CN114446903A

CN114446903A - Packaging device, packaging module and electronic equipment

Info

Publication number: CN114446903A
Application number: CN202111605409.2A
Authority: CN
Inventors: 张晓杰; 武昊
Original assignee: Huawei Digital Power Technologies Co Ltd
Current assignee: Huawei Digital Power Technologies Co Ltd
Priority date: 2021-12-25
Filing date: 2021-12-25
Publication date: 2022-05-06

Abstract

The application provides a packaging device, which comprises a circuit board, an electronic component, a packaging body, a shell and at least one first heat dissipation component, wherein the electronic component is electrically connected with the circuit board; the packaging body is used for packaging the circuit board and the electronic component and can conduct heat; the shell is used for accommodating the circuit board, the electronic component and the packaging body, and at least one surface of the shell is provided with a first part capable of conducting heat; each first heat dissipation part is connected to the first part and embedded in the packaging body. The application also provides a packaging module using the packaging device and electronic equipment using the packaging device or the packaging module. This application is through increasing first heat dissipation part in the encapsulation device, and cooperation first portion can effectively promote the radiating efficiency of encapsulation device, and is favorable to the frivolous short and small and encapsulation densification of encapsulation module.

Description

Packaging device, packaging module and electronic equipment

Technical Field

The application relates to a packaging device with good heat dissipation effect, a packaging module using the packaging device and electronic equipment using the packaging device or the packaging module.

Background

In order to adapt to the higher and higher power requirements, power semiconductor devices, especially power supply type power semiconductor devices, are gradually evolving towards miniaturization and high density. With the reduction of the volume of the power semiconductor device and the improvement of the density of internal components, the heat dissipation problem has great influence on the improvement of the working efficiency of the power semiconductor device.

However, most of the existing power semiconductor devices realize heat dissipation through packaging adhesive and a housing, the heat dissipation capability is limited, internal heat cannot be discharged in time, the temperature of the power semiconductor device is possibly too high, the working efficiency and the service life of the power semiconductor device are influenced, and internal components are possibly failed or burnt in severe cases.

Disclosure of Invention

A first aspect of an embodiment of the present application provides a package device, where the package device includes a circuit board, an electronic component, a package, a housing, and at least one first heat dissipation component, where the electronic component is electrically connected to the circuit board; the packaging body is used for packaging the circuit board and the electronic component, and the packaging body can conduct heat; the shell is used for accommodating the circuit board, the electronic component and the packaging body, and at least one surface of the shell is provided with a first part which can conduct heat; each first heat dissipation part is connected to the first part and embedded in the packaging body.

According to the heat dissipation device, the first heat dissipation part is additionally arranged in the packaging device and is connected with the first part capable of conducting heat, so that heat in the packaging body (particularly heat at a heat gathering position) can be quickly conducted to the shell, heat dissipation in the packaging device is further achieved, and heat dissipation efficiency is improved; the first heat dissipation part is connected with the first part, so that the assembly of the circuit board and the electronic component in the packaging device and the filling of the packaging body are facilitated; moreover, the added first heat dissipation part fully utilizes the internal vacant space of the packaging device, thereby being beneficial to the light, thin, short and small packaging devices; in addition, the first heat dissipation part can be directly formed on the first part when the shell is formed, and the manufacturing process is simple, low in cost and convenient for mass production.

In some embodiments, at least one of the first heat sink pieces includes a first cavity and a first capillary structure and a first working substance located within the first cavity.

Through setting first heat dissipation part to two-phase structural style, the heat conductivity of two-phase structure is high, can strengthen the quick timely derivation of the inside heat of packaging device (especially heat source density is high and the packaging device that the encapsulation volume is less), can in time derive the heat of heat source in the packaging body fast, significantly reduced because the heat gathers the thermal resistance that causes, and then promote radiating efficiency.

In some embodiments, the first portion includes a second cavity and a second capillary structure and a second working substance located within the second cavity.

Through setting the first part to two-phase structural style, the heat conductivity of two-phase structure is high, combines first heat dissipation part can strengthen the quick timely derivation of the inside heat of encapsulation device (especially heat source density is high and the encapsulation device that the encapsulation volume is less), significantly reduced because the heat gathers the thermal resistance that causes, especially when first part is two-phase structure with first heat dissipation part, can increase the area of contact of working medium and heat source, and then promote the radiating efficiency.

In some embodiments, the first portion and the first heat sink form a third cavity, and a third capillary structure and a third working medium are disposed in the third cavity.

Through the cavity structure with first part and first heat dissipation part shaping formula as an organic whole, can increase the area of contact of third working medium and heat source, and then promote the radiating efficiency.

In some embodiments, at least one of the first heat sink members is disposed through the circuit board.

Can run through the circuit board setting through first heat dissipation part to the heat that makes the circuit board keep away from first part one side gathering can be taken away through first heat dissipation part, thereby realizes the purpose that the heat in time derives fast.

In some embodiments, at least two faces of the housing having the first portion that is thermally conductive are attached to or disposed opposite or spaced apart from each other.

The first part capable of conducting heat is additionally arranged on different surfaces of the shell, so that the heat dissipation area is increased, the heat dissipation efficiency of the packaging device is further improved, and the light, thin, short and small packaging device is facilitated.

In some embodiments, when the at least two surfaces are connected to each other, the first portions on the at least two surfaces form a fourth cavity, and a fourth capillary structure and a fourth working medium are arranged in the fourth cavity; or when the at least two surfaces are oppositely arranged or spaced, the first parts on any two surfaces are connected through at least one first heat dissipation component.

But through the first part with a plurality of faces increase heat conduction of shell, especially increase the first part of double-phase heat dissipation part, can further strengthen the inside thermal derivation of encapsulation device, especially the inside thermal derivation of the encapsulation device that heat source density is high and the encapsulation volume is less, can in time derive the heat of heat source fast, and then promote the radiating efficiency. In addition, a heat dissipation device is arranged on a heat dissipation surface of the shell, which is beneficial to the light, thin, short and small of the packaging device.

In some embodiments, a surface of at least one of the first heat sink members is provided with at least one second heat sink member, each of the second heat sink members extending inside the package body.

The increase of the second heat dissipation part fully utilizes the internal vacant space of the packaging device, and can further enhance the heat dissipation efficiency of the packaging device.

In some embodiments, at least one of the second heat sink members extends toward the electronic components.

The second heat dissipation part extends towards the electronic component, and dissipation of heat near the electronic component can be accelerated.

A first aspect of embodiments of the present application provides a package module, where the package module includes the package device as described above and a heat sink located on an outer surface of the first portion.

The application has the advantages that the heat dissipation efficiency of the packaging device is high, the heat dissipation device is arranged on the outer surface of the first part of the shell capable of conducting heat, so that the purpose of efficient heat dissipation is achieved, the heat dissipation effect of the packaging module is improved, and meanwhile the size of the packaging module is favorably reduced.

A third aspect of the embodiments of the present application provides an electronic device, which includes the package device as described above or the package module as described above.

In the electronic equipment, the packaging device can play a good role in heat dissipation, so that local hot spots formed on the packaging device are avoided, and the heat dissipation is good under the condition of improving the power consumption of the electronic components, thereby improving the working efficiency and the service life of the electronic equipment.

Drawings

Fig. 1 is a schematic structural diagram of a package module.

Fig. 2 is a schematic diagram of a packaged device.

Fig. 3 is a schematic structural diagram of another package module.

Fig. 4 is a schematic structural diagram of a packaged device according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a packaged device according to another embodiment of the present application.

Fig. 6 is a schematic structural diagram of a packaged device according to yet another embodiment of the present application.

Fig. 7 is a schematic structural diagram of a packaged device according to yet another embodiment of the present application.

Fig. 8 is a schematic view of the structure of the first heat sink member of fig. 7.

Fig. 9 is a schematic structural diagram of a packaged device according to yet another embodiment of the present application.

Fig. 10 is a schematic view of the structure of the first part of fig. 9.

Fig. 11 is a schematic structural diagram of a packaged device according to yet another embodiment of the present application.

Fig. 12 is a schematic view of the structure of fig. 11 in which the first heat sink member communicates with the first portion.

Fig. 13 is a schematic structural diagram of a packaged device according to yet another embodiment of the present application.

Fig. 14 is a schematic structural diagram of a packaged device according to yet another embodiment of the present application.

Fig. 15 is a schematic structural diagram of a packaged device according to yet another embodiment of the present application.

Fig. 16 is a schematic structural diagram of a package module according to an embodiment of the present application.

Fig. 17 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Description of the main elements

Package module 1000', 1000

Packaging devices 100', 100,200,300,400,500,600

Outer casing 1', 1

First portion

11', 11,11a

Second chamber 111

Fourth wall 1111

Fifth wall 1112

Sixth wall 1113

Second capillary structure 112

Second working medium 113

Second part 12', 12

Circuit boards 2', 2

Electronic component 3', 3

Packages 4', 4

A first heat sink 5,5a

First chamber 51

First wall 511

Second wall 512

Third wall 513

First capillary structure 52

First working medium 53

Second Heat sink 6

Third cavity 71

Evaporation end 711

Condensation end 712

Third capillary structure 72

Third working medium 73

Fourth chamber 81

Fourth capillary structure 82

Fourth working medium 83

Heat sink 1100', 1100

Thermally conductive layers 1200', 1200

Electronic device 2000

Housing 2100

Detailed Description

As shown in fig. 1, a package module 1000' is provided. The package module 1000 'includes a package device 100' and a heat sink 1100 ', the package device 100' is connected to the heat sink 1100 'through a heat conductive layer 1200'. The package device 100' may be a power semiconductor device, and is used for performing power processing, including frequency conversion, voltage conversion, current conversion, power management, and the like.

As shown in fig. 2, the above-mentioned packaged device 100 'includes a housing 1', a circuit board 2 'located in the housing 1', an electronic component 3 'located in the housing 1' and electrically connected to the circuit board 2 ', a package 4' encapsulating the circuit board 2 'and the electronic component 3', wherein the housing 1 'includes a first portion 11' and a second portion 12 'disposed opposite to the first portion 11'. The circuit board 2 'and the electronic component 3' are main heat sources, the first portion 11 'is a heat-conducting and heat-dissipating case, the second portion 12' is a material with lower heat conductivity and can be understood as a non-main heat-dissipating case, and the first portion 11 'and the heat sink 1100' are bonded together through the heat-conducting layer 1200 ', so as to dissipate heat of the package device 100'. Generally, the structure has low heat dissipation efficiency and poor heat dissipation effect. Heat is easily accumulated near the second portion 12 ' inside the package device 100 ' and cannot be dissipated in time, which easily causes the burning of the internal circuit board 2 ' and the electronic component 3 ', and affects the performance and the service life of the package module 1000 '.

As shown in fig. 3 and in conjunction with fig. 2, in order to improve the heat dissipation efficiency of the package module 1000 ', the second portion 12' of the package device 100 'may be designed as a heat dissipation housing, and another heat dissipation device 1100' is further bonded to the surface of the second portion 12 'through a heat conduction layer 1200', so as to enhance the heat dissipation effect. However, for the structure of the internal high-density packaged electronic component 3 ', the heat dissipation effect of the package module 1000 ' provided with the two heat dissipation devices 1100 ' is still limited; moreover, since the heat dissipation devices 1100 'are added on the opposite sides of the package device 100', the overall thickness of the package module 1000 'is increased, which is not favorable for the package module 1000' to be light, thin, short and small.

In order to improve the heat dissipation efficiency of the package device 100 'in the package module 1000', a package device is provided in the present application, and the following describes an embodiment of the present application with reference to the drawings in the embodiment of the present application.

Referring to fig. 4, the present embodiment provides a packaged device 100 with good heat dissipation effect. The packaged device 100 comprises a housing 1, and a circuit board 2, an electronic component 3, a package 4 and at least one first heat sink 5 located within the housing 1. The electronic component 3 is electrically connected with the circuit board 2, the electronic component 3 and each first heat dissipation component 5 are all packaged in the packaging body 4, and the packaging body 4 can conduct heat. Wherein at least one face of the housing 1 has a first portion 11 which is thermally conductive, and each first heat sink member 5 is attached to an inner surface of the first portion 11, where the inner surface is defined as the surface of the housing 1 adjacent to the enclosure 4, it will be understood that the housing 1 also includes an outer surface opposite the inner surface, where the outer surface is defined as the surface of the housing 1 remote from the enclosure 4.

As shown in fig. 4, the housing 1 has a substantially cubic structure. The material of the first portion 11 is a heat conductive material, and specifically, may be a metal, such as copper, aluminum, or the like, and may also be a plastic with a heat conductive filler added thereto, where the heat conductive filler may be graphene particles, metal oxide particles, or the like. It will be appreciated that the housing 1 is also provided with a second, less thermally conductive portion 12, the second portion 12 being disposed opposite the first portion 11, i.e. the second portion 12 may be understood as a non-primary heat dissipating housing.

As shown in fig. 4, the circuit board 2 may be a double-sided board, the electronic components 3 are disposed on two opposite surfaces of the circuit board 2, and the circuit board 2 is packaged in the middle of the package 4. It will be appreciated that the circuit board 2 may also be a single panel. The number of the circuit boards 2 may be one or more, and the plurality of circuit boards 2 are electrically connected to each other.

As shown in fig. 4, the electronic component 3 may include one or more passive devices including, but not limited to, resistors, capacitors, inductors, filters, couplers, and the like. The electronic components 3 may also include one or more active devices, such as active chips, including but not limited to power chips, digital chips, radio frequency chips, and the like. The electronic components 3 are substantially collectively packaged on the circuit board 2, and the package 4 completely covers each of the electronic components 3.

As shown in fig. 4, the material of the package 4 is an insulating and heat-conducting package material, and generally includes an insulating resin and an insulating and heat-conducting filler. The insulating resin may be one selected from epoxy resin (epoxy resin), BT resin, Polyphenylene Oxide (PPO), Polyimide (PI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), and the like. The insulating heat-conducting filler can be selected from particles such as nano silicon oxide powder, nano silicon nitride powder, nano silicon carbide powder, nano boron nitride powder, nano aluminum oxide powder and the like. For example, the insulating and heat-conducting packaging material can be obtained by uniformly dispersing an epoxy resin matrix and a heat-conducting insulating filler. The epoxy resin matrix is modified epoxy resin treated by nano silicon dioxide. The heat-conducting insulating material is modified silicon carbide powder treated by a silane coupling agent. The packaging body 4 obtained by filling the thermal conductive insulating material with the modified nano epoxy resin has the characteristics of high thermal conductivity, good dielectric property, low thermal expansion coefficient, high strength, high hardness, no toxicity, no harm and the like, and is suitable for packaging precise electronic parts. It is understood that other materials having characteristics of high thermal conductivity, good dielectric properties, low thermal expansion coefficient, high strength, high hardness, non-toxicity, innocuity, etc. may also be suitable for use in the packaged device 100 provided herein.

As shown in fig. 4, the first heat sink 5 is made of a heat conductive material, which may be a metal, such as copper or aluminum, or a plastic with a heat conductive filler, wherein the heat conductive filler may be graphene particles, metal oxide particles, or the like.

In this embodiment, the first heat sink member 5 may be bonded to the inner surface of the first portion 11 by welding or a thermally conductive layer. Through welding or heat-conducting layer bonding, set up first heat dissipation part 5 on 11 with the first portion, first heat dissipation part 5 stretches into the inside of packaging body 4, because the coefficient of heat conductivity of metal is high, first heat dissipation part 5 can be with the inside heat of packaging body 4 heat conduction to the first portion 11 that shell 1 can be heat-conducting fast on, and then reach the external world through the first portion 11 of shell 1, realize the purpose that the inside heat of packaging body 4 scatters and disappears fast.

In this embodiment, the first heat sink member 5 is in contact with the package 4, and in order to increase the contact area between the first heat sink member 5 and the package 4, the first heat sink member 5 may be designed to have various shapes, such as a column, a boss structure, a block, a sheet, a trapezoid structure, a disk structure, etc., and it is understood that the first heat sink member 5 may have other irregular shapes. In this embodiment, the first heat sink member 5 is columnar. The number of the first heat dissipation members 5 may be determined according to the volume of the actual package device 100 and the density of the internal electronic components 3, so as to achieve the best heat dissipation effect, for example, a plurality of first heat dissipation members 5 may be disposed at positions where the number of the electronic components 3 is large, and the collected heat may be rapidly conducted out.

As shown in fig. 5, it can be understood that in other embodiments, at least one second heat sink member 6 may be further disposed on the surface of the first heat sink member 5, and the second heat sink member 6 extends inside the package 4, so that the contact area between the heat sink members and the package 4 is increased, and the heat dissipation efficiency of the package device 100 is improved. In this embodiment, the second heat sink member 6 extends toward the electronic component 3, so that heat near the electronic component 3 (especially the electronic component 3 far from the first portion 11) can be quickly conducted out of the package device 100. It is understood that the second heat sink member 6 can be designed in various shapes, such as a column, a boss structure, a block, a sheet, a trapezoid structure, a disk structure, etc., which can increase the contact area with the package 4.

In this embodiment, the extending distance of the end of the first heat sink member 5 away from the first portion 11 in the package 4 may be determined according to the installation position of the electronic component 3. In this embodiment, one end of the first heat sink member 5 remote from the first portion 11 extends to a position where the electronic component 3 is packaged in the package 4, particularly, to a position where the plurality of electronic components 3 are concentrated. In packaging body 4, electronic components 3 is main heat-generating body, is close to electronic components 3 with first heat dissipation part 5 and sets up, can in time derive the heat that electronic components 3 produced fast, avoids heat near electronic components 3 gathering, ensures electronic components 3's normal work.

As shown in fig. 4, it can be understood that in other embodiments, one end of the at least one first heat sink member 5, which is away from the first portion 11, is disposed through the circuit board 2, and when the electronic component 3 is disposed on the surface of the circuit board 2, which is away from the first portion 11, the first heat sink member 5 can pass through the circuit board 2, so that the first heat sink member 5 can be as close to the heat source as possible, and the purpose of quickly and timely guiding out heat is achieved. Specifically, the circuit board 2 may be windowed at a corresponding position of the circuit board 2 before the circuit board 2 is packaged, so that the first heat sink member 5 can extend from one side of the circuit board 2 near the first portion 11 to the other side of the circuit board 2 through the circuit board 2.

As shown in fig. 6, it can be understood that in other embodiments, at least one end of the first heat sink member 5 away from the first portion 11 is connected to the inner surface of the second portion 12, and the first heat sink member 5 can directly penetrate through the package 4 to connect the first portion 11 and the second portion 12 together, so that the heat collected by the second portion 12 can directly cause the first portion 11 to be conducted out, and a heat sink is not required to be added on the outer surface of the second portion 12. Especially, when the second portion 12 has a relatively low thermal conductivity, the heat collected at the second portion 12 is not easily conducted out, and the heat of the package device 100 is easily collected and damaged, and the heat collected near the second portion 12 can be smoothly conducted out through the first heat dissipation member 5, so that the heat dissipation efficiency of the whole package device 100 is improved, the heat dissipation effect of different parts of the package device 100 is enhanced, and a heat dissipation device does not need to be arranged outside the second portion 12, thereby facilitating the light weight, thin and short size of the package device 100. In this embodiment, the first heat sink member 5 connected to the second portion 12 may be disposed to penetrate through the circuit board 2, that is, a window is opened at a corresponding position of the circuit board 2, so that the first heat sink member 5 penetrates through the circuit board 2 to be connected to the second portion 12.

In the package device 100 provided in this embodiment, the first heat dissipation component 5 is added inside the package device 100, and the first heat dissipation component 5 is connected to the first portion 11 of the housing 1, which can conduct heat, so that heat inside the package body 4 (especially heat at a heat accumulation position) can be quickly conducted to the first portion 11, thereby achieving efficient heat dissipation inside the package device 100 and improving heat dissipation efficiency; the first heat sink 5 is formed directly on the first portion 11, facilitating the assembly of the circuit board 2 and the electronic component 3 and the filling of the package 4 inside the packaged device 100; moreover, the added first heat sink member 5 makes full use of the internal vacant space of the packaged device 100, which is beneficial to the light, thin, short and small packaged device 100; in addition, the first heat sink 5 can be directly formed on the first portion 11 when the housing 1 is molded, and the manufacturing process is simple, low in cost and convenient for mass production.

As shown in fig. 7, a packaged device 200 of another embodiment of the present application differs from the packaged device 100 of the previous embodiment in that: the first heat sink 5a is a two-phase structure, and the first heat sink 5a includes a first cavity 51, and a first capillary structure 52 and a first working medium 53 located in the first cavity 51. In this embodiment, the first capillary structure 52 is formed on the inner cavity wall of the first cavity 51, and the first working medium 53 is adsorbed in the first capillary structure 52.

As shown in fig. 8, the first cavity 51 has a substantially hollow rectangular parallelepiped structure, the first cavity 51 includes a first wall 511, a second wall 512 disposed opposite to the first wall 511, and a third wall 513 having two ends connected to the first wall 511 and the second wall 512, respectively, and the first capillary structure 52 is formed on the first wall 511, the second wall 512, and the third wall 513. The first capillary structure 52 is formed by adding copper powder to the first cavity 51 and sintering the copper powder. It is to be understood that the manner of forming the first capillary structure 52 is not limited to copper powder sintering, and fine grooves may be formed by etching the inner surfaces of the first, second, and

third walls

511, 512, and 513. Since the first capillary structure 52 is an internal fine structure and is irregularly arranged, fig. 7 only schematically shows the first capillary structure 52. In this embodiment, the material of the first cavity 51 may be a heat conductive material, and specifically may be metal (e.g., copper, aluminum, etc.) or plastic with a heat conductive filler added thereto, where the heat conductive filler may be graphene particles, metal oxide particles, etc. First working fluid 53 may be a liquid or gaseous refrigerant, and may be a cooling fluid, for example. It will be appreciated that the specific dosage of first working fluid 53 may be tailored to the specific product. The first working medium 53 is used for conveying heat, and if too much first working medium 53 is arranged in the first cavity 51, the thermal resistance is increased, and the heat dissipation effect is further reduced. For example, typically the total amount of first working substance 53 in first cavity 51 is a few grams. In one embodiment, the dosage of the first working medium 53 in the first cavity 51 is under the condition that the packaging device 100 does not work. It will be appreciated that in other embodiments, the first cavity 51 may have other shapes, such as a cylindrical shape, a trapezoidal configuration, etc.

As shown in fig. 7 and 8, when the packaged device 200 is used, the circuit board 2 and the electronic component 3 are main heat sources, and one end of the first cavity 51 close to the first portion 11 is defined as a condensation end, and one end away from the first portion 11 or close to the heat source is defined as an evaporation end. The first working medium 53 (which may be a cooling liquid in particular) is used to vaporize when the evaporation end of the first cavity 51 is heated and condense into a liquid at the condensation end of the first cavity 51. Wherein the first wall 511 is a condensing end far away from the heat source, and the second wall 512 is an evaporating end near the heat source. The heat dissipation principle of the first heat sink member 5a is: when the heat generated by the heat source is conducted to the second wall 512 (evaporation end) of the first cavity 51 through the heat conductive package 4, the first working medium 53 (specifically, cooling liquid) in the first cavity 51 is heated and rapidly vaporized to form steam, the steam flows to the first wall 511 (condensation end) of the first cavity 51 under the power of heat diffusion, and is condensed into liquid at the condensation end of the first cavity 51 to release heat, and the released heat is conducted out through the first portion 11 to achieve the effect of heat dissipation and temperature reduction, thereby ensuring the relatively low temperature state of the condensation end of the first cavity 51. As the cooling liquid at the evaporation end of the first cavity 51 is heated and evaporated less and less, and at this time, the condensation end of the first cavity 51 condenses and collects more and more cooling liquid, due to capillary action, the cooling liquid at the condensation end of the first cavity 51 flows back to the evaporation end of the first cavity 51. Due to the capillary phenomenon of the first capillary structure 52, no matter how the packaged device 200 is placed, for example, the first portion 11 is above and the second portion 12 is below, it can be ensured that the cooling liquid at the condensation end of the first cavity 51 can rapidly flow back to the evaporation end of the first cavity 51.

It can be understood that the first heat dissipation component 5a may be disposed to penetrate through the circuit board 2 according to the layout position of the actual heat source, or the first heat dissipation component 5a may be connected to the second portion 12, so as to achieve timely and rapid heat dissipation of the heat source at different positions.

Compared with the foregoing embodiment, in the package device 200 of the present embodiment, the first heat dissipation component 5a is configured to have the above-mentioned gas-liquid two-phase structure, and the heat conductivity of the two-phase structure is high, so that the heat conduction from the inside of the package body 4 in the package device 200 can be enhanced, especially the heat from the inside of the package device 200 with high heat source density and small package volume can be quickly and timely conducted out, and further, the heat dissipation efficiency is improved. Moreover, the gas-liquid two-phase structure of the first heat sink member 5a has high thermal conductivity, and heat generated by the electronic component 3 (i.e., the heat source) is quickly equalized to the entire first portion 11 and then dissipated through the first portion 11, thereby greatly reducing thermal resistance due to heat accumulation.

Referring to fig. 9, a packaged device 300 according to another embodiment of the present application is different from the packaged device 100 according to the previous embodiment in that: the first part 11a is a two-phase structure, and the first part 11a includes a second cavity 111, and a second capillary structure 112 and a second working medium 113 located in the second cavity 111. The second capillary structure 112 is formed on the inner cavity wall of the second cavity 111, and the second working medium 113 is adsorbed in the second capillary structure 112. The material of the second cavity 111 may be a heat conductive material, and specifically may be a metal (e.g., copper, aluminum, etc.) or a plastic with a heat conductive filler added thereto, where the heat conductive filler may be graphene particles, metal oxide particles, etc. The second working fluid 113 can be a liquid or gaseous refrigerant, for example a coolant.

As shown in fig. 10, in the present embodiment, the second cavity 111 is a substantially hollow rectangular parallelepiped structure, and includes a fourth wall 1111, a fifth wall 1112 disposed opposite to the fourth wall 1111, and a sixth wall 1113 connected to the fourth wall 1111 and the fifth wall 1112 at two ends, wherein the second capillary structure 112 is formed on the fourth wall 1111, the fifth wall 1112, and the sixth wall 1113, and the second capillary structure 112 is formed on the fourth wall 1111, the fifth wall 1112, and the sixth wall 1113. The fourth wall 1111 is a condensing end far away from the heat source, and the fifth wall 1112 is an evaporating end near the heat source. Referring to the heat dissipation principle of the first heat sink member 5a in the package device 200, when the package device 300 is used, the heat dissipation principle of the first portion 11a is as follows: when heat generated by the heat source is transferred to the fifth wall 1112 of the second cavity 111 through the heat-conducting package 4 and the first heat-dissipating component 5, the second working medium 113 located in the second cavity 111 (specifically, adsorbed to the second capillary structure 112) is heated and rapidly vaporized to form steam, the steam flows to the fourth wall 1111 of the second cavity 111 under the power of heat diffusion, and is condensed into liquid at the fourth wall 1111 and releases heat, and the released heat is further transferred to the outside through the fourth wall 1111, so that the heat-dissipating and temperature-reducing effects are achieved, and the relatively low-temperature state of the fourth wall 1111 is ensured. As the cooling liquid in the fifth wall 1112 is heated and evaporated less and less, the cooling liquid in the fourth wall 1111 is condensed and collected more and more, and the cooling liquid in the fourth wall 1111 will flow back to the fifth wall 1112 due to the capillary action of the second capillary structure 112. Due to the capillary phenomenon of the second capillary structure 112, no matter how the packaged device 300 is placed, for example, the first portion 11a is above and the second portion 12 is below, it can be ensured that the cooling liquid at the condensation end of the first cavity 51 can rapidly flow back to the evaporation end of the first cavity 51. It is understood that in other embodiments, the second cavity 111 may have other shapes, such as a cylinder, a trapezoid structure, etc.

Compared with the foregoing embodiment, the package device 300 of the present embodiment, by setting the first portion 11a to the above two-phase structure, and combining the first heat sink 5, can enhance the heat dissipation inside the package body 4 of the package device 300, especially the heat inside the package device 300 with high heat source density and small package volume can be quickly and timely dissipated, thereby improving the heat dissipation efficiency. Moreover, the gas-liquid two-phase structure of the first portion 11a has high thermal conductivity, and heat generated by the electronic component 3 (i.e., the heat source) can be quickly equalized to the whole first portion 11a and then dissipated through the condensation end of the first portion 11a, thereby greatly reducing thermal resistance caused by hot spots.

Referring to fig. 11, a packaged device 400 according to another embodiment of the present application is different from the packaged device 100 according to the previous embodiment in that: the first part 11a and the first heat sink piece 5a are both of a two-phase structure, and the cavities of the first part 11a and the first heat sink piece 5a of the two-phase structure may or may not be communicated. In this embodiment, the cavities of the first portion 11a and the first heat sink 5a are communicated, that is, the first portion 11a and the first heat sink 5a form a third cavity 71, and a third capillary structure 72 and a third working medium 73 are disposed in the third cavity 71. In this embodiment, the first portion 11a and the first heat sink 5a are integrally formed, the third capillary structure 72 is located on the side wall of the third cavity 71, and the third working medium 73 is adsorbed in the third capillary structure 72.

With reference to fig. 11 and 12, the third cavity 71 includes an evaporation end 711 close to the heat source and a condensation end 712 contacting with the outside, the heat generated by the heat source is conducted to the evaporation end 711 of the third cavity 71 through the heat conductive package 4, the third working medium 73 absorbed in the third capillary structure 72 is heated and rapidly vaporized to form steam, the steam flows to the condensation end 712 of the third cavity 71 under the power of thermal diffusion and is condensed into liquid and releases heat, and the released heat is further conducted to the outside through the condensation end 712, so as to achieve the effect of heat dissipation and temperature reduction, thereby ensuring the relatively low temperature state of the condensation end 712. As the cooling liquid at the evaporation end 711 is heated to evaporate less and less, and the condensation end 712 condenses and collects more and more cooling liquid, the cooling liquid at the condensation end 712 flows back to the evaporation end 711 due to the capillary action of the third capillary structure 72.

Compared with the previous embodiment, in the packaged device 400 of the present embodiment, by setting the first portion 11a and the first heat sink 5a to have a two-phase structure, when the first portion 11a and the first heat sink 5a are communicated with each other, the area of the evaporation end 711 of the third cavity 71 formed is increased, the contact area between the cooling liquid circulating in the third cavity 71 and the heat source is increased, and a larger area of heat can be simultaneously taken out, thereby improving the heat dissipation efficiency. Moreover, the gas-liquid two-phase structure of the first heat sink member 5a and the first portion 11a has high thermal conductivity, and heat generated by the electronic component 3 (i.e., the heat source) can be quickly equalized to the evaporation end 711 of the entire third cavity 71 and then dissipated through the condensation end 712, thereby greatly reducing thermal resistance caused by hot spots.

Referring to fig. 13 and 14, a packaged device 500 according to another embodiment of the present application is different from the packaged device 100 (or 200,300,400) according to the previous embodiment in that: at least two faces of the housing 1 are provided with the heat conductive first portions 11 (or 11a), and the positional relationship of the at least two faces provided with the heat conductive first portions 11 (or 11a) may be connected to each other, arranged opposite to each other, or spaced apart from each other. When at least two faces are connected to each other, the first portions 11 (or 11a) positioned thereon may be connected to each other; the first portions 11 (or 11a) located thereon are connected by at least one of the first heat sink members 5(5a) when at least two faces are disposed opposite to each other or spaced apart from each other. The structures of the first portion 11 (or 11a) and the first heat sink 5 (or 5a) are described in detail in the foregoing, and are not described in detail herein.

Referring to fig. 13 and 14, in the present embodiment, three adjacent surfaces of the housing 1 are provided with the first portions 11a capable of conducting heat, each of the first portions 11a is a two-phase structure, the three two-phase first portions 11a are communicated with each other to form a fourth cavity 81, a fourth capillary structure 82 and a fourth working medium 83 are disposed in the fourth cavity 81, and the three first portions 11a can be integrally formed in the forming process. In addition, in the present embodiment, at least one first heat sink member 5a is disposed on at least one first portion 11a, and the first heat sink member 5a and the corresponding first portion 11a are also communicated with each other to form a third cavity 71.

Compared with the foregoing embodiment, the packaging device 500 of the present embodiment can further enhance the conduction of the internal heat of the packaging device 500 by adding the first portion 11(11a) capable of conducting heat to the multiple surfaces of the housing 1, especially adding the first portion 11a of the two-phase heat dissipation component, especially the conduction of the internal heat of the packaging device 500 with high heat source density and small packaging volume, and can quickly and timely conduct the heat of the heat source, thereby improving the heat dissipation efficiency.

Referring to fig. 15, a packaged device 600 according to another embodiment of the present application is different from the packaged device 100 (or 200,300,400,500) according to the previous embodiment in that: the second heat sink piece 6 is a two-phase structure. In this embodiment, the specific structure of the second heat dissipation member 6 is substantially the same as that of the first heat dissipation member 5a, and please refer to the structure of the first heat dissipation member 5a in the previous embodiment for details, which will not be described herein. In this embodiment, the second heat sink member 6 communicates with the first heat sink member 5 a. By adding the second heat dissipation member 6 having a two-phase structure and simultaneously communicating the second heat dissipation member 6 with the first heat dissipation member 5a, the internal empty space of the package 4 is fully utilized, and the heat dissipation efficiency of the package 600 is further enhanced.

The temperature of the packaged device 100' and the packaged device 300 during use is monitored, and the temperature of the heat source at different positions in the packaged device in table 1 is obtained. It is understood that the

heat sources

1, 2, 3, etc. at different locations in table 1 below may be electronic components distributed at different locations within the packaged device.

TABLE 1

Device with a metal layer	Packaging device 100'	Packaged device 300
			Heat source 1	122.2℃	114.4℃
Heat source
	2	123.7℃	112.6℃
Heat source
	3	123.6℃	110.4℃
Heat source
	4	119.2℃	110.7℃
Heat source
	5	110.8℃	108.7℃
Heat source
	6	111.6℃	108.6℃
Heat source 7				111.5℃	108.8℃
	Heat source 8	110℃	105.2℃

As can be seen from table 1, each heat source of the packaged device 300 of the present application has a lower temperature than the packaged device 100 ', and the heat dissipation capability of the packaged device 300 of the present application is improved by more than 30% compared with the packaged device 100'.

According to the packaging device 100 (or 200,300,400,500,600) provided by the application, on the premise of utilizing the original surface area of the packaging device, by adding the first heat dissipation part 5 (or 5a) inside the packaging device 100 (or 200,300,400,500,600), heat inside the packaging body 4 (especially heat at a heat accumulation position) can be quickly conducted to the first part 11(11a), so that quick heat dissipation inside the packaging device 100 (or 200,300,400,500,600) is realized, and the heat dissipation efficiency is improved; the first heat sink member 5 (or 5a) is formed on the first portion 11 (or 11a) to facilitate encapsulation of the packaged device 100 (or 200,300,400,500, 600); moreover, the added first heat sink member 5 (or 5a) makes full use of the internal empty space of the packaged device 100 (or 200,300,400,500,600), which is beneficial to the light, thin and short-sized packaged device 100 (or 200,300,400,500, 600); the first heat sink 5 (or 5a) is disposed on the first portion 11 (or 11a), and has the advantages of simple preparation process, low cost, and convenient mass production. Further, by providing the second heat sink member 6 on the first heat sink member 5 (or 5a), the internal empty space of the package 4 can be fully utilized, the contact area between the heat sink member and the package 4 can be increased, and the heat dissipation effect can be further improved.

Referring to fig. 16, the above-mentioned embodiment of the present application provides a package module 1000, where the package module 1000 includes a package device 100 (or 200,300,400,500,600) and a heat dissipation device 1100, where the heat dissipation device 1100 is disposed on an outer surface of a first portion 11 (or 11a), and with the package device 100 (or 200,300,400,500,600) provided in the embodiment of the present application, a heat dissipation device 1100 is disposed on an outer surface of the first portion 11(11a) to achieve the purpose of efficient heat dissipation, so as to improve the heat dissipation effect of the package module 1000 and facilitate reducing the size of the package module 1000.

In this embodiment, the package device 100 (or 200,300,400,500,600) may be connected to the heat sink 1100 through the heat conducting layer 1200, the heat conducting layer 1200 may be a heat conducting glue, and the heat conducting efficiency may be improved by adding the heat conducting layer 1200 between the package device 100 (or 200,300,400,500,600) and the heat sink 1100. It is understood that the connection between the package device 100 (or 200,300,400,500,600) and the heat sink 1100 may be realized in other manners, such as screws, and a sealing gasket may be added between the package device 100 (or 200,300,400,500,600) and the heat sink 1100 to further improve the heat conduction efficiency.

As shown in fig. 17, an electronic device 2000 applying the above-mentioned package device 100 (or 200,300,400,500,600) or the above-mentioned package module 1000 is further provided in an embodiment of the present application, and includes a housing 2100 and the above-mentioned package device 100 (or 200,300,400,500,600) or the above-mentioned package module 1000 disposed in the housing 2100. The electronic device 2000 shown in fig. 17 is a mobile phone, but is not limited to a mobile phone, and the electronic device 2000 may be any electronic device that needs to be provided with the above-mentioned package device 100 (or 200,300,400,500,600) or the above-mentioned package module 1000.

In the electronic device 2000, the packaging device 100 (or 200,300,400,500,600) can perform a good heat dissipation function, and the problem of poor heat dissipation is not generated under the condition of improving the power consumption of the electronic component 3, so that the service life of the electronic device 2000 is prolonged.

It should be noted that the above is only a specific embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all should be covered by the scope of the present application; in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A packaged device, comprising:

a circuit board;

the electronic component is electrically connected with the circuit board;

the packaging body is used for packaging the circuit board and the electronic component, and the packaging body can conduct heat;

the shell is used for accommodating the circuit board, the electronic component and the packaging body, and at least one surface of the shell is provided with a first part which can conduct heat; and

at least one first heat sink member, each of the first heat sink members is connected to the first portion and is embedded in the package body.

2. The packaged device of claim 1, wherein at least one of said first heat sink members comprises a first cavity and a first capillary structure and a first working substance located within said first cavity.

3. The packaged device of claim 1 or 2, wherein the first portion comprises a second cavity and a second capillary structure and a second working substance located within the second cavity.

4. The packaged device of claim 1, wherein the first portion and the first heat sink member form a third cavity, and a third capillary structure and a third working medium are disposed in the third cavity.

5. The packaged device of claim 1, wherein at least one of said first heat sink members is disposed through said circuit board.

6. Packaged device according to any of claims 1 to 5, wherein at least two faces of the housing have the first portion which is thermally conductive, the at least two faces being connected to each other or being arranged opposite each other or being spaced apart from each other.

7. The packaged device according to claim 6, wherein when the at least two surfaces are connected to each other, the first portions on the at least two surfaces form a fourth cavity, and a fourth capillary structure and a fourth substance are disposed in the fourth cavity; or

When the at least two surfaces are oppositely arranged or spaced, the first parts on any two surfaces are connected through at least one first heat dissipation part.

8. Packaged device according to claim 1 or 2, wherein at least one of the first heat sink members is provided with at least one second heat sink member on a surface thereof, at least one of the second heat sink members extending inside the package.

9. The packaged device of claim 8, wherein at least one of said second heat sink members extends toward said electronic component.

10. A packaged module comprising a packaged device according to any of claims 1 to 9 and heat dissipation means located on an outer surface of said first portion.

11. An electronic device comprising a packaged device according to any of claims 1 to 9, or comprising a packaged module according to claim 10.