SG11201609166WA - Device and method for a two phase heat transfer - Google Patents

Device and method for a two phase heat transfer

Info

Publication number
SG11201609166WA
SG11201609166WA SG11201609166WA SG11201609166WA SG11201609166WA SG 11201609166W A SG11201609166W A SG 11201609166WA SG 11201609166W A SG11201609166W A SG 11201609166WA SG 11201609166W A SG11201609166W A SG 11201609166WA SG 11201609166W A SG11201609166W A SG 11201609166WA
Authority
SG
Singapore
Prior art keywords
heat transfer
phase heat
phase
transfer
heat
Prior art date
Application number
SG11201609166WA
Inventor
Poh Seng Lee
Matthew Lee Liong Law
Original Assignee
Univ Singapore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Singapore filed Critical Univ Singapore
Publication of SG11201609166WA publication Critical patent/SG11201609166WA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/04—Communication passages between channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Sustainable Development (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
SG11201609166WA 2014-05-02 2015-04-30 Device and method for a two phase heat transfer SG11201609166WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461987615P 2014-05-02 2014-05-02
PCT/SG2015/050088 WO2015167398A1 (en) 2014-05-02 2015-04-30 Device and method for a two phase heat transfer

Publications (1)

Publication Number Publication Date
SG11201609166WA true SG11201609166WA (en) 2016-12-29

Family

ID=54358975

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201609166WA SG11201609166WA (en) 2014-05-02 2015-04-30 Device and method for a two phase heat transfer
SG10201809763VA SG10201809763VA (en) 2014-05-02 2015-04-30 Device and method for a two phase heat transfer

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201809763VA SG10201809763VA (en) 2014-05-02 2015-04-30 Device and method for a two phase heat transfer

Country Status (3)

Country Link
US (2) US20170191765A1 (en)
SG (2) SG11201609166WA (en)
WO (1) WO2015167398A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9823206B2 (en) * 2014-07-14 2017-11-21 Kyungpook National University Industry-Academic Cooperation Foundation Apparatus and method for measuring overall heat transfer coefficient
US10390460B2 (en) * 2016-01-29 2019-08-20 Systemex-Energies International Inc. Apparatus and methods for cooling of an integrated circuit
CN107247067B (en) * 2017-07-28 2023-08-04 吉林大学 Microchannel phase transition heat transfer experiment table and test platform
CN112113995B (en) * 2020-08-19 2024-01-23 扬州船用电子仪器研究所(中国船舶重工集团公司第七二三研究所) Low-pressure micro-channel gas-liquid two-phase flow heat dissipation test system and method
US20240133831A1 (en) * 2021-03-16 2024-04-25 Koch-Glitsch, Lp Systems and methods for determining at least one property of fluid
US11567017B2 (en) * 2021-05-20 2023-01-31 Kuwait Institute For Scientific Research Apparatus for measuring performance of suspension for cooling computer processing unit
CN114252477B (en) * 2021-12-30 2023-12-15 中国科学院力学研究所 Carbon dioxide mixed working medium circulation micro-channel heat exchange experimental device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH109712A (en) * 1996-06-24 1998-01-16 Denso Corp Flat tube for condenser and manufacture of same
JP3906133B2 (en) * 2002-09-18 2007-04-18 株式会社フジクラ heatsink
US7139172B2 (en) * 2004-07-01 2006-11-21 International Business Machines Corporation Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
CN101160502A (en) * 2005-04-22 2008-04-09 磁性流体技术(美国)集团公司 High efficiency fluid heat exchanger and method of manufacture
US7362582B2 (en) * 2005-06-14 2008-04-22 International Business Machines Corporation Cooling structure using rigid movable elements
US7672129B1 (en) * 2006-09-19 2010-03-02 Sun Microsystems, Inc. Intelligent microchannel cooling
JP2009176881A (en) * 2008-01-23 2009-08-06 Nissan Motor Co Ltd Cooling apparatus
US20120243180A1 (en) * 2009-12-02 2012-09-27 National University Of Singapore Enhanced heat sink
JP5878352B2 (en) * 2011-12-08 2016-03-08 昭和電工株式会社 heatsink

Also Published As

Publication number Publication date
US20170191765A1 (en) 2017-07-06
SG10201809763VA (en) 2018-12-28
US20190264992A1 (en) 2019-08-29
WO2015167398A1 (en) 2015-11-05

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