JP2001244667A - Electronic circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit device of high reliability which can dissipate effectively heat generated from each semiconductor chip while mounting density is improved by mounting semiconductor chips three-dimensionally. SOLUTION: A wiring board 4 is constituted of a radiating board, an insulating layer formed on the board, and a wiring layer formed on the insulating layer. A plurality of semiconductor chips (electronic circuit chips) 5 are mounted by face down bonding on the wiring layer of the wiring board 4. The wiring board 4 between the semiconductor chips 5 is bent, and wiring layers face each other. In order that the wiring board may be connected with a mounting board which is not shown in figure, and portions of the wiring board 4 are bent almost parallel with the mounting board, in such a manner that the wiring layer is connected with the mounting board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device, and more particularly to an electronic circuit device in which an electronic circuit chip having a compact and high-density package form is modularized.

[0002]

2. Description of the Related Art An electronic circuit chip (hereinafter, referred to as a semiconductor chip) having an electronic circuit formed of a semiconductor or the like has an increasing degree of integration of elements, and the wiring connection between chips and with external devices has become complicated. Have been doing. As the degree of integration of elements has increased, the speed of the elements has been increased, and the heat generated per semiconductor chip has been increasing. It is said that the reliability is reduced by half every time the temperature of the semiconductor chip rises by 10 ° C. In order to operate the semiconductor chip at high speed, it is necessary to efficiently dissipate the heat generated from the semiconductor chip to the outside (radiation). It is becoming more important in the performance and reliability of semiconductor devices.

[0003] On the other hand, with the miniaturization of portable equipment, demands for further miniaturization and higher density are increasing. To meet this demand, an electronic circuit device (multi-chip module (MC
M); hereinafter, referred to as a semiconductor module).

However, by mounting a plurality of semiconductor chips, the heat generated from the semiconductor chips is more concentrated, and the above-mentioned problem of heat dissipation is further highlighted.

A semiconductor module according to the above conventional example will be described with reference to the drawings. FIG. 12 is a sectional view of a semiconductor module in a two-dimensional MCM according to a conventional example. The semiconductor chip 5 in which a bump electrode (first bump) 6 made of solder, gold, or the like is connected to a pad electrode (not shown) on the semiconductor chip 5 is placed on the interposer 12 on the surface of the semiconductor chip 5 where the first bump 6 is formed. The side faces the interposer 12 and is flip-chip mounted face down. The gap between the semiconductor chip 5 and the interposer 12 is sealed with a sealing resin 7 made of, for example, epoxy resin. An uneven heat sink 11 is fixed to the back surface of the semiconductor chip 5 on which the first bumps 6 are formed, using an adhesive (not shown) having a high thermal conductivity. Further, in order to mount the semiconductor module having the above structure on a mounting board (not shown), the semiconductor chip 5 of the interposer 12 is mounted.
A second bump 14 made of solder or the like is formed on the back surface of the mounting surface. The second bump 14 is used for the interposer 12.
Is electrically connected to the first bump 6 via a wiring (not shown) formed in the first bump 6.

In the semiconductor module having the above structure, heat generated from the semiconductor chip 5 is transmitted to the heat sink 11 via an adhesive having a high thermal conductivity, and is radiated to an external atmosphere by air cooling or the like. Heat dissipation is ensured. In the above-described semiconductor module, heat dissipation can be improved by the size and shape of the heat sink 11 fixed to the semiconductor chip 5.

Further, a semiconductor module in a two-dimensional MCM as described below is also known. FIG. 13 is a cross-sectional view of a semiconductor module in a two-dimensional MCM according to a conventional example. In the semiconductor module shown in FIG. 13, a heat spreader 1 made of, for example, copper having a high thermal conductivity is used.
The semiconductor chip 5 and the interposer 12 are fixed to the semiconductor chip 5 by, for example, an adhesive having a high thermal conductivity. The wiring (not shown) formed on the semiconductor chip 5 and the interposer 12 is a bonding wire 10 made of, for example, gold.
Are electrically connected. The semiconductor chip 5 and the bonding wires 10 are sealed with a sealing resin 7 made of, for example, an epoxy resin. further,
In order to mount the semiconductor module having the above structure on a mounting board (not shown), the heat spreader 1 of the interposer 12 is used.
A second bump 14 made of solder or the like is formed on a predetermined wiring (not shown) formed on the back surface of the fixing surface with No. 3.

In the semiconductor module having the above structure, the heat generated from the semiconductor chip 5 is transmitted to the heat spreader 13 via an adhesive (not shown), and is radiated to the outside atmosphere by air cooling or the like, thereby radiating heat. Is secured. In the semiconductor module having the above-described structure, the heat dissipation can be improved by changing the size, shape, and the like of the heat spreader 13 fixed to the semiconductor chip 5.

In the semiconductor module of the two-dimensional MCM according to the above-described conventional example, the heat dissipation can be improved by changing the size or shape of the heat sink 11 or the heat spreader 13 fixed to the semiconductor chip 5. But the semiconductor chip 5 only in the two-dimensional direction
Cannot be mounted, and a large mounting area is required, which makes it difficult to respond to the demand for high integration and high density of elements. There is also a problem such as a signal delay due to an increase in the wiring length.

Therefore, in recent years, in consideration of the high speed and high density of the system, the conventional two-dimensional MCM has been replaced with a three-dimensional MC.
M is attracting attention, and various developments are being actively promoted. FIG. 14 is a sectional view of a semiconductor module in a three-dimensional MCM according to a conventional example. In the semiconductor module shown in FIG.
Is defined as a unit structure that is electrically connected via the first bump 6, and the unit structure is defined as an interposer 12.
It is stacked above via a second bump 14 made of solder or the like above. In order to mount the semiconductor module having the above structure on a mounting board (not shown), a third bump 17 made of solder or the like is formed on the back surface of the mounting surface of the semiconductor chip 5 of the lower interposer 12.

In the semiconductor module having the above structure, heat generated from the semiconductor chip 5 is
From the top and sides of the semiconductor chip 5 to the external atmosphere, or to the interposer 12 on which the semiconductor chip 5 is mounted via the first bumps 6, and to the portion of the interposer 12 that is in contact with the external atmosphere. It is structured to radiate heat by being radiated to the outside atmosphere by air cooling or the like.

A semiconductor module in a three-dimensional MCM as described below is also known. FIG. 15 is a cross-sectional view of a semiconductor module in a three-dimensional MCM according to a conventional example. In the semiconductor module shown in FIG. 15, a semiconductor 5 chip is embedded in a mounting substrate, and the embedded semiconductor chip 5 is fixed to a conductor layer 16 made of metal or the like by an adhesive (not shown) having a high thermal conductivity. The conductor layer 16 is connected to the cooling via 15. The periphery of the semiconductor chip 5 is covered with an interlayer insulating film or the like.

In the semiconductor module having the above structure, heat generated from the semiconductor chip 5 is
Is transmitted to the conductor layer 16 fixed to the conductor layer 16, transmitted to the cooling via 15 connected to the conductor layer 16, and radiated to the outside atmosphere by air cooling or the like, thereby radiating heat.

Further, as described above, a semiconductor module in which a semiconductor chip is embedded in a mounting substrate and heat dissipation is taken into consideration is disclosed in, for example, JP-A-6-204399. In the above-described semiconductor module, the wiring board to which the semiconductor chip is connected is connected at its edge to a heat dissipation means (radiation board) made of aluminum or the like, so that heat from the semiconductor chip is transmitted to the wiring board, The heat is transmitted to the heat dissipating means at the edge of the wiring board, and is radiated to the outside atmosphere by air cooling or the like, thereby radiating heat.

In the above-described conventional three-dimensional MCM semiconductor module, from the viewpoint of high integration and high density of elements, a two-dimensional MCM as shown in FIGS.
It can be improved as compared with a semiconductor module in CM.

[0016]

However, in the semiconductor module in the three-dimensional MCM, since a plurality of semiconductor chips are mounted three-dimensionally at a high density, heat generated from the semiconductor chip is higher than in the semiconductor module in the two-dimensional MCM. As the density increases, it becomes necessary to more efficiently dissipate the heat generated from the semiconductor chip.

In the semiconductor module of the three-dimensional MCM shown in FIG. 14, means for dissipating the heat generated from the semiconductor chip 5 from the top and sides of the semiconductor chip 5 to the external atmosphere is provided by the external atmosphere in contact with the interposer 12.
And the surroundings of the second bumps 14 and the like, the natural convection of the external atmosphere is not sufficient, so that the heat radiation effect is not sufficient. Interposer 12 via first bump 6
Means to dissipate heat to the outside atmosphere by transferring heat to
Since the area of the interposer 12 in contact with the external atmosphere is not sufficient, the heat radiation effect is not sufficient. Therefore, it is difficult to efficiently dissipate heat from the semiconductor chip 5 to the outside in consideration of high integration and high density of elements.

Further, in the semiconductor module of the three-dimensional MCM shown in FIG. 15, means for dissipating heat generated from the semiconductor chip 5 through the conductor layer 16 connected to the semiconductor chip 5 in the cooling via 15 is provided. However, since the semiconductor chip 5 is embedded and the periphery of the semiconductor chip 5 is covered with an insulator having a relatively low thermal conductivity, the heat generated by the three-dimensionally integrated elements is high. It is difficult to sufficiently dissipate heat only with small via holes.

Further, in the semiconductor module disclosed in Japanese Patent Laid-Open No. 6-204399, heat from a semiconductor chip is transmitted to a wiring board and transmitted to a heat dissipation means at an edge portion of the wiring board. Although a means for dissipating into the external atmosphere is adopted, as in the above, the semiconductor chip is embedded, and the periphery of the semiconductor chip is covered with an insulator having relatively high thermal conductivity, If the heat transfer to the dissipation means is only by the wiring board,
It is considered that it is difficult to sufficiently dissipate the heat generated by the elements integrated at a high density in three dimensions.

The present invention has been made in view of the above circumstances. Therefore, the present invention improves the mounting density by three-dimensionally mounting a semiconductor chip (electronic circuit chip), and improves the mounting density of each semiconductor chip. It is an object of the present invention to provide a highly reliable electronic circuit device capable of efficiently dissipating heat generated by the electronic circuit device.

[0021]

In order to achieve the above object, an electronic circuit device according to the present invention comprises a heat dissipating substrate, an insulating layer formed on the heat dissipating substrate, and an insulating layer formed on the insulating layer. A wiring board having a wiring layer, and a plurality of electronic circuit chips mounted on the wiring layer, wherein the wiring board at at least one position between the electronic circuit chips is curved, The layers are facing.

In the above electronic circuit device of the present invention, preferably, the electronic circuit chip has a circuit pattern of the electronic circuit chip and a first protruding electrode connected to the circuit pattern. Via the wiring layer. More preferably, the electronic circuit chip is mounted on the wiring layer from the first bump electrode forming surface side.

In the above electronic circuit device of the present invention, preferably, the wiring board has a plurality of curved portions and a plurality of portions facing the wiring layer.

In the above electronic circuit device of the present invention, preferably, in the wiring board, the opposed wiring layers are electrically connected at the opposed positions. More preferably, the opposed wiring layers are connected by a second protruding electrode formed at the opposed position.

In the above electronic circuit device of the present invention, preferably, the thickness of the curved portion of the wiring board is smaller than the thickness of the other portions.

In the above-described electronic circuit device of the present invention, preferably, the thickness of the heat-radiating substrate at a portion where the wiring substrate is curved is smaller than the thickness of the heat-radiating substrate at another portion.

In the above electronic circuit device of the present invention, preferably, an internal wiring connected to the wiring layer is buried in the insulating layer.

In the above electronic circuit device of the present invention, preferably, the end of the wiring board is curved outward.

According to the electronic circuit device of the present invention, the heat generated from the electronic circuit chip is transmitted to the wiring layer having high thermal conductivity, and transmitted to the heat dissipation substrate via the insulating layer. The heat transferred to the heat-dissipating board is dissipated to the outside atmosphere by air cooling, etc., ensuring heat dissipation.
The generation of natural convection in the external atmosphere further promotes the above-described heat radiation. In the heat dissipation means as described above,
It is preferable that the surface area of the heat dissipating substrate in contact with the external atmosphere is large. A highly reliable electronic circuit device having reliability can be realized.

Further, by forming a configuration in which the opposing wiring layers are connected by the second protruding electrodes, a three-dimensional wiring pattern can be realized, so that the wiring length between electronic circuit chips can be reduced. And electrical characteristics such as signal delay can be improved. Further, the thickness of the heat-radiating substrate at the curved portion of the wiring substrate between the electronic circuit chips mounted on the wiring substrate is made smaller than the thickness of the other portions, thereby maintaining the above high heat-radiating property, The workability of the substrate can be improved.

[0031]

Embodiments of an electronic circuit device and a method of manufacturing the same according to the present invention will be described below with reference to the drawings.

[0032] First Embodiment FIG. 1 is a cross-sectional view of the electronic circuit device according to this embodiment,
FIG. 2 is an enlarged sectional view of a portion A of the wiring board shown in FIG.

As shown in FIG. 2, the wiring board 4 is made of a heat radiating board 1 made of a metal having a high thermal conductivity such as copper.
And an insulating layer 2 made of, for example, polyimide having a low dielectric constant formed on the upper layer of the heat radiation substrate 1 and a wiring layer 3a made of, for example, copper having a high electric conductivity formed on the insulating layer 2. It is configured. The wiring layer 3a is processed into a predetermined circuit pattern.

Here, as shown in FIG. 2, the wiring board 4 does not need to have one insulating layer 2 and one wiring layer 3a, but may have a multilayer structure as needed. In this case, the wiring board 4 includes the heat dissipation board 1, the insulating layer 2 formed on the heat dissipation board 1, the wiring layer 3 a formed on the insulation layer 2, and the inside of the insulation layer 2. Is formed from at least one internal wiring layer (not shown). In this case, the internal wiring layers (not shown) are electrically connected to each other, and the internal wiring layer (not shown) and the wiring layer 3a are electrically connected by a buyer hole (not shown) or the like.
As described above, the wiring board 4 is configured, and the electronic circuit chip 5 is mounted on the wiring layer 3a of the wiring board 4.

An electronic circuit chip (hereinafter, referred to as a semiconductor chip) 5 having an electronic circuit formed of a semiconductor has a first electrode connected to a pad electrode (not shown) made of aluminum or the like connected to a circuit pattern of the semiconductor chip 5. A bump (first protruding electrode) 6 is formed.

As shown in FIG. 1, the electronic circuit device according to the present embodiment comprises a wiring layer 3 of a wiring board 4 having the above configuration.
a, two semiconductor chips 5 mounted face down from the surface on which the first protruding electrodes 6 are formed, the wiring board 4 between the two semiconductor chips 5 is curved, and the wiring layer 3a is formed. Are opposed to each other. The gap between the semiconductor chip 5 and the wiring board 4 is sealed with a sealing resin 7 made of epoxy resin or the like.

The wiring board 4 is further connected to a mounting board (not shown), so that the wiring board 3 is connected to the mounting board (not shown) so as to be substantially parallel to the mounting board. The end of the substrate 4 has a curved structure. As described above, an electronic circuit device (semiconductor module) on which a plurality of semiconductor chips are mounted is configured.

FIGS. 3 and 4 are cross-sectional views of an electronic circuit device according to another embodiment of the present invention. The electronic circuit device shown in FIG. 3 has a structure in which two unit structures are connected with the structure of the electronic circuit device shown in FIG. 1 as a unit structure. FIG.
In the electronic circuit device shown in FIG. 1, there are three curved portions between the mounting portions of the semiconductor chip 5, and the wiring layer 3 is provided for each unit structure.
The two semiconductor chips 5 are mounted on flip-chip a by flip chip, and the end of the wiring board 4 is curved.

The electronic circuit device shown in FIG. 4 has a structure in which three unit structures are connected to each other with the structure of the electronic circuit device shown in FIG. 1 as a unit structure. In the electronic circuit device shown in FIG. 4, there are five curved portions between the mounting portions of the semiconductor chip 5, and the semiconductor chip 5 is provided on the wiring layer 3a for each unit structure.
Are mounted by flip-chip two by two, and the end of the wiring board 4 is curved.

The electronic circuit device according to the present invention is not limited to the structure shown in the above embodiment, and the structure of the electronic circuit device shown in FIG. 1 is used as a unit structure, and a plurality of the unit structures are connected as necessary. Structure.

Next, the heat radiation effect of the electronic circuit device according to the present embodiment having the above-described structure will be described. As an example, the heat radiation effect of the electronic circuit device having the structure shown in FIG. 3 will be described. FIG. 5 is a perspective view for explaining the heat radiation effect of the electronic circuit device having the structure shown in FIG.

The heat generated from the semiconductor chip 5 is transmitted to the heat dissipating substrate 1 made of copper or the like having a high thermal conductivity via the first bump 6, the wiring layer 3a and the insulating layer 2. The heat transmitted to the heat-dissipating substrate 1 is radiated to the external atmosphere by convection or the like (indicated by an arrow 18 in the drawing), and the natural convection is generated in the external atmosphere to further promote the above-described heat dissipation. The above-mentioned heat radiation effect is more effective as the surface area of the heat radiation substrate 1 in contact with the external atmosphere is larger. Therefore, as in the structure of the electronic circuit device according to the present invention, the surface area of the heat radiation substrate 1 in contact with the external atmosphere is smaller. Large structures work favorably.

FIG. 6 is a perspective view showing a heat radiation effect when forced air cooling 19 is performed in the external atmosphere of the electronic circuit device by, for example, a fan. The heat transfer from the semiconductor chip 5 to the heat dissipating substrate 1 is the same as the above-described heat dissipating action. However, when the forced air cooling 19 is performed, the heat transferred to the heat dissipating substrate 1 is further reduced by convection. Dispersion to the outside atmosphere will be promoted. The heat dissipation effect of the above forced air cooling 19 works greatly in a structure having a large contact area with the external atmosphere, such as the electronic circuit device according to the present invention, so that a further heat dissipation effect can be expected.

According to the electronic circuit device according to the present embodiment,
Since the heat generated from the semiconductor chip 5 can be efficiently radiated to the external atmosphere while the mounting density of the semiconductor chip 5 is improved, a highly reliable three-dimensional multi-chip module can be realized.

A method for manufacturing the electronic circuit device according to the present embodiment will be described. First, a method for manufacturing a wiring board for mounting a semiconductor chip used in the electronic circuit device according to the present embodiment will be described. As shown in FIG. 7A, a heat-radiating substrate 1 made of, for example, copper having a high thermal conductivity is formed with a predetermined thickness. Here, the thickness of the heat radiating substrate 1 is about 0.1 to 0.5 mm in consideration of the balance between the rigidity of the entire wiring substrate 4 and the workability when the wiring substrate 4 is bent later. Is preferred.

Next, as shown in FIG. 7B, an insulator such as polyimide having a low dielectric constant is applied uniformly on the upper layer of the heat dissipation substrate 1 to form an insulating layer 2.

Next, as shown in FIG.
On the upper layer, for example, copper or the like having a high electric conductivity is grown by plating or the like to form the wiring layer 3. Next, FIG.
As shown in FIG. 2D, the wiring layer 3 is processed into a predetermined pattern by etching or the like to form a wiring layer 3a, which leads to the wiring substrate 4 shown in FIG.

Here, when the wiring layers are formed in multiple layers, the same steps may be repeated after the above-described steps of forming the insulating layer 2 and forming the wiring layer 3a. That is, the wiring layer 3
After forming a, an insulating layer and a layer for a wiring layer are laminated thereon, and the wiring layer is patterned (surface wiring), and a via hole for forming the surface wiring and the internal wiring by a laser method or the like. To form a multilayer wiring.

Next, a method of manufacturing the electronic circuit device according to the present embodiment will be described. The method for forming each semiconductor chip 5 and the method for forming the first bumps 6 are the same as in the conventional method. First, as shown in FIG. 8A, the first bumps 6 connected to the circuit patterns of the plurality of semiconductor chips 5 correspond to predetermined positions of the wiring layer 3a,
The semiconductor chip 5 is mounted face down on the wiring board 4, the first bump 6 and the wiring layer 3a are electrically and mechanically connected, and the gap between the semiconductor chip 5 and the wiring board 4 is made of epoxy resin or the like. Sealing with a sealing resin 7 made of

Next, as shown in FIG. 8 (b), the wiring board 4 between the semiconductor chips 5 mounted on the wiring board 4 is placed, for example, with a mold or the like so that the heat-radiating board 1 is located outside. Wiring board 4 is bent as described above. At this time, as shown in FIG. 9C, it is preferable to bend the opposing wiring layers until they are substantially parallel.

Next, as shown in FIG. 9D, in order to form a connection portion for mounting the electronic circuit device on a mounting board (not shown), the end of the wiring board 4 is connected to a mounting board (not shown). It is bent using, for example, a mold so that it is substantially parallel.

Through the above steps, the electronic circuit device according to the present embodiment can be formed.

Second Embodiment FIG. 10 is a sectional view of an electronic circuit device according to the second embodiment . The structure of the electronic circuit device according to the present embodiment is substantially the same as that of the electronic circuit device according to the first embodiment, except that a predetermined portion of the wiring layer 3a of the wiring board 4 is connected to the opposing wiring layer 3a. Is different in that the bumps 8 (second protruding electrodes) are formed. The heat radiation effect of the electronic circuit device according to the present embodiment is the same as that of the first embodiment.

According to the electronic circuit device according to the present embodiment,
Since the heat generated from the semiconductor chip can be efficiently radiated to the external atmosphere while the mounting density of the semiconductor chip is improved, a highly reliable three-dimensional multi-chip module can be realized. Further, the opposing wiring layer 3a is
Therefore, since the connection is made, a three-dimensional wiring pattern can be realized, so that the wiring length between chips can be reduced, and electrical characteristics such as signal delay can be improved.

Third Embodiment FIG. 11 is a sectional view of an electronic circuit device according to this embodiment. The structure of the electronic circuit device according to the present embodiment is substantially the same as that of the electronic circuit device according to the first embodiment, but the structure of the heat radiation substrate 1 in the curved portion 9 of the wiring substrate 4 between the mounted semiconductor chips 5 is described. The difference is that the thickness is smaller than the thickness of the other parts. The heat radiation effect of the electronic circuit device according to the present embodiment is the same as that of the first embodiment.

According to the electronic circuit device according to the present embodiment,
Since the heat generated from the semiconductor chip 5 can be efficiently dissipated to the external atmosphere while the mounting density of the semiconductor chip 5 is improved, a highly reliable three-dimensional multi-chip module can be realized. The mounted semiconductor chip 5
The thickness of the heat-radiating substrate 1 in the curved portion 9 of the wiring substrate 4 is smaller than the thickness of the other portions, so that the processability of the wiring substrate 4 is improved while maintaining the above-described heat-radiating property. Can be.

The electronic circuit device and the method of manufacturing the same according to the present invention are not limited to the above embodiments. For example, in order to mount the above-mentioned semiconductor chip on a wiring board, a flip-chip method of connecting the semiconductor chip 5 face down is used, but the present invention is not limited to this, and a wire bonding method, TAB (Tape Automated Bonding) is used. ) Can be used. Further, in the present embodiment, the number of the semiconductor chips 5 included in the unit structure of the electronic circuit device illustrated in FIG. 1 is two, but is not limited thereto, and may be two or more. Further, in the present embodiment, when mounting the semiconductor chip 5 on the wiring board 4, bumps made of solder or the like are used. However, the present invention is not limited to this, and gold stud bumps, conductive paste, anisotropic It can also be performed by using a conductive film or the like, or a combination of these and a solder bump. In addition, various changes can be made without departing from the gist of the present invention.

[0058]

According to the electronic circuit device of the present invention, it is possible to efficiently dissipate heat generated from the electronic circuit chip to the outside atmosphere while increasing the mounting density by mounting the electronic circuit chip three-dimensionally. Therefore, a highly reliable electronic circuit device can be realized. Also, the facing wiring layer is
By adopting a configuration in which the wiring is electrically connected by the second protruding electrodes, a three-dimensional wiring pattern can be realized, so that the wiring length between electronic circuit chips can be reduced, and electrical characteristics such as signal delay can be reduced. Can be improved.
Further, the thickness of the heat-radiating substrate at the portion where the wiring substrate is curved is smaller than the thickness of the other portions, thereby improving the processability of the wiring substrate while maintaining the above-described heat-radiating property. be able to.

[Brief description of the drawings]

FIG. 1 is a sectional view of an electronic circuit device according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view of a portion A of FIG. 1 of the wiring board used in the electronic circuit device according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view of an electronic circuit device according to another embodiment of the present invention, in which two electronic circuit devices shown in FIG. 1 are connected as a unit structure.

4 is a cross-sectional view of an electronic circuit device according to another embodiment of the present invention, in which three electronic circuit devices shown in FIG. 1 are connected as a unit structure.

FIG. 5 is a perspective view for explaining a heat radiation effect of the electronic circuit device according to the embodiment of the present invention.

FIG. 6 is a perspective view for explaining a heat radiation effect by forced air cooling of the electronic circuit device according to the embodiment of the present invention.

FIGS. 7A and 7B are cross-sectional views illustrating a manufacturing process of a method for manufacturing a wiring board used in an electronic circuit device according to an embodiment of the present invention. FIG. 5A shows the steps up to the step of forming the insulating layer, FIG. 5C shows the steps up to the step of forming the wiring layer layer, and FIG.

FIGS. 8A and 8B are side views showing a manufacturing process of a method of manufacturing an electronic circuit device according to an embodiment of the present invention, wherein FIG. The steps up to the step of bending the wiring board are shown.

FIG. 9 shows a step that follows the step shown in FIG. 8; FIG. 9 (c) shows a step until the wiring layers are opposed to each other;

FIG. 10 is a sectional view of an electronic circuit device according to a second embodiment.

FIG. 11 is a sectional view of an electronic circuit device according to a third embodiment.

FIG. 12 is a sectional view of a two-dimensional multi-chip module according to a first conventional example.

FIG. 13 is a sectional view of a two-dimensional multi-chip module according to a second conventional example.

FIG. 14 is a sectional view of a three-dimensional multi-chip module according to a third conventional example.

FIG. 15 is a sectional view of a three-dimensional multi-chip module according to a fourth conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Heat dissipation board, 2 ... Insulation layer, 3a ... Wiring layer, 4 ... Wiring board, 5 ... Semiconductor chip (electronic circuit chip), 6 ... First
Bump, 7: sealing resin, 8: bump for wiring board connection, 9
... bending part, 11 ... heat sink, 12 ... interposer,
13: heat spreader, 14: second bump, 15 ...
Cooling via, 16: metal conductor layer, 17: third bump, 1
8: heat dissipation, 19: forced air cooling.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 1/02 (72) Inventor Yasushi Tateno 6-7-35 Kita Shinagawa, Shinagawa-ku, Tokyo Sony Corporation F term (reference) 5E322 AA01 AB08 CA05 EA01 FA04 5E338 AA01 AA03 AA11 AA12 AA16 BB51 BB54 BB65 BB71 CC01 EE02

Claims (10)

[Claims] A wiring board having a heat dissipating substrate, an insulating layer formed on the heat dissipating substrate, and a wiring layer formed on the insulating layer; and a plurality of wiring boards mounted on the wiring layer. An electronic circuit device, comprising: an electronic circuit chip, wherein the wiring board is curved at at least one position between the electronic circuit chips, and the wiring layers face each other. 2. The electronic circuit chip has a circuit pattern of the electronic circuit chip and a first protruding electrode connected to the circuit pattern, and is mounted on the wiring layer via the first protruding electrode. The electronic circuit device according to claim 1. 3. The electronic circuit device according to claim 2, wherein the electronic circuit chip is mounted on the wiring layer from the side on which the first protruding electrode is formed. 4. The electronic circuit device according to claim 1, wherein the wiring substrate has a plurality of curved portions and a plurality of portions facing the wiring layer. 5. The electronic circuit device according to claim 1, wherein in the wiring board, the facing wiring layers are electrically connected at the facing positions. 6. The electronic circuit device according to claim 5, wherein said opposed wiring layers are connected by a second projecting electrode formed at said opposed position. 7. The electronic circuit device according to claim 1, wherein the thickness of the curved portion of the wiring board is smaller than the thickness of the other portion. 8. The electronic circuit device according to claim 1, wherein the thickness of the heat radiation substrate at a portion where the wiring substrate is curved is smaller than the thickness of the heat radiation substrate at another portion. 9. The electronic circuit device according to claim 1, wherein an internal wiring connected to the wiring layer is buried in the insulating layer. 10. The electronic circuit device according to claim 1, wherein an end of said wiring board is curved outward.