CN110255491A - MEMS pressure sensor encapsulating structure and packaging method - Google Patents
MEMS pressure sensor encapsulating structure and packaging method Download PDFInfo
- Publication number
- CN110255491A CN110255491A CN201910570913.XA CN201910570913A CN110255491A CN 110255491 A CN110255491 A CN 110255491A CN 201910570913 A CN201910570913 A CN 201910570913A CN 110255491 A CN110255491 A CN 110255491A
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- pressure sensor
- mems pressure
- circuit board
- flexible circuit
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
Abstract
A kind of MEMS pressure sensor encapsulating structure and packaging method.The encapsulating structure includes flexible circuit board；MEMS pressure sensor is fixed on a surface of flexible circuit board, and is electrically connected with flexible circuit board, and it includes presser sensor structures；Outer rigid housing forms an open cavity, is equipped with MEMS pressure sensor in open cavity；And encapsulation filler, it is filled in open cavity, and be covered in the presser sensor structure and exposed gold thread of MEMS pressure sensor, and a lug boss is formed outside open cavity；Wherein, encapsulation filler can conduct pulse pressure to the presser sensor structure of MEMS pressure sensor, and MEMS pressure sensor is enable to acquire pulse pressure signal.The present invention protects its electrical connection with substrate, uses encapsulation filler as the medium of pressure conduction, improve the stability and sensitivity of sensor by fixing outer rigid housing around MEMS sensor.
Description
Technical field
The present invention relates to pulse transducer technical field more particularly to a kind of MEMS pressure sensor encapsulating structure and encapsulation
Method.
Background technique
With the development of social economy and the raising of living standards of the people, human health is guarded increasingly by the pass of people
Note.With the specific demand of the progress of sensor science and technology and health care settings to pressure sensor in recent years, city
Occurs the structure design of more and more a variety of pulse transducers on field.These sensor bulks are small, stable structure, can continue
Human health status is monitored, provides most timely healthy early warning service for the people.
MEMS (Micro-Electro-Mechnical-System, MEMS) pressure sensor generally comprises support
Beam or support film structure, Fundamentals of Sensors mostly use greatly ess-strain principle, by taking MEMS baroceptor as an example, not
The degree of strain of supporting beam or support film is different under same air pressure size, causes the electric resistance structure on MEMS baroceptor
Resistance value changes, and destroys the balance of Wheatstone bridge, to generate the voltage signal of variation.
But since MEMS sensor and the electrical of substrate such as PCB substrate or plastics cavity metal lead wire frame etc. connect
Connect the general method for using bonding gold thread, and gold thread be it is directly exposed, when measuring human pulse pressure, it is easy to destroy crisp
Weak gold thread, to destroy the normal use of sensor.In addition, there is a kind of MEMS pressure for measuring human pulse to pass at present
Induction device is that pulse wave is acquired by hydraulic bionical probe, and hydraulic bionical probe is fixed using the double-deck band, by hydraulic imitative
The variation for the pressure signal that hydraulic bionical probe detects can be transferred to pressure sensor by the transmission medium in raw probe.Its
In, transmission medium is water, and uses microsensor array technique, and 24 level sensors measure pulse wave digit situation parameter category
Property.But this kind of pulse wave sensor conducts pulse signal using water, hydraulic conduction pipe is easy to cause biggish interference, cannot
Pulse wave information is accurately obtained, diagnostic significance is little.In addition, the length of liquid conduits is 30cm, lead to the device portability
It is poor.
The finger sense pressure and microarray sensing device that there are also a kind of for measuring human pulse, with MEMS technology, design
Sensor is placed in the curvilinear rigid material of similar index finger finger pulp size, then carries out MEMS package by microarray pressure sensor,
Simulation people refers to lower tactile impressions information, obtains information of pulse examination.But in the device, MEMS micro-array sensors minute-pressure contact is entrenched in imitative
Green hand's finger belly designs the outer surface of flexible finger pressing type probe, does not protect to the gold thread of the sensitive area of sensor and bonding,
Sensor is easily damaged.
In conclusion can be protected still without a kind of for detecting the MEMS pressure sensor device of pulse in the prior art
The electrical connection of MEMS sensor and substrate, and the pressure signal from human pulse can be conducted.
Summary of the invention
In view of this, the main purpose of the present invention is to provide a kind of MEMS pressure sensor encapsulating structure and encapsulation sides
Method, at least be partially solved at least one of above-mentioned the technical issues of referring to.
To achieve the above object, technical scheme is as follows:
As one aspect of the present invention, a kind of MEMS pressure sensor encapsulating structure is provided, comprising:
Flexible circuit board；
MEMS pressure sensor is fixed on a surface of the flexible circuit board, and passes through gold with the flexible circuit board
Line electrical connection, the MEMS pressure sensor include presser sensor structure；
Outer rigid housing forms an open cavity, is equipped with the MEMS pressure sensor in the open cavity；With
And
Filler is encapsulated, is filled in the open cavity, and be covered in the presser sensor of the MEMS pressure sensor
In structure and exposed gold thread, and a lug boss is formed outside open cavity；
Wherein, the encapsulation filler can conduct pulse pressure to the presser sensor knot of the MEMS pressure sensor
Structure enables MEMS pressure sensor to acquire pulse pressure signal.
According to another aspect of the present invention, it provides a kind of using MEMS pressure sensor encapsulating structure as described above
Pulse detecting device, the quantity of MEMS pressure sensor described in the pulse detecting device be it is multiple, for acquiring respectively
Pulse pressure signal at different location.
According to a further aspect of the invention, a kind of MEMS pressure sensor packaging method is provided, comprising the following steps:
MEMS pressure sensor is fixed on a surface of a flexible circuit board, and is electrically connected by gold thread to described
Flexible circuit board；
The MEMS pressure sensor is placed in an outer rigid housing with open cavity；
Encapsulation filler is poured into the open cavity, the presser sensor structure of the MEMS pressure sensor is covered
And on exposed gold thread, and a lug boss is formed outside open cavity；Wherein, the encapsulation filler can be by pulse pressure
In conduction to the presser sensor structure of MEMS pressure sensor, MEMS pressure sensor is enable to acquire pulse pressure signal.
Compared with the prior art, the present invention has following remarkable advantage:
1, MEMS sensor is fixed on flexible circuit board by the present invention, and it is outer to provide a rigidity with open cavity
Shell is placed in the MEMS sensor in open cavity, and the filling encapsulation filler in open cavity, is filled by encapsulation
Agent can conduct the pulse pressure signal of human body, and gold thread is placed on and is also not easy to be damaged in outer rigid housing.
2, the flexible circuit board is bent MEMS pressure sensor, and then can be close with pulses measure position
Fitting；
3, in addition, encapsulation filler is other than it can conduct pulse pressure signal, moreover it is possible to make gold thread all directions by pressure
It is identical, less easy fracture, and had not been reported in the art at present by this soft contact realization electic protection.
4, further using circuit board package silica gel as encapsulation filler come conducting pressure to MEMS pressure sensor, gram
Need to seal or be easy the defect of leakage when having taken using water as transmitting medium, when encapsulation, silica gel can voluntarily solidify, and prepare work
Skill is simpler, and stability is more preferable, and high sensitivity, structure is hardly damaged.
Detailed description of the invention
Fig. 1 is MEMS pressure sensor package structure diagram of the invention；
Fig. 2 (a) is the presser sensor structure top view of the MEMS silicon piezoresistance type pressure sensor of the embodiment of the present invention 1；
Fig. 2 (b) is the presser sensor structural side view of the MEMS silicon piezoresistance type pressure sensor of the embodiment of the present invention 1；
Fig. 2 (c) is the circuit diagram of the MEMS silicon piezoresistance type pressure sensor of the embodiment of the present invention 1.
Appended drawing reference meaning is as follows in above-mentioned attached drawing:
1- silica gel；2- outer rigid housing；3- gold thread；4-MEMS silicon piezoresistance type pressure sensor；5-FPC plate；6- stiffening plate；7-
Through-hole；8- lug boss.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Attached drawing, the present invention is described in further detail.
According to some embodiments of the present invention, a kind of MEMS pressure sensor encapsulating structure is provided, comprising:
Flexible circuit board (Flexible Printed Circuit, hereinafter referred to as FPC plate)；
MEMS pressure sensor is fixed on a surface of FPC plate, and is electrically connected with flexible circuit board by gold thread,
MEMS pressure sensor includes presser sensor structure；
Outer rigid housing forms an open cavity, is equipped with MEMS pressure sensor in the open cavity；And
Encapsulate filler, filling to the presser sensor structure in the open cavity, being covered in MEMS pressure sensor and
On exposed gold thread, and a lug boss is formed outside open cavity, in order to pulse detection；
Wherein, the encapsulation filler can conduct pulse pressure to the presser sensor structure of MEMS pressure sensor, and
Pulse pressure signal is acquired by MEMS pressure sensor.
Wherein, outer rigid housing is stainless steel, copper, aluminium or the resin material such as ABS for being capable of forming rigid structure
(Acrylonitrile Butadiene Styrene) resin etc.；The open cavity formed on the outer rigid housing can be
Under shed, so that outer rigid housing only protects side；It is also possible to a direction opening, i.e., MEMS pressure sensor is installed
On the flexible circuit board of outer rigid housing covering, the through hole of presser sensor structure from flexible circuit board is exposed, direction
The open side of outer rigid housing, the filler of covering encapsulation thereon form protrusion.
Wherein, encapsulation filler is circuit board package silica gel, preferably dimethyl silicone polymer (PDMS) etc.；More preferably
The circuit board package silica gel that can voluntarily solidify, so that packaging technology is simpler, structural stability is more preferable, such as AB glue, wiring board
Fixed glue of element etc..
Wherein, outer rigid housing is fixed on flexible circuit board, preferably by welding or be bonded and fixed to flexible circuit board
On.It is readily appreciated that, if outer rigid housing is metal material, such as can be by being fixedly welded on multiple pads of flexible circuit board
On, such as on four pads on four angles；If outer rigid housing is resin material, flexible electrical is bonded and fixed to by adhesive
On the flexible layer of road plate.
Wherein, which further includes stiffening plate, is set to the unlocked MEMS pressure of FPC plate
On another surface of sensor, at the position opposite with open cavity, and the size of stiffening plate is greater than or equal to the rigidity
The opening of the open cavity of shell.The stiffening plate is rigid plate, and in some embodiments, which is glass mat,
Such as FR4, can be by hot pressing or gluing on FPC plate, preventing local FPC plate from bending, in order to avoid influence encapsulating structure.
Wherein, a through-hole is provided with naked in position corresponding with MEMS pressure sensor respectively on FPC plate and stiffening plate
Expose MEMS pressure sensor, MEMS pressure sensor is made to be located at atmospheric pressure environment.
Wherein, MEMS pressure sensor includes several pins, has several first welderings corresponding with these pins on FPC plate
Disk, several pins pass through gold thread respectively and are soldered to several first pads.In addition, MEMS pressure sensor is also to pass through welding
Mode is fixed on FPC plate.
Wherein, MEMS pressure sensor is silicon piezoresistance type pressure sensor, and corresponding presser sensor structure is to be consolidated by periphery
The stress cup structure that fixed silicon-sensitive film is formed.
According to some embodiments of the present invention, it additionally provides a kind of using MEMS pressure sensor as described above encapsulation knot
The pulse detecting device of structure, wherein the quantity of MEMS pressure sensor can be to be multiple, to form array structure, for adopting respectively
The pulse signal of Ji Butongweizhichu；In some embodiments, multiple MEMS pressure sensor is fixed on same flexible circuit
On plate, to form the protection structure of multiple corresponding outer rigid housings on a flexible circuit board.
According to some embodiments of the present invention, a kind of packaging method of MEMS pressure sensor is additionally provided, including following
Step:
Step S1: MEMS pressure sensor is fixed on a surface of a flexible circuit board, and is electrically connected by gold thread
It is connected to flexible circuit board；
Step S2: MEMS pressure sensor is placed in an outer rigid housing with open cavity；
Step S3: encapsulation filler is poured into open cavity, the presser sensor structure of MEMS pressure sensor is covered
And on exposed gold thread, and a lug boss is formed outside open cavity；
Wherein, encapsulation filler can conduct pulse pressure to the presser sensor structure of MEMS pressure sensor, make
MEMS pressure sensor can acquire pulse pressure signal.
In step S1, several first pads and several second pads are formed on flexible circuit board, several first welderings
Disk is attached with several pins in MEMS pressure sensor respectively；Several second pads are outer for rigidity to be welded and fixed
Shell.Pad can make to be formed by conventional methods, and therefore not to repeat here.
It is opposite with open cavity on another surface of the not set MEMS pressure sensor of FPC plate in step S1
Position forms stiffening plate；And the size of stiffening plate is greater than or equal to the opening of the open cavity of the outer rigid housing；Stiffening plate
It is attached on PFC plate by hot pressing or gluing.
Further, position corresponding with MEMS pressure sensor pre-sets through-hole respectively on FPC plate and reinforcement, with naked
Expose MEMS pressure sensor.
In step S1, several pins of MEMS pressure sensor are by several the on bonding gold thread technique and FPC plate
One pad realizes electrical connection.
Wherein, step S2 includes following operation: outer rigid housing is fastened on to the flexible electrical for being fixed with MEMS pressure sensor
On the plate of road, it is placed in MEMS pressure sensor chip and exposed gold thread in the open cavity of the outer rigid housing.Rigidity
Shell is preferably fixedly welded on several second pads of flexible circuit board, and the outer rigid housing of certain resin material then can be direct
It is bonded on flexible circuit board by adhesive.
Technical solution of the present invention is described further below by way of specific embodiment and in conjunction with attached drawing:
Embodiment 1
As shown in Figure 1, the present embodiment by taking conventional MEMS silicon piezoresistance type pressure sensor as an example, designs a FPC plate 5,
Multiple pads that the positive promising MEMS silicon piezoresistance type pressure sensor 4 in corresponding position makes, wherein four pads and MEMS
Four pins of silicon piezoresistance type pressure sensor 4 correspond, and another one pad is for fixing MEMS silicon piezoresistance type pressure
Sensor 4, wherein another pad is for fixing outer rigid housing 2；There is one piece to cover four pads at the back side of corresponding position
Stiffening plate 6.The centre of stiffening plate 6 and FPC plate 5 is preset with a through-hole 7 respectively, with MEMS silicon piezoresistance type pressure sensor
Fixed position is corresponding.
MEMS silicon piezoresistance type pressure sensor 4 is applied on the pad of sensor fixed bit of FPC plate 5 with silver paste, so
The some time is toasted with set temperature afterwards, MEMS silicon piezoresistance type pressure sensor 4 can be fixed on FPC plate 5 by this.Such as Fig. 2
(a)~2 (b) show the schematic diagram of the presser sensor structure of MEMS silicon piezoresistance type pressure sensor 4, for the silicon fixed by periphery
The stress cup structure that sensitive membrane is formed, and four varistor R1~R4, composition are made in silicon-sensitive film surface stress maximum
The Wheatstone bridge as shown in Fig. 2 (c).
Using instrument by four pin bonding gold threads 3 of MEMS silicon piezoresistance type pressure sensor 4, make its on FPC plate 5
Four pads correspond welding, realize the electrical connection of MEMS silicon piezoresistance type pressure sensor 4 Yu FPC plate 5.In FPC plate 5
On outer rigid housing fixed bit pad at, the one end for the outer rigid housing 2 for designing, making is welded to silver paste or scolding tin
On FPC plate 5.
In the open cavity that the outer rigid housing 2 being welded is surrounded, with 1 encapsulating of circuit board packaging silicon rubber, electricity is utilized
The surface tension of road plate packaging silicon rubber 1 itself forms a lug boss 8 outside open cavity and then exists in order to pulse detection
Ventilation is dried, and circuit board package silica gel 1 is in contact with the sensitive structure of MEMS silicon piezoresistance type pressure sensor 4 at this time, can be passed
Lead ambient pressure.Outer rigid housing 2 is, for example, the metal shell of brass production, and easy to install and use, shell wall is thin, and rigidity is good.
Using packaging method provided in this embodiment and encapsulating structure when being applied to pulses measure, due to using
FPC plate, enables overall structure to be bent, and can fit closely with pulses measure position such as human body wrist etc., and passes through circuit board and seal
Dress silica gel passes to the arterial motion situation at measurement position to the sensitive structure of sensor, generates voltage signal output.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical scheme and beneficial effects
Describe in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in protection of the invention
Within the scope of.
Claims (10)
1. a kind of MEMS pressure sensor encapsulating structure characterized by comprising
Flexible circuit board；
MEMS pressure sensor is fixed on a surface of the flexible circuit board, and passes through gold thread electricity with the flexible circuit board
Gas connection, the MEMS pressure sensor include presser sensor structure；
Outer rigid housing forms an open cavity, and is equipped with the MEMS pressure sensor in the open cavity；And
Filler is encapsulated, is filled in the open cavity, and be covered in the presser sensor structure of the MEMS pressure sensor
And on exposed gold thread, and a lug boss is formed outside open cavity；
Wherein, the encapsulation filler can conduct pulse pressure to the presser sensor structure of the MEMS pressure sensor, make
MEMS pressure sensor can acquire pulse pressure signal.
2. MEMS pressure sensor encapsulating structure according to claim 1, which is characterized in that the outer rigid housing passes through weldering
It connects or gluing is fixed on the flexible circuit board；
Preferably, outer rigid housing is by being fixedly welded on several pads of the flexible circuit board.
3. MEMS pressure sensor encapsulating structure according to claim 2, which is characterized in that the MEMS pressure sensor
Encapsulating structure further includes stiffening plate, is set to another surface of the unlocked MEMS pressure sensor of the flexible circuit board
On, and the size of stiffening plate is greater than or equal to the opening of the open cavity of the outer rigid housing.
4. MEMS pressure sensor encapsulating structure according to claim 3, which is characterized in that the stiffening plate is rigidity
Plate is attached on flexible circuit board by hot pressing or gluing；
Preferably, the flexible circuit board and stiffening plate are provided with one at position corresponding with MEMS pressure sensor respectively
Through-hole, to expose the MEMS pressure sensor.
5. MEMS pressure sensor encapsulating structure according to claim 1, it is characterised in that:
The MEMS pressure sensor is silicon piezoresistance type pressure sensor, and the presser sensor structure is quick for the silicon fixed by periphery
Feel the stress cup structure that film is formed；
Preferably, the material of the outer rigid housing is selected from stainless steel, copper, aluminium or the resin material for being capable of forming rigid structure；
Preferably, the encapsulation filler is circuit board package silica gel, further preferably dimethyl silicone polymer (PDMS).
6. a kind of pulse detecting device using MEMS pressure sensor encapsulating structure as claimed in any one of claims 1 to 5,
It is characterized in that, the quantity of MEMS pressure sensor described in the pulse detecting device be it is multiple, it is different for acquisition respectively
Pulse pressure signal at position；
Preferably, the multiple MEMS pressure sensor is fixed on same flexible circuit board.
7. a kind of packaging method of MEMS pressure sensor, which comprises the following steps:
Step S1: MEMS pressure sensor is fixed on a surface of a flexible circuit board, and by gold thread be electrically connected to
The flexible circuit board；
Step S2: the MEMS pressure sensor is placed in an outer rigid housing with open cavity；
Step S3: encapsulation filler is poured into the open cavity, the presser sensor of the MEMS pressure sensor is covered
In structure and exposed gold thread, and a lug boss is formed outside open cavity；Wherein, the encapsulation filler can be by pulse
On pressure conduction to the presser sensor structure of MEMS pressure sensor, MEMS pressure sensor is enable to acquire pulse pressure letter
Number.
8. packaging method according to claim 7, which is characterized in that step S2 is specifically included:
One outer rigid housing is fastened on on the flexible circuit board for having MEMS pressure sensor surely, the MEMS pressure sensor is made
And exposed gold thread is placed in the open cavity of the outer rigid housing；
Preferably, the outer rigid housing is fixed on the flexible circuit board by welding or gluing；As further excellent
The outer rigid housing is fixed on several pads of the flexible circuit board by choosing by welding.
9. packaging method according to claim 8, which is characterized in that in step S1, be formed on the flexible circuit board
Several first pads and several second pads, if several first pads are for respectively and in the MEMS pressure sensor
Dry pin is attached, and several second pads are for fixing the outer rigid housing；
Preferably, in step S1, several pins of the MEMS pressure sensor be by bonding gold thread technique with it is described soft
Property circuit board several first pads realize electrical connection.
10. packaging method according to claim 8, which is characterized in that further include in the flexible electrical in step S1 or S2
The step of fixed stiffening plate at the position corresponding to open cavity on another surface of the unlocked MEMS pressure sensor of road plate
Suddenly, wherein the size of the stiffening plate is greater than or equal to the opening of the open cavity of the outer rigid housing；
Preferably, the stiffening plate is attached on the flexible circuit board by hot pressing or gluing；
Preferably, being pre-seted respectively at position corresponding with MEMS pressure sensor on the flexible circuit board and stiffening plate
Through-hole, the MEMS pressure sensor can be exposed.
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| CN201910570913.XA CN110255491A (en) | 2019-06-27 | 2019-06-27 | MEMS pressure sensor encapsulating structure and packaging method |
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Cited By (8)
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| CN111422820A (en) * | 2020-03-30 | 2020-07-17 | 歌尔微电子有限公司 | Packaging structure and packaging method of sensor |
| CN111855076A (en) * | 2020-07-24 | 2020-10-30 | 深圳信息职业技术学院 | Packaging mechanism for pressure sensor chip packaging test and packaging method thereof |
| CN112869772A (en) * | 2020-12-12 | 2021-06-01 | 深圳市蟠桃树科技有限公司 | Pulse feeling system based on pressure sensor |
| CN112885789A (en) * | 2021-01-07 | 2021-06-01 | 浙江荷清柔性电子技术有限公司 | Flexible pneumatic pressure measuring device and manufacturing method thereof |
| CN113925489A (en) * | 2021-10-16 | 2022-01-14 | 北京康特电子股份有限公司 | Respiration pressure sensor and manufacturing method thereof |
| CN114190909A (en) * | 2021-12-01 | 2022-03-18 | 上海平脉科技有限公司 | Pulse wave detection device and control method thereof |
| CN114681756A (en) * | 2022-03-15 | 2022-07-01 | 介入科技发展(深圳)有限公司 | Conveying conduit |
| WO2023005822A1 (en) * | 2021-07-26 | 2023-02-02 | 芯海科技（深圳）股份有限公司 | Pressure sensor module and electronic device |
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