CN107197608B - Four direction piezoelectricity heat radiation modules - Google Patents
Four direction piezoelectricity heat radiation modules Download PDFInfo
- Publication number
- CN107197608B CN107197608B CN201710377287.3A CN201710377287A CN107197608B CN 107197608 B CN107197608 B CN 107197608B CN 201710377287 A CN201710377287 A CN 201710377287A CN 107197608 B CN107197608 B CN 107197608B
- Authority
- CN
- China
- Prior art keywords
- thermal column
- rectangular cavities
- installation window
- column
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention discloses a kind of four direction piezoelectricity heat radiation modules, it include a rectangular cavities, one side of rectangular cavities is respectively equipped with the first installation window, another side opposite with the side is equipped with the second installation window, and in addition two sides are respectively equipped with third installation window and the 4th installation window;Due to vertical structure, during vibration, the problem of being not in leverage, heat-radiating substrate is caused to separate with chip, compactness is higher, and spoilage is lower;In addition non-contacting spring structure is used, the slight lateral vibration of the ventilation lumen of part is absorbed by spring in realization, does not influence low heat-radiating substrate.Using air-suction, pass through the valve body of taper, realize rectangular cavities bottom air-breathing, it only deflates at the top of rectangular cavities, thermal column is identical as the airflow direction that the suction hole below rectangular cavities is formed since fuel factor, heat can rise bottom-up, two speed do not have differential seat angle, and heat dissipation effect is more preferable after superposition.
Description
Technical field
The present invention relates to a kind of four direction piezoelectricity heat radiation modules.
Background technique
As the problems such as radiator volume of fan form is big, noise is easy greatly aging becomes increasingly conspicuous, minimizes at present, is low
The piezoelectric type radiator of noise longer life expectancy occurs gradually in the visual field in market;The patent No.: 201510122009.4 disclosures
A kind of driving type piezoelectric actuator heat radiation module;Although the structure solves the problems, such as conventional fan radiator.But itself has such as
Under important disadvantage: 1, space utilization rate is low;Radiator portion and ventilation lumen are laterally arranged side by side, and ventilation lumen simultaneously occupies circuit board
Horizontal area, blocks other electronic components, causes the heat dissipation problem of other electronic components instead.2, vibration problems, with piezoelectricity
The use of heat radiation module, the degree that time length can find that the chips such as heat-radiating substrate and CPU are bonded is lower and lower, is primarily due to this
Structure radiator portion and ventilation lumen in patent link together, and a leverage is formed when ventilation lumen vertical tremor will
The heat-radiating substrate on side tilts, and be very easy to cause to radiate bad problem.3, the heat radiation module of the structure belongs to blowing method
Heat dissipation by the air extrusion in ventilation lumen and blows to thermal column (i.e. the shunting body of the patent), the form actual efficiency is low, because
Be thermal column due to fuel factor, around hot gas be to rise bottom-up, the transverse direction of ventilation lumen is blown to be caused with fuel factor
The bottom-up movement of gas form a differential seat angle, reduce the actual speed that hot gas scatters instead.4, the structure is scattered
Plume (i.e. the shunting body of the patent) is solid construction, reduces the air radiating rate as caused by fuel factor.
Summary of the invention
It is an object of the invention to overcome disadvantages described above, a kind of four direction piezoelectricity heat radiation modules are provided.
To achieve the above object, concrete scheme of the invention is as follows: a kind of four direction piezoelectricity heat radiation modules, include one
Rectangular cavities, a side of rectangular cavities are respectively equipped with the first installation window, another side opposite with the side is equipped with the
Two installation windows, in addition two sides are respectively equipped with third installation window and the 4th installation window;
It further include the second piezoelectricity for having the first piezoelectric vibrator structure for being installed on the first installation window, being installed on the second installation window
Oscillator structure, the 4th piezoelectric vibrator knot for being installed on the third piezoelectric vibrator structure of third installation window, being installed on the 4th installation window
Structure;
First piezoelectric vibrator structure to the 4th piezoelectric vibrator structure includes an elastic piece and is attached at elastic piece
On piezoelectric sheet;The rectangular cavities top and bottom are equipped with multiple air hole structures;Each air hole structure includes in square
The bellmouth that is opened up on shape cavity, the bullet being placed in bellmouth and the doorframe for preventing bullet from losing;Rectangular cavity
Four angular zones of body bottom surface are downwardly projecting first boss, and first boss bottom surface extends downwardly out the first fixed column, dissipates
Four angular zones of hot radical plate top surface are equipped with second boss corresponding with first boss upwards, and second boss has extended upward
Second fixed column further includes having hard spring, and hard spring one end is socketed the first fixed column, and the other end is socketed the second fixed column;
It further include the heat-radiating substrate having for being attached at chip surface;The substrate is equipped with multiple thermal columns
Wherein, the air hole structure quantity at least two that rectangular cavities bottom surface is equipped with.
Wherein, the air hole structure quantity at least two that rectangular cavities top surface is equipped with.
Wherein, the thermal column arrangement mode is that one is set to the first thermal column of heat-radiating substrate end face center, a corral
The second circle thermal column that the first thermal column around center is arranged, second encloses setting equally spaced from each other between the thermal column of thermal column;With
And the third circle thermal column around the second circle thermal column center setting, it is equally spaced from each other between the thermal column of third circle thermal column to set
It sets;The height of first thermal column is greater than the height of each thermal column of the second circle thermal column, each heat dissipation of the second circle thermal column
The height of column is greater than the height of each thermal column of third circle thermal column.
Wherein, the thermal column is hollow structure, and the heat dissipation column bottom is equipped with the air through hole of two perforations.
The invention has the benefit that 1, due to using vertical design, space utilization rate is high, will not occupy except heat-radiating substrate
Outer any transverse area.2, due to vertical structure, during vibration, be not in leverage, lead to heat-radiating substrate and core
The problem of piece separates, compactness is higher, and spoilage is lower;In addition non-contacting spring structure is used, the ventilation of part in realization
The slight lateral vibration of chamber is absorbed by spring, does not influence beneath heat-radiating substrate.3, using air-suction, that is, pass through the valve of taper
Body realizes rectangular cavities bottom air-breathing, and the top of rectangular cavities is only deflated, and thermal column can be the bottom of from due to fuel factor, heat
Portion is raised above, and identical as the airflow direction that the suction hole below rectangular cavities is formed, two speed do not have differential seat angle, after superposition
Heat dissipation effect is more preferable.4, thermal column is designed as hollow structure, and bottom offers air through hole, and the heat in thermal column is passed through bottom
The air of portion's air inlet rises to the region at top, and better heat-radiation effect is obvious.
Detailed description of the invention
Fig. 1 is perspective view of the invention;
Fig. 2 is front view of the invention;
Fig. 3 is sectional view of the invention;
Fig. 4 is the perspective view of heat-radiating substrate and thermal column of the invention;
Fig. 5 is the front view of heat-radiating substrate and thermal column of the invention;
Fig. 6 is the perspective view of thermal column;
Fig. 7 is the hollow flow of air schematic diagram of thermal column;
Description of symbols of the Fig. 1 into Fig. 7:
1- rectangular cavities;11- first installs window;12- second installs window;21- piezoelectric sheet;22- elastic piece;31- taper
Hole;32- bullet;33- doorframe;41- first boss;42- second boss;43- hard spring;The second fixed column of 44-;45-
One fixed column;5- heat-radiating substrate;51- thermal column;52- air through hole.
Specific embodiment
The present invention is described in further detail in the following with reference to the drawings and specific embodiments, is not reality of the invention
It applies range and is confined to this.
As shown in Figures 1 to 7, four direction piezoelectricity heat radiation module of one kind described in the present embodiment, includes a rectangular cavity
Body 1, a side of rectangular cavities 1 are respectively equipped with the first installation window 11, another side opposite with the side is equipped with second
Window 12 is installed, in addition two sides are respectively equipped with third installation window and the 4th installation window;
It further include having the first piezoelectric vibrator structure for being installed on the first installation window 11, being installed on the second of the second installation window 12
Piezoelectric vibrator structure, the 4th piezoelectricity vibration for being installed on the third piezoelectric vibrator structure of third installation window, being installed on the 4th installation window
Minor structure;
First piezoelectric vibrator structure to the 4th piezoelectric vibrator structure includes an elastic piece 22 and is attached at elasticity
Piezoelectric sheet 21 on piece 22;1 top and bottom of rectangular cavities are equipped with multiple air hole structures;Each air hole structure includes
There are the bellmouth opened up in rectangular cavities 1 31, the bullet being placed in bellmouth 31 32 and for preventing bullet 32 from losing
The doorframe 33 of mistake;Four angular zones of 1 bottom surface of rectangular cavities are downwardly projecting first boss 41, and 41 bottom surface of first boss is downward
Extending has the first fixed column 45, and four angular zones of 5 top surface of heat-radiating substrate are equipped with corresponding with first boss 41 the upwards
Two boss 42, second boss 42 have extended upward the second fixed column 44, further include having hard spring 43,43 one end of hard spring
It is socketed the first fixed column 45, the other end is socketed the second fixed column 44;
It further include the heat-radiating substrate 5 having for being attached at chip surface;The substrate is equipped with multiple thermal columns 51.
It is shaken by the reversed back and forth of the first piezoelectric vibrator structure to the 4th piezoelectric vibrator structure of 1 two sides of rectangular cavities,
Compression simultaneously and expand simultaneously so that gas compression and expansion in rectangular cavities 1, when compression, i.e., outlet when, the cone at top
Body 32 is blown open, and gas is excluded from bellmouth 31, and the bullet 32 of bottom causes since airflow function is pressed in bellmouth 31
It cannot go out from this hole.Upon expansion, i.e., air inlet when, exactly the opposite, i.e., the bellmouth 31 of bottom can be with air inlet, and top is just
It is not all right.Thermal column 51 is formed since fuel factor, heat can rise bottom-up with the suction hole of 1 lower section of rectangular cavities
Airflow direction is identical, that is, and respiratory state is formed, that is, siphons away the hot-air of lower section, is then discharged from the bellmouth 31 at top, it is cold
Air passes through thermal column 51 from surrounding again.Reciprocal Rapid Circulation, achievees the purpose that heat dissipation.Wherein, the present invention is due to using vertical
Design, space utilization rate is high, will not occupy any transverse area in addition to heat-radiating substrate 5.2, due to vertical structure, process is shaken
In, the problem of being not in leverage, heat-radiating substrate 5 is caused to separate with chip, compactness is higher, and spoilage is lower;In addition
Using non-contacting spring structure, in realization the ventilation lumen of part slight lateral vibration absorbed by spring, do not influence under
Heat-radiating substrate 5.3, using air-suction, i.e., by the valve body of taper, 1 bottom air-breathing of rectangular cavities is realized, rectangular cavities 1
Top is only deflated, suction hole of the thermal column 51 since fuel factor, heat can rise bottom-up, with 1 lower section of rectangular cavities
The airflow direction of formation is identical, and two speed do not have differential seat angle, and heat dissipation effect is more preferable after superposition.
In the present embodiment, air hole structure quantity at least two that 1 bottom surface of rectangular cavities is equipped with.In the present embodiment, rectangle
The air hole structure quantity at least two that 1 top surface of cavity is equipped with.It can be effectively.
In the present embodiment, 51 arrangement mode of thermal column is that is set to first heat dissipation of 5 end face center of heat-radiating substrate
Column 51, the second circle thermal column 51 that first thermal column 51 of the circle around center is placed equidistant with, and around the second circle thermal column
The 51 third circle thermal columns 51 being placed equidistant with;The height of first thermal column 51 is greater than the second circle thermal column 51, the second circle thermal column
51 height is greater than third circle thermal column 51.In this way in practice, discovery can effectively promote cold air and reach in thermal column 51
Heart district domain is conducive to radiate.
In the present embodiment, the thermal column 51 be hollow structure, 51 bottom of thermal column set there are two penetrate through air inlet
Through-hole 52.Thermal column 51 is designed as hollow structure, and bottom offers air through hole 52, and the heat in thermal column 51 is passed through bottom
The air of air inlet rises to the region at top, and better heat-radiation effect is obvious.
The above is only a preferred embodiment of the invention, therefore all according to structure described in present patent application range
It makes, the equivalent change or modification that feature and principle are done, in the protection scope of present patent application.
Claims (1)
1. a kind of four direction piezoelectricity heat radiation modules, it is characterised in that: it include a rectangular cavities (1), the one of rectangular cavities (1)
A side is respectively equipped with the first installation window (11), another side opposite with the side is equipped with the second installation window (12), in addition
Two sides are respectively equipped with third installation window and the 4th installation window;
It further include having the first piezoelectric vibrator structure for being installed on the first installation window (11), being installed on the second of the second installation window (12)
Piezoelectric vibrator structure, the 4th piezoelectricity vibration for being installed on the third piezoelectric vibrator structure of third installation window, being installed on the 4th installation window
Minor structure;
First piezoelectric vibrator structure to the 4th piezoelectric vibrator structure includes an elastic piece (22) and is attached at elastic piece
(22) piezoelectric sheet (21) on;Rectangular cavities (1) top and bottom are equipped with multiple air hole structures;Each air hole structure
It include the bellmouth (31) opened up on rectangular cavities (1), the bullet (32) being placed in bellmouth (31) and for preventing
The only doorframe (33) that bullet (32) is lost;
Four angular zones of rectangular cavities (1) bottom surface are downwardly projecting to be had first boss (41), and first boss (41) bottom surface is downward
Extending has the first fixed column (45), and it is right with first boss (41) that four angular zones of heat-radiating substrate (5) top surface are equipped with upwards
The second boss (42) answered, second boss (42) have extended upward the second fixed column (44), further include having hard spring (43),
Hard spring (43) one end is socketed the first fixed column (45), and the other end is socketed the second fixed column (44);
It further include the heat-radiating substrate (5) having for being attached at chip surface;The substrate is equipped with multiple thermal columns (51);
Thermal column (51) arrangement mode is that one is set to first thermal column (51) of heat-radiating substrate (5) end face center, a circle
Around center the first thermal column (51) be arranged second circle thermal column (51), second circle thermal column (51) thermal column between that
This is placed equidistant with;And the third circle thermal column (51) around the second circle thermal column (51) center setting, third circle thermal column
(51) setting equally spaced from each other between thermal column;The height of first thermal column (51) is greater than each of second circle thermal column (51) and dissipates
The height of the height of plume, each thermal column of the second circle thermal column (51) is greater than each thermal column of third circle thermal column (51)
Height;
The thermal column (51) be hollow structure, thermal column (51) bottom set there are two penetrate through air through hole (52);
By the vibration reversed back and forth of the first piezoelectric vibrator structure to the 4th piezoelectric vibrator structure of rectangular cavities (1) two sides, i.e.,
It compresses and expands simultaneously simultaneously, so that gas compression and expansion in rectangular cavities (1);When compression, i.e., outlet when, the cone at top
Body (32) is blown open, and gas is discharged from top tapered hole, the bellmouth closing of bottom;Upon expansion, i.e., air inlet when, bottom
Bellmouth can be closed with air inlet, the bellmouth at top;The air hole structure quantity at least two that rectangular cavities (1) bottom surface is equipped with;
The air hole structure quantity at least two that rectangular cavities (1) top surface is equipped with.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710377287.3A CN107197608B (en) | 2017-05-25 | 2017-05-25 | Four direction piezoelectricity heat radiation modules |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710377287.3A CN107197608B (en) | 2017-05-25 | 2017-05-25 | Four direction piezoelectricity heat radiation modules |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107197608A CN107197608A (en) | 2017-09-22 |
CN107197608B true CN107197608B (en) | 2019-06-25 |
Family
ID=59874856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710377287.3A Active CN107197608B (en) | 2017-05-25 | 2017-05-25 | Four direction piezoelectricity heat radiation modules |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107197608B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN204267258U (en) * | 2014-11-23 | 2015-04-15 | 浙江师范大学 | A kind of piezoelectric pump overvoltage protective device based on magnetic rheology effect |
CN104768354A (en) * | 2015-03-20 | 2015-07-08 | 长春隆美科技发展有限公司 | Piezoelectric driving type heat dissipation module |
CN104902728A (en) * | 2014-03-03 | 2015-09-09 | 联想(北京)有限公司 | Electronic equipment and heat-radiating member |
CN204721142U (en) * | 2015-05-05 | 2015-10-21 | 好太太电器(中国)有限公司 | A kind of soot motor dampening bracket |
CN105135391A (en) * | 2015-07-14 | 2015-12-09 | 东莞市闻誉实业有限公司 | Cooler |
KR101692308B1 (en) * | 2016-09-20 | 2017-01-03 | (주)지인테크 | The protective radiation cooling housing for cctv |
-
2017
- 2017-05-25 CN CN201710377287.3A patent/CN107197608B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104902728A (en) * | 2014-03-03 | 2015-09-09 | 联想(北京)有限公司 | Electronic equipment and heat-radiating member |
CN204267258U (en) * | 2014-11-23 | 2015-04-15 | 浙江师范大学 | A kind of piezoelectric pump overvoltage protective device based on magnetic rheology effect |
CN104768354A (en) * | 2015-03-20 | 2015-07-08 | 长春隆美科技发展有限公司 | Piezoelectric driving type heat dissipation module |
CN204721142U (en) * | 2015-05-05 | 2015-10-21 | 好太太电器(中国)有限公司 | A kind of soot motor dampening bracket |
CN105135391A (en) * | 2015-07-14 | 2015-12-09 | 东莞市闻誉实业有限公司 | Cooler |
KR101692308B1 (en) * | 2016-09-20 | 2017-01-03 | (주)지인테크 | The protective radiation cooling housing for cctv |
Also Published As
Publication number | Publication date |
---|---|
CN107197608A (en) | 2017-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103582392B (en) | System and method for the heat in the sealing cover that dissipates | |
CN101483992B (en) | Waterproof electronic apparatus heat radiation construction | |
CN101252821B (en) | Heat sinking method, system and device | |
US8077458B2 (en) | Airflow guiding cover and electronic device having the same | |
US7891410B1 (en) | Devices for heat exchange | |
US20100134976A1 (en) | Heat dissipating pad structure for notebook computer | |
US11825592B2 (en) | Electronic device console with natural draft cooling | |
KR20120093318A (en) | Radiation unit of electronic device and electronic device using same | |
CN107170722B (en) | A kind of bimodulus piezoelectricity radiator structure | |
CN107197608B (en) | Four direction piezoelectricity heat radiation modules | |
TWM525399U (en) | Fan module and electronic device | |
CN208090844U (en) | Air-conditioner outdoor unit | |
CN207066183U (en) | A kind of tower heat sink | |
CN205902291U (en) | High -efficient ventilation formula intelligent control ware heat radiation structure | |
CN1967438B (en) | Heat sink | |
ES2693608T3 (en) | Pyramid casing, for computer, with great heat dissipation capacity | |
CN211552112U (en) | Anti-deformation heat pump machine shell | |
JP4375218B2 (en) | Power converter cooling and soundproof structure | |
CN110277740B (en) | Utilize air to reduce outdoor switch board of air current vibration as power | |
WO2017201761A1 (en) | Autonomous heat dissipating cob integrated led lamp body based on heat convection | |
CN206309616U (en) | A kind of coiler fan structure | |
CN208090843U (en) | Cooling fin and air conditioner with the cooling fin | |
CN205726861U (en) | A kind of radiator structure of amplifirer | |
CN210745814U (en) | Piezoelectric air-cooled heat sink | |
CN205982963U (en) | Projection equipment and projecting system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190531 Address after: 215324 Room 9, 10 and 11, 188 Jinshun Road, Jinxi Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Kunshan Jianghong Precision Electronics Co., Ltd. Address before: 523000 A 302, Guangming Road, Guangming Road, Dongcheng Street, Dongguan, Guangdong, 302 Applicant before: Dongguan Hefei electromechanical Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant |