CN107170722B - A kind of bimodulus piezoelectricity radiator structure - Google Patents
A kind of bimodulus piezoelectricity radiator structure Download PDFInfo
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- CN107170722B CN107170722B CN201710377266.1A CN201710377266A CN107170722B CN 107170722 B CN107170722 B CN 107170722B CN 201710377266 A CN201710377266 A CN 201710377266A CN 107170722 B CN107170722 B CN 107170722B
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Abstract
The invention discloses a kind of bimodulus piezoelectricity radiator structures, include the heat-radiating substrate for being attached at chip surface；The substrate is equipped with multiple thermal columns；Further include there are one rectangular cavities, a side of rectangular cavities is equipped with the first installation window, another side opposite with the side is equipped with the second installation window；Using vertical design, space availability ratio is high, will not occupy any transverse area in addition to heat-radiating substrate.
Description
Technical field
The present invention relates to a kind of bimodulus piezoelectricity radiator structures.
Background technology
As the problems such as radiator volume of fan form is big, noise is easy greatly aging becomes increasingly conspicuous, minimizes at present, is low
The piezoelectric type radiator of noise longer life expectancy occurs gradually in the visual field in market；The patent No.：201510122009.4 open
A kind of driving type piezoelectric actuator heat radiation module；Although the structure solves the problems, such as conventional fan radiator.But itself has such as
Under important disadvantage：1, low space utilization；Radiator portion and ventilation lumen are laterally arranged side by side, and ventilation lumen simultaneously occupies circuit board
Horizontal area, blocks other electronic components, causes the heat dissipation problem of other electronic components instead.2, vibration problems, with piezoelectricity
The use of heat radiation module, time length can find that the degree that the chips such as heat-radiating substrate and CPU are bonded is lower and lower, be primarily due to this
Structure radiator portion and ventilation lumen in patent link together, and a leverage is formed when ventilation lumen vertical tremor will
The heat-radiating substrate on side tilts, and be very easy to cause to radiate bad problem.3, the heat radiation module of the structure belongs to blowing method
Heat dissipation by the air extrusion in ventilation lumen and blows to thermal column（That is the shunting body of the patent）, the form actual efficiency is low, because
Be thermal column due to fuel factor, around hot gas be to rise bottom-up, the transverse direction of ventilation lumen is blown to be caused with fuel factor
The bottom-up movement of gas form a differential seat angle, reduce the actual speed that hot gas scatters instead.4, the structure is scattered
Plume（That is the shunting body of the patent）For solid construction, reduce due to air radiating rate caused by fuel factor.
Invention content
It is an object of the invention to overcome disadvantages described above, a kind of bimodulus piezoelectricity radiator structure is provided.
To achieve the above object, concrete scheme of the invention is as follows：A kind of bimodulus piezoelectricity radiator structure, includes for pasting
Set on the heat-radiating substrate of chip surface；The substrate is equipped with multiple thermal columns；
Further include that there are one rectangular cavities, a side of rectangular cavities is equipped with the first installation window, opposite with the side
Another side is equipped with the second installation window；
It further include the second pressure for having the first piezoelectric vibrator structure for being installed on the first installation window and being installed on the second installation window
Electric tachometer indicator structure, the first piezoelectric vibrator structure and the second piezoelectric vibrator structure include there are one elastic piece and being attached at elasticity
The piezoelectric sheet of on piece；The rectangular cavities top and bottom are equipped with multiple air hole structures；Each air hole structure include
The bellmouth that is opened up in rectangular cavities, the bullet being placed in bellmouth and the doorframe for preventing bullet from losing；Rectangle
Four angular zones of cavity bottom surface are downwardly projecting to have first boss, first boss bottom surface to extend downwardly out the first fixed column,
Four angular zones of heat-radiating substrate top surface are equipped with second boss corresponding with first boss upwards, and second boss extends upward
There is the second fixed column, further include having hard spring, hard spring one end is socketed the first fixed column, and other end socket second is fixed
Column.
Wherein, the air hole structure quantity at least two that rectangular cavities bottom surface is equipped with.
Wherein, the air hole structure quantity at least two that rectangular cavities top surface is equipped with.
Wherein, the thermal column arrangement mode is that the thermal column arrangement mode is that one is set in heat-radiating substrate top surface
First thermal column of the heart, the second circle thermal column that first thermal column of the circle around center is arranged, the heat dissipation of the second circle thermal column
Setting equally spaced from each other between column；And the centrally disposed third circle thermal column of thermal column is enclosed around second, third circle thermal column
Setting equally spaced from each other between thermal column；The height of first thermal column is more than the height of each thermal column of the second circle thermal column, the
The height of each thermal column of two circle thermal columns is more than the height of each thermal column of third circle thermal column.
Wherein, the thermal column is hollow-core construction, and the heat dissipation column bottom is equipped with the air through hole of two perforations.
Beneficial effects of the present invention are：1, due to using vertical design, space availability ratio is high, will not occupy except heat-radiating substrate
Outer any transverse area.2, due to vertical structure, during vibrations, be not in leverage, lead to heat-radiating substrate and core
The problem of piece detaches, compactness higher, spoilage are lower；In addition non-contacting spring structure is used, the ventilation of part in realization
The slight lateral vibrations of chamber are absorbed by spring, do not influence beneath heat-radiating substrate.3, using air-suction, that is, pass through the valve of taper
Body realizes that rectangular cavities bottom air-breathing, the top of rectangular cavities are only deflated, and thermal column can be the bottom of from due to fuel factor, heat
Portion is raised above, and identical as the airflow direction that the suction hole below rectangular cavities is formed, two speed do not have differential seat angle, after superposition
Heat dissipation effect is more preferable.4, thermal column is designed as hollow structure, and bottom offers air through hole, and the heat in thermal column is passed through bottom
The air of portion's air admission hole rises to the region at top, and better heat-radiation effect is apparent.
Description of the drawings
Fig. 1 is the stereogram of the present invention；
Fig. 2 is the front view of the present invention；
Fig. 3 is the sectional view of the present invention；
Fig. 4 is the stereogram of the heat-radiating substrate and thermal column of the present invention；
Fig. 5 is the front view of the heat-radiating substrate and thermal column of the present invention；
Fig. 6 is the stereogram of thermal column；
Fig. 7 is the hollow flow of air schematic diagram of thermal column；
Reference sign in Fig. 1 to Fig. 7：
1- rectangular cavities；11- first installs window；12- second installs window；21- piezoelectric sheets；22- elastic pieces；31- tapers
Hole；32- bullets；33- doorframes；41- first boss；42- second boss；43- hard springs；The second fixed columns of 44-；45-
One fixed column；5- heat-radiating substrates；51- thermal columns；52- air through hole.
Specific implementation mode
The present invention is described in further detail in the following with reference to the drawings and specific embodiments, is not the reality the present invention
It applies range and is confined to this.
As shown in Figures 1 to 7, a kind of bimodulus piezoelectricity radiator structure described in the present embodiment, includes for being attached at core
The heat-radiating substrate 5 on piece surface；The substrate is equipped with multiple thermal columns 51；Further include that there are one rectangular cavities 1, rectangular cavities 1
A side be equipped with first installation window 11, another side opposite with the side be equipped with second installation window 12；Further include having
It is installed on the first piezoelectric vibrator structure of the first installation window 11 and is installed on the second piezoelectric vibrator structure of the second installation window 12, the
One piezoelectric vibrator structure and the second piezoelectric vibrator structure include that there are one elastic piece 22 and the pressures being attached on elastic piece 22
Electric thin slice 21；1 top and bottom of the rectangular cavities are equipped with multiple air hole structures；Each air hole structure includes in rectangular cavity
The bellmouth 31 that is opened up on body 1, the bullet 32 being placed in bellmouth 31 and the doorframe 33 for preventing bullet 32 from losing；
Four angular zones of 1 bottom surface of rectangular cavities are downwardly projecting to have first boss 41,41 bottom surface of first boss to extend downwardly out
Four angular zones of one fixed column 45,5 top surface of heat-radiating substrate are equipped with second boss corresponding with first boss 41 42 upwards, the
Two boss 42 have extended upward the second fixed column 44, further include having hard spring 43, and 43 one end of hard spring socket first is solid
Fixed column 45, the other end are socketed the second fixed column 44.
It is shaken by the first piezoelectric vibrator structure of 1 both sides of rectangular cavities and the reversed back and forth of the second piezoelectric vibrator structure,
Compression simultaneously and expand simultaneously so that the gas compression in rectangular cavities 1 and expansion, when compression, i.e., outlet when, the cone at top
Body 32 is blown open, and gas is excluded from bellmouth 31, and the bullet 32 of bottom causes since airflow function is pressed in bellmouth 31
It cannot go out from this hole.Upon expansion, i.e., air inlet when, exactly the opposite, i.e., the bellmouth 31 of bottom can be with air inlet, and top is just
It is not all right.Thermal column 51 is formed since fuel factor, heat can rise bottom-up with the suction hole of 1 lower section of rectangular cavities
Airflow direction is identical, that is, and respiratory state is formed, that is, siphons away the hot-air of lower section, is then discharged from the bellmouth at top 31, it is cold
Air passes through thermal column 51 from surrounding again.Reciprocal Rapid Circulation, achievees the purpose that heat dissipation.Wherein, the present invention is due to using vertical
Design, space availability ratio is high, will not occupy any transverse area in addition to heat-radiating substrate 5.2, due to vertical structure, process is shaken
In, the problem of being not in leverage, heat-radiating substrate 5 is caused to be detached with chip, compactness higher, spoilage is lower；In addition
Using non-contacting spring structure, in realization the ventilation lumen of part slight lateral vibrations absorbed by spring, do not influence under
Heat-radiating substrate 5.3, using air-suction, i.e., by the valve body of taper, 1 bottom air-breathing of rectangular cavities is realized, rectangular cavities 1
Top is only deflated, and thermal column 51 is since fuel factor, heat can rise bottom-up, the suction hole with 1 lower section of rectangular cavities
The airflow direction of formation is identical, and two speed do not have differential seat angle, and heat dissipation effect is more preferable after superposition.
In the present embodiment, air hole structure quantity at least two that 1 bottom surface of rectangular cavities is equipped with.In the present embodiment, rectangle
The air hole structure quantity at least two that 1 top surface of cavity is equipped with.It can be effectively.
In the present embodiment, 51 arrangement mode of the thermal column is first heat dissipation for being set to 5 end face center of heat-radiating substrate
Column 51, the second circle thermal column that first thermal column 51 of the circle around center is arranged（51）, the thermal column of the second circle thermal column 51
Between setting equally spaced from each other；And around the second circle thermal column（51）Centrally disposed third circle thermal column 51, the heat dissipation of third circle
Setting equally spaced from each other between the thermal column of column 51；The height of first thermal column 51 is more than each thermal column of the second circle thermal column 51
Height, second circle thermal column 51 each thermal column height be more than third circle thermal column 51 each thermal column height.
In this way in practice, discovery can effectively promote cold air and reach 51 central area of thermal column, be conducive to radiate.
In the present embodiment, the thermal column 51 be hollow-core construction, 51 bottom of the thermal column set there are two penetrate through air inlet
Through-hole 52.Thermal column 51 is designed as hollow structure, and bottom offers air through hole 52, and the heat in thermal column 51 is passed through bottom
The air of air admission hole rises to the region at top, and better heat-radiation effect is apparent.
The above is only the preferred embodiment of the present invention, therefore all structures according to described in present patent application range
It makes, the equivalent change or modification that feature and principle are done, is included in the protection domain of present patent application.
Claims (1)
1. a kind of bimodulus piezoelectricity radiator structure, it is characterised in that：It include the heat-radiating substrate for being attached at chip surface（5）,
The substrate is equipped with multiple thermal columns（51）；
Further include that there are one rectangular cavities（1）, rectangular cavities（1）A side be equipped with first installation window（11）, with the side
Another opposite side is equipped with the second installation window（12）；
Further include being installed on the first installation window（11）The first piezoelectric vibrator structure and be installed on the second installation window（12）
Two piezoelectric vibrator structures；First piezoelectric vibrator structure and the second piezoelectric vibrator structure include that there are one elastic pieces（22）And patch
Set on elastic piece（22）On piezoelectric sheet（21）；The rectangular cavities（1）Top and bottom are equipped with multiple air hole structures；Often
A air hole structure includes in rectangular cavities（1）On the bellmouth that opens up（31）, be placed in bellmouth（31）Interior bullet（32）
And for preventing bullet（32）The doorframe of loss（33）；
Pass through rectangular cavities（1）The vibrations reversed back and forth of the first piezoelectric vibrator structure and the second piezoelectric vibrator structure of both sides, i.e.,
It compresses and expands simultaneously simultaneously so that rectangular cavities（1）Interior gas compression and expansion；When compression, i.e., outlet when, the cone at top
Body（32）It is blown open, gas is discharged from top tapered hole, the bellmouth closing of bottom；Upon expansion, i.e., air inlet when, bottom
Bellmouth can be closed with air inlet, the bellmouth at top；
Rectangular cavities（1）Four angular zones of bottom surface are downwardly projecting first boss（41）, first boss（41）Bottom surface is downward
Extending has the first fixed column（45）, heat-radiating substrate（5）Four angular zones of top surface are equipped with upwards and first boss（41）It is right
The second boss answered（42）, second boss（42）The second fixed column is extended upward（44）, further include having hard spring（43）,
Hard spring（43）One end is socketed the first fixed column（45）, the other end the second fixed column of socket（44）；
Rectangular cavities（1）The air hole structure quantity at least two that bottom surface is equipped with；
Rectangular cavities（1）The air hole structure quantity at least two that top surface is equipped with；
The thermal column（51）Arrangement mode is that is set to a heat-radiating substrate（5）First thermal column of end face center（51）, a circle
The first thermal column around center（51）The second circle thermal column being arranged（51）, the second circle thermal column（51）Thermal column between that
This is placed equidistant with；And around the second circle thermal column（51）Centrally disposed third circle thermal column（51）, third circle thermal column
（51）Thermal column between setting equally spaced from each other；First thermal column（51）Height be more than second circle thermal column（51）Each of dissipate
The height of plume, the second circle thermal column（51）Each thermal column height be more than third circle thermal column（51）Each thermal column
Height；
The thermal column（51）For hollow-core construction, the thermal column（51）Bottom set there are two penetrate through air through hole（52）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710377266.1A CN107170722B (en) | 2017-05-25 | 2017-05-25 | A kind of bimodulus piezoelectricity radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710377266.1A CN107170722B (en) | 2017-05-25 | 2017-05-25 | A kind of bimodulus piezoelectricity radiator structure |
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| Publication Number | Publication Date |
|---|---|
| CN107170722A CN107170722A (en) | 2017-09-15 |
| CN107170722B true CN107170722B (en) | 2018-08-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710377266.1A Expired - Fee Related CN107170722B (en) | 2017-05-25 | 2017-05-25 | A kind of bimodulus piezoelectricity radiator structure |
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| US20230200017A1 (en) * | 2021-12-20 | 2023-06-22 | Microsoft Technology Licensing, Llc | Systems and methods for electromagnetic shielding of thermal fin packs |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1383205A (en) * | 2001-04-27 | 2002-12-04 | 张千山 | Computer CPU chip radiator |
| CN103929925A (en) * | 2013-01-16 | 2014-07-16 | 欧司朗有限公司 | Radiation device, electronic device comprising same and lighting device comprising same |
| CN104768354A (en) * | 2015-03-20 | 2015-07-08 | 长春隆美科技发展有限公司 | Piezoelectric driving type heat dissipation module |
| CN204721142U (en) * | 2015-05-05 | 2015-10-21 | 好太太电器（中国）有限公司 | A kind of soot motor dampening bracket |
| CN105135391A (en) * | 2015-07-14 | 2015-12-09 | 东莞市闻誉实业有限公司 | Cooler |
| CN105508207A (en) * | 2016-01-20 | 2016-04-20 | 吉林大学 | Piezoelectric pump with cymbal-shaped pump bodies |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102736708A (en) * | 2011-04-01 | 2012-10-17 | 台通科技股份有限公司 | Heat-dissipating device |
| CN103702541A (en) * | 2012-09-28 | 2014-04-02 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and radiator thereof |
| CN104902728B (en) * | 2014-03-03 | 2019-02-05 | 联想(北京)有限公司 | A kind of electronic equipment and radiating piece |
| CN204267258U (en) * | 2014-11-23 | 2015-04-15 | 浙江师范大学 | A kind of piezoelectric pump overvoltage protective device based on magnetic rheology effect |
| CN106329348A (en) * | 2016-09-12 | 2017-01-11 | 周杰 | Power distribution box convenient for moving |
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2017
- 2017-05-25 CN CN201710377266.1A patent/CN107170722B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1383205A (en) * | 2001-04-27 | 2002-12-04 | 张千山 | Computer CPU chip radiator |
| CN103929925A (en) * | 2013-01-16 | 2014-07-16 | 欧司朗有限公司 | Radiation device, electronic device comprising same and lighting device comprising same |
| CN104768354A (en) * | 2015-03-20 | 2015-07-08 | 长春隆美科技发展有限公司 | Piezoelectric driving type heat dissipation module |
| CN204721142U (en) * | 2015-05-05 | 2015-10-21 | 好太太电器（中国）有限公司 | A kind of soot motor dampening bracket |
| CN105135391A (en) * | 2015-07-14 | 2015-12-09 | 东莞市闻誉实业有限公司 | Cooler |
| CN105508207A (en) * | 2016-01-20 | 2016-04-20 | 吉林大学 | Piezoelectric pump with cymbal-shaped pump bodies |
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| CN107170722A (en) | 2017-09-15 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20180621 Address after: 518000 A District, two floor, 5 building, second industrial zone, Tian Liao community, Gongming office, Guangming New District, Shenzhen, Guangdong Applicant after: Shenzhen Fucheng mold Products Co.,Ltd. Address before: 523000 A 302, Guangming Road, Guangming Road, Dongcheng Street, Dongguan, Guangdong, 302 Applicant before: DONGGUAN HEAN ELECTROMECHANICAL Co.,Ltd. |
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Granted publication date: 20180814 |