CN104869786A - Electronic device - Google Patents

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Publication number
CN104869786A
CN104869786A CN201410058608.XA CN201410058608A CN104869786A CN 104869786 A CN104869786 A CN 104869786A CN 201410058608 A CN201410058608 A CN 201410058608A CN 104869786 A CN104869786 A CN 104869786A
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China
Prior art keywords
heat sink
temperature
electronic equipment
electronic device
oscillating circuit
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CN201410058608.XA
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Chinese (zh)
Inventor
贾自周
那志刚
孙英
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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Priority to CN201410058608.XA priority Critical patent/CN104869786A/en
Publication of CN104869786A publication Critical patent/CN104869786A/en
Pending legal-status Critical Current

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Abstract

An electronic device disclosed by the present invention comprises a heating electronic device, a radiating member, a conducting member and a driving member. The radiating member is made of a heat conduction material, the conducting member is arranged between the electronic device and the radiating member and is used to conduct the heat generated by the electronic device to the radiating member, and the driving member is used to drive the radiating member to vibrate, thereby improving the heat radiation efficiency.

Description

A kind of electronic equipment
Technical field
The present invention relates to electronic technology field, particularly relate to a kind of electronic equipment.
Background technology
Along with the development of science and technology and the progress of society, electronic equipment such as computer, mobile phone, TV have become an indispensable part in people's live and work.
In order to ensure that the electronic device in electronic equipment can normally work, in electronic equipment, be usually provided with heat dissipation element.Particularly, described electronic equipment comprises: the heater members (as central processing unit, heat-generating electronic elements etc.) of evolution of heat during work, distribute as described in the heat sink of heat and the conducting piece that is arranged between heater members and heat sink.The heat that described conducting piece is used for being sent by heater members is passed to described heat sink and distributes.
Along with the development trend that electronic equipment is frivolous, the size of the heat sink of existing electronic equipment is usually less, and the heat that described heater members is produced can not be conducted timely, thus causes the temperature of described heater members higher, affects the work of heater members.
Summary of the invention
The application provides a kind of electronic equipment, the heat improving the generation of heater members described in prior art can not be conducted timely, thus cause the temperature of described heater members higher, affect the technical problem of the work of heater members, reach the technique effect improving described electronic equipment dissipating heat efficiency.
The application provides a kind of electronic equipment, and described electronic equipment comprises: the electronic device of heating, heat sink, conducting piece and actuator, and described heat sink is made up of Heat Conduction Material; Described conducting piece is arranged between described electronic device and described heat sink, for the heat conduction that produced by described electronic device to described heat sink; Described actuator vibrates for driving described heat sink, to improve radiating efficiency.
Preferably, the piezoelectric ceramic that described actuator comprises oscillating circuit and is electrically connected with described oscillating circuit, described heat sink is fixed on described piezoelectric ceramic, when described oscillating circuit passes into electric current, described piezoelectric ceramic can produce vibration, vibrates to drive described heat sink.
Preferably, described electronic equipment also comprises temperature-detecting device and controller, and described temperature-detecting device is for detecting the temperature of described electronic device, and described controller adjusts the vibration frequency of described oscillating circuit according to the temperature of described detection.
Preferably, described heat sink comprises multiple multiple fin be arranged at abreast on described piezoelectric ceramic.
Preferably, the shell fragment that described actuator involving vibrations motor is connected with described vibrating motor, described heat sink is fixed on described shell fragment, and described vibrating motor vibrates for driving described shell fragment, vibrates to drive described heat sink.
Preferably, described electronic equipment also comprises temperature-detecting device and controller, and described temperature-detecting device is for detecting the temperature of described electronic device, and described controller controls vibration frequency or the Oscillation Amplitude of described vibrating motor according to the temperature of described detection.
Preferably, described heat sink comprises multiple multiple fin be arranged at abreast on described shell fragment.
The application's beneficial effect is as follows:
Above-mentioned electronic equipment vibrates to drive described heat sink by arranging actuator, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink and ambient air, thus raising radiating rate, the heat improving the generation of heater members described in prior art can not be conducted timely, thus cause the temperature of described heater members higher, affect the technical problem of the work of heater members, reach the technique effect improving described electronic equipment dissipating heat efficiency.
By arranging described oscillating circuit and being fixed on the piezoelectric ceramic be connected on described heat sink and with described oscillating circuit, when described oscillating circuit passes into electric current, described oscillating circuit can produce oscillating current, described piezoelectric ceramic can vibrate under the excitation of described oscillating current, thus drive described heat sink to vibrate, ambient air flowing velocity is accelerated, thus improves the rate of heat exchange between described heat radiation and ambient air, thus improve radiating rate.
When the vibration frequency of described oscillating circuit is adjustable, by arranging the checkout gear of temperature and the temperature according to described detection for detecting described electronic device, control the controller of the vibration frequency of described oscillating circuit, when the temperature of described electronic device is higher, the vibration frequency that can control described oscillating circuit increases, to improve the rate of heat exchange between described heat sink and ambient air.
By arranging described vibrating motor and being fixed on described heat sink and vibrating with described the shell fragment be connected, when described vibrating motor starts, described vibrating motor drives described shell fragment to vibrate, thus drive described heat sink to vibrate, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink and ambient air, thus improve radiating rate.
By arranging the checkout gear of temperature and the temperature according to described detection for detecting described electronic device, control the vibration frequency of described vibrating motor and the controller of amplitude, when the temperature of described electronic device is higher, vibration frequency and the amplitude that can control described vibrating motor increase, to improve the rate of heat exchange between described heat sink and ambient air, when the temperature of described electronic device is lower than safe temperature, vibration frequency and the amplitude that can control described vibrating motor reduce, to improve the utilance of resource, avoid the waste of the energy.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described by the accompanying drawing used required in describing embodiment below, apparently, the accompanying drawing in the following describes is only some embodiments of the present invention.
Fig. 1 is the structural representation of the application one better embodiment electronic equipment;
Fig. 2 is the structural representation of another better embodiment electronic equipment.
Embodiment
The embodiment of the present application is by providing a kind of electronic equipment, the heat improving the generation of heater members described in prior art can not be conducted timely, thus cause the temperature of described heater members higher, affect the technical problem of the work of heater members, reach the technique effect improving described electronic equipment dissipating heat efficiency.
Technical scheme in the embodiment of the present application is for solving the problems of the technologies described above, and general thought is as follows:
A kind of electronic equipment, described electronic equipment comprises: the electronic device of heating, heat sink, conducting piece and actuator, and described heat sink is made up of Heat Conduction Material; Described conducting piece is arranged between described electronic device and described heat sink, for the heat conduction that produced by described electronic device to described heat sink; Described actuator vibrates for driving described heat sink, to improve radiating efficiency.
Above-mentioned electronic equipment vibrates to drive described heat sink by arranging actuator, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink and ambient air, thus raising radiating rate, the heat improving the generation of heater members described in prior art can not be conducted timely, thus cause the temperature of described heater members higher, affect the technical problem of the work of heater members, reach the technique effect improving described electronic equipment dissipating heat efficiency.
In order to better understand technique scheme, below in conjunction with Figure of description and concrete execution mode, technique scheme is described in detail.
As shown in Figure 1, be the structural representation of the application one better embodiment electronic equipment 100.Described electronic equipment 100 comprises the electronic device 10 of heating, heat sink 20, conducting piece 30 and actuator 40.
Described electronic device 10 can be any electronic device of heating, as chip etc.
Described heat sink 20 is made up of Heat Conduction Material, and as aluminium, copper, aluminium alloy etc., the heat absorbed and week can be carried out exchange heat along air by described heat sink 20, to realize heat radiation.
Described conducting piece 30 is arranged between described electronic device 10 and described heat sink 20, for the heat conduction that produced by described electronic device 10 to described heat sink 20.Described conducting piece 30 is made up of highly heat-conductive material, in order to improve the pyroconductivity between described electronic device 10 and described heat sink 20.Described heat-conducting piece 30 can be made up of materials such as Graphene, heat conductive silica gel, heat-conducting creams.By arranging described heat-conducting piece 30, the gap between described heat sink 30 and described electronic device 10 can not only be filled, to improve the efficiency of described heat trnasfer, the effect such as damping, insulation can also be played simultaneously.
Actuator 40, vibrates for driving described heat sink 20, to improve radiating efficiency.When described heat sink 20 vibrates, ambient air flowing velocity can be accelerated, thus improve the rate of heat exchange between described heat sink 20 and ambient air, thus improve radiating rate.
Above-mentioned electronic equipment 100 vibrates to drive described heat sink 20 by arranging actuator 40, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink 20 and ambient air, thus raising radiating rate, the heat improving the generation of heater members described in prior art can not be conducted timely, thus cause the temperature of described heater members higher, affect the technical problem of the work of heater members, reach the technique effect improving described electronic equipment dissipating heat efficiency.
Preferably, the mode driving described heat sink 20 to vibrate has following two kinds at least:
The first: driven by oscillating circuit and piezoelectric ceramic.
As shown in Figure 1, the piezoelectric ceramic 42 that described actuator 40 comprises oscillating circuit 41 and is electrically connected with described oscillating circuit 41, described heat sink 20 is fixed on described piezoelectric ceramic 42, when described oscillating circuit 41 passes into electric current, described piezoelectric ceramic 42 can produce vibration, vibrates to drive described heat sink 20.
Described piezoelectric ceramic 42 is a kind of ceramic materials mechanical energy and electric energy can changed mutually, belongs to Inorganic Non-metallic Materials, is specifically as follows the one in the piezoelectric ceramic such as barium titanate series, lead zirconate titanate binary system, metaniobate system.
Described oscillating circuit 41 is a kind of circuit that can produce oscillating current, and described oscillating circuit is that a kind of size and Orientation is all with the electric current that the cycle changes.Described oscillating circuit 41 can be LC oscillating circuit, quartz crystal oscillator circuit and RC oscillating circuit etc.When the frequency of oscillation of described piezoelectric ceramic 42 does not need to regulate, the uncontrollable oscillating circuit of frequency can be adopted, LC vibrating circuit as all uncontrollable in electric capacity and inductance; Certainly, when the vibration frequency of described piezoelectric ceramic 42 needs adjustable, the adjustable oscillating circuit of frequency of oscillation can be adopted, RC oscillating circuit as all adjustable in resistance and electric capacity.
By arranging described oscillating circuit 41 and being fixed on the piezoelectric ceramic 42 be connected on described heat sink 20 and with described oscillating circuit 41, when described oscillating circuit 41 passes into electric current, described oscillating circuit 41 can produce oscillating current, described piezoelectric ceramic 42 can vibrate under the excitation of described oscillating current, thus drive described heat sink 20 to vibrate, ambient air flowing velocity is accelerated, thus improves the rate of heat exchange between described heat sink 20 and ambient air, thus improve radiating rate.
In implementation process, the vibration frequency of described oscillating circuit 41 can be set to regulate, that is, whenever be all, according to same vibration frequency, vibrational excitation is carried out to described piezoelectric ceramic 42, also can be set to adjustable by the vibration frequency of described oscillating circuit 41, user can the vibration frequency of oscillating circuit 41 described in manual adjustments.
Certainly, also the vibration frequency automatically adjusting described oscillating circuit 41 can be set to, particularly, described electronic equipment 100 also comprises controller 50 and temperature-detecting device 60, described temperature-detecting device 60 is for detecting the temperature of described electronic device 10, described controller 50, according to the temperature of described detection, controls the vibration frequency of described oscillating circuit 41.As: as described in the temperature of electronic device 10 higher time, as alarm temperature, described controller 50 can according to described temperature, the vibration frequency controlling described oscillating circuit 41 increases, thus the vibration frequency of described piezoelectric ceramic 42 is increased, the vibration frequency of described heat sink 20 increases, and reaches and accelerates described heat sink 20 ambient air flowing velocity further, thus improve the rate of heat exchange between described heat sink 20 and ambient air.
Particularly, in the present embodiment, described heat sink 20 comprises multiple multiple fin 21 be arranged at abreast on described piezoelectric ceramic 42.
The second: driven by vibrating motor and shell fragment.
As shown in Figure 2, the shell fragment 44 that described actuator 40 involving vibrations motor 43 is connected with described vibrating motor 43, described heat sink 20 is fixed on described shell fragment 44, and described vibrating motor 42 vibrates for driving described shell fragment 44, vibrates to drive described heat sink 20.
Vibrating motor 43 is exciting sources that power source and vibration source are combined as a whole, and vibrating motor 43 respectively installs one group of adjustable eccentric block at armature spindle two ends, and the centrifugal force utilizing axle and eccentric block High Rotation Speed to produce obtains exciting force.The exciting force utilance of vibrating motor 43 is high, energy consumption is little, noise is low, the life-span is long.The exciting force of vibrating motor 43 can step-less adjustment.
By arranging described vibrating motor 43 and being fixed on the shell fragment 44 be connected on described heat sink 20 and with described vibration 43, when described vibrating motor 43 starts, described vibrating motor 43 drives described shell fragment 44 to vibrate, thus drive described heat sink 20 to vibrate, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink 20 and ambient air, thus improve radiating rate.
In implementation process, can the vibration frequency of described vibrating motor 43 and amplitude be set to constant, that is, be whenever all, according to same vibration frequency, vibratory drive is carried out to described shell fragment 44, also can the vibration frequency of vibrating motor 43 described in manual adjustments and amplitude.
Certainly, also the vibration frequency and the amplitude that automatically adjust described vibrating motor 43 can be set to, particularly, described electronic equipment 100 also comprises controller 50 and temperature-detecting device 60, described temperature-detecting device 60 is for detecting the temperature of described electronic device 10, described controller 50, according to the temperature of described detection, controls vibration frequency or the Oscillation Amplitude of described vibrating motor 43.As: as described in the temperature of electronic device 10 higher time, as alarm temperature, described controller 50 can according to described temperature, the vibration frequency controlling described vibrating motor 43 increases or Oscillation Amplitude increase, thus the vibration frequency of described shell fragment 44 is increased or amplitude increase, the vibration frequency of described heat sink 20 and amplitude increase, and reach and accelerate described heat sink 20 ambient air flowing velocity further, thus improve the rate of heat exchange between described heat sink 20 and ambient air.And for example: when the temperature of described electronic device 10 is lower than safe temperature, described controller 50 can according to this temperature, and the vibration frequency controlling described vibrating motor 43 reduces and amplitude reduction, to improve the utilance of resource, avoids the waste of the energy.
Particularly, described heat sink 20 comprises multiple multiple fin 21 be arranged at abreast on described shell fragment 44.
Above-mentioned electronic equipment 100 vibrates to drive described heat sink 20 by arranging actuator 40, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink 20 and ambient air, thus raising radiating rate, the heat improving the generation of heater members described in prior art can not be conducted timely, thus cause the temperature of described heater members higher, affect the technical problem of the work of heater members, reach the technique effect improving described electronic equipment dissipating heat efficiency.
By arranging described oscillating circuit 41 and being fixed on the piezoelectric ceramic 42 be connected on described heat sink 20 and with described oscillating circuit 41, when described oscillating circuit 41 passes into electric current, described oscillating circuit 41 can produce oscillating current, described piezoelectric ceramic 42 can vibrate under the excitation of described oscillating current, thus drive described heat sink 20 to vibrate, ambient air flowing velocity is accelerated, thus improves the rate of heat exchange between described heat sink 20 and ambient air, thus improve radiating rate.
When the vibration frequency of described oscillating circuit 41 is adjustable, by arranging the checkout gear 60 of temperature and the temperature according to described detection for detecting described electronic device 10, control the controller 50 of the vibration frequency of described oscillating circuit 41, when the temperature of described electronic device 10 is higher, the vibration frequency that can control described oscillating circuit 41 increases, to improve the rate of heat exchange between described heat sink 20 and ambient air.
By arranging described vibrating motor 42 and being fixed on the shell fragment 44 be connected on described heat sink 20 and with described vibration 42, when described vibrating motor 42 starts, described vibrating motor 42 drives described shell fragment 44 to vibrate, thus drive described heat sink 20 to vibrate, ambient air flowing velocity is accelerated, thus the rate of heat exchange improved between described heat sink 20 and ambient air, thus improve radiating rate.
By arranging the checkout gear 60 of temperature and the temperature according to described detection for detecting described electronic device 10, control the vibration frequency of described vibrating motor 43 and the controller 50 of amplitude, when the temperature of described electronic device 10 is higher, vibration frequency and the amplitude that can control described vibrating motor 43 increase, to improve the rate of heat exchange between described heat sink 20 and ambient air, when the temperature of described electronic device 10 is lower than safe temperature, vibration frequency and the amplitude that can control described vibrating motor 43 reduce, to improve the utilance of resource, avoid the waste of the energy.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.

Claims (7)

1. an electronic equipment, described electronic equipment comprises:
The electronic device of heating;
Heat sink, is made up of Heat Conduction Material;
Conducting piece, is arranged between described electronic device and described heat sink, for the heat conduction that produced by described electronic device to described heat sink;
Actuator, for driving described heat sink to vibrate, to improve radiating efficiency.
2. electronic equipment as claimed in claim 1, it is characterized in that, the piezoelectric ceramic that described actuator comprises oscillating circuit and is electrically connected with described oscillating circuit, described heat sink is fixed on described piezoelectric ceramic, when described oscillating circuit passes into electric current, described piezoelectric ceramic can produce vibration, vibrates to drive described heat sink.
3. electronic equipment as claimed in claim 2, it is characterized in that, described electronic equipment also comprises temperature-detecting device and controller, and described temperature-detecting device is for detecting the temperature of described electronic device, and described controller adjusts the vibration frequency of described oscillating circuit according to the temperature of described detection.
4. electronic equipment as claimed in claim 2 or claim 3, it is characterized in that, described heat sink comprises multiple multiple fin be arranged at abreast on described piezoelectric ceramic.
5. electronic equipment as claimed in claim 1, it is characterized in that, the shell fragment that described actuator involving vibrations motor is connected with described vibrating motor, described heat sink is fixed on described shell fragment, described vibrating motor vibrates for driving described shell fragment, vibrates to drive described heat sink.
6. electronic equipment as claimed in claim 5, it is characterized in that, described electronic equipment also comprises temperature-detecting device and controller, described temperature-detecting device is for detecting the temperature of described electronic device, and described controller controls vibration frequency or the Oscillation Amplitude of described vibrating motor according to the temperature of described detection.
7. the electronic equipment as described in claim 5 or 6, is characterized in that, described heat sink comprises multiple multiple fin be arranged at abreast on described shell fragment.
CN201410058608.XA 2014-02-20 2014-02-20 Electronic device Pending CN104869786A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105283041A (en) * 2015-10-26 2016-01-27 南京航空航天大学 Piezoelectric driven rapid cooling device
CN111649894A (en) * 2020-07-03 2020-09-11 中国飞机强度研究所 Thermal vibration test device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1734394A (en) * 2004-08-13 2006-02-15 上海乐金广电电子有限公司 Heat radiation apparatus utilizing vibration
CN101193539A (en) * 2006-11-30 2008-06-04 英业达股份有限公司 Heat radiator with dust-removing function
KR20110097552A (en) * 2010-02-23 2011-08-31 한국과학기술원 Heat sink having cooling fin capable of vibrating
CN102841615A (en) * 2011-06-24 2012-12-26 中兴通讯股份有限公司 Method and device for regulating temperature of terminal and terminal
CN103369916A (en) * 2012-03-30 2013-10-23 台达电子工业股份有限公司 A heat-dissipating module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1734394A (en) * 2004-08-13 2006-02-15 上海乐金广电电子有限公司 Heat radiation apparatus utilizing vibration
CN101193539A (en) * 2006-11-30 2008-06-04 英业达股份有限公司 Heat radiator with dust-removing function
KR20110097552A (en) * 2010-02-23 2011-08-31 한국과학기술원 Heat sink having cooling fin capable of vibrating
CN102841615A (en) * 2011-06-24 2012-12-26 中兴通讯股份有限公司 Method and device for regulating temperature of terminal and terminal
CN103369916A (en) * 2012-03-30 2013-10-23 台达电子工业股份有限公司 A heat-dissipating module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105283041A (en) * 2015-10-26 2016-01-27 南京航空航天大学 Piezoelectric driven rapid cooling device
CN111649894A (en) * 2020-07-03 2020-09-11 中国飞机强度研究所 Thermal vibration test device

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Application publication date: 20150826

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