CN107690223B - Packaging substrate with efficient heat dissipation - Google Patents

Packaging substrate with efficient heat dissipation Download PDF

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Publication number
CN107690223B
CN107690223B CN201710653434.5A CN201710653434A CN107690223B CN 107690223 B CN107690223 B CN 107690223B CN 201710653434 A CN201710653434 A CN 201710653434A CN 107690223 B CN107690223 B CN 107690223B
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Prior art keywords
layer
heat dissipation
heat
section
inlet section
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CN201710653434.5A
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CN107690223A (en
Inventor
陈旭东
张智明
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CHANGSHU DONGNAN XIANGHU ELECTRONIC Co Ltd
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CHANGSHU DONGNAN XIANGHU ELECTRONIC Co Ltd
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Priority to CN201710653434.5A priority Critical patent/CN107690223B/en
Publication of CN107690223A publication Critical patent/CN107690223A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20181—Filters; Louvers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes

Abstract

The present case relates to a high-efficient radiating packaging substrate, includes: the heat dissipation layer is of a hollow thin-wall structure, a capillary tissue is arranged on the inner wall of the heat dissipation layer, working liquid is filled in the heat dissipation layer, the heat dissipation layer is at least divided into a heat inlet section and a heat outlet section, the heat inlet section is communicated with the heat outlet section, a main body of the heat inlet section is of a flat cuboid structure which is horizontally arranged, and the heat outlet section extends outwards from two ends of the heat inlet section in the length direction; the first surface of the core base layer is arranged on the surface of the heat dissipation layer; at least one spacer layer having a first side disposed on the core substrate second side; and at least one circuit layer, the first surface of which is arranged on the second surface of the isolation layer. Through the heat dissipation layer, the fan and the whole packaging substrate in the scheme, a clear air outlet and an air inlet are formed, a clear air channel is formed, the low heat dissipation layout of a large amount of air dissipation in the traditional setting is changed, and the overall heat dissipation efficiency of the packaging substrate is improved.

Description

Packaging substrate with efficient heat dissipation
Technical Field
The invention relates to the field of package substrates, in particular to a package substrate with high-efficiency heat dissipation.
Background
The package substrate is a term in PCB, i.e. printed wiring board. The substrate can provide the effects of electric connection, protection, support, heat dissipation, assembly and the like for the chip so as to realize the purposes of multi-pin, reduction of the volume of a packaged product, improvement of electric performance and heat dissipation, ultrahigh density or multi-chip modularization. The package substrate should belong to the interdisciplinary technology, and it relates to the knowledge of electronics, physics, chemical engineering, etc.
When a high-power chip is mounted on a package substrate, if a rapid heat dissipation channel cannot be provided, the chip is subjected to frequency reduction, failure and even burning.
Disclosure of Invention
An object of the present invention is to solve at least the above problems or disadvantages and to provide at least the advantages described hereinafter.
The invention also aims to provide a packaging substrate with high-efficiency heat dissipation, working liquid arranged in the heat dissipation layer is firstly gasified in a heat inlet section, is discharged to a heat outlet section under the pressure of gas, is re-liquefied in the heat outlet section and then returns to the heat inlet section through capillary tissue, so that the working liquid forms heat carrying circulation, and meanwhile, the heat dissipation layer is integrally made of a copper material with excellent heat conductivity, so that the heat dissipation effect is further improved; by arranging the filter layer, the fan cannot gradually reduce the heat dissipation efficiency of the fan due to the blockage of air dust, and the packaging substrate can have high heat dissipation performance for a long time; through will the second section is in the fan wind gap, combines forced air cooling and heat dissipation layer heat dissipation together, compares in the whole packaging substrate and the fan of opening in the air that separately sets up, and whole packaging substrate has formed clear wind channel with going into the wind gap clearly in the present case, has changed the low heat dissipation overall arrangement that a large amount of wind escaped in traditional setting, has improved packaging substrate's whole radiating efficiency.
Therefore, the technical scheme provided by the invention is as follows:
a package substrate for efficient heat dissipation, comprising:
the heat dissipation layer is of a hollow thin-wall structure, a capillary tissue is arranged on the inner wall of the heat dissipation layer, working liquid is filled in the heat dissipation layer, the heat dissipation layer is at least divided into a heat inlet section and a heat outlet section, the heat inlet section is communicated with the heat outlet section, a main body of the heat inlet section is of a flat cuboid structure which is horizontally arranged, and the heat outlet section extends outwards from two ends of the heat inlet section in the length direction;
the first surface of the core base layer is arranged on the surface of the heat dissipation layer;
at least one spacer layer having a first side disposed on the core substrate second side; and
at least one circuit layer, the first side of which is disposed on the second side of the isolation layer.
Preferably, the thickness of the heat inlet section is 2-5 times of the wall thickness of the heat inlet section, and the thickness of the heat outlet section is at least 6 times of the wall thickness of the heat outlet section.
Preferably, the core base layer is further provided with a through hole, and the heat dissipation plate is provided with a first cavity for the through hole to pass through.
Preferably, a plurality of blind holes are formed in the circuit layer, and the blind holes are electrically communicated with the circuit layer and the core base layer.
Preferably, a plurality of vent holes are further formed in the high-efficiency heat-dissipation packaging substrate, and the vent holes penetrate through second cavities preset in the circuit layer, the isolation layer, the core base layer and the heat dissipation layer from outside to inside in sequence.
Preferably, a fan is further arranged on the lower side of the packaging substrate with high heat dissipation efficiency, and an air outlet of the fan is opposite to the heat dissipation layer, the core base layer, the isolation layer and the circuit layer.
Preferably, the heat outlet section is vertically arranged to form an air duct with two open ends.
Preferably, the heat outlet section is divided into an upper first section and a lower second section, the second section extends downward and has a terminal forming an opening for air intake, the first section is disposed above the circuit layer, the first section is located on an air outlet path of the fan, and the first section extends downward and is communicated with the upper part of the second section.
Preferably, a filter layer is further arranged on the lower side of the fan, and the edge of the filter layer is connected with the side wall of the heat inlet section.
Preferably, the circuit layer, the isolation layer and the side wall of the core substrate are located in the same vertical plane and form a uniform first side surface, and an isolation side plate is arranged between the first side surface and the heat inlet section.
The invention at least comprises the following beneficial effects:
1. working liquid arranged in the heat dissipation layer is firstly gasified in the heat inlet section, is discharged to the heat outlet section under the pressure of gas, is liquefied again in the heat outlet section and then returns to the heat inlet section through capillary tissue, so that heat carrying circulation is formed by the working liquid, and meanwhile, the heat dissipation layer is integrally made of a copper material with excellent heat conductivity, so that the heat dissipation effect is further improved;
2. by arranging the filter layer, the fan cannot gradually reduce the heat dissipation efficiency of the fan due to the blockage of air dust, and the packaging substrate can have high heat dissipation performance for a long time;
3. through with the second section setting is in the fan wind gap, combines forced air cooling and heat dissipation layer heat dissipation together, compares in the whole packaging substrate and the fan of opening in the air that separately set up, and whole packaging substrate has formed clear air outlet and income wind gap in the present case, has formed clear wind channel, has changed the low heat dissipation overall arrangement that a large amount of wind were lost in traditional setting, has improved packaging substrate's whole radiating efficiency.
Drawings
Fig. 1 is a schematic cross-sectional view of a package substrate with efficient heat dissipation according to a first embodiment of the invention;
fig. 2 is a schematic cross-sectional view of a package substrate with high heat dissipation efficiency according to a third embodiment of the invention.
Detailed Description
The present invention is further described in detail below with reference to examples so that those skilled in the art can practice the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," when used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
Example one
Referring to fig. 1, a package substrate with high heat dissipation efficiency includes: the heat dissipation layer 100 is of a hollow thin-wall structure, a capillary tissue 110 is arranged on the inner wall of the heat dissipation layer 100, working liquid is filled in the heat dissipation layer 100, the heat dissipation layer 100 is at least divided into a heat inlet section 120 and a heat outlet section 130, the heat inlet section 120 is communicated with the heat outlet section 130, the main body of the heat inlet section 120 is of a flat cuboid structure which is horizontally arranged, and the heat outlet section 130 extends outwards from two ends of the heat inlet section 120 in the length direction; at least one core substrate 200, a first side of which is disposed on the surface of the heat dissipation layer 100; at least one spacer layer 300 having a first side disposed on a second side of the core substrate 200; and at least one wiring layer 400 having a first side disposed on a second side of the isolation layer 300. The working fluid is firstly gasified in the heat inlet section 120, is discharged to the heat outlet section 130 under the gas pressure, is re-liquefied in the heat outlet section 130 and then returns to the heat inlet section 120 through the capillary tissue 110, so that the working fluid forms a heat carrying cycle, and meanwhile, the whole heat dissipation layer 100 is made of a copper material with excellent heat conductivity, so that the heat dissipation effect is further improved.
The thickness of the heat inlet section 120 is 2-5 times of the wall thickness of the heat inlet section 120, and the thickness of the heat outlet section 130 is at least 6 times of the wall thickness of the heat outlet section 130. The thickness of the heat input section 120 is small, so that the package substrate is as thin as possible, and the thickness of the heat output section 130 can be enlarged as required, so as to achieve a better heat dissipation effect.
The core base layer 200 is further provided with a through hole 210, and a first cavity through which the through hole 210 passes is preset on the heat dissipation plate. A plurality of blind holes 410 are formed in the circuit layer 400, and the blind holes 410 are electrically connected with the circuit layer 400 and the core substrate 200. The side walls of the circuit layer 400, the isolation layer 300 and the core substrate 200 are located in the same vertical plane and form a uniform first side surface, and an isolation side plate 500 is disposed between the first side surface and the heat inlet section 120. The isolation side plate 500 is provided so that the circuit layers do not form a leakage or short circuit due to contact with the second section 132 of the heat dissipation layer 100.
Example two
Still be equipped with a plurality of ventilation holes 600 on the radiating packaging substrate of high efficiency, ventilation hole 600 is from outside to inside passed in proper order circuit layer 400, isolation layer 300, core basic unit 200 and the second cavity of predetermineeing on the layer 100 that dispels the heat. The lower side of the packaging substrate with high heat dissipation efficiency is further provided with a fan 700, and an air outlet of the fan 700 is over against the heat dissipation layer 100, the core substrate 200, the isolation layer 300 and the circuit layer 400. Compared with the common fan 700 independently arranged in the upper space of the package substrate, the fan 700 is integrated in the lower part of the package substrate and is exhausted through the air vent 600, air cooling heat dissipation of the whole package substrate is formed, the air cooling heat dissipation device is simple and convenient, the space is saved, the air outlet direction is consistent with the hot air rising direction, and the heat dissipation efficiency is higher.
The heat outlet section 130 is vertically arranged to form an air duct with two open ends. The lower side of the fan 700 is further provided with a filter layer 710, and the edge of the filter layer 710 is connected with the sidewall of the heat inlet section 120. A more closed space, so that the heat extraction efficiency of the fan 700 is higher. Through setting up the filter layer for the fan can not reduce its radiating efficiency gradually because of the jam of air dust, guarantees that packaging substrate can have high heat dispersion for a long time.
EXAMPLE III
Referring to fig. 2, the heat outlet section 130 is divided into an upper first section 131 and a lower second section 132, the second section 132 extends downward and has an open end for air inlet, the first section 131 is disposed on the circuit layer 400, the first section 131 is located on the air outlet path of the fan 700, and the first section 131 extends downward and is communicated with the upper portion of the second section 132. Through with second section 132 sets up in fan 700 wind gap, combines forced air cooling and heat dissipation layer 100 heat dissipation together, compare in the whole packaging substrate and the fan of opening in the air that separately set up, whole packaging substrate has formed clear air outlet and income wind gap in the present case, has formed clear wind channel, has changed the low heat dissipation overall arrangement that a large amount of wind were lost in traditional setting, has improved packaging substrate's whole radiating efficiency.
As described above, the working fluid disposed in the heat dissipation layer is firstly gasified in the heat inlet section, and is discharged to the heat outlet section under gas pressure, and is liquefied again in the heat outlet section and then returned to the heat inlet section through the capillary structure, so that the working fluid forms a heat transfer cycle, and meanwhile, the heat dissipation layer is integrally made of a copper material with excellent heat conductivity, thereby further improving the heat dissipation effect; by arranging the filter layer, the fan cannot gradually reduce the heat dissipation efficiency of the fan due to the blockage of air dust, and the packaging substrate can have high heat dissipation performance for a long time; through with the second section setting is in the fan wind gap, combines forced air cooling and heat dissipation layer heat dissipation together, compares in the whole packaging substrate and the fan of opening in the air that separately set up, and whole packaging substrate has formed clear air outlet and income wind gap in the present case, has formed clear wind channel, has changed the low heat dissipation overall arrangement that a large amount of wind were lost in traditional setting, has improved packaging substrate's whole radiating efficiency.
While embodiments of the invention have been disclosed above, it is not intended to be limited to the uses set forth in the specification and examples. It can be applied to all kinds of fields suitable for the present invention. Additional modifications will readily occur to those skilled in the art. It is therefore intended that the invention not be limited to the exact details and illustrations described and illustrated herein, but fall within the scope of the appended claims and equivalents thereof.

Claims (6)

1. A package substrate for efficient heat dissipation, comprising:
the heat dissipation layer is of a hollow thin-wall structure, a capillary tissue is arranged on the inner wall of the heat dissipation layer, working liquid is filled in the heat dissipation layer, the heat dissipation layer is at least divided into a heat inlet section and a heat outlet section, the heat inlet section is communicated with the heat outlet section, a main body of the heat inlet section is of a flat cuboid structure which is horizontally arranged, and the heat outlet section extends outwards from two ends of the heat inlet section in the length direction;
the first surface of the core base layer is arranged on the surface of the heat dissipation layer;
at least one spacer layer having a first side disposed on the core substrate second side; and
at least one circuit layer, the first surface of which is arranged on the second surface of the isolation layer;
the packaging substrate with high-efficiency heat dissipation is also provided with a plurality of vent holes, and the vent holes sequentially penetrate through second cavities preset on the circuit layer, the isolation layer, the core base layer and the heat dissipation layer from outside to inside;
the lower side of the packaging substrate with high-efficiency heat dissipation is further provided with a fan, and the air outlet of the fan is opposite to the heat dissipation layer, the core base layer, the isolation layer and the circuit layer.
2. The efficient heat dissipation package substrate of claim 1, wherein the thickness of the heat inlet section is 2-5 times the wall thickness of the heat inlet section, and the thickness of the heat outlet section is at least 6 times the wall thickness of the heat outlet section.
3. The package substrate with efficient heat dissipation as defined in claim 1, wherein a through hole is further formed in the core base layer, and a first cavity is pre-formed in the heat dissipation plate for the through hole to pass through.
4. The package substrate with efficient heat dissipation as defined in claim 1, wherein the circuit layer has a plurality of blind vias, and the blind vias electrically connect the circuit layer and the core substrate.
5. The substrate as claimed in claim 1, wherein a filter layer is further disposed on the lower side of the fan, and the edge of the filter layer is connected to the sidewall of the heat inlet section.
6. The substrate as claimed in claim 1, wherein the side walls of the circuit layer, the isolation layer and the core substrate are located in a same vertical plane and form a unified first side surface, and an isolation side plate is disposed between the first side surface and the heat inlet section.
CN201710653434.5A 2017-08-02 2017-08-02 Packaging substrate with efficient heat dissipation Active CN107690223B (en)

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Application Number Priority Date Filing Date Title
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CN107690223A CN107690223A (en) 2018-02-13
CN107690223B true CN107690223B (en) 2020-03-31

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115707170A (en) * 2021-08-10 2023-02-17 庆鼎精密电子（淮安）有限公司 Circuit board and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102290389A (en) * 2010-06-18 2011-12-21 晶致半导体股份有限公司 Semiconductor packaging component with cooling fan and stacking structure thereof
CN102460689A (en) * 2009-04-16 2012-05-16 莫列斯公司 Cooling device, electronic substrate and electronic device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5117101B2 (en) * 2007-05-08 2013-01-09 株式会社東芝 Evaporator and circulating cooling device using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102460689A (en) * 2009-04-16 2012-05-16 莫列斯公司 Cooling device, electronic substrate and electronic device
CN102290389A (en) * 2010-06-18 2011-12-21 晶致半导体股份有限公司 Semiconductor packaging component with cooling fan and stacking structure thereof

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