CN104902728B - A kind of electronic equipment and radiating piece - Google Patents
A kind of electronic equipment and radiating piece Download PDFInfo
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- CN104902728B CN104902728B CN201410074834.7A CN201410074834A CN104902728B CN 104902728 B CN104902728 B CN 104902728B CN 201410074834 A CN201410074834 A CN 201410074834A CN 104902728 B CN104902728 B CN 104902728B
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Abstract
The present invention discloses a kind of electronic equipment, the electronic equipment includes electronic device, radiating piece, radiating piece and the conducting piece flow accelerator of at least one fever, the radiating piece is made from a material that be thermally conductive, the radiating piece includes substrate, the first cooling fin group and the second cooling fin group, and the first cooling fin group and the second cooling fin group are juxtaposed on the first surface of the substrate；The conducting piece is set between the electronic device and the radiating piece, and the heat for generating the electronic device is transmitted to the radiating piece and distributes；The air-flow of the air outlet outflow of the flow accelerator covers the first cooling fin group；Wherein, the first cooling fin group is greater than height of the second cooling fin group relative to the substrate relative to the height of the substrate.
Description
Technical field
The present invention relates to electronic technology field more particularly to a kind of electronic equipment and radiating pieces.
Background technique
It is had become for people's lives with social progress, electronic equipment such as computer, mobile phone, TV with the development of science and technology
With a part indispensable in work.
Electronic device in order to guarantee in electronic equipment can work normally, and heat dissipation is usually provided in electronic equipment
Element.Specifically, heating device (such as central processing unit, fever electronics member to give off heat when the electronic equipment includes: work
Part etc.), distribute the radiating piece of the heat and be set between heating device, radiating piece for the heat that issues heating device
It is transferred to the conducting piece that the radiating piece is distributed and the air-flow for accelerating the speed air flow around the radiating piece
Accelerator.
But it finds during use, because the height of multiple cooling fins of the radiating piece is identical, and the radiating piece
The air-flow that upper partial region can be flowed out by the air outlet of the flow accelerator covers, therefore, to the heating device
When being radiated, the heat in the region that the air-flow not flowed out by the air outlet of the flow accelerator on the radiating piece covers
The speed distributed is slower, causes the case temperature of the electronic equipment contacted with the part higher, influences user experience.
Summary of the invention
The application provides a kind of electronic equipment and radiating piece, improves multiple heat dissipations in the prior art because of the radiating piece
The height of piece is identical, and partial region can be covered by the air-flow that the air outlet of the flow accelerator flows out on the radiating piece
Lid is not flowed out by the air outlet of the flow accelerator on the radiating piece when radiating to the heating device
The speed that the heat in the region of air-flow covering distributes is slower, causes the case temperature of the electronic equipment contacted with the part higher,
The technical issues of influencing user experience, reach the temperature for reducing the shell of the electronic equipment, improves the technology effect of user experience
Fruit.
The application provides a kind of electronic equipment, and the electronic equipment includes electronic device, the radiating piece, biography of at least one fever
Guiding element and flow accelerator, the radiating piece are made from a material that be thermally conductive, and the radiating piece includes substrate, the first cooling fin group
With the second cooling fin group, the first cooling fin group and the second cooling fin group are juxtaposed on the first surface of the substrate
On；The conducting piece is set between the electronic device and the radiating piece, the heat for generating the electronic device
The radiating piece is transmitted to be distributed；The air-flow of the air outlet outflow of the flow accelerator covers first cooling fin
Group；Wherein, the first cooling fin group is greater than the second cooling fin group relative to the base relative to the height of the substrate
The height of plate.
Preferably, the first cooling fin group includes being set in parallel in multiple first heat dissipations on the first surface
Piece, the second cooling fin group include being set in parallel in multiple second cooling fins on the first surface.
Preferably, the interval in the multiple first cooling fin between two neighboring first cooling fin is less than the multiple the
Interval in two cooling fins between two neighboring second cooling fin.
Preferably, the radiating piece further includes the first cover board and the second cover board, first cover board and the multiple first
One end on cooling fin far from the substrate is fixedly connected, far from described on second cover board and the multiple second cooling fin
One end of substrate is fixedly connected.
Preferably, the flow accelerator is specially vibration of thin membrane fan.
Preferably, the electronic equipment further includes controller and temperature-detecting device, and the temperature-detecting device is for examining
The temperature of the electronic device is surveyed, the controller controls the gas source of the flow accelerator according to the temperature of the detection
Temperature or flow velocity or revolving speed.
Preferably, the electronic equipment further includes actuator, and the actuator is for driving the radiating piece to vibrate, to mention
High cooling efficiency.
Preferably, the actuator includes oscillating circuit and the piezoelectric ceramics that is electrically connected with the oscillating circuit, described to dissipate
Warmware is fixed on the piezoelectric ceramics, and when the oscillating circuit is passed through electric current, the piezoelectric ceramics can generate vibration, with band
Move the radiating piece vibration.
Preferably, the actuator includes the elastic slice that vibrating motor is connect with the vibrating motor, and the radiating piece is fixed
In on the elastic slice, the vibrating motor is for driving the elastic slice to vibrate, to drive the radiating piece to vibrate.
The application also provides a kind of radiating piece, and the radiating piece is made from a material that be thermally conductive, and the radiating piece includes substrate, more
A first cooling fin and multiple second cooling fins, the multiple first cooling fin and the multiple second cooling fin are set in parallel
In on a surface of the substrate, height and second cooling fin of the multiple first cooling fin relative to the substrate
Height relative to the substrate is different.
Preferably, the interval and the multiple second in the multiple first cooling fin between two neighboring first cooling fin
Interval in cooling fin between two neighboring second cooling fin is unequal.
The application has the beneficial effect that:
Pass through the first of the air-flow covering that will can be flowed out by the air outlet of the flow accelerator on the radiating piece
Cooling fin group is set greater than the height of the second cooling fin group of the radiating piece relative to the height of the substrate, to avoid
The second cooling fin group is contacted with the shell of the electronic equipment, reduces the temperature of the shell of the electronic equipment, meanwhile,
It can timely be radiated by the first cooling fin group, so as to improve in the prior art because the multiple of the radiating piece dissipate
The height of backing is identical, and the air-flow that partial region can be flowed out by the air outlet of the flow accelerator on the radiating piece
Covering is not flowed out by the air outlet of the flow accelerator on the radiating piece when radiating to the heating device
Air-flow covering region the speed that distributes of heat it is slower, cause the case temperature of the electronic equipment contacted with the part compared with
Height, reaches the temperature for reducing the shell of the electronic equipment, improves the technology of user experience the technical issues of influencing user experience
Effect.
First cover board is set by one end on the multiple first cooling fin far from the substrate, described more
Second cover board is arranged in one end on a second cooling fin far from the substrate, to increase the heat dissipation area of the radiating piece,
Improving heat radiation efficiency.
By setting actuator to drive the radiating piece to vibrate, so that the speed air flow of surrounding is accelerated, to mention
Rate of heat exchange between the high radiating piece and the air of surrounding improves institute in the prior art to improve radiating rate
The heat for stating heating device generation cannot timely be conducted, and the temperature so as to cause the heating device is higher, influences to generate heat
The technical issues of work of device, reaches the technical effect for improving the electronic equipment dissipating heat efficiency.
Pass through the piezoelectricity pottery that the oscillating circuit is set and is fixed on the radiating piece and connect with the oscillating circuit
Porcelain, when the oscillating circuit is passed through electric current, the oscillating circuit can generate oscillating current, and the piezoelectric ceramics is in the oscillation
It can be vibrated under the excitation of electric current, to drive the radiating piece to vibrate, so that the speed air flow of surrounding is accelerated, to mention
Rate of heat exchange between the high radiating piece and the air of surrounding, to improve radiating rate.
By the elastic slice that the vibrating motor is arranged and is fixed on the radiating piece and is connect with the vibrating motor,
When the vibrating motor starts, the vibrating motor drives the elastic slice vibration, to drive the radiating piece to vibrate, so that all
The speed air flow enclosed is accelerated, so that the rate of heat exchange between the radiating piece and the air of surrounding is improved, to improve
Radiating rate.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, embodiment will be described below
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment.
Fig. 1 is the structural schematic diagram of one better embodiment electronic equipment of the application；
Fig. 2 is the structural schematic diagram of the another better embodiment electronic equipment of the application；
Fig. 3 is the structural schematic diagram of the another better embodiment radiating piece of the application.
Specific embodiment
The embodiment of the present application is improved in the prior art by providing a kind of electronic equipment and radiating piece because of the radiating piece
Multiple cooling fins height it is identical, and partial region can be by the air outlet stream of the flow accelerator on the radiating piece
Out air-flow covering, when radiating to the heating device, on the radiating piece not by the flow accelerator go out
The speed that the heat in the region of the air-flow covering of air port outflow distributes is slower, causes the shell of the electronic equipment contacted with the part
The technical issues of temperature is higher, influences user experience reaches the temperature for reducing the shell of the electronic equipment, improves user experience
Technical effect.
Technical solution in the embodiment of the present application is in order to solve the above technical problems, general thought is as follows:
A kind of electronic equipment, the electronic equipment include electronic device, radiating piece, conducting piece and the gas of at least one fever
Accelerator is flowed, the radiating piece is made from a material that be thermally conductive, and the radiating piece includes substrate, the first cooling fin group and the second heat dissipation
Piece group, the first cooling fin group and the second cooling fin group are juxtaposed on the first surface of the substrate；The biography
Guiding element is set between the electronic device and the radiating piece, and the heat for generating the electronic device is transmitted to described
Radiating piece is distributed；The air-flow of the air outlet outflow of the flow accelerator covers the first cooling fin group；Wherein, institute
The height that the first cooling fin group is stated relative to the substrate is greater than height of the second cooling fin group relative to the substrate.
A kind of radiating piece, the radiating piece are made from a material that be thermally conductive, and the radiating piece includes substrate, multiple first cooling fins
With multiple second cooling fins, the multiple first cooling fin and the multiple second cooling fin are set in parallel in the substrate
On one surface, the multiple first cooling fin is relative to the height of the substrate and second cooling fin relative to the base
The height of plate is different.
Pass through the first of the air-flow covering that will can be flowed out by the air outlet of the flow accelerator on the radiating piece
Cooling fin group is set greater than the height of the second cooling fin group of the radiating piece relative to the height of the substrate, to avoid
The second cooling fin group is contacted with the shell of the electronic equipment, reduces the temperature of the shell of the electronic equipment, meanwhile,
It can timely be radiated by the first cooling fin group, so as to improve in the prior art because the multiple of the radiating piece dissipate
The height of backing is identical, and the air-flow that partial region can be flowed out by the air outlet of the flow accelerator on the radiating piece
Covering is not flowed out by the air outlet of the flow accelerator on the radiating piece when radiating to the heating device
Air-flow covering region the speed that distributes of heat it is slower, cause the case temperature of the electronic equipment contacted with the part compared with
Height, reaches the temperature for reducing the shell of the electronic equipment, improves the technology of user experience the technical issues of influencing user experience
Effect.
In order to better understand the above technical scheme, in conjunction with appended figures and specific embodiments to upper
Technical solution is stated to be described in detail.
Embodiment one
As shown in Figure 1, being the structural schematic diagram of a better embodiment electronic equipment 100.The electronic equipment 100 can be with
For mobile phone, tablet computer, laptop, game machine etc..The electronic equipment 100 includes the electronic device of at least one fever
10, radiating piece 20, conducting piece 30 and flow accelerator 40.
The electronic device 10 can be any electronic device of fever, such as chip.
The radiating piece 20 is made from a material that be thermally conductive, such as aluminium, copper, aluminium alloy, and the radiating piece 20 can will be absorbed into
Heat with week along air carry out heat exchange, with realize heat dissipation.The radiating piece 20 includes substrate 23, the first cooling fin group 21
With the second cooling fin group 22, the first cooling fin group 21 and the second cooling fin group 22 are juxtaposed on the substrate 23
On first surface 231.The first cooling fin group 21 is greater than 22 groups of second cooling fin relative to the height of the substrate 23
Height relative to the substrate 23.
The conducting piece 30 is set between the electronic device 10 and the radiating piece 20, is used for the electronic device
10 heats generated are transmitted to the radiating piece 20 and are distributed.The conducting piece 30 is made of a highly heat conductive material, to improve
Pyroconductivity between the electronic device 10 and the radiating piece 20.The heat-conducting piece 30 can by graphene, heat conductive silica gel,
The materials such as heat-conducting cream are made.By the way that the heat-conducting piece 30 is arranged, the radiating piece 30 and the electronic device can not only be filled
Gap between 10, with improve it is described heat transmitting efficiency, while can also play damping, insulation the effects of.
The flow accelerator 40 is used to accelerate the flowing velocity of air-flow.The air outlet 41 of the flow accelerator 40
The air-flow of outflow can cover the first cooling fin group 21.Therefore, the heat in heat dissipation, in the first cooling fin group 21
The speed that distributes distribute speed greater than the second cooling fin group 22.The flow accelerator 40 be specifically as follows fan or
Person's air pump.Specifically, in order to reduce the size of the electronic equipment 100, the flow accelerator 40 can be specially to vibrate
Film fan.
By that will can be flowed out by the air outlet of the flow accelerator 40 on the radiating piece 20 of the electronic equipment 100
Air-flow covering the first cooling fin group 21 be set greater than the second of the radiating piece 20 relative to the height of the substrate 23
The height of cooling fin group 22 reduces institute so that the second cooling fin group 22 be avoided to contact with the shell of the electronic equipment 100
The temperature of the shell of electronic equipment is stated, meanwhile, also can timely it be radiated by the first cooling fin group 21, so as to improve
In the prior art because the height of multiple cooling fins of the radiating piece is identical, and on the radiating piece, partial region can be by institute
The air-flow covering for stating the air outlet outflow of flow accelerator, when radiating to the heating device, on the radiating piece
The speed not distributed by the heat in the region that the air-flow that the air outlet of the flow accelerator flows out covers is slower, causes and is somebody's turn to do
The technical issues of case temperature of the electronic equipment of part contact is higher, influences user experience, reaching reduces the electronic equipment
Shell temperature, improve the technical effect of user experience.
Specifically, the first cooling fin group 21 includes being set in parallel in multiple first on the first surface 231
Cooling fin 211, the second cooling fin group 22 include being set in parallel in multiple second cooling fins on the first surface 231
221, the multiple first cooling fin 211 is greater than second cooling fin 221 relative to institute relative to the height of the substrate 22
State the height of substrate 22.And the height of each first cooling fin may be the same or different in multiple first cooling fins 211；Together
It manages, the height of each second cooling fin may be the same or different in the multiple second cooling fin 221.
Further, in order to improve heat dissipation effect, by the first cooling fin two neighboring in the multiple first cooling fin 211
Between being set to be less than in the multiple second cooling fin 221 between two neighboring second cooling fin 221 between 211
Every.That is, increasing the quantity of first cooling fin 211, reduce the quantity of second cooling fin 221, to increase
The caloric receptivity of first cooling fin 211 improves the radiating efficiency, reduces the caloric receptivity of second cooling fin 221, reduces
The heat stored up on second cooling fin 221 avoids area opposite with second cooling fin 221 on the electronic device 10
The temperature in domain is excessively high, protects the electronic device 10.
In order to increase the heat dissipation area of the radiating piece 20, the radiating piece 20 further includes the first cover board 24 and the second cover board
25, first cover board 24 is fixedly connected on the multiple first cooling fin 211 far from one end of the substrate 23, and described the
Two cover boards 25 are fixedly connected with one end on the multiple second cooling fin 221 far from the substrate 23.By the multiple
First cover board 24 is arranged in one end on first cooling fin 211 far from the substrate 23, in the multiple second cooling fin 221
Second cover board 25 is arranged in upper one end far from the substrate 23, to increase the heat dissipation area of the radiating piece 20, is promoted and is dissipated
The thermal efficiency.
Specifically, in order to further improve the conduction efficiency, the electronic equipment 100 further includes controller 50
With temperature-detecting device 60, the temperature-detecting device 60 is used to detect the temperature of the electronic device 10, the controller 50
According to the temperature of the detection, the gas source temperature or flow velocity or revolving speed of the flow accelerator 40 are controlled.Such as: in the electronics
When the temperature of device 10 reaches alarm temperature, the controller 50 can control the flow accelerator according to the temperature
40 gas source temperature reduces perhaps flow velocity increase or revolving speed and increases, to accelerate the heat distributed with the electronic device 10
Exchange velocity in time conducts the heat that the electronic device 10 generates, and protects the electronic device 10.Also, described
When the temperature of electronic device 10 is lower than safe temperature, the controller 50 can control the air-flow and accelerate dress according to the temperature
The flow velocity or revolving speed for setting 40 reduce, and to improve the utilization rate of resource, avoid the waste of the energy.
Further, the electronic equipment 100 further includes actuator 70, and the actuator 70 is for driving the radiating piece
20 vibrations, to improve radiating efficiency.In the radiating piece 20 vibration, the speed air flow of surrounding can be accelerated, to mention
Rate of heat exchange between the high radiating piece 20 and the air of surrounding, to improve radiating rate.By the way that actuator 70 is arranged
To drive the radiating piece 20 to vibrate, so that the speed air flow of surrounding is accelerated, to improve the radiating piece 20 and surrounding
Air between rate of heat exchange improve the heat of the generation of heating device described in the prior art to improve radiating rate
Amount cannot timely be conducted, and the temperature so as to cause the heating device is higher, and the technology for influencing the work of heating device is asked
Topic, reaches the technical effect for improving the electronic equipment dissipating heat efficiency.
The first: being driven by oscillating circuit and piezoelectric ceramics.
As shown in Figure 1, the actuator 70 includes oscillating circuit 71 and the piezoelectricity being electrically connected with the oscillating circuit 71 pottery
Porcelain 72, the radiating piece 20 are fixed on the piezoelectric ceramics 72, when the oscillating circuit 71 is passed through electric current, the piezoelectricity pottery
Porcelain 72 can generate vibration, to drive the radiating piece 20 to vibrate.
The piezoelectric ceramics 72 is a kind of ceramic material that can convert mutually mechanical energy and electric energy, is belonged to inorganic
Nonmetallic materials are specifically as follows one of piezoelectric ceramics such as barium titanate series, lead zirconate titanate binary system, metaniobate system.
The oscillating circuit 71 is a kind of circuit that can generate oscillating current, and the oscillating circuit is a kind of size and Orientation
All with period changed electric current.The oscillating circuit 71 can be LC oscillating circuit, quartz crystal oscillator circuit and RC vibration
Swing circuit etc..
By being arranged the oscillating circuit 71 and being fixed on the radiating piece 20 and connect with the oscillating circuit 71
Piezoelectric ceramics 72, when the oscillating circuit 71 is passed through electric current, the oscillating circuit 71 can generate oscillating current, the piezoelectricity pottery
Porcelain 72 can vibrate under the excitation of the oscillating current, to drive the radiating piece 20 to vibrate, so that the air stream of surrounding
Dynamic speed is accelerated, so that the rate of heat exchange between the radiating piece 20 and the air of surrounding is improved, to improve radiating rate.
Second: being driven by vibrating motor and elastic slice.
As shown in Fig. 2, the actuator 70 includes the elastic slice 74 that vibrating motor 73 is connect with the vibrating motor 73, it is described
Radiating piece 20 is fixed on the elastic slice 74, and the vibrating motor 73 is for driving the elastic slice 74 to vibrate, to drive described dissipate
Warmware 20 vibrates.
Vibrating motor 73 is the exciting source that power source and vibration source are combined as a whole, and vibrating motor 73 is at armature spindle both ends
Respectively one group of adjustable eccentric block of installation obtains exciting force using the centrifugal force that axis and eccentric block high speed rotation generate.Vibrating motor 73
Exciting force utilization rate it is high, energy consumption is small, low noise, service life are long.
By being arranged the vibrating motor 73 and being fixed on the radiating piece 20 and connect with the vibrating motor 73
Elastic slice 74, in the vibrating motor 73 starting, the vibrating motor 73 drives the elastic slice 74 to vibrate, to drive described dissipate
Warmware 20 vibrates, so that the speed air flow of surrounding is accelerated, to improve between the radiating piece 20 and the air of surrounding
Rate of heat exchange, to improve radiating rate.
By that will can be flowed out by the air outlet of the flow accelerator 40 on the radiating piece 20 of the electronic equipment 100
Air-flow covering the first cooling fin group 21 be set greater than the second of the radiating piece 20 relative to the height of the substrate 23
The height of cooling fin group 22 reduces institute so that the second cooling fin group 22 be avoided to contact with the shell of the electronic equipment 100
The temperature of the shell of electronic equipment is stated, meanwhile, also can timely it be radiated by the first cooling fin group 21, so as to improve
In the prior art because the height of multiple cooling fins of the radiating piece is identical, and on the radiating piece, partial region can be by institute
The air-flow covering for stating the air outlet outflow of flow accelerator, when radiating to the heating device, on the radiating piece
The speed not distributed by the heat in the region that the air-flow that the air outlet of the flow accelerator flows out covers is slower, causes and is somebody's turn to do
The technical issues of case temperature of the electronic equipment of part contact is higher, influences user experience, reaching reduces the electronic equipment
Shell temperature, improve the technical effect of user experience.
By one end on the multiple first cooling fin 211 far from the substrate 23, first cover board 24 is set,
Second cover board 25 is arranged in one end on the multiple second cooling fin 221 far from the substrate 23, to increase described dissipate
The heat dissipation area of warmware 20, improving heat radiation efficiency.
By setting actuator 70 to drive the radiating piece 20 to vibrate, so that the speed air flow of surrounding is accelerated, from
And the rate of heat exchange between the radiating piece 20 and the air of surrounding is improved, to improve radiating rate, improve existing skill
The heat that heating device described in art generates cannot timely be conducted, and the temperature so as to cause the heating device is higher, shadow
The technical issues of ringing the work of heating device, reaches the technical effect for improving the electronic equipment dissipating heat efficiency.
By being arranged the oscillating circuit 71 and being fixed on the radiating piece 20 and connect with the oscillating circuit 71
Piezoelectric ceramics 72, when the oscillating circuit 71 is passed through electric current, the oscillating circuit 71 can generate oscillating current, the piezoelectricity pottery
Porcelain 72 can vibrate under the excitation of the oscillating current, to drive the radiating piece 20 to vibrate, so that the air stream of surrounding
Dynamic speed is accelerated, so that the rate of heat exchange between the radiating piece 20 and the air of surrounding is improved, to improve radiating rate.
By being arranged the vibrating motor 73 and being fixed on the radiating piece 20 and connect with the vibrating motor 73
Elastic slice 74, in the vibrating motor 73 starting, the vibrating motor 73 drives the elastic slice 74 to vibrate, to drive described dissipate
Warmware 20 vibrates, so that the speed air flow of surrounding is accelerated, to improve between the radiating piece 20 and the air of surrounding
Rate of heat exchange, to improve radiating rate.
Embodiment two
Based on same inventive concept, the application also improves a kind of radiating piece 200.As shown in figure 3, for the application further compared with
The structural schematic diagram of good embodiment radiating piece 200.The radiating piece 200 is made from a material that be thermally conductive.
The radiating piece 200 includes substrate 203, multiple first cooling fins 201 and multiple second heat dissipations 202, described more
A first cooling fin 201 and the multiple second cooling fin 202 are set in parallel on a surface of the substrate 203, institute
It states multiple first cooling fins 201 and is greater than second cooling fin 202 relative to the substrate relative to the height of the substrate 206
201 height.And the height of each first cooling fin may be the same or different in multiple first cooling fins 211；Similarly, institute
The height for stating each second cooling fin in multiple second cooling fins 221 may be the same or different.
Specifically, the interval in the multiple first cooling fin 201 between two neighboring first cooling fin 201 is less than described
Interval in multiple second cooling fins 202 between two neighboring second cooling fin 20.
By the way that the first cooling fin group 21 on the radiating piece 200 is set greater than relative to the height of the substrate 23
The height of second cooling fin group 22 of the radiating piece 20 avoids described to reduce the height of second cooling fin 22
Two cooling fin groups 22 are contacted with the shell of the electronic equipment, reduce the temperature of the shell of the electronic equipment, so as to improve
In the prior art because the height of multiple cooling fins of the radiating piece is identical, and partial region can be described on the radiating piece
The air-flow covering of the air outlet outflow of flow accelerator, when radiating to the heating device, on the radiating piece not
The speed distributed by the heat in the region that the air-flow that the air outlet of the flow accelerator flows out covers is slower, causes and the portion
The technical issues of case temperature for tapping the electronic equipment of touching is higher, influences user experience, reaching reduces the electronic equipment
The temperature of shell improves the technical effect of user experience.
Although preferred embodiments of the present invention have been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the scope of the invention.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (8)
1. a kind of electronic equipment, the electronic equipment include:
The electronic device of at least one fever；
Radiating piece is made from a material that be thermally conductive, and the radiating piece includes substrate, the first cooling fin group and the second cooling fin group, described
First cooling fin group and the second cooling fin group are juxtaposed on the first surface of the substrate；
Conducting piece is set between the electronic device and the radiating piece, and the heat for generating the electronic device passes
The radiating piece is led to be distributed；
The air-flow of flow accelerator, the air outlet outflow of the flow accelerator covers the first cooling fin group, without
The second cooling fin group is covered, the flow accelerator is specially vibration of thin membrane fan；
Wherein, the first cooling fin group is greater than the second cooling fin group relative to the base relative to the height of the substrate
The height of plate reduces the shell of the electronic equipment so that the second cooling fin group is not contacted with the shell of the electronic equipment
The temperature of body.
2. electronic equipment as described in claim 1, which is characterized in that the first cooling fin group includes being set in parallel in institute
Multiple first cooling fins on first surface are stated, the second cooling fin group includes being set in parallel on the first surface
Multiple second cooling fins.
3. electronic equipment as claimed in claim 2, which is characterized in that two neighboring first dissipates in the multiple first cooling fin
Interval between backing is less than the interval in the multiple second cooling fin between two neighboring second cooling fin.
4. the electronic equipment as described in any claim in claim 1-3, which is characterized in that the radiating piece further includes
The fixed company in one end on one cover board and the second cover board, first cover board and the multiple first cooling fin far from the substrate
It connects, second cover board is fixedly connected with one end on the multiple second cooling fin far from the substrate.
5. the electronic equipment as described in any claim in claim 1-3, which is characterized in that the electronic equipment further includes
Controller and temperature-detecting device, the temperature-detecting device are used to detect the temperature of the electronic device, the controller root
According to the temperature of the detection, the gas source temperature or flow velocity of the flow accelerator are controlled.
6. the electronic equipment as described in any claim in claim 1-3, which is characterized in that the electronic equipment further includes
Actuator, the actuator is for driving the radiating piece to vibrate, to improve radiating efficiency.
7. electronic equipment as claimed in claim 6, which is characterized in that the actuator include oscillating circuit and with the oscillation
The piezoelectric ceramics of circuit electrical connection, the radiating piece is fixed on the piezoelectric ceramics, when the oscillating circuit is passed through electric current,
The piezoelectric ceramics can generate vibration, to drive the radiating piece to vibrate.
8. electronic equipment as claimed in claim 6, which is characterized in that the actuator includes vibrating motor and the vibration horse
Up to the elastic slice of connection, the radiating piece is fixed on the elastic slice, and the vibrating motor is for driving the elastic slice to vibrate, with band
Move the radiating piece vibration.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410074834.7A CN104902728B (en) | 2014-03-03 | 2014-03-03 | A kind of electronic equipment and radiating piece |
| US14/495,117 US9532485B2 (en) | 2014-02-21 | 2014-09-24 | Heat dissipating device and electronic apparatus |
| DE102014113888.0A DE102014113888B8 (en) | 2014-02-21 | 2014-09-25 | Heat dissipation device and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410074834.7A CN104902728B (en) | 2014-03-03 | 2014-03-03 | A kind of electronic equipment and radiating piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104902728A CN104902728A (en) | 2015-09-09 |
| CN104902728B true CN104902728B (en) | 2019-02-05 |
Family
ID=54035029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410074834.7A Active CN104902728B (en) | 2014-02-21 | 2014-03-03 | A kind of electronic equipment and radiating piece |
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| Country | Link |
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| CN (1) | CN104902728B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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