CN106455300B - Circuit board and mobile terminal - Google Patents
Circuit board and mobile terminal Download PDFInfo
- Publication number
- CN106455300B CN106455300B CN201610988889.8A CN201610988889A CN106455300B CN 106455300 B CN106455300 B CN 106455300B CN 201610988889 A CN201610988889 A CN 201610988889A CN 106455300 B CN106455300 B CN 106455300B
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- China
- Prior art keywords
- signal
- sub
- circuit board
- wiring area
- wiring
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
Abstract
The embodiment of the invention discloses a circuit board and a mobile terminal; the circuit board comprises: the device comprises a body and an isolation groove arranged on the body, wherein the body comprises a first wiring area and a second wiring area which are isolated by the isolation groove, the first wiring area is used for transmitting a first signal, the second wiring area is used for transmitting a second signal, and the first wiring area and the second wiring area are isolated by the isolation groove so as to reduce interference between the first signal and the second signal. The first signal and the second signal are physically isolated through the isolation groove arranged on the body of the circuit board, so that signal interference generated during signal transmission between the signal lines can be effectively reduced, stability and accuracy of signal transmission are ensured, and normal operation of the circuit is maintained.
Description
Technical Field
The invention relates to the technical field of terminals, in particular to a circuit board and a mobile terminal.
Background
Circuit boards are an indispensable component in electronic products, and are supports for various circuit elements and devices in electronic products. Various types of signal lines are typically arranged on a circuit board for establishing electrical connections between circuit elements and devices. However, signal interference between various signal lines is easily generated when signals are transmitted, and normal operation of the circuit is further affected. Therefore, further improvement is required.
Disclosure of Invention
The embodiment of the invention provides a circuit board and a mobile terminal, which can reduce signal interference generated during signal transmission between various signal lines and ensure normal operation of a circuit.
In order to solve the technical problems, the embodiment of the invention provides the following technical scheme:
a circuit board, comprising:
a body;
and an isolation groove arranged on the body; wherein, the liquid crystal display device comprises a liquid crystal display device,
the body includes a first wiring region and a second wiring region isolated by the isolation trench, the first wiring region is used for transmitting a first signal, the second wiring region is used for transmitting a second signal, and the first wiring region and the second wiring region are isolated by the isolation trench to reduce interference between the first signal and the second signal.
In order to solve the technical problems, the embodiment of the invention also provides the following technical scheme:
a mobile terminal, comprising: the circuit board is used for arranging electric circuits, and the circuit board is electrically connected with the main board through the connector.
The circuit board provided by the embodiment of the invention comprises a body and an isolation groove arranged on the body, wherein the body comprises a first wiring area and a second wiring area which are isolated by the isolation groove, the first wiring area is used for transmitting a first signal, the second wiring area is used for transmitting a second signal, and the first wiring area and the second wiring area are isolated by the isolation groove so as to reduce interference between the first signal and the second signal. According to the invention, the first signal and the second signal are physically isolated through the isolation groove arranged on the body of the circuit board, so that signal interference generated during signal transmission between signal lines is effectively reduced, the stability and accuracy of signal transmission are ensured, and the normal operation of the circuit is maintained.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present invention.
Fig. 2 is another schematic structural diagram of a circuit board according to an embodiment of the present invention.
Fig. 3 is a cross-sectional view of fig. 2 in the Y-Z plane.
Fig. 4 is a schematic structural diagram of a circuit board according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of another structure of a circuit board according to an embodiment of the invention.
Fig. 6 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the invention may be practiced. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., are used herein with reference to the attached drawings. It will be understood that when an element or layer is referred to as being "on," "connected to" or "coupled to" another element or layer, it can be directly on, connected or coupled to the other element or layer, or intervening elements or layers may be present.
It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Further, the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, elements, components, and/or groups thereof. The description hereinafter sets forth a preferred embodiment for practicing the invention, but is not intended to limit the scope of the invention, as the description is given for the purpose of illustrating the general principles of the invention. The scope of the invention is defined by the appended claims.
In an embodiment of the present invention, the mobile terminal may be, but is not limited to, an intelligent mobile terminal such as a mobile phone, a notebook computer, a tablet computer, a palm game machine or a media player, an intelligent wearable device, and the like. In this embodiment, the mobile terminal is described by taking a mobile phone as an example.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a circuit board 100 according to an embodiment of the invention. The circuit board 100 is provided with a plurality of signal lines arranged thereon for establishing electrical connection between circuit elements and devices. In this embodiment, the circuit board 100 is rectangular. It will be appreciated that in some embodiments, the shape of the circuit board 100 may be adapted according to practical requirements, such as square, diamond, polygon, etc.
It is understood that the circuit board 100 may be a flexible circuit board (Flexible Printed Circuit, FPC), a printed circuit board (Printed Circuit Board, PCB), or the like. In some embodiments, the circuit board 100 may be a single-sided board, i.e., the body 10 of the circuit board 100 has a single conductive layer; the circuit board 100 may also be a double-sided board, i.e. the body 10 of the circuit board 100 has a double-layer conductive layer; the circuit board 100 may also be a multi-sided board, i.e. the body 10 of the circuit board 100 has multiple conductive layers. The routing area in the circuit board 100 includes all conductive layers.
In this embodiment, the circuit board 100 includes a body 10 and a separation groove 13 provided on the body 10. In order to better illustrate the specific structure of the circuit board, the length direction X, the width direction Y, and the thickness direction Z are defined herein. Specifically, the isolation grooves 13 are arranged in parallel to the length direction X of the body 10. I.e. the length of the isolation groove 13 is equal to the body 10. In this embodiment, the isolation trench 13 is an elongated rectangular groove having a uniform width. It will be appreciated that in other embodiments, the width of the isolation groove 13 may be gradually reduced or gradually increased along the width direction Y of the body. In this embodiment, the isolation groove 13 is disposed in the middle of the body 10. It will be appreciated that in embodiments, the isolation groove 13 may be provided at a specific ratio, such as 1/3,1/4, etc., along the length direction X of the body 10.
Wherein the isolation groove 13 isolates the body 10 to form a first wiring region 11 and a second wiring region 12 which are spaced apart from each other. In the present embodiment, the first wiring region 11 and the second wiring region 12 are arranged side by side along the longitudinal direction X of the body 10. That is, the first wiring region 11 and the second wiring region 12 are spaced apart from each other in the longitudinal direction of the body. In the present embodiment, the area of the first wiring region 11 is equal to the area of the second wiring region 12, whereby independence of the respective wiring arrangements is ensured in which the first wiring region 11 is used for transmitting the first signal and the second wiring region 12 is used for transmitting the second signal. The first wiring region 11 and the second wiring region 12 are isolated by the isolation trench 13 to reduce interference between the first signal and the second signal.
In some embodiments, the isolation trench 13 divides a conductive layer located in a wiring area on the body 10 of the circuit board 100 into two separate sub-conductive layers. The first wiring region 11 in this embodiment includes a first sub-conductive layer 111, and the second wiring region 12 includes a second sub-conductive layer 121. The first sub-conductive layer 111 and the second sub-conductive layer 121 are disposed at intervals along the length direction of the body 10. The area of the first sub-conductive layer 111 is equal to the area of the second sub-conductive layer 121. The upper surface of the first sub-conductive layer 111 is flush with the upper surface of the second sub-conductive layer 121. Wherein the first sub-conductive layer 111 is used for transmitting a first signal, the second sub-conductive layer 121 is used for transmitting a second signal, and the first sub-conductive layer 111 and the second sub-conductive layer 121 are isolated by the isolation groove 13 to reduce interference between the first signal and the second signal.
In some embodiments, an additional transmission layer 112 is further disposed on the first wiring area 11, where the additional transmission layer 112 is used to transmit the first signal. In this embodiment, the additional transmission layer 112 is disposed along the length direction X of the body 10, and the area of the additional transmission layer 112 is equal to the area of the first wiring region 11.
It is understood that the first wiring region 11 may include the additional transmission layer 112 and the first sub-conductive layer 111, that is, the additional transmission layer 112 of the first wiring region 11 is integrally formed with the first sub-conductive layer 111. It will be appreciated that the first routing area 11 may also include only the first sub-conductive layer 111, and that the additional transmission layer 112 may be laid down as a separate component on the surface of the first routing area 11.
In some embodiments, a first signal line is routed in the additional transmission layer 112 on the first routing area 11 and a second signal line is routed in the second sub-conductive layer 121 within the second routing area 12.
In some embodiments, a height difference is formed between the surface of the additional transmission layer 113 and the surface of the second wiring region 12, thereby forming a step. That is, the upper surface of the first wiring region 11 is higher than the upper surface of the second wiring region 12.
In some embodiments, the first signal is an interference signal and the second signal is a sensitivity signal.
The interference signal is a signal with certain radiation capability, which can cause interference to other signals, so that the interfered signal is distorted, and the interference signal is insensitive to surrounding noise and has strong self anti-interference capability. For example, the interference signal may be an electromagnetic signal, a high voltage signal, a high current signal, etc., and the high voltage signal may be a high voltage charging signal. The sensitive signal is a signal which is very sensitive to surrounding noise and is extremely susceptible to interference. For example, the sensitive signal may be a low voltage signal, a universal serial bus impedance signal, a high speed differential signal, a video signal, an audio signal, etc.
Under the condition that the area of the lower surface of the body 10 is unchanged, an additional transmission layer 112 is further arranged on the first wiring area 11, wherein the additional transmission layer 112 is used for arranging a first signal wire, the second wiring area 12 is used for arranging a second signal wire, so that the creepage distance between the first signal wire and the second signal wire is increased, interference between the first signal wire and the second signal wire is reduced, stability and accuracy of signal transmission are ensured, and normal operation of a circuit is maintained.
The creepage distance is the shortest distance between two adjacent conductors or between one conductor and the surface of the adjacent motor casing, which is measured along the insulating surface. In this embodiment, the creepage distance is the shortest distance between the first signal line and the second signal line measured along the insulating surface.
In some embodiments, the additional transmission layer 112 is disposed on the side of the first wiring region 11 remote from the second wiring region 12. Referring to fig. 2, fig. 2 is a schematic diagram of another structure of a circuit board according to an embodiment of the invention.
The circuit board 100 includes a body 10 and a separation groove 13 provided on the body 10; the body 10 includes a first wiring area 11 and a second wiring area 12 separated by the isolation trench 13, and an additional transmission layer 112 is further disposed on the first wiring area 11, and the additional transmission layer 112 is disposed on a side of the first wiring area 11 away from the second wiring area 12. Wherein the additional transmission layer 112 is used for transmitting a first signal and the second wiring area 12 is used for transmitting a second signal.
In this embodiment, the additional transmission layer 112 is disposed along the length direction X of the body 10, the length of the additional transmission layer 112 is equal to the length of the first wiring region 11, the width of the additional transmission layer 112 is smaller than the width of the first wiring region 11, and the area of the additional transmission layer 112 is smaller than the area of the first wiring region 11.
In some embodiments, the first signal line is routed in the additional transmission layer 112 and the second signal line is routed in the second sub-conductive layer 121 within the second routing area 12.
In this embodiment, the additional transmission layer 112 is disposed on the side of the first wiring area 11 away from the second wiring area 12, so as to increase the distance between the first signal and the second signal in plane and space, reduce the mutual interference between the first signal and the second signal, ensure the stability and accuracy of signal transmission, and maintain the normal operation of the circuit.
In some embodiments, the additional transmission layer 112 may be disposed at an edge position of the first wiring region 11 at a side remote from the second wiring region 12. In addition, the additional transmission layer 112 may be disposed on the side of the second wiring region 12 away from the first wiring region 11.
For a clearer understanding of the present embodiment, please refer to fig. 3, fig. 3 is a cross-sectional view of fig. 2 in the Y-Z plane.
The body 10 may be structurally divided in a thickness direction Z, the body 10 may include an upper surface 101, conductive layers (N-th to first conductive layers), a substrate 103, and a lower surface 102 from top to bottom, and the isolation groove 13 includes a bottom wall 131 and a sidewall 132. The bottom wall 131 of the isolation trench 13 may penetrate the conductive layer of the body 10 from the upper surface 101 of the body 10, for example, a single panel, and divide the first conductive layer of the body 10 into a first sub-conductive layer 111 and a second sub-conductive layer 121, and divide the body 10 into a first wiring region 11 and a second wiring region 12, wherein the first wiring region 11 includes the first sub-conductive layer 111 and the additional transmission layer 112, and the second wiring region 12 includes the second sub-conductive layer 121. The bottom wall 131 of the isolation trench 13 is flush with the upper surface 1031 of the substrate 103, or the bottom wall 131 of the isolation trench 13 is lower than the upper surface 1031 of the substrate 103 to achieve isolation of the conductive layer, the first wiring region 11 and the second wiring region 12 may remain connected through the substrate 103.
In some embodiments, the isolation trench 13 penetrates the body 10, and a hollow isolation trench 13 is formed between the first wiring region 11 and the second wiring region 12. That is, the bottom wall 131 of the isolation groove 13 penetrates from the upper surface 101 of the body 10 to the lower surface 102 of the body 10, and divides the body 10 into the first wiring region 11 and the second wiring region 12, which may be components that are not connected to each other.
In some embodiments, the arrangement direction of the isolation trench 13 is not intersected with the wiring directions of the first wiring region 11 and the second wiring region 12. For example, the isolation trench 13 may be disposed in a direction parallel to the wiring directions on the first wiring region 11 and the second wiring region 12.
In some embodiments, at least one of the two ends of the isolation slot 13 may be provided with a connector for electrical connection with a circuit.
In some embodiments, the first wiring area 11 is divided into three layers, wherein the middle layer is used for transmitting the first signal, and the upper and lower layers are used for setting the ground line. Referring to fig. 4 and fig. 5, fig. 4 is a schematic structural diagram of a circuit board according to an embodiment of the present invention, and fig. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present invention.
As shown in fig. 4, the first wiring region 11 is divided into three layers, wherein the first wiring region 11 includes a first sub-conductive layer 111 and two sub-additional transmission layers belonging to the additional transmission layer 112; wherein the first sub-additional transmission layer 112a serves as an intermediate layer of the first wiring region 11 for transmitting a first signal; a second sub-additional transmission layer 112b as an upper layer of the first wiring region 11 for setting a ground line; the first sub-conductive layer 111 serves as a lower layer of the first wiring region 11 for setting a ground line.
As shown in fig. 5, the first wiring region 11 is divided into three layers, wherein the first wiring region 11 includes a first sub-conductive layer 111, a third sub-conductive layer 113, and the additional transmission layer 112; wherein an additional transmission layer 112 is provided as an upper layer of the first wiring region 11 for setting a ground line; the third sub-conductive layer 113 serves as an intermediate layer of the first wiring region 11 for transmitting a first signal; the first sub-conductive layer 111 serves as a lower layer of the first wiring region 11 for setting a ground line. The second wiring region 12 further includes a second sub-conductive layer 121 and a fourth sub-conductive layer 123, wherein a signal line for transmitting a second signal may be disposed on the second sub-conductive layer 121 or may be disposed on the fourth sub-conductive layer 123.
The embodiment of the invention also provides a mobile terminal which comprises a main board, a connector and a circuit board.
The circuit board is used for arranging electric circuits and is electrically connected with the main board through the connector.
In some embodiments, the electrical circuit may include signal lines such as high voltage signals, low voltage signals, sensitive signals, interference signals, and ground lines.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention. The mobile terminal 1 includes main boards 300a and 300b, connectors 200a and 200b, and a circuit board 100.
The circuit board 100 is used for arranging electrical circuits, one end of the circuit board 100 is electrically connected with the motherboard 300a through the connector 200a, and the other end of the circuit board 100 is electrically connected with the motherboard 300b through the connector 200 b.
The body 10 of the circuit board 100 includes a first wiring region 11 and a second wiring region 12 isolated by an isolation trench 13, the first wiring region 11 for disposing a first signal line and the second wiring region 12 for disposing a second signal line, the first wiring region 11 and the second wiring region 12 being isolated by the isolation trench 13 to reduce interference between the first signal and the second signal.
One end of the first signal line in the first wiring area 11 is electrically connected to the motherboard 300a through the connector 200a, and the other end of the first signal line is electrically connected to the motherboard 300b through the connector 200 b.
One end of the second signal line in the second wiring area 12 is electrically connected to the motherboard 300a through the connector 200a, and the other end of the second signal line is electrically connected to the motherboard 300b through the connector 200 b.
In the embodiment of the invention, the first signal and the second signal are physically isolated through the isolation groove 13 arranged on the body 10 of the circuit board 100, so that signal interference generated during signal transmission between signal lines is effectively reduced, stability and accuracy of signal transmission are ensured, and normal operation of the mobile terminal is maintained.
In summary, the principles and embodiments of the present invention have been described with reference to specific examples, which are intended to be only illustrative of the methods and core concepts of the invention; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present invention, the present description should not be construed as limiting the present invention in summary.
Claims (5)
1. A circuit board, comprising:
a body;
the width of the isolation groove is gradually reduced or gradually increased along the width direction of the body; wherein, the liquid crystal display device comprises a liquid crystal display device,
the body comprises a first wiring area and a second wiring area which are isolated by the isolation groove, wherein the first wiring area is used for transmitting a first signal, the first signal is an interference signal, the second wiring area is used for setting a second signal line and transmitting a second signal, the second signal is a sensitive signal, and the first wiring area and the second wiring area are isolated by the isolation groove so as to reduce the interference between the first signal and the second signal;
the first wiring area comprises a second sub-additional transmission layer, a first sub-additional transmission layer and a first sub-conductive layer which are sequentially stacked, wherein the first sub-additional transmission layer is used for setting a first signal line and transmitting the first signal, and the second sub-additional transmission layer and the first sub-conductive layer are both provided with ground wires; a height difference is formed between the surface of the first sub-additional transmission layer and the surface of the second wiring region to increase a creepage distance between the first signal line and the second signal line; the second sub-additional transmission layer and the first sub-additional transmission layer are arranged on one side, far away from the second wiring area, of the first wiring area, and the widths of the second sub-additional transmission layer and the first sub-additional transmission layer are smaller than the width of the first wiring area.
2. The circuit board of claim 1, wherein the isolation slot extends through the body to form a hollow isolation slot between the first routing region and the second routing region.
3. The circuit board of claim 2, wherein the isolation groove is disposed in a direction that does not intersect the wiring directions of the first and second wiring regions.
4. The circuit board of claim 1, wherein at least one of the two ends of the isolation slot is provided with a connector for electrical connection with a circuit.
5. A mobile terminal, comprising: a motherboard, a connector, and a circuit board according to any one of claims 1 to 4 for arranging electrical wiring, the circuit board establishing electrical connection with the motherboard through the connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610988889.8A CN106455300B (en) | 2016-11-10 | 2016-11-10 | Circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610988889.8A CN106455300B (en) | 2016-11-10 | 2016-11-10 | Circuit board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106455300A CN106455300A (en) | 2017-02-22 |
| CN106455300B true CN106455300B (en) | 2023-09-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610988889.8A Active CN106455300B (en) | 2016-11-10 | 2016-11-10 | Circuit board and mobile terminal |
Country Status (1)
| Country | Link |
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| CN (1) | CN106455300B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109379543B (en) * | 2018-09-21 | 2021-03-23 | 海信视像科技股份有限公司 | Digital television receiving equipment and radio frequency signal processing device thereof |
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| JP2016076540A (en) * | 2014-10-03 | 2016-05-12 | 沖プリンテッドサーキット株式会社 | Multilayer printed wiring board |
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| CN106455300A (en) | 2017-02-22 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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