CN102290389A - Semiconductor packaging component with cooling fan and stacking structure thereof - Google Patents
Semiconductor packaging component with cooling fan and stacking structure thereof Download PDFInfo
- Publication number
- CN102290389A CN102290389A CN2010102073189A CN201010207318A CN102290389A CN 102290389 A CN102290389 A CN 102290389A CN 2010102073189 A CN2010102073189 A CN 2010102073189A CN 201010207318 A CN201010207318 A CN 201010207318A CN 102290389 A CN102290389 A CN 102290389A
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- substrate
- semiconductor package
- fan
- package part
- radiator fan
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The invention discloses a semiconductor packaging component with a cooling fan and a manufacturing method and a stacking structure thereof. The semiconductor packaging component with the cooling fan comprises a substrate, an electronic element, a packaging rubber body and a fan unit, wherein the substrate is provided with a first surface and a second surface, the first surface is provided with a fan arrangement area, the fan arrangement area of the substrate is provided with an open hole and a ventilation hole penetrating through the substrate; the electronic element is arranged on the first surface and around the fan arrangement area and is electrically connected with the substrate; the packaging rubber body is formed on the electronic element and the first surface of the substrate and is provided with a packaging rubber body opening for the exposure of the fan arrangement area; and the fan unit is arranged in the packaging rubber body opening and is electrically connected with the substrate. Since the electronic element is arranged on the part of the substrate outside the fan arrangement area, when the fan unit operates normally, heat produced by the electronic element can be effectively dissipated and can be prevented from being damaged as a result of overheating, and the overall height of the fan unit can be reduced.
Description
Technical field
The present invention relates to a kind of semiconductor package part and method for making thereof, particularly relate to a kind of semiconductor package part and method for making thereof of tool radiator fan.
Background technology
Circuit board as mainboard (Main Board or Mother Board) is provided with a plurality of electronic component as CPU or drafting card (Electronic Components) and the electrical circuit (Conductive Circuits) in order to electrically connect this electronic component, described electronic component can produce heat doing the time spent, if the heat that is produced is not got rid of in the electronic product that is equiped with circuit board, then electronic component can lose efficacy because of overheated; This kind problem is even more important at the electronic product that functional requirement increases day by day and processing speed is fast more, because of the electronic component integrated on the lifting of function and the processing speed meaning circuit board or electronic installation need more or high-order more, electronic component more or more high-order or electronic installation promptly can produce many more heats.So with effectively diffusing the removing of heat that circuit board produced is the design an of necessity.
One of dissipation heat mode that general industry is adopted, be on mainboard or motherboard, to add the heat that radiator fan is produced with runaway electron element and/or electronic installation, this kind radiator fan has seen as the 6th, 799, and 282,7,215,548,7,286,357 and 7, wait in the United States Patent (USP) for 568, No. 517.
For example, the existing radiator fan shown in Figure 1A is to be installed on the predeterminated position of circuit board, mainly is made of printed circuit board (PCB) 11, housing 12 and impeller 13.This housing 12 has base 120, pipe spreader 122 and is located on stator pack 121 on this pipe spreader 122; 13 of this impellers have wheel hub 130, be located at magnet 131 on these wheel hub 130 inboards, be located on a plurality of blades 132 in these wheel hub 130 outsides and be coupling to this wheel hub 130 to be located in the jack-post 133 in this pipe spreader 122; Then be provided with at least one control chip 110 and a plurality of passive device 112 on this printed circuit board (PCB) 11, this printed circuit board (PCB) 11 is to be arranged on the base 120 of this housing 12, with rotation, with rotating drive air-flow by this impeller 13 by these control chip 110 control impellers 13.
The employed control chip 110 of existing radiator fan shown in Figure 1A is a pyrotoxin, and if the heat of generation is can't dissipation, also can cause the overheated of itself and loses efficacy, in case this control chip 110 lost efficacy then uncontrollable this impeller 13; So, can make the heat that electronic component produces on the mainboard of electronic product can't effectively dissipation, thereby cause electronic product to work as machine, even damage.And this control chip 110 just is the gap between the wheel hub 130 of the base 120 of this housing 12 and this impeller 13, the narrow and small heat that this control chip 110 is produced in this gap can't effectively escape and remove, and causes and can be because of the overheated damage that causes this control chip 110.Radiator fan is inexpensive relatively in the parts of electronic product, but it promptly can undermine the mainboard of the core component of electronic product high price, so its importance is not can weigh from its price can't move the time.
In addition, the gap length that the wheel hub 130 that being provided with of control chip 110 can have influence on impeller 13 and the base of housing 12 are 120, tending to needs to increase the height in this gap because of the thickness of control chip 110, and is unfavorable for the reduction of the whole height of radiator fan.And the area that can make this printed circuit board (PCB) 11 need to use that is provided with of control chip 110 increases, under the situation that is increased in the sectional area that does not increase existing radiator fan of printed circuit board (PCB) 11 areas, then need reduce the area of blade 132, but the reduction of the area of blade 132 can have influence on the output of air quantity, and if the output of air quantity is the not enough heat radiation function desiring to reach of then can having influence on.
For addressing the above problem, the 7th, 345, No. 884 United States Patent (USP) promptly proposes a kind of improved radiator fan.Shown in Figure 1B, the 7th, 345, the structure of the radiator fan of No. 884 United States Patent (USP)s roughly is same as aforementioned prior art, difference is that its printed circuit board (PCB) 11 ' is formed with an outward extending extension 11a, be provided with on it for control chip 110 ', so that this control chip 110 ' is positioned at outside the gap between the wheel hub 130 ' of the base 120 ' of housing 12 ' and impeller 13 ' or part exposes outside this gap, thereby the heat ease that the air-flow that makes this impeller 13 ' drive is able to this control chip 110 ' is produced is removed.
But the air-flow that the formation of above-mentioned printed circuit board (PCB) 11 ' the outward extending extension 11a can make impeller 13 ' be driven when rotating is interfered, and air-flow is disturbed promptly can to produce noise, and then influence is to the using character of the electronic product that is equiped with radiator fan.Simultaneously, because of this extension 11a for stretching out, making between blade 132 ' and control chip 110 ' needs to keep a predetermined interval, this also is unfavorable for the reduction of the whole height of existing radiator fan, and can't satisfy the demand of electronic product thinning.
Again and, aforesaid existing radiator fan still needs printed circuit board (PCB) 11 ' is arranged between the base 120 ' of the wheel hub 130 ' of impeller 13 ' and housing 12 ', cause the thickness of printed circuit board (PCB) 11 ' still can influence the whole height of radiator fan, and thinning radiator fan further.
Summary of the invention
In view of this, purpose of the present invention promptly is to provide a kind of semiconductor package part and method for making thereof of tool radiator fan, can effectively reduce the integral thickness of radiator fan.
Another object of the present invention is to provide a kind of stacked structure of semiconductor package part of tool radiator fan, can provide bigger air quantity, enhance heat usefulness.
For achieving the above object, the invention provides a kind of semiconductor package part of tool radiator fan, comprise: have first and second surperficial substrate, this first surface has the fan rest area, and the fan rest area place of this substrate is formed with perforate and the ventilation hole that runs through this substrate; Be located on the first surface around this fan rest area and electrically connect the electronic component of this substrate; Be formed at the packing colloid on the first surface of this electronic component and substrate, and this packing colloid has the packing colloid opening that exposes outside this fan rest area; And be located in this packing colloid opening and electrically connect the fan unit of this substrate.
For obtaining the aforesaid semiconductor packaging part, the invention provides a kind of method for making of semiconductor package part of tool radiator fan, comprising: provide one to have first and second surperficial substrate, and this first surface has the fan rest area; Form perforate and the ventilation hole that runs through this substrate at this fan rest area; On the first surface around this fan rest area, electronic component is set, and makes this electronic component electrically connect this substrate; Form packing colloid on the first surface of this substrate, coating this electronic component, and this packing colloid has the packing colloid opening that exposes outside this fan rest area; And fan unit is located in this packing colloid opening, and make this fan unit electrically connect this substrate.
In aforementioned method for making and semiconductor package part, this fan unit comprises on the first surface that is positioned at this substrate and is coupling to the impeller of this perforate freely and connects the stator pack as coil of putting and being electrically connected on this substrate with rotatable; This impeller has wheel hub, be located at the magnet of this wheel hub inboard, be located at a plurality of blades in this wheel hub outside and be coupling to the jack-post of this wheel hub, and this stator pack is located on this jack-post outside.
This fan unit also can be the blower module of other pattern, and be not limited to said structure, the difference part of fan unit of the present invention and existing radiator fan is directly electrically not to be provided with in the fan unit electronic component, but required electronic component is integrated on the base plate for packaging that is combined with this fan unit, thereby by the control chip in this electronic component through the stator pack of this substrate transfer control signal, to control the running of this fan unit to this fan unit.
In another example, this electronic component can also comprise functional chip, is located on this substrate and is embedded in this packing colloid, and in view of the above, this semiconductor package part with functional chip also has the active heat removal performance except being the known packaging part of industry.In addition, in preferred embodiment, be formed with cooling pad on first and second surface of this substrate; And run through this substrate and connect the thermal column of this two cooling pad, and this functional chip is located on the cooling pad of this substrate first surface, and the heat transferred that functional chip is produced by cooling pad and thermal column is put the flow channel of substrate below thus.
In another example, the substrate of this semiconductor package part also can have tooling hole, and it is outside and run through first and second surface of this substrate to be located at packing colloid; Perhaps, this substrate and packing colloid also can have the tooling hole of connection, run through first and second surface of this packing colloid and substrate.
Again, if desire to make semiconductor package part of the present invention with as other electric devices of mainboard or another packaging part electrically connect, this substrate can also be equipped with one and conduct electricity Connection Element.
The electronic component that comprises control chip and passive device owing to these are a plurality of is to be located on the outer substrate of fan rest area, when semiconductor package part of the present invention connects when placing on mainboard or other electronic components, under fan unit runs well, as the heat that electronic component produced of control chip or this semiconductor package part below can be by the effective dissipation of flow channel below the substrate of this semiconductor package part unlikely generation because of overheated and impaired problem.And this electronic component as control chip be to be located on the fan rest area substrate outward of this semiconductor package part, can not interfere blade area to impeller, so make the blade area of impeller that bigger stretching, extension nargin be arranged in certain spatial dimension, and then can increase the output of air quantity.Simultaneously, because of need not to use housing, so electronic component need be located between the wheel hub of the base of housing and impeller, and can reduce the integral thickness of fan unit, thereby can meet the demand in the electronic product thinning.Again and, control chip is located at the precalculated position on the substrate, can not interfere with the air-flow that fan unit is produced under operate condition, so also there is not the problem that produces noise or vibrations.
In another example, the present invention also provides a kind of semiconductor package part stacked structure of tool radiator fan, comprising: the semiconductor package part of tool radiator fan of the present invention; The bottom electric device comprises bearing part and is located at electronic component on this bearing part; And conduction is followed material, be located between this semiconductor package part and this bottom electric device, and the substrate of this semiconductor package part connects and places this conduction to follow on the material, constitute a flow channel between this semiconductor package part and this bottom electric device to make, thus the hot gas that this fan unit is produced by this bottom electric device of flow channel dissipation.
In another example, the present invention also provides the semiconductor package part of the tool radiator fan that a kind of confession splices other electric devices, comprise: substrate, has first and second surface, this first surface has the fan rest area, and the fan rest area place of this substrate is formed with perforate and the ventilation hole that runs through this substrate; Electronic component is located on this fan rest area first surface on every side, and is electrically connected this substrate; Packing colloid is formed on the first surface of this electronic component and substrate, and has the packing colloid opening that exposes outside this fan rest area; Conductive pole is located on the first surface around this fan rest area and is run through this packing colloid, and this conductive pole electrically connects this substrate; And fan unit, be located in this packing colloid opening, and this fan unit electrically connects this substrate.In addition, the splice semiconductor package part of tool radiator fan of other electric devices of this confession can comprise that also the conduction of being located on this conductive pole follows material, splices in this conduction then on the material for other electric devices; Perhaps this conduction then material be located on the second surface of this substrate, to splice in other electric devices by it.So, then can make a plurality of semiconductor packages have heat radiation function by a fan unit.Perhaps, the splice semiconductor package part of tool radiator fan of other electric devices of a plurality of these confessions of can splicing is to provide bigger air quantity, enhance heat usefulness.
Description of drawings
Figure 1A is for showing the cutaway view of existing radiator fan;
Figure 1B is for showing the radiator fan cutaway view of the 7th, 345, No. 884 United States Patent (USP)s;
Fig. 2 A to Fig. 2 F ' is the cutaway view of the method for making of the semiconductor package part of tool radiator fan of the present invention, wherein, Fig. 2 A ' is the local top view of the substrate of Fig. 2 A, Fig. 2 E ' and Fig. 2 E " be cutaway view with semiconductor package part of tooling hole, Fig. 2 F and Fig. 2 F ' they are the cutaway view that is equipped with the semiconductor package part of conduction Connection Element;
Fig. 3 A and Fig. 3 B are for showing the schematic diagram of the semiconductor package part that comprises functional chip, and wherein, Fig. 3 B is for showing along the cutaway view of the dotted line 3B-3B of Fig. 3 A;
Fig. 4 A to Fig. 4 C is the cutaway view of the semiconductor package part stacked structure of demonstration tool radiator fan of the present invention, and wherein, Fig. 4 A is for showing that bearing part is the embodiment of mainboard; Fig. 4 B and Fig. 4 B ' embodiment for showing that this bottom electric device is a ball grid array (BGA) semiconductor package; And Fig. 4 C insulate material and runs through the conductive pole of this insulation material for showing that this bottom electric device also comprises;
Fig. 5 A is for showing the splice cutaway view of semiconductor package part of tool radiator fan of other electric devices of confession of the present invention;
Fig. 5 B and Fig. 5 C are for showing the method schematic diagram of the conductive pole that forms the semiconductor package part shown in Fig. 5 A.
The main element symbol description
11,11 ' printed circuit board (PCB)
The 11a extension
110,110 ', 21a control chip
112,21b passive device
12,12 ' housing
120,120 ' base
121,231 stator pack
122,232 pipe spreaders
13,13 ', 230 impellers
130,130 ', 2300 wheel hubs
131,2301 magnet
132,132 ', 2302 blades
133,2303 jack-posts
2,5 semiconductor package parts
20 substrates
The 20a first surface
The 20b second surface
200 perforates
201 ventilation holes
21 electronic components
22 packing colloids
23 fan units
221 packing colloid openings
The 21c functional chip
25 tooling holes
26,26 ' conduction Connection Element
27 cooling pads
28 thermal columns
3 semiconductor package part stacked structures
31 conductions are material then
4,6 bottom electric devices
41 bearing parts
43 electronic components
44 insulation materials
45 conductive poles
46 bonding wires
47,47 ' soldered ball
48 perforates
K fan rest area
S cuts imaginary line
The W flow channel
Embodiment
Below describe technology contents of the present invention and execution mode in detail by particular specific embodiment, those skilled in the art can understand advantage of the present invention and effect easily by the content that this specification disclosed.The present invention also can be implemented or be used by other different specific embodiment, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
Notice, the structure that accompanying drawing in this specification illustrated, ratio, size etc., all only in order to cooperate the content that specification disclosed, understand and reading for those skilled in the art, be not in order to limit the enforceable qualifications of the present invention, event is the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not influencing under effect that the present invention can produce and the purpose that can reach, all should still drop in the scope that disclosed technology contents may contain.Simultaneously, that is quoted in this specification reaches terms such as " bottoms " as " upper and lower ", " inside and outside ", " forward and backward ", " one ", also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under no essence change technology contents, when also being considered as the enforceable scope of the present invention.
First specific embodiment
See also Fig. 2 A to Fig. 2 E, be the cutaway view of the method for making of the semiconductor package part of tool radiator fan of the present invention.
Shown in Fig. 2 A, at first, provide a substrate 20 with first surface 20a and second surface 20b, and the first surface 20a of this substrate 20 has fan rest area K; Then, on this fan rest area K, form perforate 200 and the ventilation hole 201 that runs through substrate 20.Shown in Fig. 2 A ', in the present embodiment, be by four ventilation holes 201 around this perforate 200.Certainly, the present invention does not limit the quantity and the shape of ventilation hole, can only have two or more ventilation holes, and ventilation hole can be as honeycomb also.
Shown in Fig. 2 B, on the first surface 20a around this fan rest area K, a plurality of electronic components 21 are set, and make this electronic component 21 electrically connect this substrate 20; This electronic component 21 comprises that at least control chip 21a reaches the passive device 21b as resistance and electric capacity, and this control chip 21a controls signal to this substrate 20 in order to transmission.
The example of described electronic component 21 also comprises South Bridge chip, north bridge chips or other as the functional chip of drawing chip, display chip etc., because it can be suitable for for prior art, other does not give unnecessary details for literary composition at this.
Shown in Fig. 2 C, forming packing colloid 22 goes up to coat this electronic component 21 in the first surface 20a of this electronic component 21 with substrate 20, and this packing colloid 22 has the packing colloid opening 221 that exposes outside this fan rest area K, in addition exposed portions serve first surface 20a, perforate 200 and ventilation hole 201.
Shown in Fig. 2 D, fan unit 23 is located in this packing colloid opening 221, and make this fan unit 23 electrically connect this substrate 20, control signal to this substrate 20 for this control chip 21a transmission and reach this fan unit 23 again, to control the running of this fan unit 23; This fan unit 23 is to unload or mode that non-group is unloaded combines with this substrate 20 organizing.
In the present embodiment, described fan unit 23 comprises that the first surface 20a that is positioned at this substrate 20 goes up and is coupling to the impeller 230 of this perforate 200 freely and connects stator pack 231 on the first surface 20a that puts and be electrically connected to this substrate 20 with rotatable.
At length, impeller 230 has wheel hub 2300, be located at the magnet 2301 of these wheel hub 2300 inboards, be located at a plurality of blades 2302 in these wheel hub 2300 outsides and be coupling to the jack-post 2303 of this wheel hub 2300, and this stator pack 231 is located on this jack-post 2303 outsides.The magnetic repulsion effect takes place in the magnetic field that is produced by this magnet 2301 and stator pack 231, to drive the rotation of this impeller 230, because impeller 230 is identical with the drive principle of prior art, so repeat no more.
Preferably, this fan unit 23 also comprises the pipe spreader of being located in this perforate 200 232, is coupling to this pipe spreader 232 in rotatable mode freely to make this jack-post 2303.
Then, shown in Fig. 2 E, cut this packing colloid 22 along cutting imaginary line S (shown in Fig. 2 D), to obtain semiconductor package part 2.
In another embodiment shown in Fig. 2 E ', this packing colloid 22 is not covered with the area beyond the fan rest area K on this substrate 20, but make these substrate 20 vacating spaces and be provided with tooling hole 25, semiconductor package part 2 of the present invention is fixed in other electric devices by this tooling hole 25, for example mainboard or another semiconductor package part of the present invention, or or even other semiconductor package parts, and aforementioned tools hole 25 is that to be located at packing colloid 22 outside and run through the first surface 20a and the second surface 20b of this substrate 20, for spiral shell if fix semiconductor package part 2 of the present invention.Certainly, in the present embodiment, when cutting single job, then only need cutting substrate 20 to get final product.
In addition, as Fig. 2 E " shown in another embodiment; after semiconductor package part 2 of the present invention also can be included in and form this packing colloid 22; on this substrate 20, form and run through the first surface 20a of this packing colloid 22 and substrate 20 and the tooling hole 25 of second surface 20b, semiconductor package part 2 of the present invention is fixed in other electric devices by this tooling hole 25.
In another embodiment shown in Fig. 2 F and Fig. 2 F ', this substrate 20 also is equipped with just like the conduction Connection Element 26 of winding displacement or the conduction Connection Element 26 ' of soldered ball, to electrically connect by this conduction Connection Element and other electric devices.
As from the foregoing, the method for making of the semiconductor package part of tool radiator fan of the present invention, mainly be with this fan unit 23 and the electronic component 21 of controlling this fan unit 23 in conjunction with and be integrated into this substrate 20, the electronic component 21 that is about to control these fan unit 23 runnings is integrated on this substrate 20 but not is located in the structure of this fan unit 23, with the existing blower module of effective solution existing problem in running and design.
Particularly, should as electronic component 21 of control chip 21a be not to be located in the gap between wheel hub and the housing as prior art, the heat that control chip produced effectively can't be escaped and remove, and cause chip overheating impaired.Relatively; the present invention utilizes semiconductor packaging; to be located at outside the fan rest area K as the electronic component 21 of control chip 21a; and with packing colloid 22 protections; and when semiconductor package part 2 of the present invention is located on other electronic components or during circuit board, the heat dissipation that the flow channel of substrate 20 belows that fan unit 23 can be by semiconductor package part 2 produces electronic component.
Again and, the present invention utilize semiconductor packaging with electronic component 21 and fan unit 23 Horizontal Integrations on substrate 20, do not need as described above prior art to use housing, can not only reduce the space, and help the reduction of the whole height of this fan unit, and can meet the demand of thin littleization of electronic product.
Moreover, this electronic component 21 is positioned on the outer substrate 20 of this fan rest area K, can make that the area of this blade 2302 is unlikely to be subjected to the influence of this electronic component 21 and can effectively to increase, the area of this blade 2302 can enlarge this fan rest area K scope on demand and give increase, helps the lifting of air quantity and radiating efficiency.
The present invention also provides a kind of semiconductor package part of tool radiator fan, comprise: substrate 20, have first and second surperficial 20a, 20b, this first surface 20a has fan rest area K, and the fan rest area K place of this substrate 20 is formed into perforate 200 and the ventilation hole 201 that runs through this substrate 20; Electronic component 21 is located on this fan rest area K first surface 20a on every side, and is electrically connected this substrate 20; Packing colloid 22 is formed on the first surface 20a of this electronic component 21 and substrate 20, and has exposed portions serve first surface 20a beyond the packing colloid opening 221 that exposes outside this fan rest area K, perforate 200 and ventilation hole 201; And fan unit 23, be located in this packing colloid opening 221, and this fan unit 23 electrically connects this substrate 20.
Described ventilation hole 201 is positioned at around this perforate 200, and certainly, the present invention does not limit the quantity and the shape of ventilation hole, can only have two or more ventilation holes, and ventilation hole can be as honeycomb also.Described electronic component 21 comprises control chip 21a and passive device 21b at least, and this control chip 21a controls signal to this substrate 20 and fan unit 23 in order to transmission, to control the running of this fan unit 23; Described fan unit 23 is to unload or mode that non-group is unloaded combines with this substrate 20 organizing.
Detailed it, fan unit 23 comprises that the first surface 20a that is positioned at this substrate 20 goes up and is coupling to the impeller 230 of this perforate 200 freely and connects the stator pack 231 of putting and being electrically connected on this substrate 20 with rotatable.This impeller 230 has wheel hub 2300, be located at the magnet 2301 of these wheel hub 2300 inboards, be located at a plurality of blades 2302 in these wheel hub 2300 outsides and be coupling to the jack-post 2303 of this wheel hub 2300, and this stator pack 231 is located on this jack-post 2303 outsides.In addition, this fan unit 23 also can comprise pipe spreader 232, is located in this perforate 200, to make this jack-post 2303 rotatable being coupling freely to this pipe spreader 232.
In another embodiment shown in Fig. 2 E ', this packing colloid 22 is not covered with the area beyond the fan rest area K on this substrate 20, but make these substrate 20 vacating spaces and be provided with tooling hole 25, semiconductor package part 2 of the present invention is fixed in other electric devices by this tooling hole 25, for example mainboard or another semiconductor package part of the present invention, or or even other semiconductor package parts, and aforementioned tools hole 25 is that to be located at packing colloid 22 outside and run through the first surface 20a and the second surface 20b of this substrate 20, for spiral shell if fix semiconductor package part 2 of the present invention.
In addition, as Fig. 2 E " shown in another embodiment; this substrate 20 and packing colloid 22 also have the tooling hole 25 of connection; it runs through the first surface 20a and the second surface 20b of this packing colloid 22 and substrate 20, by this tooling hole 25 semiconductor package part 2 of the present invention is fixed in other electric devices.
In another embodiment shown in Fig. 2 F and Fig. 2 F ', this substrate 20 also is equipped with just like the conduction Connection Element 26 of winding displacement or the conduction Connection Element 26 ' of soldered ball, to electrically connect by this conduction Connection Element and other electric devices, when using soldered ball, also can save conventional fixed modes such as clamping or locking, be set up on the heater element with the SMT technology of consistentization semiconductor package part with the tool radiator fan as the conduction Connection Element.
Second specific embodiment
In the method for making of the semiconductor package part of another tool radiator fan of the present invention, shown in Fig. 3 A and Fig. 3 B, on the first surface 20a around this fan rest area K electronic component 21 is set, also comprises functional chip 21c, be located on this substrate 20 and after forming packing colloid 22 and be embedded in it.In addition, in this preferred embodiment, be formed with cooling pad 27 on this substrate 20 first surface 20a and the second surface 20b; And run through this substrate 20 and connect the thermal column 28 of this two cooling pad 27, and this functional chip 21c is located on the cooling pad 27 of this substrate 20 first surface 20a.In addition, also can connect the conduction Connection Element of establishing as soldered ball 26 ' on the cooling pad 27 under this second surface 20b, thermal energy transfer is electrically connected to substrate 20 belows and/or with other electric devices by this conduction Connection Element 26 '.
The 3rd specific embodiment
Shown in Fig. 4 A to Fig. 4 C, be the structure of hookup 2E, the present invention also provides a kind of semiconductor package part stacked structure 3 of tool radiator fan, comprising: as the semiconductor package part 2 of tool radiator fan of the present invention; Bottom electric device 4 comprises bearing part 41 and is located at electronic component 43 on this bearing part 41; And follow material 31 as the conduction of soldered ball, be located between this semiconductor package part 2 and this bottom electric device 4, and the substrate 20 of this semiconductor package part 2 connects and places this conduction to follow on the material 31, constitute a flow channel W between this semiconductor package part 2 and this bottom electric device 4 to make, thus the hot gas that this fan unit 23 is produced by flow channel W dissipation bottom electric device 4.
Shown in Fig. 4 A, electric device 4 included bearing parts 41 in aforementioned bottom can be mainboard, and this electronic component 43 is the electronic component of being located on this mainboard through encapsulation, thus the heat of these electronic component 43 generations of dissipation.
Shown in Fig. 4 B, this bottom electric device 4 can be ball grid array (BGA) semiconductor package, be with, this bearing part 41 is a substrate, and this electronic component 43 electrically connects this substrate by bonding wire 46, and this bottom electric device 4 also comprises the insulation material 44 that is formed on this substrate and coats this electronic component 43 again.
Shown in Fig. 4 B ', this bottom electric device 4 can be the ball grid array (BGA) semiconductor package of crystal covering type, be with, this bearing part 41 is a substrate, and this electronic component 43 electrically connects these substrates by soldered ball 47.Shown in Fig. 4 B and Fig. 4 B ', these bearing part 41 bottom surfaces also can connect and be equipped with a plurality of soldered balls 47 '.
In another example shown in Fig. 4 C, be different from shown in Fig. 4 B and Fig. 4 B ', this bottom electric device 4 of aforesaid semiconductor packaging part stacked structure 3 also comprises the conductive pole 45 that is formed on this bearing part 41; And be formed on this bearing part 41 and coat the insulation material 44 of this electronic component 43 and this conductive pole 45, wherein, this conduction then material 31 is located on this conductive pole 45 that runs through this insulation material 44.The bottom electric device 4 that Fig. 4 C is illustrated not is to establish mode in order to the group of limiting element, in other words, should can be located on the bearing part 41 as base plate for packaging or lead frame by covering crystalline substance or other modes as the electronic component 43 of chip yet.
The 4th specific embodiment
Shown in Fig. 5 A, the present invention also provides the semiconductor package part 5 of the tool radiator fan that a kind of confession splices other electric devices, comprise: substrate 20, has first and second surperficial 20a, 20b, this first surface 20a has fan rest area K, and the fan rest area K place of this substrate 20 is formed into perforate 200 and the ventilation hole 201 that runs through this substrate 20; Electronic component 21 is located on this fan rest area K first surface 20a on every side, and is electrically connected this substrate 20; Packing colloid 22 is formed on the first surface 20a of this electronic component 21 and substrate 20, and has exposed portions serve first surface 20a beyond the packing colloid opening 221 that exposes outside this fan rest area K, perforate 200 and ventilation hole 201; Conductive pole 45 is located at first surface 20a around this fan rest area K and goes up and run through this packing colloid 22, and this conductive pole 45 electrically connects these substrates 20; And fan unit 23, be located in this packing colloid opening 221, and this fan unit 23 electrically connects this substrate 20.
In addition, the splice semiconductor package part 5 of tool radiator fan of other electric devices of aforementioned confession also can comprise as the conduction of soldered ball and follows material 31, is located on this conductive pole 45, splices in this conduction then on the material 31 for other electric devices; Perhaps, this conduction then material 31 is located on the second surface 20b of this substrate 20, splices in other electric devices to make aforesaid semiconductor packaging part 5 by it.In this specific embodiment,, make that semiconductor package part 5 tops and the lower position for the tool radiator fan of other electric devices that splice all can pile up and electrically connect other electric devices by the setting of conductive pole 45.Shown in Fig. 5 A, this confession is spliced and can be piled up another semiconductor package part 5 on the semiconductor package part 5 of tool radiator fan of other electric devices, and bottom electric device 6 that can splice under it, for example, be located at electronic component or other semiconductor package parts on the mainboard, as ball grid array (BGA) semiconductor package etc.
Moreover, in the 4th specific embodiment of the present invention, can as first and second specific embodiment, make the splice semiconductor package part 5 of tool radiator fan of other electric devices of this confession.Particularly, shown in Fig. 2 A ', can be around this perforate 200 by four ventilation holes 201.Certainly, present embodiment does not limit the quantity and the shape of ventilation hole, can only have two or more ventilation holes, and ventilation hole can be as honeycomb also.
Shown in Fig. 2 B, on the first surface 20a around this fan rest area K, a plurality of electronic components 21 are set, and make this electronic component 21 electrically connect this substrate 20; This electronic component 21 comprises that at least control chip 21a reaches the passive device 21b as resistance and electric capacity, and this control chip 21a controls signal to this substrate 20 in order to transmission.
The example of described electronic component 21 also comprises South Bridge chip, north bridge chips or other as the functional chip of drawing chip, display chip etc., because it can be suitable for for prior art, other does not give unnecessary details for literary composition at this.
Because the semiconductor package part of present embodiment also has conductive pole 45, therefore, can shown in Fig. 5 B, before or after the step that this electronic component 21 is set, form the conductive pole 45 that electrically connects this substrate 20.
Shown in Fig. 2 C, forming packing colloid 22 goes up to coat this electronic component 21 and this conductive pole 45 in the first surface 20a of this electronic component 21 with substrate 20, and this packing colloid 22 has the packing colloid opening 221 that exposes outside this fan rest area K, in addition exposed portions serve first surface 20a, perforate 200 and ventilation hole 201.Because this conductive pole 45 shown in Fig. 5 A runs through and exposes outside this packing colloid 22, therefore can be after forming packing colloid 22, again with for example 22 faces of this packing colloid of CMP technology planarization.
Shown in Fig. 5 C, the mode that is different from aforementioned formation conductive pole 45, also can be after forming packing colloid 22, utilize mode on the first surface 20a of substrate 20, to form the perforate 48 that runs through this packing colloid 22, follow in this perforate 48 to form the conductive pole 45 shown in Fig. 5 A as the mode of electroplating as laser beam perforation.
Consult again shown in Fig. 2 D, fan unit 23 is located in this packing colloid opening 221, and make this fan unit 23 electrically connect this substrate 20, control signal to this substrate 20 for this control chip 21a transmission and reach this fan unit 23 again, to control the running of 23 yuan of this fan lists; This fan unit 23 is to unload or mode that non-group is unloaded combines with this substrate 20 organizing.
In the present embodiment, described fan unit 23 comprises that the first surface 20a that is positioned at this substrate 20 goes up and is coupling to the impeller 230 of this perforate 200 freely and connects stator pack 231 on the first surface 20a that puts and be electrically connected to this substrate 20 with rotatable.
At length, impeller 230 has wheel hub 2300, be located at the magnet 2301 of these wheel hub 2300 inboards, be located at a plurality of blades 2302 in these wheel hub 2300 outsides and be coupling to the jack-post 2303 of this wheel hub 2300, and this stator pack 231 is located on this jack-post 2303 outsides.The magnetic repulsion effect takes place in the magnetic field that is produced by this magnet 2301 and stator pack 231, to drive the rotation of this impeller 230, because impeller 230 is identical with the drive principle of prior art, so repeat no more.
Preferably, this fan unit 23 also comprises the pipe spreader of being located in this perforate 200 232, is coupling to this pipe spreader 232 in rotatable mode freely to make this jack-post 2303.
Then, shown in Fig. 2 E, cut this packing colloid 22 along cutting imaginary line S (shown in Fig. 2 D), to obtain semiconductor package part 2.
In another embodiment shown in Fig. 2 E ', this packing colloid 22 is not covered with the area beyond the fan rest area K on this substrate 20, but make these substrate 20 vacating spaces and be provided with tooling hole 25, semiconductor package part 2 of the present invention is fixed in other electric devices by this tooling hole 25, for example mainboard or another semiconductor package part of the present invention, or or even other semiconductor package parts, and that packing colloid 22 is located in aforementioned tools hole 25 is outside and run through the first surface 20a and the second surface 20b of this substrate 20, for spiral shell if fix semiconductor package part 2 of the present invention.Certainly, in the present embodiment, when cutting single job, then only need cutting substrate 20 to get final product.
In addition, as Fig. 2 E " shown in another embodiment; after semiconductor package part 2 of the present invention also can be included in and form this packing colloid 22; on this substrate 20, form and run through the first surface 20a of this packing colloid 22 and substrate 20 and the tooling hole 25 of second surface 20b, semiconductor package part 2 of the present invention is fixed in other electric devices by this tooling hole 25.
In another embodiment shown in Fig. 2 F and Fig. 2 F ', this substrate 20 also is equipped with just like the conduction Connection Element 26 of winding displacement or the conduction Connection Element 26 ' of soldered ball, to electrically connect by this conduction Connection Element and other electric devices.
In addition, also can on the first surface 20a around this fan rest area K, functional chip 21c be set as the mode of second specific embodiment, and in this embodiment, this substrate 20 can be formed with cooling pad 27 on this substrate 20 first surface 20a and second surface 20b shown in Fig. 3 B; And run through this substrate 20 and connect the thermal column 28 of this two cooling pad 27.
In the 4th specific embodiment of the present invention, be in originally with regard to the semiconductor package part of compact tool radiator fan, to form conductive pole 45, to obtain at semiconductor package part upper and lower surface Stackable and electrically connect the active heat-radiating semiconductor packaging part of other electric devices all, promote heat dissipation thus where necessary, and do not influence the electronic product size, in addition, this stacked structure that is provided for the semiconductor package part 5 of the tool radiator fan of other electric devices that splice can not disturb the radiating airflow circulation, so can not cause the generation of noise.
The present invention is integrated in fan unit on the base plate for packaging by semiconductor packaging, and the electronic component of drive fan unit running also is horizontally placed on the outer substrate of fan rest area, reduce the height of fan unit integral body thus, and, also can will comprise this semiconductor package part in the interior effective dissipation of the hot gas that electronic component produced by the flow channel that forms when the semiconductor package part of tool radiator fan of the present invention connects when placing other electronic components or circuit board.In addition; the semiconductor package part of the prepared tool radiator fan of method for making that the present invention proposes; except that protecting the electronic component by packing colloid; because of the electronic component as control chip is to be located on the outer substrate of fan rest area; the air-flow that also unlikely interference fan unit is driven is not so can cause the generation of noise or influence the rotational stability of fan unit.
The foregoing description is in order to illustrative principle of the present invention and effect thereof, but not is used to limit the present invention.Any those skilled in the art all can make amendment to the foregoing description under spirit of the present invention and category.Therefore the scope of the present invention should be foundation with the scope of claims.
Claims (21)
1. the semiconductor package part of a tool radiator fan is characterized in that, comprising:
Substrate has first and second surface, and this first surface has the fan rest area, and the fan rest area place of this substrate is formed with perforate and the ventilation hole that runs through this substrate;
Electronic component is located on this fan rest area first surface on every side, and is electrically connected this substrate;
Packing colloid is formed on the first surface of this electronic component and substrate, and has the packing colloid opening that exposes outside this fan rest area; And
Fan unit be located in this packing colloid opening, and this fan unit electrically connects this substrate.
2. the semiconductor package part of tool radiator fan according to claim 1 is characterized in that: this ventilation hole is positioned at around this perforate.
3. the semiconductor package part of tool radiator fan according to claim 1 is characterized in that: this electronic component comprises control chip and passive device at least.
4. the semiconductor package part of tool radiator fan according to claim 3 is characterized in that: this control chip controls signal to this substrate and fan unit in order to transmission, to control the running of this fan unit.
5. the semiconductor package part of tool radiator fan according to claim 3 is characterized in that: this electronic component also comprises functional chip, is located on this substrate and is embedded in this packing colloid.
6. the semiconductor package part of tool radiator fan according to claim 5 is characterized in that: this substrate is formed with cooling pad on first and second surface; And run through this substrate and connect the thermal column of this two cooling pad, and this functional chip is located on the cooling pad of this substrate first surface.
7. the semiconductor package part of tool radiator fan according to claim 1 is characterized in that: this fan unit comprises on the first surface that is positioned at this substrate and is coupling to the impeller of this perforate freely and connects the stator pack of putting and being electrically connected on this substrate with rotatable.
8. the semiconductor package part of tool radiator fan according to claim 1 is characterized in that: this substrate also is equipped with a conduction Connection Element, to electrically connect by this conduction Connection Element and other electric devices.
9. the semiconductor package part stacked structure of a tool radiator fan is characterized in that, comprising:
The semiconductor package part of tool radiator fan as claimed in claim 1;
The bottom electric device comprises bearing part and is located at electronic component on this bearing part; And
Conduction is material then, be located between this semiconductor package part and this bottom electric device, and the substrate of this semiconductor package part connects and places this conduction to follow on the material.
10. the semiconductor package part stacked structure of tool radiator fan according to claim 9 is characterized in that: this bottom electric device also comprises the insulation material that is formed on this bearing part and coats this electronic component; And be formed on this bearing part and run through the conductive pole of this insulation material, wherein, this conduction then material is located on this conductive pole.
11. the semiconductor package part stacked structure of tool radiator fan according to claim 9 is characterized in that: the bearing part of this bottom electric device is a mainboard, and this electronic component is the electronic component of being located on this mainboard through encapsulation.
12. the semiconductor package part stacked structure of tool radiator fan according to claim 9 is characterized in that: this conduction then material is a soldered ball.
The semiconductor package part of the tool radiator fan of other electric devices is characterized in that 13. a confession is spliced, and comprising:
Substrate has first and second surface, and this first surface has the fan rest area, and the fan rest area place of this substrate is formed with perforate and the ventilation hole that runs through this substrate;
Electronic component is located on this fan rest area first surface on every side, and is electrically connected this substrate;
Packing colloid is formed on the first surface of this electronic component and substrate, and has the packing colloid opening that exposes outside this fan rest area;
Conductive pole is located on the first surface around this fan rest area and is run through this packing colloid, and this conductive pole electrically connects this substrate; And
Fan unit be located in this packing colloid opening, and this fan unit electrically connects this substrate.
The semiconductor package part of the tool radiator fan of other electric devices 14. confession according to claim 13 is spliced is characterized in that: also comprise then material of conduction, be located on this conductive pole, splice for other electric devices and follow on the material in this conduction.
The semiconductor package part of the tool radiator fan of other electric devices 15. confession according to claim 13 is spliced is characterized in that: also comprise then material of conduction, be located on the second surface of this substrate, to splice in other electric devices by it.
The semiconductor package part of the tool radiator fan of other electric devices 16. confession according to claim 13 is spliced, it is characterized in that: this ventilation hole is positioned at around this perforate.
The semiconductor package part of the tool radiator fan of other electric devices 17. confession according to claim 13 is spliced, it is characterized in that: this electronic component comprises control chip and passive device at least.
The semiconductor package part of the tool radiator fan of other electric devices 18. confession according to claim 17 is spliced, it is characterized in that: this electronic component also comprises functional chip, is located on this substrate and is embedded in this packing colloid.
The semiconductor package part of the tool radiator fan of other electric devices 19. confession according to claim 18 is spliced is characterized in that: this substrate is formed with cooling pad on first and second surface; And run through this substrate and connect the thermal column of this two cooling pad, and this functional chip is located on the cooling pad of this substrate first surface.
The semiconductor package part of the tool radiator fan of other electric devices 20. confession according to claim 13 is spliced is characterized in that: this fan unit comprises on the first surface that is positioned at this substrate and is coupling to the impeller of this perforate freely and connects the stator pack of putting and being electrically connected on this substrate with rotatable.
The semiconductor package part of the tool radiator fan of other electric devices 21. confession according to claim 13 is spliced is characterized in that: this substrate also is equipped with a conduction Connection Element, to electrically connect by itself and other electric device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010207318 CN102290389B (en) | 2010-06-18 | 2010-06-18 | Semiconductor packaging component with cooling fan and stacking structure thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010207318 CN102290389B (en) | 2010-06-18 | 2010-06-18 | Semiconductor packaging component with cooling fan and stacking structure thereof |
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| CN102290389A true CN102290389A (en) | 2011-12-21 |
| CN102290389B CN102290389B (en) | 2013-04-10 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104517916A (en) * | 2013-09-26 | 2015-04-15 | 晶致半导体股份有限公司 | Heat dissipation apparatus |
| CN105765481A (en) * | 2013-10-31 | 2016-07-13 | 微软技术许可有限责任公司 | Centrifugal fan with integrated thermal transfer unit |
| CN107690223A (en) * | 2017-08-02 | 2018-02-13 | 常熟东南相互电子有限公司 | The package substrate of high efficiency and heat radiation |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7568517B2 (en) * | 2005-08-05 | 2009-08-04 | Foxconn Technology Co., Ltd. | Thermal module |
| CN101728342A (en) * | 2008-10-24 | 2010-06-09 | 晶致半导体股份有限公司 | Control module structure of heat radiating fan |
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2010
- 2010-06-18 CN CN 201010207318 patent/CN102290389B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7568517B2 (en) * | 2005-08-05 | 2009-08-04 | Foxconn Technology Co., Ltd. | Thermal module |
| CN101728342A (en) * | 2008-10-24 | 2010-06-09 | 晶致半导体股份有限公司 | Control module structure of heat radiating fan |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104517916A (en) * | 2013-09-26 | 2015-04-15 | 晶致半导体股份有限公司 | Heat dissipation apparatus |
| CN104517916B (en) * | 2013-09-26 | 2017-06-23 | 晶致半导体股份有限公司 | Heat abstractor |
| CN105765481A (en) * | 2013-10-31 | 2016-07-13 | 微软技术许可有限责任公司 | Centrifugal fan with integrated thermal transfer unit |
| CN107690223A (en) * | 2017-08-02 | 2018-02-13 | 常熟东南相互电子有限公司 | The package substrate of high efficiency and heat radiation |
| CN107690223B (en) * | 2017-08-02 | 2020-03-31 | 常熟东南相互电子有限公司 | Packaging substrate with efficient heat dissipation |
Also Published As
| Publication number | Publication date |
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| CN102290389B (en) | 2013-04-10 |
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