EP2248406A4 - Heat sink device - Google Patents

Heat sink device

Info

Publication number
EP2248406A4
EP2248406A4 EP08730843A EP08730843A EP2248406A4 EP 2248406 A4 EP2248406 A4 EP 2248406A4 EP 08730843 A EP08730843 A EP 08730843A EP 08730843 A EP08730843 A EP 08730843A EP 2248406 A4 EP2248406 A4 EP 2248406A4
Authority
EP
European Patent Office
Prior art keywords
heat sink
sink device
heat
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08730843A
Other languages
German (de)
French (fr)
Other versions
EP2248406A1 (en
Inventor
Shailesh N Joshi
Arthur K Farnsworth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of EP2248406A1 publication Critical patent/EP2248406A1/en
Publication of EP2248406A4 publication Critical patent/EP2248406A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP08730843A 2008-02-27 2008-02-27 Heat sink device Withdrawn EP2248406A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2008/055126 WO2009108192A1 (en) 2008-02-27 2008-02-27 Heat sink device

Publications (2)

Publication Number Publication Date
EP2248406A1 EP2248406A1 (en) 2010-11-10
EP2248406A4 true EP2248406A4 (en) 2012-10-24

Family

ID=41016382

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08730843A Withdrawn EP2248406A4 (en) 2008-02-27 2008-02-27 Heat sink device

Country Status (4)

Country Link
US (1) US20110000649A1 (en)
EP (1) EP2248406A4 (en)
CN (1) CN101960938A (en)
WO (1) WO2009108192A1 (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
TW201216827A (en) * 2010-10-11 2012-04-16 Hon Hai Prec Ind Co Ltd Disk drive bracket and disk drive assembly
US11454454B2 (en) 2012-03-12 2022-09-27 Cooler Master Co., Ltd. Flat heat pipe structure
TWI503072B (en) * 2013-06-17 2015-10-01 Nat Univ Tainan Method for designing optimal size of channels of microchannel heat sink containing porous materials
US9532485B2 (en) * 2014-02-21 2016-12-27 Lenovo (Beijing) Co., Ltd. Heat dissipating device and electronic apparatus
CN104902728B (en) * 2014-03-03 2019-02-05 联想(北京)有限公司 A kind of electronic equipment and radiating piece
CN104847476B (en) * 2014-06-04 2017-07-11 北汽福田汽车股份有限公司 Heat-sink unit, radiator and engine-cooling system
CN104075604A (en) * 2014-07-17 2014-10-01 芜湖长启炉业有限公司 Superconductor with multiple U-shaped heat pipes in same cavity
CN104266521A (en) * 2014-10-24 2015-01-07 芜湖长启炉业有限公司 Insertion type superconducting heat dissipation crook
US20170156240A1 (en) * 2015-11-30 2017-06-01 Abb Technology Oy Cooled power electronic assembly
CN107044790A (en) * 2016-02-05 2017-08-15 讯凯国际股份有限公司 Solid heat transferring device
US10330392B2 (en) 2016-02-05 2019-06-25 Cooler Master Co., Ltd. Three-dimensional heat transfer device
US20180023895A1 (en) * 2016-07-22 2018-01-25 Trane International Inc. Enhanced Tubular Heat Exchanger
US10648745B2 (en) * 2016-09-21 2020-05-12 Thermal Corp. Azeotropic working fluids and thermal management systems utilizing the same
CN106332529B (en) * 2016-10-18 2019-06-11 中车大连机车研究所有限公司 A kind of corrugated tube type microcirculation radiator and microcirculation heat-exchange system
US20180106500A1 (en) * 2016-10-18 2018-04-19 Trane International Inc. Enhanced Tubular Heat Exchanger
CN106255396B (en) * 2016-10-18 2019-06-11 中车大连机车研究所有限公司 A kind of pipe type microcirculation radiator and microcirculation heat-exchange system
CN106304805B (en) * 2016-10-18 2019-06-11 中车大连机车研究所有限公司 A kind of plate-fin microcirculation radiator and microcirculation heat-exchange system
US20180192545A1 (en) * 2017-01-03 2018-07-05 Quanta Computer Inc. Heat dissipation apparatus
US11320211B2 (en) 2017-04-11 2022-05-03 Cooler Master Co., Ltd. Heat transfer device
US10597286B2 (en) 2017-08-01 2020-03-24 Analog Devices Global Monolithic phase change heat sink
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US20200068745A1 (en) * 2018-08-22 2020-02-27 Asia Vital Components Co., Ltd. Heat dissipation structure of electronic device
TWM575882U (en) * 2018-11-22 2019-03-21 訊凱國際股份有限公司 External water cooling device
US10677535B1 (en) * 2018-11-30 2020-06-09 Furukawa Electric Co., Ltd. Heat sink
US10760855B2 (en) * 2018-11-30 2020-09-01 Furukawa Electric Co., Ltd. Heat sink
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
CN109977578B (en) * 2019-04-03 2020-02-14 北京卫星环境工程研究所 CFD structure optimization method of large plate type heat sink
JP6813197B2 (en) * 2019-04-26 2021-01-13 Ｎｅｃプラットフォームズ株式会社 Heat dissipation structure
FI20195390A1 (en) 2019-05-10 2020-11-11 Teknologian Tutkimuskeskus Vtt Oy Electric or optical component, coupler, and heat transfer system
US11632853B2 (en) * 2021-03-15 2023-04-18 Heatscape.Com, Inc. Heatsink with perpendicular vapor chamber
TWI828112B (en) * 2022-04-12 2024-01-01 邁萪科技股份有限公司 Heat dissipation module and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US20050028965A1 (en) * 2003-08-07 2005-02-10 Ching-Chih Chen Combined structure of a thermal chamber and a thermal tower
US20050225943A1 (en) * 2004-04-07 2005-10-13 Delta Electronics, Inc. Heat dissipation module
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08340189A (en) * 1995-04-14 1996-12-24 Nippondenso Co Ltd Boiling cooling device
TW556328B (en) * 2001-05-11 2003-10-01 Denso Corp Cooling device boiling and condensing refrigerant
US6626233B1 (en) * 2002-01-03 2003-09-30 Thermal Corp. Bi-level heat sink
US6714413B1 (en) * 2002-10-15 2004-03-30 Delphi Technologies, Inc. Compact thermosiphon with enhanced condenser for electronics cooling
US20050173098A1 (en) * 2003-06-10 2005-08-11 Connors Matthew J. Three dimensional vapor chamber
US7193851B2 (en) * 2004-12-09 2007-03-20 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
US7184269B2 (en) * 2004-12-09 2007-02-27 International Business Machines Company Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
JP4714638B2 (en) * 2006-05-25 2011-06-29 富士通株式会社 heatsink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US20050028965A1 (en) * 2003-08-07 2005-02-10 Ching-Chih Chen Combined structure of a thermal chamber and a thermal tower
US20050225943A1 (en) * 2004-04-07 2005-10-13 Delta Electronics, Inc. Heat dissipation module
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009108192A1 *

Also Published As

Publication number Publication date
CN101960938A (en) 2011-01-26
WO2009108192A1 (en) 2009-09-03
US20110000649A1 (en) 2011-01-06
EP2248406A1 (en) 2010-11-10

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