating efficiency of the air of holding intracavity solves the problem of ventilation effect is poor among the heat radiation structure, radiating efficiency ground.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic view of a medical device of the present application from a first perspective;
FIG. 2 is a schematic view of a second perspective of a medical device of the present application;
fig. 3 is a first perspective structural view of the heat sink of the present application;
fig. 4 is a second perspective structural view of the heat sink of the present application.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
44 | Groove |
| 11 | |
45 | |
| 111 | |
50 | |
| 112 | |
51 | First through hole |
| 12 | |
52 | Second through |
| 20 | |
60 | |
| 30 | |
61 | |
| 40 | |
62 | Vent |
| 41 | |
70 | |
| 42 | |
100 | |
| 43 | Second fin |
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that all the directional indications (such as up, down, left, right, front, and rear … …) in the embodiment of the present application are only used to explain the relative position relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indication is changed accordingly.
In addition, descriptions in this application as to "first", "second", etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In addition, technical solutions between the various embodiments of the present application may be combined with each other, but it must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should be considered to be absent and not within the protection scope of the present application.
The application provides a heat radiation structure and medical equipment with the same.
Referring to fig. 1 and 2, the heat dissipation structure includes: the air conditioner comprises a shell 10, wherein the shell comprises a bottom wall 11 and a side wall 12 surrounding the bottom wall 11, the bottom wall 11 and the side wall 12 form an accommodating cavity (not marked), the shell 10 is provided with an air inlet hole 111 and an air outlet hole 112, and the air inlet hole 111 and the air outlet hole 112 are arranged oppositely; the main board 20, the said main board 20 is accommodated in the said accommodating cavity; the heat dissipation assembly 100 is arranged on the mainboard, and the heat dissipation assembly 100 is arranged on the mainboard; in the working process of the heat dissipation structure, air enters the accommodating cavity from the air inlet 111, flows through the heat dissipation assembly 100 and then is discharged from the accommodating cavity from the air outlet 112.
In the technical scheme that this application provided, heat radiation structure includes casing 10, host board 20 and radiator unit 100, casing 10 includes diapire 11 and follows 11 marginal setings to one side of diapire 12 lateral wall 12, diapire 11 with lateral wall 12 encloses to close and forms the holding chamber, casing 10 still includes fresh air inlet 111 and exhaust vent 112, fresh air inlet 111 with exhaust vent 112 sets up relatively, radiator unit 100 locates on the host board 20, and with host board 20 accept jointly in the holding intracavity in the heat radiation structure working process, the air is followed fresh air inlet 111 gets into the holding intracavity, form the wind channel in the holding intracavity, the air current flows through take away behind radiator unit 100 the heat that radiator unit 100 produced, and finally follow exhaust vent 112 the holding chamber. Through fresh air inlet 111, exhaust vent 112 forms the ventilation wind channel, makes the air can the holding intracavity flows and takes away the produced heat of holding intracavity to improve heat radiation structure's ventilation effect, improve the entering the radiating efficiency of the air of holding intracavity solves among the heat radiation structure ventilation effect is poor, the problem on radiating efficiency ground.
Further, referring to fig. 1 and fig. 2, the heat dissipation assembly 100 includes a guiding air plate 30, and the guiding air plate 30 is fixedly connected to the housing 10 and disposed at a side of the accommodating cavity close to the air inlet 111. In a specific embodiment, the air entering the accommodating cavity from the air inlet holes 111 flows in multiple directions, and in order to increase the air flow passing through the heat dissipation assembly 100, the guide damper 30 guides the air entering the air inlet holes 111, so that the air can flow in a specific direction after entering the air inlet holes 111 and then passes through the heat dissipation assembly 100.
Further, referring to fig. 1 and fig. 2, the extending direction of the guiding air plate 30 is deviated to one side of the heat dissipation assembly 100, so that the air entering the accommodating cavity flows along the setting direction of the guiding air plate 30, preferably, the extending direction of the guiding air plate 30 points to one side of the heat dissipation assembly 100 close to the air inlet 111, so that the air passing through the air inlet 111 is rectified and then all enters the heat dissipation assembly 100, thereby improving the heat dissipation efficiency of the heat dissipation structure.
Further, referring to fig. 1 to 4, the heat dissipation assembly 100 includes a heat sink 40, and the heat sink 40 is disposed on the motherboard 20 and disposed in an extending direction of the guiding air plate 30; the heat sink 40 is fixed on the motherboard 20, the heat sink 40 includes a heat dissipation base 41 and first fins 42, the first fins 42 are connected with the base, and a first ventilation air duct (not labeled) is formed between the first fins 42 and the adjacent first fins 42. In the specific embodiment, the heat sink 40 is fixed to the motherboard 20, and the heat sink 40 includes a heat dissipation base 41 and a first fin 42. First fin 42 with heat dissipation base 41 is connected, and locates heat dissipation base 41 deviates from one side of diapire 11, first fin 42 sets up along the first direction, wherein, first fin 42 and adjacent form first ventilation wind channel between the first fin 42, first ventilation wind channel with the air inlet direction of fresh air inlet 111 is the same.
Further, the heat sink 40 further includes a second fin 43, the second fin 43 is fixedly disposed on the main board 20 and disposed between the adjacent first fins 42, the extending directions of the first fins 42 and the second fins 43 are the same, and a second ventilation duct (not shown) is formed between the first fins 42 and the second fins 43. In a specific embodiment, the heat sink 40 further includes a second fin 43, wherein the second fin 43 is fixedly connected to the bottom plate 20, the second fin 43 is disposed between the first fin 42 and the adjacent first fin 42, and a second ventilation duct is formed between the first fin 42 and the second fin 43. Since there is a height difference between the first fins 42 and the second fins 43, the first fins 42 and the second fins 43 are spaced at high and low intervals during the heat dissipation process, and the combination of the first fins 42 and the second fins 43 can more effectively allow air to pass through the first ventilation air duct and the second ventilation air duct than the first fins 42 having the same height, thereby improving the heat dissipation efficiency of the heat sink 40. Preferably, the first fins 42 and the second fins 43 are alternately arranged at intervals, the second fins 43 are arranged on two adjacent sides of the first fins 42, the first fins 42 are arranged on two adjacent sides of the second fins 43, and the number of the first fins 42 is equal to or similar to that of the second fins 43. It can be understood that, in another embodiment, the number of the first fins 42 is an integral multiple of the number of the second fins 43, or the number of the second fins 43 is an integral multiple of the number of the first fins 42, and the ventilation efficiency of the heat sink is adjusted according to the specific requirements of the heat dissipation system by the combination of the heights of the first fins 42 and the second fins 43, so as to improve the heat dissipation efficiency of the heat sink.
Further, referring to fig. 4, the heat sink 40 further includes a heat conducting block 45, and the heat conducting block 45 is accommodated in the groove 44. In a specific embodiment, a groove 44 is formed on a side of the heat dissipation base 41 close to the bottom wall 11, the heat sink 40 further includes a heat conduction block 45, the heat conduction block 45 is accommodated in the groove 44, the heat conduction block 45 can guide heat generated by the chip into the heat dissipation base 41, and since the heat conduction performance of the heat conduction block 45 is higher than that of the heat dissipation base 41, the heat conduction block 45 can improve the heat conduction performance of the heat dissipation base 41, and increase the heat dissipation efficiency of the heat sink 40. In addition, the heat conduction block 45 is a copper block, it is understood that the material used for the heat conduction block 45 is not limited thereto, and in another embodiment, the heat conduction block 45 is a silver block.
Further, referring to fig. 1 and fig. 2, the heat dissipation assembly 100 further includes a shielding cover 50, wherein the shielding cover 50 is fixedly disposed on the motherboard 20 and is disposed on a side of the heat sink 40 away from the air inlet 111; a first through hole 51 is opened on the peripheral side of the shield case 50. In a specific embodiment, the shielding case 50 is fixedly disposed on the motherboard 20, a first through hole 51 is disposed on a peripheral side of the shielding case 50, and the first through hole 51 can communicate the inside and the outside of the shielding case 50, so that air entering from the air inlet 111 enters the shielding case 50, the heat dissipation performance in the shielding case 50 is improved, and the heat dissipation efficiency of the heat dissipation structure is improved.
Further, a second through hole 52 is formed in a side of the shielding case 50 away from the motherboard 20. In a specific embodiment, a second through hole 52 is formed in a side of the shielding case 50 away from the motherboard 20, and the second through hole 52 enables heat generated in the shielding case 50 to be dissipated to an outside of the shielding case 50 through the second through hole 52, and then the hot air is taken away from the shielding case 50 under the driving of air flowing in the first ventilation channel and the second ventilation channel, so as to further improve ventilation performance in the shielding case 50, thereby improving other heat dissipation performance of the shielding case 50 and improving heat dissipation efficiency of the heat dissipation structure.
Further, the heat dissipation assembly 100 further includes a battery compartment 60, and the battery compartment 60 is disposed on a side of the motherboard 20 away from the air inlet 111; the battery compartment 60 is arranged on one side of the shielding case 50 far away from the air inlet 111, a notch 61 is formed in one side of the battery compartment 60 far away from the bottom wall 11, and the forming direction of the notch 61 is the same as the opening direction of the air outlet 112. In a specific embodiment, the battery compartment 60 is accommodated in the accommodating cavity and is arranged on one side of the shielding cover 50 far away from the air inlet 111, the battery compartment 60 is far away from one side of the bottom wall 11 and is provided with a notch 61, and the notch 61 enables air to pass through the battery compartment 60, so that heat generated in the battery compartment 60 is taken away, and the heat dissipation efficiency of the heat dissipation structure is improved.
Furthermore, battery compartment 60 has been seted up along the air-out direction of exhaust vent 112 and has been run through the ventilation hole 62 of battery compartment, the battery is put into behind battery compartment 60, battery compartment 60 is kept away from one side of diapire 11 with there is the clearance (not marked) between the battery, flow through shield cover 50 and/or the air of radiator 40 gets into ventilation hole 62, and follows the clearance passes through, takes away the produced heat of battery. The distance between the vent hole 62 and the bottom wall 11 is greater than the distance between the motherboard 20 and the bottom wall 11, so that the air flowing through the motherboard 20 can enter the vent hole 62, and the vent hole 62 is prevented from being blocked by the motherboard 20. Preferably, the vent holes 62 are communicated with the notches 61, so that the flow range of air can be further increased, the ventilation efficiency of the heat dissipation structure can be improved, and the heat dissipation efficiency of the heat dissipation structure can be improved.
Further, an air outlet 112 is formed in the side wall 12 of the casing 10 on the side away from the air inlet 111, and the opening direction of the air outlet 112 is the same as the opening direction of the air inlet 111. In a specific embodiment, the opening direction of the air outlet 112 is the same as the opening direction of the air inlet 111, and the air inlet 111 and the air outlet 112 can help air flow in the accommodating cavity, so that the ventilation effect of the heat dissipation structure is improved, and the heat dissipation efficiency of the heat dissipation structure is improved.
Further, the heat dissipation assembly 100 further includes a heat dissipation fan 70, the heat dissipation fan 70 is fixedly connected to the housing 10, and an air outlet direction of the heat dissipation fan 70 points to one side of the air outlet 112. In a specific embodiment, the heat dissipation fan 70 is disposed in the accommodating cavity, the heat dissipation fan 70 is fixedly connected to the housing 10, the air outlet direction of the heat dissipation fan 70 is directed to one side of the air outlet 112 away from the accommodating cavity, preferably, one side of the air outlet direction of the heat dissipation fan 70 is abutted against the air outlet 112, and the air in the accommodating cavity can be drawn out of the accommodating cavity through the work of the heat dissipation fan 70, so as to improve the heat dissipation efficiency of the heat dissipation structure.
The present application further provides a medical device, where the medical device includes the heat dissipation structure according to any of the above embodiments, and the specific structure of the heat dissipation structure refers to the above embodiments, and since the routing structure of the heat dissipation structure adopts all technical solutions of all the above embodiments, all beneficial effects brought by the technical solutions of the above embodiments are at least achieved, and are not repeated here.
In the technical solution provided in the present application, in the working process of the medical device, under the driving of the heat dissipation fan 70, the air outside the housing chamber enters the housing chamber from the air inlet 111, the air flows to the heat sink 40 under the guiding of the guiding wind plate 30, the air flows along the first ventilation air channel and the second ventilation air channel, the air passes through the heat sink 40 and then enters the shielding cover 50 through the first through hole 51, and then flows to the battery compartment 60 through the shielding cover 50, the battery compartment 60 is provided with the notch 61 and the ventilation hole 62, the air passes through the notch 61 and the ventilation hole 62 and then passes through the battery compartment 60, and finally flows out of the housing chamber through the heat dissipation fan 70, the ventilation efficiency of the heat dissipation structure is improved by planning the flowing direction of the air in the heat dissipation structure, therefore, the heat dissipation efficiency of the heat dissipation structure is improved, and the problems of poor ventilation effect and low heat dissipation efficiency of the heat dissipation structure in the prior art are solved.
The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all modifications and equivalents of the technical solutions that can be directly or indirectly applied to other related fields without departing from the spirit of the present application are intended to be included in the scope of the present application.
Claims (7)
1. A heat dissipation structure, comprising:
the air conditioner comprises a shell, a fan and a control device, wherein the shell comprises a bottom wall and a side wall surrounding the bottom wall, the bottom wall and the side wall surround to form an accommodating cavity, the shell is provided with an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are arranged oppositely;
the mainboard is accommodated in the accommodating cavity;
the heat dissipation assembly is arranged on the mainboard;
in the working process of the heat dissipation structure, air enters the accommodating cavity from the air inlet hole, flows through the heat dissipation assembly and then is discharged out of the accommodating cavity from the air outlet hole;
the heat dissipation assembly comprises a guide air plate, the guide air plate is fixedly connected with the shell and is arranged on one side, close to the air inlet hole, of the accommodating cavity;
the heat dissipation assembly further comprises a heat dissipation fan, the heat dissipation fan is arranged in the accommodating cavity and fixedly connected with the shell, the air outlet direction of the heat dissipation fan points to one side of the air outlet hole, and one side of the air outlet direction of the heat dissipation fan is abutted against the air outlet;
the extending direction of the guide air plate deviates to one side of the heat dissipation assembly, and the guide air plate is used for guiding air to the heat dissipation assembly from the air inlet hole;
the heat dissipation assembly comprises a radiator, and the radiator is arranged on the mainboard and is arranged in the extending direction of the guide air plate;
the heat dissipation assembly further comprises a battery bin, and the battery bin is arranged on one side, far away from the air inlet hole, of the mainboard; a notch is formed in one side, away from the bottom wall, of the battery compartment, and the opening direction of the notch is the same as the opening direction of the air outlet;
the battery compartment is followed the air-out direction of exhaust vent is seted up and is run through the ventilation hole of battery compartment, the ventilation hole with the distance of diapire is greater than the mainboard with the distance of diapire.
2. The heat dissipating structure of claim 1, wherein said heat sink comprises a heat dissipating base, first fins connected to said heat dissipating base, said first fins forming a first ventilation duct with adjacent ones of said first fins.
3. The heat dissipation structure of claim 2, wherein the heat sink further comprises a second fin, the second fin is fixedly disposed on the main board, the first fin and the second fin are disposed at an interval, the first fin and the second fin extend in the same direction, and a second ventilation duct is formed between the first fin and the second fin.
4. The heat dissipating structure of claim 2, wherein a recess is formed in a side of the heat dissipating base adjacent to the bottom wall, and the heat sink further comprises a heat conducting block received in the recess.
5. The heat dissipating structure of claim 2, wherein said heat dissipating assembly further comprises a shield disposed on said motherboard and disposed on a side of said heat sink away from said air inlet; the periphery of the shielding cover is provided with a first through hole.
6. The heat dissipation structure of claim 5, wherein a second through hole is formed in a side of the shield case facing away from the motherboard.
7. A medical device, characterized in that it comprises a heat dissipation structure according to any one of claims 1-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910106720.9A CN111526676B (en) | 2019-02-01 | 2019-02-01 | Heat radiation structure and medical equipment with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910106720.9A CN111526676B (en) | 2019-02-01 | 2019-02-01 | Heat radiation structure and medical equipment with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111526676A CN111526676A (en) | 2020-08-11 |
| CN111526676B true CN111526676B (en) | 2022-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910106720.9A Active CN111526676B (en) | 2019-02-01 | 2019-02-01 | Heat radiation structure and medical equipment with same |
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| CN (1) | CN111526676B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163244A (en) * | 2020-11-30 | 2021-07-23 | 江苏德联达智能科技有限公司 | Protective set top box capable of effectively dissipating heat |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101674715A (en) * | 2008-09-12 | 2010-03-17 | 和硕联合科技股份有限公司 | Device and method for radiating |
| CN104902728A (en) * | 2014-03-03 | 2015-09-09 | 联想(北京)有限公司 | Electronic equipment and heat-radiating member |
| CN207652870U (en) * | 2017-11-13 | 2018-07-24 | 苏州苏众精密金属制品有限公司 | A kind of passive heat radiation structure |
| CN208061842U (en) * | 2017-12-27 | 2018-11-06 | 连云港明昊电子有限公司 | A kind of radiator structure of LED transformers |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204217288U (en) * | 2014-07-28 | 2015-03-18 | 佛山市顺德区美的电热电器制造有限公司 | Circuit components radiator structure and electromagnetic oven |
-
2019
- 2019-02-01 CN CN201910106720.9A patent/CN111526676B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101674715A (en) * | 2008-09-12 | 2010-03-17 | 和硕联合科技股份有限公司 | Device and method for radiating |
| CN104902728A (en) * | 2014-03-03 | 2015-09-09 | 联想(北京)有限公司 | Electronic equipment and heat-radiating member |
| CN207652870U (en) * | 2017-11-13 | 2018-07-24 | 苏州苏众精密金属制品有限公司 | A kind of passive heat radiation structure |
| CN208061842U (en) * | 2017-12-27 | 2018-11-06 | 连云港明昊电子有限公司 | A kind of radiator structure of LED transformers |
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| Publication number | Publication date |
|---|---|
| CN111526676A (en) | 2020-08-11 |
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