CN107683017A - High-insulativity wiring board - Google Patents
High-insulativity wiring board Download PDFInfo
- Publication number
- CN107683017A CN107683017A CN201711085699.6A CN201711085699A CN107683017A CN 107683017 A CN107683017 A CN 107683017A CN 201711085699 A CN201711085699 A CN 201711085699A CN 107683017 A CN107683017 A CN 107683017A
- Authority
- CN
- China
- Prior art keywords
- layer
- wiring board
- insulativity
- aluminium base
- electro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 45
- 239000004411 aluminium Substances 0.000 claims abstract description 41
- 239000004020 conductor Substances 0.000 claims abstract description 28
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 229920000642 polymer Polymers 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 6
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
Abstract
The present invention relates to a kind of high-insulativity wiring board, including：Aluminium base；Alumina insulating layer, positioned at the aluminium base plate surface, to make the aluminium base be electrically insulated with the external world；Electro-plated pottery layer, positioned at the alumina insulation layer surface；Conductor layer, the surface of the electro-plated pottery layer is printed in, to form default conducting wire.Above-mentioned high-insulativity wiring board utilizes being sequentially provided with aluminum insulation layer, electro-plated pottery layer on aluminium base to increase the insulating properties of wiring board, to reach the effect of the insulating properties of wiring board.
Description
Technical field
The present invention relates to circuit field, more particularly to high-insulativity wiring board.
Background technology
With the new line of global environmental consciousness, energy saving turns into current trend.LED industry is most to be looked steadily in recent years
One of purpose industry.Be developed so far, LED product have energy-conservation, power saving, high efficiency, the reaction time is fast, life cycle is long and
It is not mercurous, there is environmental benefit.
However, current LED circuit board makes circuit again after powerful work for a long time easily due to the aging of wiring board
Circuit mutual conduction on plate, in turn results in short circuit.
The content of the invention
Based on this, it is necessary to for it is above-mentioned due to current wiring board after long-term use, wiring board aging causes circuit short
A kind of the problem of road, there is provided high-insulativity wiring board having compared with high-insulativity.
A kind of high-insulativity wiring board, including：
Aluminium base；
Alumina insulating layer, positioned at the aluminium base plate surface, to make the aluminium base be electrically insulated with the external world；
Electro-plated pottery layer, positioned at the alumina insulation layer surface；
Conductor layer, the surface of the electro-plated pottery layer is printed in, to form default conducting wire.
In a wherein preferred embodiment, the electro-plated pottery layer is silicon carbide ceramics layer.
In a wherein preferred embodiment, also have insulation poly- between the electro-plated pottery layer and the conductor layer
Compound layer.
In a wherein preferred embodiment, the thickness of the dielectric polymers is 2 μm -5 μm.
In a wherein preferred embodiment, the thickness of the conductor layer is 5 μm~10 μm.
In a wherein preferred embodiment, the thickness of the aluminium base is at least 0.1mm.
In a wherein preferred embodiment, the conductor layer is formed by copper foil.
In a wherein preferred embodiment, the opposite sides face of the aluminium base is respectively provided with the alumina insulation
Layer, electro-plated pottery layer and conductor layer.
In a wherein preferred embodiment, the alumina insulating layer, electro-plated pottery layer and conductor layer are positioned at described
The one side of aluminium base, the high-insulativity wiring board also include the heat sink positioned at the aluminium base another side.
In a wherein preferred embodiment, the heat sink undulate.
Above-mentioned high-insulativity wiring board utilizes on aluminium base being sequentially provided with aluminum insulation layer, electro-plated pottery layer to increase line
The insulating properties of road plate, reach the effect of the insulating properties of wiring board.
Brief description of the drawings
Fig. 1 is the structural representation of the high-insulativity wiring board of a preferred embodiment of the invention；
Fig. 2 is the structural representation of the high-insulativity wiring board of another preferred embodiment of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as " being arranged at " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
As shown in figure 1, a preferred embodiment of the invention discloses a kind of high-insulativity wiring board 100, the high-insulativity
Wiring board 100 includes aluminium base 110, alumina insulating layer 120, electro-plated pottery layer 130 and conductor layer 140.
Above-mentioned high-insulativity wiring board 100 in present embodiment is the wiring board of one side circuit, in present embodiment
Above-mentioned aluminium base 110 can be thin sheet like plate, and usually, the thickness of the aluminium base 110 is at least 0.1mm, the thin plate in the form of sheets
Aluminium base 110 can have upper surface and the lower surface relative with the upper surface.
Above-mentioned alumina insulating layer 120 is located at the upper surface of above-mentioned aluminium base 110, mainly make above-mentioned aluminium base 110 with it is outer
Boundary is electrically insulated.
Above-mentioned electro-plated pottery layer 130 is located at the surface of above-mentioned alumina insulating layer 120.Specifically, above-mentioned electro-plated pottery layer
130 can be silicon carbide ceramics layer.
The above-mentioned printing of conductor layer 140 and the surface of above-mentioned electro-plated pottery layer 130, and on the surface of its electro-plated pottery layer 130
Form preinstalled circuit.
In more detail, there can also be insulating polymer between above-mentioned electro-plated pottery layer 130 and above-mentioned conductor layer 140
Layer, can so strengthen the insulating properties between above-mentioned conductor layer 140 and aluminium base 110.Usually, the dielectric polymers can
Formed with being referred and synthesized including butadiene-styrene rubber or butadiene-styrene rubber with aluminum oxide, so, the dielectric polymers can both have high insulation
Property, can also have high-termal conductivity.In present embodiment, the thickness of above-mentioned dielectric polymers is 2 μm -5 μm.Above-mentioned conductor layer
Thickness can be 5 μm~10 μm.
Above-mentioned conductor layer is formed by copper foil.
Have in the lower surface of above-mentioned aluminium base 110 and heat sink 150, the lower surface of the heat sink 150 and aluminium base 110
Contact, quickly to transmit and distribute heat, to reach the effect quickly to radiate.In more detail, the heat sink 150 can
Waveform is thought, to increase the radiating effect of the heat sink 150.
The above-mentioned high-insulativity wiring board 100 of above-mentioned embodiment using on aluminium base being sequentially provided with aluminum insulation layer,
Electro-plated pottery layer reaches the effect of the insulating properties of wiring board to increase the insulating properties of wiring board 100.
As shown in Fig. 2 another preferred embodiment of the present invention discloses a kind of high-insulativity wiring board 200, height insulation
Property wiring board 200 includes aluminium base 210, alumina insulating layer 220, electro-plated pottery layer 230 and conductor layer 240.
Above-mentioned high-insulativity wiring board 200 in present embodiment is the wiring board of Double-side line, in present embodiment
Above-mentioned aluminium base 210 can be thin sheet like plate, and usually, the thickness of the aluminium base 210 is at least 0.1mm, the thin plate in the form of sheets
Aluminium base 210 can have upper surface and the lower surface relative with the upper surface.
Above-mentioned alumina insulating layer 220 is located at the upper surface of above-mentioned aluminium base 210, mainly make above-mentioned aluminium base 210 with it is outer
Boundary is electrically insulated.
Above-mentioned electro-plated pottery layer 230 is located at the upper surface of above-mentioned alumina insulating layer 220.Specifically, above-mentioned electro-plated pottery
Layer 230 can be silicon carbide ceramics layer.
The above-mentioned printing of conductor layer 240 and the upper surface of above-mentioned electro-plated pottery layer 230, and in the table of its electro-plated pottery layer 230
Face forms preinstalled circuit.
In more detail, there can also be insulating polymer between above-mentioned electro-plated pottery layer 230 and above-mentioned conductor layer 240
Layer, can so strengthen the insulating properties between above-mentioned conductor layer 240 and aluminium base 210.Usually, the dielectric polymers can
Formed with being referred and synthesized including butadiene-styrene rubber or butadiene-styrene rubber with aluminum oxide, so, the dielectric polymers can both have high insulation
Property, can also have high-termal conductivity.In present embodiment, the thickness of above-mentioned dielectric polymers is 2 μm -5 μm.Above-mentioned conductor layer
Thickness can be 5 μm~10 μm.
Alumina insulating layer 220 also is located at the lower surface of above-mentioned aluminium base 210, mainly makes above-mentioned aluminium base 210 and the external world
It is electrically insulated.
Positioned at the lower surface of the alumina insulating layer 220 of the lower surface of above-mentioned aluminium base 210, similarly with electro-plated pottery
Layer 230.Specifically, the electro-plated pottery layer 230 can be silicon carbide ceramics layer.
Conductor layer 240 is printed in the lower surface of the electro-plated pottery layer 230, and is formed on the surface of its electro-plated pottery layer 230
Preinstalled circuit.
In more detail, there can also be insulating polymer between above-mentioned electro-plated pottery layer 230 and above-mentioned conductor layer 240
Layer, can so strengthen the insulating properties between above-mentioned conductor layer 240 and aluminium base 210.Usually, the dielectric polymers can
Formed with being referred and synthesized including butadiene-styrene rubber or butadiene-styrene rubber with aluminum oxide, so, the dielectric polymers can both have high insulation
Property, can also have high-termal conductivity.In present embodiment, the thickness of above-mentioned dielectric polymers is 2 μm -5 μm.Above-mentioned conductor layer
Thickness can be 5 μm~10 μm.
Above-mentioned conductor layer is formed by copper foil.
The above-mentioned high-insulativity wiring board 100 of present embodiment on two-sided in aluminium base using being provided with aluminum insulation layer, electricity
Ceramic platingv layer reaches the effect of the insulating properties of wiring board to increase the insulating properties of wiring board 100.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. high-insulativity wiring board, it is characterised in that including：Aluminium base；Alumina insulating layer, positioned at the aluminium base plate surface, to make the aluminium base be electrically insulated with the external world；Electro-plated pottery layer, positioned at the alumina insulation layer surface；Conductor layer, the surface of the electro-plated pottery layer is printed in, to form default conducting wire.
- 2. high-insulativity wiring board according to claim 1, it is characterised in that the electro-plated pottery layer is silicon carbide ceramics Layer.
- 3. high-insulativity wiring board according to claim 1, it is characterised in that in the electro-plated pottery layer and the wire Also there are dielectric polymers between layer.
- 4. high-insulativity wiring board according to claim 3, it is characterised in that the thickness of the dielectric polymers is 2 μ m-5μm。
- 5. high-insulativity wiring board according to claim 1, it is characterised in that the thickness of the conductor layer is 5 μm~10 μ m。
- 6. high-insulativity wiring board according to claim 1, it is characterised in that the thickness of the aluminium base is at least 0.1mm。
- 7. high-insulativity wiring board according to claim 1, it is characterised in that the conductor layer is formed by copper foil.
- 8. high-insulativity wiring board according to claim 1, it is characterised in that the opposite sides face of the aluminium base has There are the alumina insulating layer, electro-plated pottery layer and conductor layer.
- 9. high-insulativity wiring board according to claim 1, it is characterised in that the alumina insulating layer, electro-plated pottery Layer and conductor layer are located at the one side of the aluminium base, and the high-insulativity wiring board also includes being located at the aluminium base opposite side The heat sink in face.
- 10. high-insulativity wiring board according to claim 9, it is characterised in that the heat sink undulate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711085699.6A CN107683017A (en) | 2017-11-07 | 2017-11-07 | High-insulativity wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711085699.6A CN107683017A (en) | 2017-11-07 | 2017-11-07 | High-insulativity wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107683017A true CN107683017A (en) | 2018-02-09 |
Family
ID=61146647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711085699.6A Pending CN107683017A (en) | 2017-11-07 | 2017-11-07 | High-insulativity wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107683017A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127224A (en) * | 1999-10-29 | 2001-05-11 | Kyocera Corp | Insulating alumina board and alumina copper-pasted circuit board |
| JP2007165751A (en) * | 2005-12-16 | 2007-06-28 | Multi:Kk | Wiring board, and method for manufacturing same |
| CN202406386U (en) * | 2012-01-09 | 2012-08-29 | 苏州艾迪亚电子科技有限公司 | High efficient heat radiation aluminum substrate |
| CN107072038A (en) * | 2017-03-23 | 2017-08-18 | 深圳亚信昌科技有限公司 | Double-side aluminum circuit board and preparation method thereof |
| CN207560460U (en) * | 2017-11-07 | 2018-06-29 | 百硕电脑(苏州)有限公司 | High-insulativity wiring board |
-
2017
- 2017-11-07 CN CN201711085699.6A patent/CN107683017A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127224A (en) * | 1999-10-29 | 2001-05-11 | Kyocera Corp | Insulating alumina board and alumina copper-pasted circuit board |
| JP2007165751A (en) * | 2005-12-16 | 2007-06-28 | Multi:Kk | Wiring board, and method for manufacturing same |
| CN202406386U (en) * | 2012-01-09 | 2012-08-29 | 苏州艾迪亚电子科技有限公司 | High efficient heat radiation aluminum substrate |
| CN107072038A (en) * | 2017-03-23 | 2017-08-18 | 深圳亚信昌科技有限公司 | Double-side aluminum circuit board and preparation method thereof |
| CN207560460U (en) * | 2017-11-07 | 2018-06-29 | 百硕电脑(苏州)有限公司 | High-insulativity wiring board |
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