CN215726486U - Pressure sensor module and electronic device - Google Patents
Pressure sensor module and electronic device Download PDFInfo
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- CN215726486U CN215726486U CN202121706888.2U CN202121706888U CN215726486U CN 215726486 U CN215726486 U CN 215726486U CN 202121706888 U CN202121706888 U CN 202121706888U CN 215726486 U CN215726486 U CN 215726486U
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- pressure sensor
- sensor module
- circuit board
- pressure
- housing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Measuring Fluid Pressure (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The embodiment of the application provides a pressure sensor module and an electronic device, the pressure sensor module comprises a pressed part, a pressure sensor and at least two conductive pins, the pressure sensor is arranged on the pressed part and generates a pressure signal when the pressed part deforms, and the at least two conductive pins are electrically connected with the pressure sensor and are used for being electrically connected with an external circuit board. The application provides a pressure sensor module, can be fixed in pressure sensor through electrically conductive pin in the circuit board, realize the electricity between pressure sensor and the circuit board and be connected, and need not laminate pressure sensor in electron device's shell alone, it can assemble in the shell with the circuit board together, reduce the assembly degree of difficulty, be convenient for realize automatic assembly, when electron device was located to pressure sensor module, when the user touched the pressure, the portion of being pressed is deformed and is made pressure sensor produce corresponding pressure signal, in order to trigger corresponding touch-control operation.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a pressure sensor module and an electronic device.
Background
Along with the continuous development of science and technology, electronic device's kind is more and more, for example products such as earphone, electron cigarette, and most electronic device adopts the forced induction key to accept outside touch-control operation at present, has better experience function, but because the structure that is used for installing pressure sensor of current electronic device is mostly the cambered surface, has restricted pressure sensor's installation for pressure sensor has great degree of difficulty in the aspect of automatic assembly.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, the present application provides a pressure sensor module and an electronic device to reduce the assembly degree of difficulty and be convenient for realize automatic assembly.
In a first aspect, an embodiment of the present application provides a pressure sensor module, the pressure sensor module includes a pressed portion, a pressure sensor and at least two conductive pins, the pressure sensor is disposed in the pressed portion, and generates a pressure signal when the pressed portion deforms, and the at least two conductive pins are electrically connected with the pressure sensor and are used for being electrically connected with an external circuit board.
In a second aspect, an embodiment of the present application further provides an electronic device, which includes the pressure sensor module, a circuit board and a housing, wherein the pressure sensor module and the circuit board are disposed in the housing, and a conductive pin of the pressure sensor module is welded to the circuit board.
The application provides a pressure sensor module, can be fixed in pressure sensor on the circuit board and realize the electricity between pressure sensor and the circuit board through electrically conductive pin, and need not laminate pressure sensor in electron device's shell alone, it can assemble in the shell together with the circuit board, reduce the assembly degree of difficulty, be convenient for realize automatic assembly, when electron device was located to pressure sensor module, when the user touched the pressure, the portion that receives compressed was deformed and is made pressure sensor produce corresponding pressure signal, in order to trigger corresponding touch-control operation.
These and other aspects of the present application will be more readily apparent from the following description of the embodiments.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments, not all embodiments, of the present application. All other embodiments and drawings obtained by a person skilled in the art based on the embodiments of the present application without any inventive step are within the scope of the present invention.
Fig. 1 is a schematic structural diagram of a pressure sensor module according to an embodiment of the present disclosure mounted on a circuit board;
fig. 2 is a schematic structural diagram of the pressure sensor module shown in fig. 1 under a first viewing angle;
FIG. 3 is a schematic structural diagram of the pressure sensor module shown in FIG. 1 under a second viewing angle;
fig. 4 is a schematic structural diagram of another pressure sensor module according to an embodiment of the present disclosure;
FIG. 5 is a schematic view of the pressure sensor shown in FIG. 4 from a first perspective;
FIG. 6 is a schematic structural view of the pressure sensor shown in FIG. 5 in a disassembled state;
fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;
FIG. 8 is an axial view of the housing, the pressure sensor module, and the circuit board of the electronic device shown in FIG. 7;
fig. 9 is a schematic structural diagram of a housing in the electronic device shown in fig. 8.
Fig. 10 is a schematic structural diagram of a housing of another electronic device according to an embodiment of the present application.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The pressure sensor module and the electronic device provided in the embodiments of the present application will be described in detail through specific embodiments.
Referring to fig. 1, an embodiment of the present application provides a pressure sensor module 100, where the pressure sensor module 100 includes a pressure sensor 120, at least two conductive pins 131, and a pressure receiving portion 140. The pressure sensor module 100 may be mounted on a circuit board 110, and at least two conductive pins 131 are electrically connected to the pressure sensor 120 and are used for electrically connecting to the circuit board 110.
The application provides a pressure sensor module 100, can be directly be fixed in on circuit board 110 with pressure sensor 120 through conductive pin 131, in order to realize the electricity between pressure sensor 120 and the circuit board 110 and be connected, and need not laminate pressure sensor 120 in electronic device's shell alone, pressure sensor module 100 can assemble in the shell together with circuit board 110, reduce the assembly degree of difficulty, be convenient for realize automatic assembly, when pressure sensor module 100 locates electronic device's shell inner wall, when the user touched and pressed corresponding position, receive the portion 140 pressurized deformation and make pressure sensor 120 produce corresponding pressure signal, in order to trigger corresponding touch-control operation.
In this embodiment, the pressed part 140 may be a plate-shaped structure, wherein the pressed part 140 may be made of an elastic material, and when pressed, the pressed part 140 can deform to a large extent to drive the pressure sensor 120 to deform and generate a corresponding pressure signal; when the external force applied to the pressure receiving portion 140 is removed, the pressure receiving portion 140 may be restored by its own restoring force. The pressure receiving portion 140 may include a mounting surface 141, a mounting back surface 142, and a side surface 143 facing away from each other, the side surface 143 being connected between the mounting surface 141 and the mounting back surface 142, the mounting surface 141 may be used for mounting the pressure sensor 120, and the mounting back surface 142 may be used for receiving an external force. For example, when the pressure sensor module and the circuit board are assembled inside the housing of the electronic device, the mounting back surface 142 may abut against an inner wall of the housing of the electronic device to receive a force generated by a user when performing a pressure touch operation on the electronic device. The pressed portion 140 may be regular or irregular, for example, the pressed portion 140 may be circular, rectangular, oval, semi-oval, "T" or other shapes.
In some embodiments, as shown in fig. 1 and 2, the pressure receiving portion 140 is provided with a pressure receiving protrusion 144, and the pressure receiving protrusion 144 is provided on the mounting back surface 142, that is, the pressure receiving protrusion 144 and the pressure sensor are provided on two opposite surfaces of the pressure receiving portion. Alternatively, the compression lobes 144 may be cylinders, hemispheres, etc. When pressure sensor module 100 assembles in electron device's shell, protruding 144 of pressurized can be used for contacting with the shell, and correspond with the predetermined operating position of shell, protruding 144 of pressurized can be made by hard material, because protruding 144 of pressurized is made by hard material, make protruding 144 of pressurized can not form the buffering like this, when the user is pressing the corresponding position of shell, the pressing force directly makes pressed part 140 take place deformation fast through protruding 144 of pressurized, simultaneously here, pressure sensor 120 takes place deformation and produces obvious signal of telecommunication, and then improve electron device's feedback speed. In addition, the compression protrusion 144 may also be made of an elastic material, such as rubber or plastic, and may be specifically configured according to actual requirements.
In some embodiments, the pressure receiving portion 140 may be a metal structure, and an insulating adhesive layer 151 may be disposed between the pressure receiving portion 140 and the pressure sensor 120. Can bond in an organic whole with pressure sensor 120 by setting up insulating glue layer 151, be convenient for both quick fixity, simultaneously, can make pressure portion 140 and pressure sensor 120 electrical isolation each other through insulating glue layer 151 to prevent that pressure sensor 120 from leaking electricity and taking place the short circuit.
In the present embodiment, the conductive pin 131 is made of a material having a conductive function, for example, the conductive pin 131 may be a metal structure.
In some embodiments, as shown in fig. 1 and 3, the at least two conductive leads 131 include a first conductive lead 1311 and a second conductive lead 1312, the first conductive lead 1311 and the second conductive lead 1312 being connected to opposite sides of the pressure sensor 120, respectively. The first and second conductive leads 1311, 1312 may be solder tails capable of being soldered to the circuit board 110. One end of the first conductive pin 1311 and one end of the second conductive pin 1312 may be connected to one of the upper surface, the lower surface, or the side surface of the pressure sensor 120 and electrically connected to the pressure sensor 120, and the other end of the first conductive pin 1311 and the other end of the second conductive pin 1312 may be soldered to a pad of the circuit board 110 to be electrically connected to an internal circuit of the circuit board 110. By disposing the first conductive pin 1311 and the second conductive pin 1312 on opposite sides of the pressure sensor 120, the opposite sides of the pressure sensor 120 may be supported, so that the pressure sensor 120 is more firmly fixed on the circuit board 110.
In some embodiments, as shown in fig. 1, the conductive pin 131 can include a connection end 1314 and a support end 1313, the connection end 1314 being electrically connected to the pressure sensor 120, and the support end 1313 being for soldering to the circuit board 110. The connecting end 1314 and the supporting end 1313 may be integrally formed, and the connecting end 1314 may be fixed to the mounting surface 141 and electrically connected to the pressure sensor 120. The support end 1313 is angled away from the connection end 1314 to support the pressure sensor 120 at the connection end 1314. The included angle is a bending angle of the supporting end 1313 relative to the connecting end 1314, and the bending angle may be greater than or equal to 90 ° to achieve a better supporting effect. Further, the support end 1313 may be generally "L" shaped with one side of the L being connected to the connection end 1314 and the other side being for soldering to the circuit board 110. In this way, the lower surface of the supporting end 1313 can substantially fit the circuit board 110, so that the lower surface of the supporting end 1313 can cover the pad on the circuit board 110 to form a good electrical contact, which is convenient for soldering.
In some embodiments, as shown in fig. 3, the pressure receiving portion 140 includes a plate body 145 and at least two mounting feet 146, and the pressure sensor 120 is disposed on the plate body 145. When the pressed portion is of a metal structure, the pressure sensor 120 and the insulating adhesive layer 151 are both disposed on the plate 145, and specifically, the pressure sensor 120 is adhered to the plate 145 through the insulating adhesive layer 151. Each of the mounting legs 146 has one end connected to the board 145 and the other end connected to the circuit board 110. As an example, a partial number of the mounting legs 146 may be connected to a first side of the plate body 145, and the remaining mounting legs 146 may be connected to a second side of the plate body 145, wherein the first side and the second side may intersect or be parallel, for example, the first side and the second side may be disposed opposite to each other in a width direction or a length direction of the plate body 145. The mounting feet 146 and the plate 145 may be integrally formed. As yet another example, the plurality of mounting feet 146 may be divided into two groups, with the two groups of mounting feet 146 being located on opposite sides of the pressure sensor 120, respectively, wherein a portion of the number of conductive pins 131 may be located on the same side of the pressure sensor 120 as one of the groups of mounting feet 146, and a portion of the number of conductive pins 131 may be located on the other side of the pressure sensor 120 as the other group of mounting feet 146. In another example, the conductive pins 131 and the mounting feet 146 may be located on different sides of the pressure sensor 120. The plate body 145 can be supported by the installation foot 146, and when the plate body 145 deforms under pressure, the installation foot 146 and the conductive pin 131 can bear pressure together, so that the conductive pin 131 is prevented from deforming under excessive pressure.
In some embodiments, as shown in fig. 4 and 5, the pressed part 140 may be an insulator, and the at least two conductive pins 131 are disposed on the pressed part 140. As an example, one end of each conductive pin 131 is disposed on the mounting surface 141 and electrically connected to the pressure sensor 120, and the other end is used for connecting the circuit board 110. By providing the pressed portion 140 as an insulator, it is possible to effectively electrically isolate the adjacent conductive pins 131 and avoid short circuits. As an example, as shown in fig. 6, the mounting surface 141 is provided with at least two mounting grooves 1411, each conductive pin 131 is respectively embedded in one of the mounting grooves 1411, and the depth of the mounting groove 1411 is less than or equal to the thickness of the conductive pin 131, so that the portion of the conductive pin 131 embedded in the mounting groove 1411 can be exposed out of the mounting surface 141 to be electrically connected to the corresponding electrical contact on the pressure sensor 120, and the corresponding electrical contact of the pressure sensor 120 can be directly soldered to the structure where the corresponding conductive pin 131 is exposed out of the mounting surface 141. The surface of each conductive pin 131 electrically connected to the pressure sensor 120 may be flush with the mounting surface 141, so that the entire pressure sensor 120 can completely and smoothly fit to the mounting surface 141, and thus when the pressure receiving portion 140 deforms, the mounting surface 141 can directly transmit a large deformation to the pressure sensor 120, so that the pressure sensor 120 deforms to a large extent. In addition, the surface of each conductive pin 131 electrically connected to the pressure sensor 120 may also protrude from the mounting surface 141. In addition, in some embodiments, the conductive pin 131 and the pressed portion 140 may also be fixed by bonding, screwing, or clipping.
The application provides a pressure sensor module 100, be fixed in pressure sensor 120 on circuit board 110 through conductive pin 131 in order to realize the electricity between pressure sensor 120 and the circuit board 110 to be connected, conductive pin 131 can play the effect of supporting pressure sensor 120 and pressure portion 140 simultaneously, through with pressure sensor 120, pressure portion 140 and conductive pin 131 form the module, and need not laminate pressure sensor 120 in electronic device's shell alone, only need assemble in the shell together with circuit board 110, reduce the assembly degree of difficulty, be convenient for realize automatic assembly, when pressure sensor module 100 locates in electronic device's shell, when the user touches and presses corresponding position, pressure portion 140 receives the pressure deformation and makes pressure sensor 120 produce corresponding pressure signal, in order to trigger corresponding touch operation.
Referring to fig. 7 and 8, an electronic device 200 is further provided in an embodiment of the present disclosure, which includes the pressure sensor module 100, the circuit board 110, and the housing 210, wherein the pressure sensor module 100 and the circuit board 110 are disposed in the housing 210. When a user presses a corresponding position of the housing 210, the housing 210 deforms to some extent and drives the pressure receiving portion 140 to deform, so that the pressure sensor 120 generates a corresponding pressure signal.
Alternatively, the electronic device 200 may be an earphone, an electronic cigarette, a recording pen, or the like, and the electronic device 200 is taken as an earphone as an example for explanation.
In the present embodiment, the pressure sensor 120 is disposed opposite to the circuit board 110 at an interval, the circuit board 110 and the pressure sensor 120 are respectively connected to two ends of each conductive pin 131, the pressure receiving portion 140 is disposed on a side of the pressure sensor 120 away from the circuit board 110, and the conductive pins 131 of the pressure sensor 120 are soldered to the circuit board 110. Because the pressure sensor 120 and the circuit board 110 are arranged at an opposite interval, a large heat dissipation space can be formed between the pressure sensor 120 and the circuit board 110, so that heat dissipation is facilitated, and the over-high temperature of the pressure sensor 120 and the circuit board 110 during operation is avoided.
In some embodiments, the compression portion 140 is configured to be disposed adjacent the housing 210 such that the housing 210 abuts the compression portion 140 when compressed.
In some embodiments, at least a portion of the housing 210 is a hollow structure, the pressure sensor module 100 is embedded in the hollow structure, and the outer wall of the hollow structure is provided with a pressing portion 240 corresponding to the pressed portion 140. Referring to fig. 7, the housing 210 may include an ear plug portion 211 and an outer extension portion 212, the ear plug portion 211 is configured to be a structure adapted to an ear, a sound generating element is disposed in the ear plug portion 211, the ear plug portion 211 may be plugged into the ear of a user to hang the whole earphone on the ear of the user, the outer extension portion 212 may be a hollow structure, the outer extension portion 212 may be used to mount the above-mentioned components such as the pressure sensor module 100, a battery and a control circuit, and a touch key or a press key may be further disposed outside the outer extension portion 212 for the user to operate. For example, the outer extension 212 may be a hollow cylinder structure, the housing 210 has an inner wall 2121, the inner wall 2121 may be provided with a stopper 2122, and the circuit board 110 may be mounted on the stopper 2122.
As an example, as shown in fig. 8 and 9, the position-limiting portion 2122 may be a rib, the rib may be disposed on the inner wall 2121 along a central axis parallel to the housing 210, the circuit board 110 may abut against the position-limiting portion 2122, the circuit board 110 may be embedded into the housing 210 substantially along an axial direction of the housing 210, and the position-limiting portion 2122 abuts against the circuit board 110 to fix the circuit board 110 and prevent the circuit board 110 from moving up and down relative to the housing 210. The number of the protruding ribs is two, the two protruding ribs are oppositely arranged on the inner wall 2121 at intervals, the two protruding ribs can be arranged along the axial direction of the housing 210 and extend to the annular end surface of the housing 210, and two ends of the circuit board 110 can be fixed on the protruding ribs to be fixedly arranged on the housing 210 and can be abutted against the inner wall 2121.
Further, as another example, the limiting portion 2122 may also be a slot, wherein the slot may extend along an axis of the housing 210, and the circuit board 110 may be inserted into the slot along the axis of the housing 210.
As an example, the pressing portion 240 may be a pressing mark for guiding a user to press a corresponding position on the housing 210, the pressing portion 240 may be a "key" of the electronic device, and the pressing portion 240 triggers the pressure sensor 120 when pressed. The user can control the electronic device 200 to execute the corresponding key operation function by touching and pressing the "key", and the user can perform the touch operation by pressing the pressing part 240 instead of the conventional mechanical key, so that the electronic device executes the corresponding operation function. For example, the pressing portion 240 may be an "on/off key", a "volume key", or another function key, and is not particularly limited herein.
In some embodiments, as shown in fig. 8, when the pressure sensor module 100 provided with the pressure receiving protrusion 144 is disposed in the housing 210, the pressure receiving protrusion 144 may abut against the housing 210, and when the region of the housing 210 corresponding to the position of the pressure receiving protrusion 144 is deformed under pressure, the pressure receiving protrusion 144 may be driven to drive the pressure receiving portion 140 to deform. In addition, in some embodiments, when the pressure sensor 120 is assembled to the housing 210, the pressed protrusion 144 may also be in interference fit with the housing 210, and the pressed portion 140 may generate a certain pre-deformation, so that the pressure sensor 120 disposed on the pressed portion 140 may generate a slight deformation, and thus when the housing 210 is stressed, the pressure sensor 120 may be stressed and deformed synchronously at the first time, thereby avoiding a situation of signal delay and improving the sensitivity of the pressure sensor 120.
In some embodiments, as shown in fig. 10, the housing 210 may further include a contact protrusion 2123, the contact protrusion 2123 is disposed on the inner wall 2121, and the contact protrusion 2123 is disposed toward the pressed portion 140, so that the contact protrusion 2123 abuts against the pressed portion 140 when the housing 210 is pressed. The corresponding operation can be triggered only when the corresponding position area of the housing 210 is pressed. When the pressure contact protrusion 2123 of the housing 210 is pressed, the pressure contact protrusion 2123 is displaced and drives the pressure receiving portion 140 to deform, so that the pressure sensor 120 generates a pressure signal. When the pressure receiving portion 140 of the pressure sensor module 100 is provided with the pressure receiving protrusion 144, the housing 210 may not be provided with the pressure contacting protrusion 2123, or when the pressure receiving portion 140 of the pressure sensor module 100 is not provided with the pressure receiving protrusion 144, the pressure contacting protrusion 2123 may be provided in the housing 210, or the pressure sensor module 100 may be provided with the pressure receiving protrusion 144, and the housing 210 may also be provided with the pressure contacting protrusion 2123, where the pressure contacting protrusion 2123 is disposed opposite to the pressure receiving protrusion 144 of the pressure sensor module 100, and when the pressure contacting protrusion 2123 of the housing 210 is pressed, the pressure contacting protrusion 2123 may transmit the pressure to the pressure receiving protrusion 144 of the pressure sensor module 100, so that the pressure sensor 120 deforms and generates a corresponding electrical signal.
In some embodiments, the electronic device 200 may further include a wireless communication module 230 (as shown in fig. 6), the wireless communication module 230 is used for establishing wireless communication with the mobile terminal, wherein the wireless communication module 230 may be a bluetooth module, a Wi-Fi module, or a ZigBee module, etc. Furthermore, in some embodiments, the end of the outer extension 212 may also be provided with a charging structure, wherein the charging structure may be a charging post or a metal contact for making an electrical connection with a charging connector of a charging device.
To sum up, the electronic device 200 provided in the embodiment of the present application, through setting up the above-mentioned pressure sensor module 100, when the user presses the pressing area corresponding to the housing 210, and the housing 210 receives the force to drive the pressure receiving portion 140 to deform, the pressure receiving portion 140 deforms and drives the pressure sensor 120 to deform to a greater extent, so that the pressure sensor 120 generates a corresponding pressure signal, and the corresponding touch operation is triggered.
While the present embodiments have been described with reference to the accompanying drawings, the present embodiments are not limited to the above embodiments, which are merely illustrative and not restrictive, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention.
Claims (12)
1. A pressure sensor module, comprising:
a pressure receiving portion;
the pressure sensor is arranged on the pressure receiving part and generates a pressure signal when the pressure receiving part deforms; and
and the at least two conductive pins are electrically connected with the pressure sensor and are used for being electrically connected with an external circuit board.
2. The pressure sensor module of claim 1, wherein the at least two conductive pins include a first conductive pin and a second conductive pin, the first conductive pin and the second conductive pin being connected to opposite sides of the pressure sensor, respectively.
3. The pressure sensor module of claim 1, wherein the pressed portion is an insulator, and the at least two conductive pins are disposed on the pressed portion.
4. The pressure sensor module of claim 3, wherein the pressed portion includes a mounting surface facing the pressure sensor, and one end of each conductive pin is disposed on the mounting surface and connected to the pressure sensor, and the other end is used for connecting to the circuit board.
5. The pressure sensor module of claim 4, wherein the mounting surface has at least two mounting grooves, each of the conductive pins is embedded in one of the mounting grooves, and the depth of the mounting groove is less than or equal to the thickness of the conductive pin.
6. The pressure sensor module of claim 1, wherein the pressed portion is a metal structure, and an insulating adhesive layer is disposed between the pressed portion and the pressure sensor.
7. The pressure sensor module of claim 6, wherein the pressed portion comprises a plate body and at least two mounting pins, the insulating adhesive layer and the pressure sensor are disposed on the plate body, one end of each mounting pin is connected to the plate body, and the other end of each mounting pin is used for connecting the circuit board.
8. The pressure sensor module of any of claims 1-7, wherein the conductive pin includes a connection end and a support end, the connection end being electrically connected to the pressure sensor, the support end forming an angle with the connection end and being configured to be soldered to the circuit board.
9. The pressure sensor module according to any one of claims 1 to 7, wherein the pressure receiving portion is provided with a pressure receiving protrusion, and the pressure receiving protrusion and the pressure sensor are provided on two opposite surfaces of the pressure receiving portion.
10. An electronic device, comprising the pressure sensor module as claimed in any one of claims 1 to 9, a circuit board, and a housing, wherein the pressure sensor module and the circuit board are disposed in the housing, and conductive pins of the pressure sensor module are soldered to the circuit board.
11. The electronic device of claim 10, wherein the pressed portion is disposed adjacent to the housing such that the housing presses against the pressed portion when pressed.
12. The electronic device according to claim 11, wherein the housing includes an inner wall and a contact protrusion, the contact protrusion is disposed on the inner wall, and the contact protrusion is disposed opposite to the pressed portion.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121706888.2U CN215726486U (en) | 2021-07-26 | 2021-07-26 | Pressure sensor module and electronic device |
| PCT/CN2022/107274 WO2023005822A1 (en) | 2021-07-26 | 2022-07-22 | Pressure sensor module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121706888.2U CN215726486U (en) | 2021-07-26 | 2021-07-26 | Pressure sensor module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215726486U true CN215726486U (en) | 2022-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121706888.2U Active CN215726486U (en) | 2021-07-26 | 2021-07-26 | Pressure sensor module and electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN215726486U (en) |
| WO (1) | WO2023005822A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023005822A1 (en) * | 2021-07-26 | 2023-02-02 | 芯海科技（深圳）股份有限公司 | Pressure sensor module and electronic device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4230241B2 (en) * | 2003-02-14 | 2009-02-25 | 東芝電子エンジニアリング株式会社 | Touch sensor, gripping robot |
| CN106289596A (en) * | 2015-05-29 | 2017-01-04 | 鸿富锦精密工业（深圳）有限公司 | Pressure sensor |
| KR20190035013A (en) * | 2017-09-25 | 2019-04-03 | 주식회사 센터스 | Pressure sensor package and electronic device including the same |
| CN208012800U (en) * | 2017-11-27 | 2018-10-26 | 深圳市迈泰生物医疗有限公司 | More pin capacitance formula pressure sensors |
| CN208488196U (en) * | 2018-06-08 | 2019-02-12 | 精量电子（深圳）有限公司 | A kind of force snesor |
| CN110255491A (en) * | 2019-06-27 | 2019-09-20 | 中国科学院微电子研究所 | MEMS pressure sensor encapsulating structure and packaging method |
| CN215726486U (en) * | 2021-07-26 | 2022-02-01 | 芯海科技（深圳）股份有限公司 | Pressure sensor module and electronic device |
-
2021
- 2021-07-26 CN CN202121706888.2U patent/CN215726486U/en active Active
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2022
- 2022-07-22 WO PCT/CN2022/107274 patent/WO2023005822A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023005822A1 (en) * | 2021-07-26 | 2023-02-02 | 芯海科技（深圳）股份有限公司 | Pressure sensor module and electronic device |
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| WO2023005822A1 (en) | 2023-02-02 |
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