CN106287260B - LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure - Google Patents
LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure Download PDFInfo
- Publication number
- CN106287260B CN106287260B CN201610864091.2A CN201610864091A CN106287260B CN 106287260 B CN106287260 B CN 106287260B CN 201610864091 A CN201610864091 A CN 201610864091A CN 106287260 B CN106287260 B CN 106287260B
- Authority
- CN
- China
- Prior art keywords
- layer
- led lamp
- circuit
- circuit board
- conductive electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000010410 layer Substances 0.000 claims abstract description 139
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000011324 bead Substances 0.000 claims abstract description 12
- 239000002344 surface layer Substances 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000011190 CEM-3 Substances 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 claims 1
- 230000006698 induction Effects 0.000 abstract description 10
- 239000003990 capacitor Substances 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 241000258971 Brachiopoda Species 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 210000002615 epidermis Anatomy 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED lamp circuit board, an LED lamp and a method for eliminating slight brightness of the LED lamp after power failure, wherein the method comprises the following steps: a circuit board of an LED lamp comprises an insulating base material layer, wherein a circuit layer and an upper surface layer are sequentially arranged on the upper surface of the insulating base material layer, a positive circuit and a negative circuit are formed on the circuit layer, and a conductive electrode plate layer is further arranged on the lower surface of the insulating base material layer and is electrically connected and conducted with the positive circuit of the circuit layer; a LED lamp is characterized in that an LED lamp chip is welded on a bonding pad; a method for eliminating slight brightness of an LED lamp after power failure is provided, wherein an anode line of a line layer is connected with a conductive electrode plate layer by using a via hole insulating substrate layer to form an induction capacitance circuit, and the P-junction voltage of an LED lamp bead is guided to the conductive electrode plate layer after power failure. The invention aims to eliminate the voltage of the P junction of the circuit layer and the LED chip lamp bead, thereby solving the problem that the LED lamp is slightly bright after power failure.
Description
Technical Field
The invention relates to an LED circuit board, in particular to an LED lamp circuit board, an LED lamp and an application method for eliminating slight brightness of the LED lamp after power failure.
Background
The wiring of the LED lamp in practical use is shown in figure 1, a switch of a two-phase switch shown in figure 1 exists in practical use, when a switch for cutting off a single phase is used, and when a single-phase N line is cut off or a switch with an indicator lamp is used, a lamp bead can slightly emit light, and the wiring is particularly obvious at night. It will affect production and life, and the loss of electric energy. Specifically, in the internal structure (as shown in fig. 2) of the circuit board of the lamp, the aluminum substrate is connected to the housing of the lamp, that is, the aluminum substrate is grounded, when the lamp is abnormally turned off, the copper foil (LED bead patch layer) on the aluminum substrate stores the grid voltage, the epoxy resin (insulating layer) with the thickness of 100um is arranged in the middle of the aluminum substrate, and the aluminum is grounded, so that the whole aluminum substrate structure is equivalent to a capacitor. The PN junction of the LED lamp bead can emit light as long as the potential difference exists, and the intensity of the light emission is related to the current flowing through the PN junction, so that after an induction capacitor is formed on the aluminum substrate, the induction voltage of the capacitor is applied to the LED light source, and the LED light source emits light slightly. In the conventional capacitor structure shown in fig. 3, a and B are parallel conductive plates separated by an insulating material (e.g., air) and connected to a dc source E through a switch S. The two plates are kept neutral and uncharged before being powered on. When S is closed, the electrons of the polar plate A are attracted to the positive pole of the battery, so that A has a positive charge; meanwhile, electrons at the negative end of the battery are repelled to the polar plate B, so that the polar plate B has a negative charge; thus, an electric field is formed between the plates A, B and a potential difference V is established. This electron flow continues, and the amount of transferred electricity is proportional to the voltage of the power supply, and the movement of electrons is not stopped until the potential difference between the two plates AB is equal to the voltage of the power supply (V ═ E). In the process of electron flow, the energy of the power supply is taken out and stored on the two electrode plates, that is, the electric charge is stored. The capacitance induction principle is as follows: if the potential difference between two stages is 1V when the electricity quantity of the 1 library is charged, the capacitance is 1 method, namely: c ═ Q/U but the size of the capacitance is not determined by Q or U, i.e.: and C is epsilon S/4 pi kd. Wherein epsilon is a constant, S is the area opposite to the capacitor plate, d is the distance of the capacitor plate, and k is the constant of the electrostatic force. A typical plate capacitor has a capacitance C ═ S/d (e is the dielectric constant of the dielectric between the plates, S is the plate area, and d is the distance between the plates). Therefore, how to solve the above problems is a problem to be solved urgently.
Disclosure of Invention
The invention aims to solve the technical problem of the prior art, and provides an LED lamp circuit board, an LED lamp and an application method for eliminating slight brightness of the LED lamp after power failure.
The technical scheme of the invention is as follows: the utility model provides a LED lamp circuit board, includes the insulating substrate layer, sets gradually circuit layer and upper epidermis at the upper surface of insulating substrate layer, forms anodal circuit and negative pole circuit on the circuit layer, wherein: and the lower surface of the insulating substrate layer is also provided with a conductive electrode plate layer, and the conductive electrode plate layer is electrically connected and conducted with the positive circuit of the circuit layer.
According to the LED lamp circuit board adopting the technical scheme, the metal conductive electrode plate layer is arranged on the lower surface of the LED circuit board of the single surface of the insulating base material layer, the conductive electrode plate layer and the circuit layer on the upper surface of the insulating base material layer form opposite flat electrodes, the conductive electrode plate layer is electrically connected with the positive circuit of the circuit layer to form a flat capacitor structure, a sensing capacitor circuit is formed, and after power failure, the P-junction voltage of the LED lamp beads can be guided to the conductive electrode plate layer. The voltage of the P junction of the circuit layer and the LED chip lamp bead is eliminated, so that the phenomenon that the LED lamp is slightly bright after power failure is solved.
In the LED lamp circuit board, the conductive electrode plate layer and the anode circuit of the circuit layer are electrically connected and conducted with the insulating substrate layer through the via hole; the insulating substrate layer is provided with a conductive hole, the circuit layer of the upper positive circuit is stretched downwards through the conductive hole and is in physical contact with the lower conductive electrode plate layer, and a double-sided circuit board which is formed by the conductive electrode plate layer and the circuit layer. The circuit layer and the lower conductive electrode plate layer can be filled with tin materials to be conducted and the like.
According to the LED lamp circuit board, a plurality of groups of integrated circuits are formed on the circuit layer, each group of integrated circuits comprises a positive electrode and a negative electrode, and the circuit layer is provided with the pad positions at equal intervals; and the bonding pad position on the circuit layer is provided with an LED electronic component, and the positive electrode and the negative electrode of the LED electronic component are connected with the positive electrode and the negative electrode of the integrated circuit.
According to the LED lamp circuit board, the insulating substrate layer is a CEM-3 double-sided board with high heat conductivity coefficient, the thickness of the insulating substrate layer is 0.8-1.6 mmum, and the heat conductivity coefficient is (1.0-2.0) W/MK. The thickness of the insulating substrate layer ensures the distance between the electrode plates of the flat capacitor structure, so that the conductive electrode plate layer is electrically connected with the positive circuit of the circuit layer to form the flat capacitor structure, and an induction capacitance circuit is formed. The CEM-3 double-sided board with high heat conductivity coefficient can effectively dissipate heat on the heat dissipation shell body due to the heat of the LED electronic components.
In the LED lamp circuit board, the circuit layer is a copper foil layer, and the thickness of the circuit layer is 20-40 um.
The upper surface layer of the LED lamp circuit board is a corrosion inhibitor layer, and the thickness of the corrosion inhibitor layer is 20-30 mu m; the purposes of protecting the circuit layer and preventing oxidation and corrosion are achieved.
In the LED lamp circuit board, the lower surface of the conductive electrode plate layer is provided with the heat-conducting silica gel sheet; the heat conducting silica gel sheet is positioned on the lamp shell and conducts heat to the heat dissipation shell, and the heat conducting silica gel sheet has the properties of insulation, heat conduction and heat dissipation, so that the electric conducting plate layer is insulated from the lamp shell.
An LED lamp is characterized in that an LED lamp chip is arranged between a positive circuit and a negative circuit formed on a circuit layer, and the positive electrode and the negative electrode of the LED lamp chip are respectively welded and conducted with the positive circuit and the negative circuit correspondingly.
A LED lamp is characterized in that pad positions are arranged on a circuit layer at equal intervals, and LED lamp chips are welded on the pad positions; the purpose that the LED lamp chip is connected with the conductive electrode plate layer and the circuit layer is achieved.
An application method for eliminating slight brightness of an LED lamp after power failure, wherein: the positive line of circuit layer uses the electrically conductive polar plate layer of via hole insulating substrate layer and bottom to couple together and form the induction capacitance circuit, leads LED lamp pearl P knot voltage to on the electrically conductive polar plate layer after the outage. The voltage of the P junction of the circuit layer and the LED chip lamp bead is eliminated, so that the phenomenon that the LED lamp is slightly bright after power failure is solved.
Drawings
The invention will be further described in detail with reference to examples of embodiments shown in the drawings to which, however, the invention is not restricted.
FIG. 1 is a wiring structure of an LED lamp in practical use;
FIG. 2 is a schematic diagram of an internal structure of a circuit board of a conventional LED lamp circuit board;
FIG. 3 is a schematic circuit diagram of the operation of the capacitor;
FIG. 4 is a schematic cross-sectional view of the connection structure of the circuit board of the LED lamp of the present invention;
FIG. 5 is a schematic diagram of a planar structure of an LED lamp circuit board according to the present invention;
FIG. 6 is a schematic cross-sectional view of another connection structure of the circuit board of the LED lamp of the present invention;
FIG. 7 is a schematic sectional view of the structure of the LED lamp of the present invention.
Detailed Description
As shown in fig. 4-6, a LED lamp circuit board, including insulating substrate layer 1, set gradually circuit layer 2 and upper surface layer 3 at insulating substrate layer 1's upper surface, form anodal circuit LED + and negative pole circuit LED-on circuit layer 2, wherein: and the lower surface of the insulating substrate layer 1 is also provided with a conductive electrode plate layer 4, and the conductive electrode plate layer 4 is electrically connected and conducted with the anode line LED + of the line layer 2.
The conductive electrode plate layer 4 and the positive electrode circuit of the circuit layer 2 are electrically connected and conducted with the insulating substrate layer 1 through the via hole a. The via holes a of the circuit layer and the lower conductive electrode plate layer are realized by filling tin materials.
As shown in fig. 6, the insulating substrate layer is provided with a conductive via a, the circuit layer of the upper positive circuit is stretched downward through the conductive via a, and is in physical contact with the lower conductive electrode board layer, so as to form a double-sided circuit board with the conductive electrode board layer and the circuit layer conducted.
A plurality of groups of integrated circuits are formed on the circuit layer 2, each group of integrated circuits comprises an anode circuit LED + and a cathode circuit LED-, and the circuit layer 2 is provided with soldering land positions 21 at equal intervals.
The insulating substrate layer 1 is a CEM-3 double-sided board with high heat conductivity coefficient, the thickness of the insulating substrate layer 1 is 0.8-1.6 mmum, and the heat conductivity coefficient is (1.0-2.0) W/MK.
Top copper foil: the circuit layer 2 is a copper foil layer with the thickness of 30 um.
The upper surface layer 3 is a resist layer with a thickness of 25 um.
The lower surface of the conductive electrode plate layer 4 is provided with a heat-conducting silica gel sheet 5. The lower surface of the conductive electrode plate layer 4 can be provided with a resist protective layer for insulation and protection. And correspondingly, a heat-conducting silica gel sheet 5 is attached to the lamp shell when the lamp is installed.
As shown in fig. 7, an LED lamp, wherein: the pad position 21 is used for welding the LED lamp chip 6.
An application method for eliminating slight brightness of an LED lamp after power failure, wherein: the positive line LED + of line layer 2 uses via hole insulating substrate layer 1 to couple together with the conducting electrode plate layer 4 of bottom and forms the induction capacitance circuit, leads LED lamp pearl P knot voltage to on conducting electrode plate layer 4 after the outage.
When the LED lamp bead P-junction capacitor is used, the metal conductive electrode plate layer 4 is arranged on the lower surface of the LED circuit board on the single surface of the insulating base material layer 1, the conductive electrode plate layer 4 and the circuit layer 2 on the upper surface of the insulating base material layer 1 form opposite flat electrodes, the conductive electrode plate layer 4 is electrically connected and conducted with the positive circuit LED + of the circuit layer 4 to form a flat capacitor structure, an induction capacitor circuit is formed, and after power failure, the P-junction voltage of the LED lamp bead can be guided to the conductive electrode plate layer 4. The voltage of the P junction of the circuit layer and the LED chip lamp bead is eliminated, so that the phenomenon that the LED lamp is slightly bright after power failure is solved.
The specific working principle is as follows: according to the formula C of the flat capacitor, epsilon S/d (epsilon is the dielectric constant of a medium between polar plates, S is the polar plate area, d is the distance between the polar plates), because the area of the conductive polar plate layer 4 (bottom copper foil) of the PCB is larger than the area of the circuit layer 2 (top copper foil), the value of the induction capacitance formed between the conductive polar plate layer 4 (bottom copper foil) at the bottom of the insulating base material layer 1 (PCB) and the lamp shell (grounding) is higher than the induction capacitance formed between the circuit layer 2 (top copper foil) and the lamp shell (grounding), and the LED + end potential of the top layer is LED to the bottom layer completely, so that the LED PN junction does not form potential difference any more.
In summary, the actual samples of the present invention are prepared according to the description and the drawings, and after a plurality of usage tests, the effect of the usage tests proves that the present invention can achieve the expected purpose, and the practical value is undoubted. The above-mentioned embodiments are only for convenience of illustration and not intended to limit the invention in any way, and those skilled in the art will be able to make equivalents of the features of the invention without departing from the technical scope of the invention.
Claims (10)
1. The utility model provides a LED lamp circuit board, includes insulating substrate layer (1), sets gradually circuit layer (2) and upper surface (3) at the upper surface of insulating substrate layer (1), forms anodal circuit and negative pole circuit on circuit layer (2), its characterized in that: and the lower surface of the insulating base material layer (1) is also provided with a conductive electrode plate layer (4), and the conductive electrode plate layer (4) is electrically connected and conducted with the positive circuit of the circuit layer (2).
2. The LED lamp circuit board of claim 1, wherein: the conductive electrode plate layer (4) and the positive electrode circuit of the circuit layer (2) are electrically connected and conducted with the insulating base material layer (1) through the via hole.
3. The LED lamp circuit board of claim 1, wherein: a plurality of groups of integrated circuits are formed on the circuit layer (2), each group of integrated circuits comprises a positive electrode and a negative electrode, and the circuit layer (2) is equidistantly provided with soldering land positions (21).
4. The LED lamp circuit board of claim 1, wherein: the insulating substrate layer (1) is a CEM-3 double-sided board with high heat conductivity coefficient, and the heat conductivity coefficient of the insulating substrate layer (1) is (1.0-2.0) W/MK.
5. The LED lamp circuit board of claim 1 or 3, wherein: the circuit layer (2) is a copper foil layer with a thickness of 20-40 um.
6. The LED lamp circuit board of claim 1 or 3, wherein: the upper surface layer (3) is a corrosion resisting agent layer with the thickness of 20-30 um.
7. The LED lamp circuit board of claim 1, wherein: the lower surface of the conductive electrode plate layer (4) is provided with a heat-conducting silica gel sheet (5).
8. An LED lamp, characterized in that: the circuit board for LED lamp comprising the circuit board for LED lamp according to any one of claims 1 to 7, wherein the LED lamp chip (6) is disposed between the positive electrode circuit and the negative electrode circuit formed on the circuit layer (2).
9. An LED lamp as claimed in claim 8, wherein: and pad positions (21) are arranged on the circuit layer (2) at equal intervals, and the LED lamp chip (6) is welded on the pad positions (21).
10. An application method for eliminating slight brightness of an LED lamp after power failure is characterized in that: the LED lamp circuit board comprises the LED lamp circuit board of any one of claims 1 to 7, wherein a positive circuit of the circuit layer (2) penetrates through the insulating base material layer (1) to be connected with the conductive electrode board layer (4) of the bottom layer to form an inductive capacitance circuit, and the P-junction voltage of the LED lamp beads is guided to the conductive electrode board layer (4) after power failure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864091.2A CN106287260B (en) | 2016-09-29 | 2016-09-29 | LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864091.2A CN106287260B (en) | 2016-09-29 | 2016-09-29 | LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106287260A CN106287260A (en) | 2017-01-04 |
| CN106287260B true CN106287260B (en) | 2022-08-05 |
Family
ID=57716371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610864091.2A Active CN106287260B (en) | 2016-09-29 | 2016-09-29 | LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106287260B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031657A (en) * | 2019-12-10 | 2020-04-17 | 欧普照明股份有限公司 | LED lamp circuit board, LED lamp and manufacturing method of LED lamp circuit board |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994022281A1 (en) * | 1993-03-19 | 1994-09-29 | Fujitsu Limited | Laminated circuit board |
| CN201902900U (en) * | 2010-11-26 | 2011-07-20 | 四川新力光源有限公司 | Alternating-current LED (light-emitting diode) fluorescent lamp |
| CN202697035U (en) * | 2012-08-01 | 2013-01-23 | 田茂福 | LED circuit board with conducting adhesive lines, and LED lamp band |
| CN202721893U (en) * | 2012-06-26 | 2013-02-06 | 田茂福 | Aluminum-based circuit board and LED lamp bar |
| CN103542386A (en) * | 2013-11-01 | 2014-01-29 | 深圳市九洲光电科技有限公司 | Light-emitting diode (LED) substrate and high voltage resistant LED lamp |
| CN203895504U (en) * | 2013-12-30 | 2014-10-22 | 广州市鸿利光电股份有限公司 | LED light source for stage lamp |
| CN204721722U (en) * | 2015-05-07 | 2015-10-21 | 深圳市星之光实业发展有限公司 | A kind of easily extensible multi-layer flexible circuit board |
| CN204894670U (en) * | 2015-08-24 | 2015-12-23 | 浙江展邦电子科技有限公司 | LED lamps and lanterns are with aluminium base two -sided copper -clad plate |
| CN105898982A (en) * | 2016-06-30 | 2016-08-24 | 广东顺德施瑞科技有限公司 | High-voltage flexible circuit board and multi-layer flexible circuit board |
| CN206514084U (en) * | 2016-09-29 | 2017-09-22 | 东莞市善时照明科技有限公司 | A kind of LED wiring board and LED |
-
2016
- 2016-09-29 CN CN201610864091.2A patent/CN106287260B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994022281A1 (en) * | 1993-03-19 | 1994-09-29 | Fujitsu Limited | Laminated circuit board |
| CN201902900U (en) * | 2010-11-26 | 2011-07-20 | 四川新力光源有限公司 | Alternating-current LED (light-emitting diode) fluorescent lamp |
| CN202721893U (en) * | 2012-06-26 | 2013-02-06 | 田茂福 | Aluminum-based circuit board and LED lamp bar |
| CN202697035U (en) * | 2012-08-01 | 2013-01-23 | 田茂福 | LED circuit board with conducting adhesive lines, and LED lamp band |
| CN103542386A (en) * | 2013-11-01 | 2014-01-29 | 深圳市九洲光电科技有限公司 | Light-emitting diode (LED) substrate and high voltage resistant LED lamp |
| CN203895504U (en) * | 2013-12-30 | 2014-10-22 | 广州市鸿利光电股份有限公司 | LED light source for stage lamp |
| CN204721722U (en) * | 2015-05-07 | 2015-10-21 | 深圳市星之光实业发展有限公司 | A kind of easily extensible multi-layer flexible circuit board |
| CN204894670U (en) * | 2015-08-24 | 2015-12-23 | 浙江展邦电子科技有限公司 | LED lamps and lanterns are with aluminium base two -sided copper -clad plate |
| CN105898982A (en) * | 2016-06-30 | 2016-08-24 | 广东顺德施瑞科技有限公司 | High-voltage flexible circuit board and multi-layer flexible circuit board |
| CN206514084U (en) * | 2016-09-29 | 2017-09-22 | 东莞市善时照明科技有限公司 | A kind of LED wiring board and LED |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106287260A (en) | 2017-01-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2012333908C1 (en) | Manufacturing process of high-power LED radiating structure | |
| AU2012333910B2 (en) | Manufacturing process of high-power LED radiating structure | |
| CN105576103A (en) | Light emitting device | |
| CN106287260B (en) | LED lamp circuit board, LED lamp and application method for eliminating slight brightness of LED lamp after power failure | |
| CN201064069Y (en) | Heat radiating structure for circuit board | |
| CN202855803U (en) | High heat conduction LED packaging substrate | |
| CN202103085U (en) | Thermoelectric separation type LED integrated light source board | |
| CN206514084U (en) | A kind of LED wiring board and LED | |
| TWI475174B (en) | Light emitting diode lighting device | |
| CN202032361U (en) | Anti-puncture LED (light-emitting diode) lamp | |
| CN102252279A (en) | Thermoelectric separation-type LED integrated light source plate and manufacturing method thereof | |
| CN206331859U (en) | Piezo-resistance with overcurrent protection function | |
| CN202503815U (en) | Point discharge proof high voltage resistance aluminum substrate | |
| CN103298246B (en) | LED high pressure resistant circuit pcb board and the high voltage bearing circuit connecting method of LED | |
| CN103234181A (en) | High heat conduction light-emitting diode (LED) welding method | |
| CN103515508A (en) | Light emitting diode package and its used heat-removal module | |
| CN209861242U (en) | High-efficient radiating PCB board | |
| CN213907018U (en) | Anti-static circuit board | |
| CN205938580U (en) | LED lamp panel | |
| CN202058730U (en) | LED device with high heat-conductive insulated base packaging | |
| CN206148420U (en) | Fill electric pile and prevent anti - diode module | |
| CN204792453U (en) | Aluminum electrolytic condenser | |
| CN103325744A (en) | LED light source module with high voltage-withstanding performance | |
| CN201307594Y (en) | LED thermal conduction structure | |
| CN203286311U (en) | LED module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231226 Address after: No. 5 Shengxing Street, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN XINHAI METAL PRODUCTS Co.,Ltd. Address before: 523000 third floor, No. 1, Weiming Road, hengzeng Avenue, Xin'an community, Chang'an Town, Dongguan City, Guangdong Province Patentee before: Dongguan Sense Lighting Technology Co.,Ltd. |