SG10201408026VA - An enhanced heat sink - Google Patents

An enhanced heat sink

Info

Publication number
SG10201408026VA
SG10201408026VA SG10201408026VA SG10201408026VA SG10201408026VA SG 10201408026V A SG10201408026V A SG 10201408026VA SG 10201408026V A SG10201408026V A SG 10201408026VA SG 10201408026V A SG10201408026V A SG 10201408026VA SG 10201408026V A SG10201408026V A SG 10201408026VA
Authority
SG
Singapore
Prior art keywords
heat sink
enhanced heat
enhanced
sink
heat
Prior art date
Application number
SG10201408026VA
Inventor
Poh Seng Lee
Yong Jiun Lee
Original Assignee
Univ Singapore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Singapore filed Critical Univ Singapore
Publication of SG10201408026VA publication Critical patent/SG10201408026VA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG10201408026VA 2009-12-02 2010-04-29 An enhanced heat sink SG10201408026VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26582509P 2009-12-02 2009-12-02

Publications (1)

Publication Number Publication Date
SG10201408026VA true SG10201408026VA (en) 2015-01-29

Family

ID=44115166

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201408026VA SG10201408026VA (en) 2009-12-02 2010-04-29 An enhanced heat sink
SG2012052650A SG182569A1 (en) 2009-12-02 2010-04-29 An enhanced heat sink

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012052650A SG182569A1 (en) 2009-12-02 2010-04-29 An enhanced heat sink

Country Status (5)

Country Link
US (1) US20120243180A1 (en)
CN (1) CN102713490A (en)
DE (1) DE112010004672T5 (en)
SG (2) SG10201408026VA (en)
WO (1) WO2011068470A1 (en)

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US20140326441A1 (en) * 2013-05-06 2014-11-06 GCorelab Private, Ltd. Cluster of inclined structures
US9510478B2 (en) 2013-06-20 2016-11-29 Honeywell International Inc. Cooling device including etched lateral microchannels
SG11201609166WA (en) * 2014-05-02 2016-12-29 Univ Singapore Device and method for a two phase heat transfer
US11002497B1 (en) * 2015-06-26 2021-05-11 University ot Maryland, College Park Multi-stage microchannel heat and/or mass transfer system and method of fabrication
US10221498B2 (en) 2015-08-11 2019-03-05 Lawrence Livermore National Security, Llc Method of manufacturing a micro heatsink by an additive process
US11003808B2 (en) * 2015-09-30 2021-05-11 Siemens Industry Software Inc. Subtractive design for heat sink improvement
TWI624640B (en) * 2017-01-25 2018-05-21 雙鴻科技股份有限公司 Liquid-cooling heat dissipation device
EP3404710A1 (en) * 2017-05-18 2018-11-21 Diabatix BVBA Heat sink and method for producing same
US10881034B2 (en) * 2017-11-21 2020-12-29 Syracuse University Passive nano-heat pipes for cooling and thermal management of electronics and power conversion devices
WO2019171077A1 (en) 2018-03-09 2019-09-12 Bae Systems Plc Heat exchanger
US11248854B2 (en) 2018-03-09 2022-02-15 Bae Systems Plc Heat exchanger
GB2576748B (en) * 2018-08-30 2022-11-02 Bae Systems Plc Heat exchanger
ES2958209T3 (en) 2018-03-09 2024-02-05 Bae Systems Plc Heat exchanger
BE1026282B1 (en) * 2018-05-15 2019-12-17 Phoenix Contact Gmbh & Co Modular system for manufacturing an electronic device
SG11202011555TA (en) 2018-06-08 2020-12-30 Nat Univ Singapore System and method for dehumidification
CN108807309B (en) * 2018-06-08 2020-07-24 四川大学 Self-similar micro-channel heat sink with jet flow structure
CN109149325B (en) * 2018-09-21 2019-11-22 清华大学 A kind of mixed structure micro-channel heat sink
CN110043974B (en) * 2019-04-19 2024-06-18 青岛海尔空调器有限总公司 Radiator, air conditioner outdoor unit and air conditioner
US20200409398A1 (en) * 2019-06-25 2020-12-31 Intel Corporation Device, system and method for providing microchannels with porous sidewall structures
US11656032B2 (en) * 2019-09-27 2023-05-23 Industrial Technology Research Institute High temperature flow splitting component and heat exchanger and reforming means using the same
CN110793370B (en) * 2019-11-12 2020-10-02 山东大学 Design method of water-cooled tube plate heat exchanger
CN110848822A (en) * 2019-11-21 2020-02-28 青岛海尔空调器有限总公司 Radiating component, radiator and air conditioner
CN115014107B (en) * 2022-05-26 2023-04-07 西安交通大学 Double-effect enhanced heat exchange micro-channel heat sink with airfoil flow distribution ribs
WO2024052473A1 (en) * 2022-09-09 2024-03-14 Diabatix N.V. Computer-implemented method for designing a heat sink

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU146534A1 (en) * 1961-09-13 1961-11-30 Н.П. Удалов Temperature measuring device
GB1550368A (en) * 1975-07-16 1979-08-15 Rolls Royce Laminated materials
DE2906363C2 (en) * 1979-02-19 1981-06-04 Siemens AG, 1000 Berlin und 8000 München Self-ventilated rectifier
US4450472A (en) 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
SU1146534A2 (en) * 1983-12-05 1985-03-23 Предприятие П/Я Р-6956 Plate heat exchanger package
JPS6266061A (en) * 1985-09-18 1987-03-25 Showa Alum Corp Solar heat water heater utilizing heat pipe
US6422307B1 (en) * 2001-07-18 2002-07-23 Delphi Technologies, Inc. Ultra high fin density heat sink for electronics cooling
US7203064B2 (en) * 2003-12-12 2007-04-10 Intel Corporation Heat exchanger with cooling channels having varying geometry
US20090294105A1 (en) * 2005-03-22 2009-12-03 Bharat Heavy Electricals Limited Selectively Grooved Cold Plate for Electronics Cooling
US7259965B2 (en) * 2005-04-07 2007-08-21 Intel Corporation Integrated circuit coolant microchannel assembly with targeted channel configuration
US7411290B2 (en) * 2005-08-05 2008-08-12 Delphi Technologies, Inc. Integrated circuit chip and method for cooling an integrated circuit chip
US8479806B2 (en) * 2007-11-30 2013-07-09 University Of Hawaii Two-phase cross-connected micro-channel heat sink

Also Published As

Publication number Publication date
US20120243180A1 (en) 2012-09-27
CN102713490A (en) 2012-10-03
DE112010004672T5 (en) 2013-04-18
SG182569A1 (en) 2012-08-30
WO2011068470A1 (en) 2011-06-09

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