EP2248406A4 - Heat sink device - Google Patents

Heat sink device

Info

Publication number
EP2248406A4
EP2248406A4 EP20080730843 EP08730843A EP2248406A4 EP 2248406 A4 EP2248406 A4 EP 2248406A4 EP 20080730843 EP20080730843 EP 20080730843 EP 08730843 A EP08730843 A EP 08730843A EP 2248406 A4 EP2248406 A4 EP 2248406A4
Authority
EP
Grant status
Application
Patent type
Prior art keywords
heat sink
sink device
device
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20080730843
Other languages
German (de)
French (fr)
Other versions
EP2248406A1 (en )
Inventor
Shailesh N Joshi
Arthur K Farnsworth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett-Packard Development Co LP
Original Assignee
Hewlett-Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP20080730843 2008-02-27 2008-02-27 Heat sink device Withdrawn EP2248406A4 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2008/055126 WO2009108192A1 (en) 2008-02-27 2008-02-27 Heat sink device

Publications (2)

Publication Number Publication Date
EP2248406A1 true EP2248406A1 (en) 2010-11-10
EP2248406A4 true true EP2248406A4 (en) 2012-10-24

Family

ID=41016382

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20080730843 Withdrawn EP2248406A4 (en) 2008-02-27 2008-02-27 Heat sink device

Country Status (4)

Country Link
US (1) US20110000649A1 (en)
EP (1) EP2248406A4 (en)
CN (1) CN101960938A (en)
WO (1) WO2009108192A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
US9532485B2 (en) * 2014-02-21 2016-12-27 Lenovo (Beijing) Co., Ltd. Heat dissipating device and electronic apparatus
CN104847476B (en) * 2014-06-04 2017-07-11 北汽福田汽车股份有限公司 Cooling unit, radiator and engine cooling system
CN104075604A (en) * 2014-07-17 2014-10-01 芜湖长启炉业有限公司 Superconductor with multiple U-shaped heat pipes in same cavity
CN104266521A (en) * 2014-10-24 2015-01-07 芜湖长启炉业有限公司 Insertion type superconducting heat dissipation crook
CN107044790A (en) * 2016-02-05 2017-08-15 讯凯国际股份有限公司 Stereoscopic heat transferring device
US20180023895A1 (en) * 2016-07-22 2018-01-25 Trane International Inc. Enhanced Tubular Heat Exchanger
CN106255396A (en) * 2016-10-18 2016-12-21 中车大连机车研究所有限公司 Segment-type microcirculation radiator and microcirculation heat exchange system
CN106332529A (en) * 2016-10-18 2017-01-11 中车大连机车研究所有限公司 Corrugated tube type micro-circulation radiator and micro-circulation heat exchange system
CN106304805A (en) * 2016-10-18 2017-01-04 中车大连机车研究所有限公司 Plate fin type micro-circulation radiator and micro-circulation heat exchange system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US20050028965A1 (en) * 2003-08-07 2005-02-10 Ching-Chih Chen Combined structure of a thermal chamber and a thermal tower
US20050225943A1 (en) * 2004-04-07 2005-10-13 Delta Electronics, Inc. Heat dissipation module
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08340189A (en) * 1995-04-14 1996-12-24 Nippondenso Co Ltd Boiling cooling device
US6626233B1 (en) * 2002-01-03 2003-09-30 Thermal Corp. Bi-level heat sink
US6714413B1 (en) * 2002-10-15 2004-03-30 Delphi Technologies, Inc. Compact thermosiphon with enhanced condenser for electronics cooling
US20050173098A1 (en) * 2003-06-10 2005-08-11 Connors Matthew J. Three dimensional vapor chamber
US7193851B2 (en) * 2004-12-09 2007-03-20 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
US7184269B2 (en) * 2004-12-09 2007-02-27 International Business Machines Company Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
JP4714638B2 (en) * 2006-05-25 2011-06-29 富士通株式会社 heatsink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US20050028965A1 (en) * 2003-08-07 2005-02-10 Ching-Chih Chen Combined structure of a thermal chamber and a thermal tower
US20050225943A1 (en) * 2004-04-07 2005-10-13 Delta Electronics, Inc. Heat dissipation module
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009108192A1 *

Also Published As

Publication number Publication date Type
WO2009108192A1 (en) 2009-09-03 application
EP2248406A1 (en) 2010-11-10 application
US20110000649A1 (en) 2011-01-06 application
CN101960938A (en) 2011-01-26 application

Legal Events

Date Code Title Description
AX Request for extension of the european patent to

Countries concerned: ALBAMKRS

17P Request for examination filed

Effective date: 20100824

AK Designated contracting states:

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

DAX Request for extension of the european patent (to any country) deleted
A4 Despatch of supplementary search report

Effective date: 20120921

RIC1 Classification (correction)

Ipc: H01L 23/467 20060101ALI20120917BHEP

Ipc: H01L 23/427 20060101AFI20120917BHEP

18D Deemed to be withdrawn

Effective date: 20130420