CN111031657A - LED lamp circuit board, LED lamp and manufacturing method of LED lamp circuit board - Google Patents
LED lamp circuit board, LED lamp and manufacturing method of LED lamp circuit board Download PDFInfo
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- CN111031657A CN111031657A CN201911261070.1A CN201911261070A CN111031657A CN 111031657 A CN111031657 A CN 111031657A CN 201911261070 A CN201911261070 A CN 201911261070A CN 111031657 A CN111031657 A CN 111031657A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED lamp circuit board, an LED lamp and a manufacturing method of the LED lamp circuit board, wherein the LED lamp circuit board comprises the following components: a first insulating layer; the first conducting layer is arranged on the upper surface of the first insulating layer, and the heat dissipation layer is arranged on the lower surface of the first insulating layer; a second conductive layer disposed between the first insulating layer and the heat dissipation layer; a second insulating layer disposed between the second conductive layer and the heat dissipation layer; the second conductive layer is connected to the positive electrode line of the first conductive layer. According to the embodiment of the invention, the second conducting layer is arranged between the first insulating layer and the heat dissipation layer, the second insulating layer is arranged between the second conducting layer and the heat dissipation layer, the second conducting layer is connected with the anode line of the first conducting layer, and the parasitic capacitor on the LED lamp panel is isolated by the second conducting layer, so that current does not flow through the parasitic capacitor of the LED lamp panel and the LED lamp any more, the LED lamp can be prevented from being slightly lightened after being powered off, reverse voltage cannot be generated, and the service life of the LED lamp is prolonged.
Description
Technical Field
The invention relates to the field of illumination, in particular to an LED lamp circuit board, an LED lamp and a manufacturing method of the LED lamp circuit board.
Background
The LED lamp is an electroluminescent semiconductor material chip, silver glue or white glue is solidified on a support, then the chip and a circuit board are connected by silver wires or gold wires, and the periphery of the chip and the circuit board is sealed by epoxy resin.
However, the LED lamp generates a large amount of heat during the light emitting process, and the LED lamp needs to be attached to a metal plate for heat dissipation when the heat is conducted out. In this manner, the conductive copper foil, the insulating layer and the heat sink layer form a parasitic capacitor. The parasitic capacitor can enable the LED lamp to be slightly bright under a certain condition, and can also enable the LED lamp to generate reverse voltage, the electric energy can be wasted due to slight brightness, and the service life of the LED lamp can be shortened due to the reverse voltage.
Disclosure of Invention
The embodiment of the invention provides an LED lamp circuit board, an LED lamp and a manufacturing method of the LED lamp circuit board, and aims to solve the problems of slight brightness and reverse voltage of an LED lamp.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an LED lamp circuit board is provided, which includes:
a first insulating layer;
the first conducting layer is arranged on the upper surface of the first insulating layer, and the heat dissipation layer is arranged on the lower surface of the first insulating layer;
a second conductive layer disposed between the first insulating layer and the heat dissipation layer;
a second insulating layer disposed between the second conductive layer and the heat dissipation layer;
the second conductive layer is connected to the positive electrode line of the first conductive layer.
Further, the second conductive layer is connected with the positive line of the first conductive layer through the via hole on the first insulating layer.
Furthermore, the second conducting layer is connected with the heat dissipation layer through the via hole in the second insulating layer, and the heat dissipation layer is connected with the shell of the LED lamp.
Further, a plurality of groups of integrated circuits are formed on the first conductive layer, and each group of integrated circuits comprises a positive electrode circuit and a negative electrode circuit.
Further, an LED lamp is arranged between the positive electrode circuit and the negative electrode circuit.
Further, the second conducting layer is connected with the positive electrode voltage of the LED lamp.
Further, the first and second conductive layers each include: a conductive copper foil layer or a conductive aluminum foil layer.
In a second aspect, an LED lamp is provided, comprising: the LED lamp circuit board of any one of the above, and the casing that links to each other with the heat dissipation layer of LED lamp circuit board.
In a third aspect, a method for manufacturing a circuit board of an LED lamp is provided, which includes:
forming a first conductive layer on an upper surface of the first insulating layer;
generating a heat dissipation layer on the lower surface of the first insulating layer;
generating a second conductive layer between the first insulating layer and the heat dissipation layer;
creating a second insulating layer between the second conductive layer and the heat spreading layer;
and connecting the second conductive layer with the positive electrode circuit of the first conductive layer.
Further, connecting the second conductive layer with the positive electrode line of the first conductive layer includes:
providing a via on the first insulating layer;
and connecting the second conductive layer with the positive circuit of the first conductive layer through the through hole of the first insulating layer.
Further, the method further comprises:
arranging a via hole on the second insulating layer;
connecting the second conductive layer with the heat dissipation layer through a via hole on the second insulating layer;
the heat dissipation layer is connected with the shell of the LED lamp.
In the embodiment of the invention, the second conducting layer is arranged between the first insulating layer and the heat dissipation layer, the second insulating layer is arranged between the second conducting layer and the heat dissipation layer, the second conducting layer is connected with the anode line of the first conducting layer, and the parasitic capacitor on the LED lamp panel is isolated by the second conducting layer, so that current does not flow through the parasitic capacitor of the LED lamp panel and the LED lamp any more, the LED lamp can be prevented from being slightly lightened after being powered off, reverse voltage cannot be generated, and the service life of the LED lamp is prolonged.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic layout diagram of an LED circuit board according to an embodiment of the present invention;
fig. 2 is a circuit diagram corresponding to the LED circuit board provided in an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a flow direction of current in an L-PE direction when the LED circuit board provided by the embodiment of the invention is in operation;
FIG. 4 is a schematic diagram illustrating a current flow in a PE-L direction when the LED circuit board provided by the embodiment of the invention is in operation;
fig. 5 is a flowchart of a method for manufacturing a circuit board of an LED lamp according to an embodiment of the present invention;
100-an LED circuit board; 110-a first conductive layer; 120-a first insulating layer; 130-a second conductive layer; 140-a second insulating layer; 150-heat dissipation layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides an LED lamp circuit board, wherein a second conducting layer is added to connect with an anode circuit of a first conducting layer, so that a parasitic capacitor on an LED lamp panel is isolated by the second conducting layer, and the problems that an LED is slightly bright after power failure and a reverse voltage is easy to damage an LED lamp are solved.
Fig. 1 is a schematic layout diagram of an LED circuit board according to an embodiment of the present invention. This LED circuit board 100 specifically includes: a first insulating layer 120; a first conductive layer 110 disposed on the upper surface of the first insulating layer 120 and a heat dissipation layer 150 disposed on the lower surface of the first insulating layer 120; a second conductive layer 130 disposed between the first insulating layer 120 and the heat dissipation layer 150; and a second insulating layer 140 disposed between the second conductive layer 130 and the heat dissipation layer 150. The second conductive layer 130 is connected to the positive line of the first conductive layer 110.
In this application embodiment, through set up the second conducting layer between first insulating layer and heat dissipation layer, set up the second insulating layer between second conducting layer and heat dissipation layer to with the positive pole line connection of second conducting layer and first conducting layer, parasitic capacitance on the LED lamp plate is kept apart by the second conducting layer, makes the parasitic capacitance and the LED lamp that the electric current no longer flows through the LED lamp plate, can realize no longer slightly bright after the LED lamp outage, also can not produce reverse voltage, increases the life of LED lamp.
In one possible embodiment of the invention, the first conductive layer and the second conductive layer are both metal conductive layers for conduction, such as: conductive aluminum foil layers, conductive copper foil layers, conductive gold foil layers, and the like.
Fig. 2 is a circuit diagram of an LED circuit board according to an embodiment of the present invention. The capacitors CA and CB are parasitic capacitors formed between the first conductive layer 110 and the second conductive layer 130 in the LED circuit board; CC is a parasitic capacitance generated between the second conductive layer 130 and the heat dissipation layer 150. DB1 is bridge full wave rectification circuit; the capacitor C1 is a power supply EMC (Electromagnetic Compatibility) capacitor; the capacitor C2 is a filter capacitor. The LED lamp welds and forms the LED lamp plate on first conducting layer 110, and the number of LED lamp can be set for according to actual conditions. Fig. 2 illustrates three LED lamps as an example.
Specifically, the connection relationship is as follows:
the first end of the bridge full-wave rectification circuit DB1 is connected to a first terminal L (Live Wire) of the power supply, the second end is connected to an anode line of the LED lamp panel, one end of the second capacitor C2, and an anode line of the second conductive layer 130, the third end is connected to a second terminal N (Neutral Wire) of the power supply, and the fourth end is connected to one end of the first capacitor C1. The other end of second electric capacity C2 is connected with the other end of first electric capacity and the negative pole circuit of LED lamp plate respectively. The LED lamp plate circuit includes the LED lamp of a plurality of series connections, wherein, the positive pole of first LED lamp LEDA respectively with the second end of bridge type full wave rectifier circuit DB1, the anodal line connection of second conducting layer 130, the negative pole of first LED lamp LEDA respectively with the positive pole of second LED lamp LEDB, parasitic capacitance CA's one end is connected, the negative pole of second LED lamp LEDB respectively with the positive pole of third LED lamp LEDC, parasitic capacitance CB's one end is connected, the negative pole of second LED lamp LEDC respectively with the other end of first electric capacity C1, the other end of second electric capacity C2 is connected. The other end of the parasitic capacitor CA is connected to the second conductive layer 130. The other end of the parasitic capacitor CB is connected to the second conductive layer 130. The negative electrode line of the second conductive layer 130 is connected to one end of the parasitic capacitance CC. The other end of the parasitic capacitor CC is connected to a third terminal PE (Earth wire) of the power supply.
Fig. 3 to fig. 4 are schematic diagrams illustrating a current flow direction when the LED circuit board provided by the embodiment of the present invention operates. As shown in the figure, increase one deck second conducting layer 130, and after the anodal circuit of LED lamp plate, parasitic capacitance CA and the CB of LED lamp plate are by second conducting layer 130 short circuit, and L-PE's electric current no longer flows through the parasitic capacitance and the LED lamp of LED lamp plate, and the LED lamp is no longer slightly bright after the outage. Since the current of the PE-L directly flows to the bridge full-wave rectifying circuit DB1 through the capacitor CC and the second conductive layer 130, it does not pass through the LED lamp, and therefore, the reverse voltage is not generated.
In one possible embodiment of the present invention, the second conductive layer 130 is connected to the positive wiring board of the first conductive layer 110 through a via hole on the first insulating layer 120. Through linking together second conducting layer 130 and first conducting layer 110, the parasitic capacitance short circuit of second conducting layer with the LED lamp plate, the outage back, no longer have voltage on the parasitic capacitance, therefore the LED lamp can not be slightly bright.
In one possible embodiment of the present invention, the second conductive layer 130 and the heat dissipation layer 150 are connected through a via hole on the second insulating layer 140. The heat dissipation layer is connected with the shell of the LED lamp, namely the heat dissipation layer is grounded.
In one possible embodiment of the present invention, a plurality of sets of integrated circuits are formed on the first conductive layer 110, and each set of integrated circuits includes a positive electrode circuit and a negative electrode circuit. And an LED lamp is arranged between the anode circuit and the cathode circuit.
That is, the LED lamp is soldered on the first conductive layer 110 to form the LED lamp panel. The number of the LED lamps is set according to actual conditions, and is not limited herein.
In one possible embodiment of the present invention, the second conductive layer 130 is connected to the positive voltage of the LED lamp.
The embodiment of the invention also provides an LED lamp which comprises any one of the circuit boards such as the LED and the like and a shell connected with the heat dissipation layer 150 of the circuit board of the LED lamp.
The embodiment of the invention also provides a manufacturing method of the LED lamp circuit board, as shown in fig. 5, the manufacturing method of the LED lamp circuit board specifically comprises the following steps:
forming a first conductive layer on an upper surface of the first insulating layer;
generating a heat dissipation layer on the lower surface of the first insulating layer;
generating a second conductive layer between the first insulating layer and the heat dissipation layer;
creating a second insulating layer between the second conductive layer and the heat spreading layer;
and connecting the second conductive layer with the positive electrode circuit of the first conductive layer.
In this application embodiment, through set up the second conducting layer between first insulating layer and heat dissipation layer, set up the second insulating layer between second conducting layer and heat dissipation layer to with the positive pole line connection of second conducting layer and first conducting layer, parasitic capacitance on the LED lamp plate is kept apart by the second conducting layer, makes the parasitic capacitance and the LED lamp that the electric current no longer flows through the LED lamp plate, can realize no longer slightly bright after the LED lamp outage, also can not produce reverse voltage, increases the life of LED lamp.
Specifically, the order of the steps of the method is not limited, and the order of the layers is reasonable.
In one possible embodiment of the present invention, connecting the second conductive layer to the positive electrode line of the first conductive layer specifically includes:
providing a via on the first insulating layer;
and connecting the second conductive layer with the positive circuit of the first conductive layer through the through hole.
In this application embodiment, through the positive pole line connection of via hole with second conducting layer and first conducting layer, the parasitic capacitance short circuit of LED lamp plate is no longer had voltage on the second conducting layer, the outage back, therefore the LED lamp can not be slightly bright.
In one possible embodiment of the invention, the method further comprises:
arranging a via hole on the second insulating layer;
connecting the second conductive layer with the heat dissipation layer through a via hole on the second insulating layer;
the heat dissipation layer is connected with the shell of the LED lamp.
In one possible embodiment of the invention, the method further comprises:
generating a plurality of groups of integrated circuits on the first conductive layer;
wherein, every group integrated circuit all includes anodal circuit and negative pole circuit, all is provided with the LED lamp between every anodal circuit of group and negative pole circuit.
Further, the second conductive layer is connected to a positive electrode voltage of the LED or the like.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (11)
1. An LED lamp circuit board, characterized by, includes:
a first insulating layer;
the first conducting layer is arranged on the upper surface of the first insulating layer, and the heat dissipation layer is arranged on the lower surface of the first insulating layer;
a second conductive layer disposed between the first insulating layer and the heat dissipation layer;
a second insulating layer disposed between the second conductive layer and the heat dissipation layer;
the second conductive layer is connected to the positive electrode line of the first conductive layer.
2. The LED lamp circuit board of claim 1, wherein the second conductive layer is connected to the positive trace of the first conductive layer by a via on the first insulating layer.
3. The LED lamp circuit board of claim 1, wherein the second conductive layer is connected to the heat dissipation layer through a via hole in the second insulating layer, and the heat dissipation layer is connected to the housing of the LED lamp.
4. The LED lamp circuit board of claim 1, wherein a plurality of sets of integrated circuits are formed on the first conductive layer, each set of integrated circuits including a positive electrode circuit and a negative electrode circuit.
5. The LED lamp circuit board of claim 4, wherein an LED lamp is disposed between the positive and negative traces.
6. The LED lamp circuit board of claim 5, wherein the second conductive layer is connected to a positive voltage of the LED lamp.
7. The LED lamp cord plate of any of claims 1-6, wherein the first and second conductive layers each comprise: a conductive copper foil layer or a conductive aluminum foil layer.
8. An LED lamp, comprising: the LED light circuit board of any one of claims 1-7, and a housing connected to the heat sink layer of the LED light circuit board.
9. A manufacturing method of an LED lamp circuit board is characterized by comprising the following steps:
forming a first conductive layer on an upper surface of the first insulating layer;
generating a heat dissipation layer on the lower surface of the first insulating layer;
generating a second conductive layer between the first insulating layer and the heat dissipation layer;
creating a second insulating layer between the second conductive layer and the heat spreading layer;
and connecting the second conductive layer with the positive electrode circuit of the first conductive layer.
10. The method for manufacturing the circuit board of the LED lamp according to claim 9, wherein the step of connecting the second conductive layer to the positive electrode circuit of the first conductive layer comprises:
providing a via on the first insulating layer;
and connecting the second conductive layer with the positive circuit of the first conductive layer through the via hole on the first insulating layer.
11. The method for manufacturing the circuit board of the LED lamp according to claim 10, further comprising:
arranging a via hole on the second insulating layer;
connecting the second conductive layer with the heat dissipation layer through a via hole on the second insulating layer;
the heat dissipation layer is connected with the shell of the LED lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911261070.1A CN111031657A (en) | 2019-12-10 | 2019-12-10 | LED lamp circuit board, LED lamp and manufacturing method of LED lamp circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911261070.1A CN111031657A (en) | 2019-12-10 | 2019-12-10 | LED lamp circuit board, LED lamp and manufacturing method of LED lamp circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN111031657A true CN111031657A (en) | 2020-04-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911261070.1A Pending CN111031657A (en) | 2019-12-10 | 2019-12-10 | LED lamp circuit board, LED lamp and manufacturing method of LED lamp circuit board |
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| CN (1) | CN111031657A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287260A (en) * | 2016-09-29 | 2017-01-04 | 东莞市善时照明科技有限公司 | LED wiring board and LED and the application process of glimmer after eliminating LED power-off |
| CN209054524U (en) * | 2018-10-19 | 2019-07-02 | 江门市嘉胜照明有限公司 | A kind of wiring board and lamps and lanterns |
-
2019
- 2019-12-10 CN CN201911261070.1A patent/CN111031657A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287260A (en) * | 2016-09-29 | 2017-01-04 | 东莞市善时照明科技有限公司 | LED wiring board and LED and the application process of glimmer after eliminating LED power-off |
| CN209054524U (en) * | 2018-10-19 | 2019-07-02 | 江门市嘉胜照明有限公司 | A kind of wiring board and lamps and lanterns |
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Application publication date: 20200417 |