CN102595767A - Circuit board structure of mobile electronic product and manufacturing method thereof - Google Patents
Circuit board structure of mobile electronic product and manufacturing method thereof Download PDFInfo
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- CN102595767A CN102595767A CN2011100068231A CN201110006823A CN102595767A CN 102595767 A CN102595767 A CN 102595767A CN 2011100068231 A CN2011100068231 A CN 2011100068231A CN 201110006823 A CN201110006823 A CN 201110006823A CN 102595767 A CN102595767 A CN 102595767A
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- circuit board
- flexible circuit
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Abstract
The invention relates to a circuit board structure of a mobile electronic product and a manufacturing method thereof. The circuit board structure structurally comprises a flexible circuit board and a heat dissipating unit. In the manufacturing process of the circuit board structure, a first insulating layer is laminated with a copper layer; a circuit layout zone is formed on the copper layer; a second insulating layer is adhered onto the circuit layout zone, so that connecting interfaces and contact points are respectively formed at both ends of the circuit layout zone; a perforated hole is arranged between the contact points to form the flexible circuit board; a bump is arranged on a copper material to form the heat dissipating unit; the bump is correspondingly arranged in the perforated hole; a third insulating layer is arranged between the first insulating layer and the heat dissipating unit; and finally, a projection mechanism is electrically connected with the contact points and the bottom surface of the projection mechanism is contacted with the bump. Therefore, the requirements for thinning and bending can be met, so that the circuit board structure is easy to assemble in an inner space of the mobile electronic product and the requirement of according with the assembly of various mobile electronic products is met.
Description
Technical field
The present invention is relevant for a kind of action electron product circuit plate structure and preparation method thereof; Especially refer to a kind of make flexible circuit board, heat-sink unit slimming and bent design; And then be easy to be assembled in the inner space of action electronic product, can meet the effect that various action electronic product is assembled and reach.
Background technology
The general board structure of circuit 4 (like Figure 12) of the action electronic product of usefulness, its by a hard circuit board 41, be electrically connected at projector mechanism 42 on the hard circuit board 41, and 43 of connecting interfaces being electrically connected on the hard circuit board 41 constitute; By this, it is inner and electrically connect to make this projection structure 4 be incorporated into the action electronic product, and lets the action electronic product utilize this projection structure 4 to produce the effect of projections.
But because this connecting interface 43 has a predetermined height; So after this connecting interface 43 is located on the hard circuit board 41; Then can make projection structure 4 can't reach the design of slimming because of connecting interface 43; And owing to the hard circuit board 41 of this projection structure 4 can't bend, therefore, when this projection structure 4 is assembled in the inner space of action electronic product; Regular meeting interferes with the inner space generation of action electronic product because of protruding connecting interface 43; And also can't hard circuit board 41 be bent to this inner space, must change the mechanism design of electronic product casing of taking action when causing actual use, and cause the puzzlement in the actual use.
Summary of the invention
Main purpose of the present invention is, a kind of slimming and bent action electron product circuit plate structure and preparation method thereof are provided, and makes this circuit board be easy to be assembled in the inner space of action electronic product, and meets various action electronic product assembling needs.
For reaching above-mentioned purpose; The present invention is a kind of action electron product circuit plate structure; It includes: the flexible circuit board that has the circuit layout district on the one side; One end in this circuit layout district has connecting interface, and the other end has corresponding contact, have between each contact one run through flexible circuit board perforation; One is located at the heat-sink unit on the flexible circuit board one side; This heat-sink unit has a pedestal, and the projection be located on the pedestal one side; This pedestal and flexible circuit board are fitted, this projection with bore a hole corresponding and extend in the perforation, and this heat-sink unit area is less than this flexible circuit board.
In one embodiment of the invention; This flexible circuit board includes one first insulating barrier, and is located at copper layer, on first insulating barrier one side and is located at second insulating barrier on the copper layer, and the 3rd insulating barrier be located between first insulating barrier and heat-sink unit; And described circuit layout district is located on the one side of copper layer, and this second insulating barrier sticks in the circuit layout district.
In one embodiment of the invention, this flexible circuit board system is the tabular of a long strip type.
In one embodiment of the invention, this flexible circuit board system can bend, and its connecting interface below is provided with a stiffening plate.
In one embodiment of the invention, this flexible circuit board is the tabular of a L type.
In one embodiment of the invention, this heat-sink unit can be a copper material and processes.
In one embodiment of the invention, after the projection of this heat-sink unit was located at perforation, the height of this projection was surperficial consistent with flexible circuit board.
In one embodiment of the invention, contact more capable of using further is electrically connected with projector mechanism on the one side of this flexible circuit board, and the bottom surface of this projector mechanism contacts with the projection of heat-sink unit.
In one embodiment of the invention, this projector mechanism can be LED assembly or OLED assembly.
Electron product circuit plate structure manufacture method includes the following step and the present invention takes action:
Step 1: with one first insulating barrier and bronze medal layer pressing in addition;
Step 2: on the one side of this copper layer, form a circuit layout district;
Step 3: in the circuit layout district of copper layer, paste one second insulating barrier, make an end in this circuit layout district be formed with connecting interface, the other end has corresponding contact;
Step 4: between each contact, dash again and set out a perforation, use forming a flexible circuit board, and this perforation runs through this flexible circuit board;
Step 5: get a copper material, and on the one side of this copper material, form a projection, use forming a heat-sink unit;
Step 6: the projection correspondence of this heat-sink unit one side is located in the perforation of flexible circuit board, and one the 3rd insulating barrier is set between first insulating barrier and heat-sink unit; And
Step 7: last again a projector mechanism being located on the one side of flexible circuit board and with contact electrically connects, and the bottom surface of this projector mechanism is contacted with projection.
In an embodiment of circuit board manufacturing method of the present invention, this circuit layout district forms on the one side of this copper layer with etching mode.
In an embodiment of circuit board manufacturing method of the present invention, this flexible circuit board system is the tabular of a long strip type.
In an embodiment of circuit board manufacturing method of the present invention, this flexible circuit board is that the ductility of copper layer capable of using bends, and can be provided with a stiffening plate under its connecting interface.
In an embodiment of circuit board manufacturing method of the present invention, this flexible circuit board system is the tabular of a L type.
In an embodiment of board structure of circuit manufacture method of the present invention, this projector mechanism is LED assembly or OLED assembly.
Compared with prior art, the beneficial effect that the present invention had is: the present invention adopts flexible circuit board, and directly the end in the circuit layout district forms connecting interface; The other end forms contact; Also make heat-sink unit consistent, so not only realized the needs of action electron product circuit plate thin typeization, utilize the bent characteristic of flexible circuit board in addition simultaneously with the height of flexible circuit board; When being used, the present invention can be easy to be assembled in the inner space of action electronic product; Can not produce and interfere, use the mechanism design that need not change the action electronic product casing, and meet various action electronic product assembling needs with the inner space of action electronic product; More can, projector mechanism utilize heat-sink unit to dispel the heat when operating.
Description of drawings
Fig. 1 is a schematic appearance of the present invention.
Fig. 2 is the sketch map of step 1 of the present invention.
Fig. 3 is the sketch map of step 2 of the present invention.
Fig. 4 is the sketch map of step 3 of the present invention.
Fig. 5 is the sketch map of step 4 of the present invention.
Fig. 6 is the sketch map of step 5 of the present invention.
Fig. 7 is the sketch map of step 6 of the present invention.
Fig. 8 is the sketch map of step 7 of the present invention.
Fig. 9 is the side-looking view of step 7 of the present invention.
Figure 10 is another user mode sketch map of the present invention.
Figure 11 is the schematic appearance of another embodiment of the present invention.
Figure 12 is the schematic appearance of usefulness.
Label declaration:
First insulating barrier 11;
Connecting interface 131;
Contact 132;
Stiffening plate 133;
Second insulating barrier 14;
Heat-sink unit 2;
Connecting interface 43.
Embodiment
Seeing also Fig. 1～shown in Figure 9, is the sketch map of the sketch map of the sketch map of the sketch map of the sketch map of the sketch map of the sketch map that is respectively schematic appearance of the present invention, step 1 of the present invention, step 2 of the present invention, step 3 of the present invention, step 4 of the present invention, step 5 of the present invention, step 6 of the present invention, step 7 of the present invention and the side-looking view of step 7 of the present invention.As shown in the figure: the present invention is flexible circuit board structure of a kind of electronic product of taking action and preparation method thereof, and its structure comprises a flexible circuit board 1, a heat-sink unit 2 and a projector mechanism 3 at least and constitutes (as shown in Figure 1).
And this projection structure manufacture method includes the following step:
Step 1: with one first insulating barrier 11 and a bronze medal layer 12 pressing (as shown in Figure 2) in addition.
Step 2: on the one side of this copper layer 12, form a circuit layout district 13 (as shown in Figure 3) with etching mode.
Step 3: in a circuit layout district 13 of copper layer 12, paste one second insulating barrier 14, make an end in this circuit layout district 13 be formed with connecting interface 131, the other end has corresponding contact 132 (as shown in Figure 4).
Step 4: between each contact 132, dash again and set out a perforation 15; Use and form a flexible circuit board 1; And this perforation 15 runs through this flexible circuit board 1; And can be provided with a stiffening plate 133 for 131 times in this connecting interface, and this flexible circuit board 1 is the tabular (as shown in Figure 5) of a long strip type.
Step 5: get the pedestal 21 of a copper material, and on the one side of this pedestal 21, form a projection 22, use forming a heat-sink unit 2, and the area of this heat-sink unit 2 is less than this flexible circuit board 1 (as shown in Figure 6).
Step 6: projection 22 correspondences of these heat-sink unit 2 one sides are located in the perforation 15 of flexible circuit board 1; And after making projection 22 be located at perforation 15; The height of this projection 22 is surperficial consistent with flexible circuit board 1; And be no more than flexible circuit board 1, and one the 3rd insulating barrier 16 (like Fig. 7 and shown in Figure 8) is set between first insulating barrier 11 and heat-sink unit 2.
Step 7: last again a projector mechanism 3 being located on the one side of flexible circuit board 1 and with contact 132 electrically connects; And make the bottom surface of this projector mechanism 3 contact (as shown in Figure 9), and this projector mechanism 3 can be LED assembly or OLED assembly with the projection 22 of heat-sink unit 2.
So; Can constitute an action electronic product by above-mentioned steps and have the flexible circuit board structure of heat-sink unit; The cooperation of flexible circuit board capable of using 1, heat-sink unit 2 and projector mechanism 3 and constitute the design (and not having protrusion improperly) of slimming; Can be easy to be assembled in the inner space of action electronic product (not shown) when letting the present invention use; Do not interfere and can not produce, use the mechanism design that need not change the action electronic product casing, and meet various action electronic product assembling needs with the inner space of action electronic product; More can when projector mechanism 3 runnings, utilize heat-sink unit 2 to dispel the heat.
Seeing also shown in Figure 10ly, is another user mode sketch map of the present invention.As shown in the figure: when the present invention when reality is used; Can make this flexible circuit board 1 utilize the ductility of copper layer 12 to bend; And the bent design that makes this flexible circuit board 1 can be easy to be assembled in the action electronic product inner space of (figure does not show); Do not interfere and can not produce, use the mechanism design that need not change the action electronic product casing, and reach the effect that can meet various action electronic product assembling with the inner space of action electronic product.
Seeing also shown in Figure 11ly, is the schematic appearance of another embodiment of the present invention.As shown in the figure: flexible circuit board 1 of the present invention is except that the tabular that can be a long strip type; More can be the configuration of present embodiment, and its difference is, this flexible circuit board 1a is the tabular of a L type; So; System can be easy to be assembled in the action electronic product inner space of (figure does not show) in the time of can letting the present invention use, do not interfere and can not produce with the inner space of action electronic product, and this flexible circuit board 1a is bent; Use the mechanism design that need not change the action electronic product casing, can meet various action electronic product assembling effect and reach.
In sum; The present invention's flexible circuit board structure that electronic product has heat-sink unit and preparation method thereof of taking action can effectively be improved the various shortcoming of usefulness; Can make the slimming and the bent design of flexible circuit board, heat-sink unit; And then be easy to be assembled in the inner space of action electronic product, can meet the effect that various action electronic product is assembled and reach.
Claims (15)
1. action electron product circuit plate structure; It is characterized in that including: a flexible circuit board; Has a circuit layout district on its one side; One end in this circuit layout district has connecting interface, and the other end has corresponding contact, have between each contact one run through this flexible circuit board perforation; One heat-sink unit, it has a pedestal, and the projection be located on the pedestal one side, this pedestal is fitted with flexible circuit board, this projection with bore a hole corresponding and extend in the perforation, and this heat-sink unit area is less than this flexible circuit board.
2. action electron product circuit plate structure according to claim 1; It is characterized in that; This flexible circuit board includes one first insulating barrier, and is located at copper layer, on first insulating barrier one side and is located at second insulating barrier on the copper layer, and the 3rd insulating barrier be located between first insulating barrier and heat-sink unit; And said circuit layout district is located on the one side of copper layer, and this second insulating barrier sticks in the circuit layout district.
3. action electron product circuit plate structure according to claim 1 is characterized in that this flexible circuit board is the tabular of a long strip type.
4. action electron product circuit plate structure according to claim 1 is characterized in that this flexible circuit board can bend, and its connecting interface below is provided with a stiffening plate.
5. action electron product circuit plate structure according to claim 1 is characterized in that this flexible circuit board is the tabular of a L type.
6. action electron product circuit plate structure according to claim 1 is characterized in that, this heat-sink unit is that copper material is processed.
7. action electron product circuit plate structure according to claim 1 is characterized in that, after the projection of this heat-sink unit was located at perforation, the height of this projection was surperficial consistent with flexible circuit board.
8. action electron product circuit plate structure according to claim 1 is characterized in that, utilizes contact to be electrically connected with projector mechanism on the one side of this flexible circuit board, and the bottom surface of this projector mechanism contacts with the projection of heat-sink unit.
9. action electron product circuit plate structure according to claim 8 is characterized in that, this projector mechanism is LED assembly or oLED assembly.
10. action electron product circuit board manufacturing method is characterized in that including the following step:
Step 1: with one first insulating barrier and bronze medal layer pressing in addition;
Step 2: on the one side of this copper layer, form a circuit layout district;
Step 3: in the circuit layout district of copper layer, paste one second insulating barrier, make an end in this circuit layout district be formed with connecting interface, the other end has corresponding contact;
Step 4: between each contact, dash again and set out a perforation, use forming a flexible circuit board, and this perforation runs through this flexible circuit board;
Step 5: get the pedestal of a copper material, and on the one side of this pedestal, form a projection, use forming a heat-sink unit;
Step 6: the projection correspondence of this heat-sink unit one side is located in the perforation of flexible circuit board, and one the 3rd insulating barrier is set between first insulating barrier and heat-sink unit; And
Step 7: last again a projector mechanism being located on the one side of flexible circuit board and with contact electrically connects, and the bottom surface of this projector mechanism is contacted with projection.
11. action electron product circuit plate structure according to claim 10 is characterized in that this circuit layout district forms on the one side of this copper layer with etching mode.
12. action electron product circuit plate structure according to claim 10 is characterized in that this flexible circuit board is the tabular of a long strip type.
13. action electron product circuit plate structure according to claim 10 is characterized in that, the ductility of this flexible circuit board copper layer capable of using is fold-type in addition, and its connecting interface below is provided with a stiffening plate.
14. action electron product circuit plate structure according to claim 10 is characterized in that this flexible circuit board is the tabular that is a L type.
15. action electron product circuit plate structure according to claim 10 is characterized in that, this projector mechanism is LED assembly or OLED assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110006823.1A CN102595767B (en) | 2011-01-13 | 2011-01-13 | Circuit board structure of mobile electronic product and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110006823.1A CN102595767B (en) | 2011-01-13 | 2011-01-13 | Circuit board structure of mobile electronic product and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102595767A true CN102595767A (en) | 2012-07-18 |
| CN102595767B CN102595767B (en) | 2015-07-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110006823.1A Expired - Fee Related CN102595767B (en) | 2011-01-13 | 2011-01-13 | Circuit board structure of mobile electronic product and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN102595767B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10229255A (en) * | 1997-02-14 | 1998-08-25 | Iwaki Electron Corp Ltd | Flexible printed board with flat plate |
| CN1348215A (en) * | 2000-10-05 | 2002-05-08 | 三洋电机株式会社 | Radiating base plate and semiconductor module |
| CN1512572A (en) * | 2002-12-30 | 2004-07-14 | 扬明光学股份有限公司 | Optical valve heat radiator |
| CN2730078Y (en) * | 2004-07-22 | 2005-09-28 | 嘉联益科技股份有限公司 | Compound multi-layer flexible circuit board structure |
| CN100471375C (en) * | 2004-11-24 | 2009-03-18 | 乐金电子(中国)研究开发中心有限公司 | Mobile communication terminal with double organic luminescent display units |
| WO2009094829A1 (en) * | 2008-01-07 | 2009-08-06 | Jie She | A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly |
| CN100574554C (en) * | 2007-04-10 | 2009-12-23 | 鸿富锦精密工业（深圳）有限公司 | Flexible PCB, processing method of said flexible circuit board and electronic installation |
-
2011
- 2011-01-13 CN CN201110006823.1A patent/CN102595767B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10229255A (en) * | 1997-02-14 | 1998-08-25 | Iwaki Electron Corp Ltd | Flexible printed board with flat plate |
| CN1348215A (en) * | 2000-10-05 | 2002-05-08 | 三洋电机株式会社 | Radiating base plate and semiconductor module |
| CN1512572A (en) * | 2002-12-30 | 2004-07-14 | 扬明光学股份有限公司 | Optical valve heat radiator |
| CN2730078Y (en) * | 2004-07-22 | 2005-09-28 | 嘉联益科技股份有限公司 | Compound multi-layer flexible circuit board structure |
| CN100471375C (en) * | 2004-11-24 | 2009-03-18 | 乐金电子(中国)研究开发中心有限公司 | Mobile communication terminal with double organic luminescent display units |
| CN100574554C (en) * | 2007-04-10 | 2009-12-23 | 鸿富锦精密工业（深圳）有限公司 | Flexible PCB, processing method of said flexible circuit board and electronic installation |
| WO2009094829A1 (en) * | 2008-01-07 | 2009-08-06 | Jie She | A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly |
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| Publication number | Publication date |
|---|---|
| CN102595767B (en) | 2015-07-22 |
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Granted publication date: 20150722 Termination date: 20170113 |
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| CF01 | Termination of patent right due to non-payment of annual fee |