CN102209428B - Circuit board with electromagnetic shielding structure - Google Patents
Circuit board with electromagnetic shielding structure Download PDFInfo
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- CN102209428B CN102209428B CN 201010134630 CN201010134630A CN102209428B CN 102209428 B CN102209428 B CN 102209428B CN 201010134630 CN201010134630 CN 201010134630 CN 201010134630 A CN201010134630 A CN 201010134630A CN 102209428 B CN102209428 B CN 102209428B
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Abstract
The invention discloses a circuit board with an electromagnetic shielding structure. The circuit board comprises an outer circuit layer, an anti-welding covering layer, a conductive adhesive and a metal substrate, wherein the outer circuit layer is arranged at one side of the circuit board; the outer circuit layer is provided with a bonding pad, and a contact copper pad is formed on the bonding pad; the anti-welding covering layer is adhered to the outer circuit layer and provided with a through hole for accommodating the bonding pad and the contact copper pad; the total thickness of the bonding pad and the contact copper pad is greater than 1/2 of the depth of the through hole and less than the depth of the through hole; the metal substrate is arranged at one side (far away from the outer circuit layer) of the anti-welding covering layer and covers the through hole; the conductive adhesive passes through the through hole and is connected between the contact copper pad and the metal substrate; and the bonding pad is electrically connected with the metal substrate by the contact copper pad and the conductive adhesive.
Description
Technical field
The present invention relates to circuit board technology, particularly a kind of circuit board with electromagnetic armouring structure.
Background technology
Along with the develop rapidly of electronic industry, seem more and more important as the manufacturing technology of the circuit board of electronic product basic building block.Circuit board generally by copper-clad base plate through cut, the series of process such as boring, etching, exposure, development, pressing, moulding is made.Specifically can consult the people such as C.H.Steer at Proceedings of the IEEE, " Dielectric characterization of printed circuit board substrates " literary composition that Vol.39, No.2 delivered in (in August, 2002).
Usually, the outer-layer circuit layer of circuit board need to form the anti-welding cover layer protection circuit of one deck; Then, make electromagnetic armouring structure processes circuit board is carried out electromagnetic shielding in the anti-welding tectal outside, thereby shield electromagnetic interference mutual between this circuit board and extraneous other electronic devices and components, improve the job stability of circuit board or extraneous other electronic devices and components.Particularly, this electromagnetic armouring structure utilizes an end of conducting resinl to pass anti-welding cover layer to be connected with weld pad in the outer-layer circuit layer, and the other end of conducting resinl then is connected with the metal substrate that plays shielding action.In addition, this electromagnetic armouring structure can be transmitted to metal substrate with the static in the elimination circuit board by conducting resinl with the static that produces in the circuit board, and this metal substrate also can play the effect of support circuit plate.
In the electromagnetic armouring structure of existing circuit board, generally offer the through hole corresponding with this weld pad on the anti-welding cover layer, conducting resinl need to pass anti-welding tectal through hole and could be connected with the weld pad of line layer.But, owing to have larger difference in height between anti-welding tectal outer surface and the weld pad, so that conducting resinl probably can't be filled full through hole or insufficient with contacting of weld pad fully, thereby cause poor flow between weld pad and the metal substrate or conducting resistance excessive and affect the anti-electromagnetic interference capability of circuit board, and then affect the signal transmitting quality of circuit board.
Therefore, for the problems referred to above, be necessary to provide a kind of circuit board with electromagnetic armouring structure that can more effectively eliminate electromagnetic interference, thereby promote the signal transmitting quality of circuit board.
Summary of the invention
The below will illustrate a kind of circuit board with electromagnetic armouring structure with specific embodiment.
A kind of circuit board with electromagnetic armouring structure, it comprises the outer-layer circuit layer that is arranged on circuit board one side, anti-welding cover layer, conducting resinl and metal substrate.This outer-layer circuit layer has weld pad, is formed with the contact copper packing on this weld pad.This anti-welding cover layer is fitted on this outer-layer circuit layer and is provided with the through hole of accommodating this weld pad and contact copper packing.This weld pad and the gross thickness that contacts copper packing greater than the degree of depth of this through hole 1/2 and less than the degree of depth of this through hole.This metal substrate is arranged on this anti-welding cover layer away from a side of this outer-layer circuit layer and covers this through hole.This conducting resinl passes and fully fills up this through hole and is connected between this contact copper packing and this metal substrate.This weld pad is electrically connected with this metal substrate by this contact copper packing and conducting resinl.
A kind of circuit board with electromagnetic armouring structure, it comprises the outer-layer circuit layer that is arranged on circuit board one side, anti-welding cover layer, conducting resinl and metal substrate.This outer-layer circuit layer has weld pad, is formed with successively contact copper packing and metal protective film on this weld pad.This anti-welding cover layer is fitted on this outer-layer circuit layer and is provided with the through hole of accommodating this weld pad, contact copper packing and metal protective film.The gross thickness of this weld pad, contact copper packing and metal protective film greater than the degree of depth of this through hole 1/2 and less than the degree of depth of this through hole.This metal substrate is arranged on this anti-welding cover layer away from a side of this outer-layer circuit layer and covers this through hole.This conducting resinl pass and fully fill up this through hole and be connected in this metal protective film and this metal substrate between.This weld pad is electrically connected with this metal substrate by this contact copper packing, metal protective film and conducting resinl.
A kind of circuit board with electromagnetic armouring structure, it comprises the outer-layer circuit layer that is arranged on circuit board one side, anti-welding cover layer, conducting resinl and metal substrate.This outer-layer circuit layer has weld pad, is formed with the contact copper packing on this weld pad.This anti-welding cover layer is fitted on this outer-layer circuit layer and is provided with the through hole of accommodating this weld pad and contact copper packing, this anti-welding tectal even thickness.This weld pad and the gross thickness that contacts copper packing greater than this anti-welding tectal thickness 1/2 and less than this anti-welding tectal thickness.This metal substrate is arranged on this anti-welding cover layer away from a side of this outer-layer circuit layer and covers this through hole.This conducting resinl passes and fully fills up this through hole and is connected between this contact copper packing and this metal substrate.This weld pad is electrically connected with this metal substrate by this contact copper packing and conducting resinl.
With respect to prior art, in the circuit board with electromagnetic armouring structure of the technical program, owing to be formed with the contact copper packing on its weld pad, weld pad and the gross thickness that contacts copper packing greater than the degree of depth (perhaps anti-welding tectal thickness) of through hole 1/2 and less than the degree of depth (perhaps anti-welding tectal thickness) of through hole; Perhaps be formed with contact copper packing and metal protective film on its weld pad, the gross thickness of weld pad, contact copper packing and metal protective film greater than the degree of depth of through hole 1/2 and less than the degree of depth of through hole; Therefore; need the volume of filled conductive glue to reduce in the anti-welding tectal through hole; and need the height of this partial through holes of filled conductive glue to reduce; thereby so that conducting resinl in the pressing filling process, can fully fill up this through hole and with contact copper packing or metal protective film and have good electrical contact; and then improve the anti-electromagnetic interference capability of this circuit board, promote the signal transmitting quality of this circuit board.
Description of drawings
Fig. 1 is the front exploded view of the press fit of circuit boards with electromagnetic armouring structure that the technical program the first embodiment provides.
Fig. 2 is the front cutaway view of press fit of circuit boards that has electromagnetic armouring structure among Fig. 1.
Fig. 3 is the cutaway view that has among Fig. 1 behind the press fit of circuit boards of electromagnetic armouring structure.
Fig. 4 is the cutaway view behind the press fit of circuit boards with electromagnetic armouring structure that provides of the technical program the second embodiment.
Fig. 5 is the cutaway view behind the press fit of circuit boards with electromagnetic armouring structure that provides of the technical program the 3rd embodiment.
The main element symbol description
Embodiment
Be described in further detail below in conjunction with the circuit board with electromagnetic armouring structure of drawings and Examples to the technical program.
The technical program embodiment provides a kind of circuit board with electromagnetic armouring structure, mutual electromagnetic interference between this circuit board of electromagnetic armouring structure maskable of this circuit board and extraneous other electronic devices and components.
See also Fig. 1-3, above-mentioned circuit board 100 with electromagnetic armouring structure comprises outer-layer circuit layer 10, anti-welding cover layer 20, conducting resinl 30 and metal substrate 40.
This outer-layer circuit layer 10 is arranged on a side of circuit board 100.Outer-layer circuit layer 10 has weld pad 12.This weld pad 12 has upper surface 122.This weld pad 12 is electrically connected with signal line or electronic component that circuit board 100 interior needs carry out electromagnetic shielding, to realize the electromagnetic shielding of this signal line or electronic component.
Be formed with contact copper packing 14 on this weld pad 12.Particularly, this contact copper packing 14 has relative first surface 141 and second 142.The first surface 141 of this contact copper packing 14 is fitted with the upper surface of weld pad 12 122.In the present embodiment, the area of the first surface 141 of this contact copper packing 14 equates that with the area of the upper surface 122 of this weld pad 12 second 142 area of this contact copper packing 14 is less than the area of the upper surface 122 of this weld pad 12.Like this, when conducting resinl 30 when contacting copper packing 14 pressing, can increase the contact area of contact copper packing 14 and conducting resinl 30, thereby improve conducting resinl 30 and the adhesion that contacts between the copper packing 14, lifting conducting resinl 30 and the reliability of electrical connection that contacts copper packing 14.Preferably, this contact second 142 of copper packing 14 in the distance of the outer contour of the upper surface 122 of the outer contour of the projection of the upper surface 122 of this weld pad 12 and this weld pad 12 greater than 0 μ m and less than or equal to 100 μ m.The thickness of this contact copper packing 14 is greater than the thickness of this weld pad 12.This contact copper packing 14 can be formed on this weld pad 12 by methods such as plating or printing conductive cream.
Certainly, this contact first surface 141 of copper packing 14 and second 's 142 area all can equate with the area of the upper surface 122 of this weld pad 12.In addition, the first surface 141 of this contact copper packing 14 and second 142 area also can be identical and less than the area of the upper surface 122 of this weld pad 12, the distance of the outer contour of the upper surface 122 of the outer contour of this first surface 141 and this weld pad 12 is greater than 0 μ m and less than or equal to 100 μ m.
This anti-welding cover layer 20 is fitted on this outer-layer circuit layer 10.This anti-welding cover layer 20 offers with this weld pad 12 and contacts the through hole 205 that copper packing 14 is complementary.This through hole 205 is accommodated this weld pad 12 and contact copper packing 14.This weld pad 12 and the gross thickness that contacts copper packing 14 greater than the degree of depth of this through hole 205 1/2 and less than the degree of depth of this through hole 205.Preferably, this weld pad 12 and the gross thickness that contacts copper packing 14 are 2/3 of the degree of depth of this through hole 205.In the present embodiment, the even thickness of this anti-welding cover layer 20, this weld pad 12 and the gross thickness that contacts copper packing 14 greater than the thickness of this anti-welding cover layer 20 1/2 and less than the thickness of this anti-welding cover layer 20.Preferably, this weld pad 12 and the gross thickness that contacts copper packing 14 are 2/3 of the thickness of this anti-welding cover layer 20.
This anti-welding cover layer 20 has relative first surface 201 and second surface 202.First surface 201 is parallel with second surface 202.This first surface 201 fits with outer-layer circuit layer 10, and this second surface 202 is away from outer-layer circuit layer 10.This through hole 205 runs through this first surface 201 and second surface 202.In the present embodiment, this weld pad 12 is circular.Accordingly, the cross section of this through hole 205 also is approximately circular.The center of the center of this through hole 205 and circular bond pad 12 is on same straight line.
This conducting resinl 30 passes this through hole 205 and is connected in this contact copper packing 14.Conducting resinl 30 can be hot pressing curing type conducting resinl or room temperature pressing curing type conducting resinl.For example, the hot pressing curing type conducting resinl model that can adopt Japanese Tatsuta company to produce is the conductivity adhesive film of CBF-300; And the model that room temperature pressing curing type conducting resinl can adopt Minnesota Mining and Manufacturing Company to produce is the conductivity electromagnetic shielding adhesive tape of 9709S.This conducting resinl 30 is fitted on the metal substrate 40 first usually in advance, then under heating or room temperature condition, be pressure bonded in the through hole 205, thereby so that partially conductive glue 30 is filled in the through hole 205,30 of remainder conducting resinls are bonded between the second surface 202 and metal substrate 40 of anti-welding cover layer 20.Since this weld pad 12 and the gross thickness that contacts copper packing 14 greater than the degree of depth of this through hole 205 1/2 and less than the degree of depth of this through hole 205, the through hole 205 interior volumes of filled conductive glue 30 that need reduce, and need the height of this partial through holes 205 of filled conductive glue 30 to reduce, thereby so that conducting resinl 30 in the pressing filling process, can fully fill up this through hole 205 and with contact copper packing 14 and have good electrical contact.
This metal substrate 40 is arranged on this anti-welding cover layer 20 away from a side of this outer-layer circuit layer 10 and covers this through hole 205.This metal substrate 40 and this through hole 205 are relative and be arranged on anti-welding cover layer 20 away from a side of outer-layer circuit layer 10 by conducting resinl 30.This metal substrate 40 is electrically connected with this weld pad 12 by this conducting resinl 30 and contact copper packing 14, thus the signal line in the realization circuit board 100 or the electromagnetic shielding of electronic component.Simultaneously, this metal substrate 40 function of also having support circuit plate 100 and the static of circuit board 100 interior generations being drawn elimination.Preferably, it is the steel plate of SUS301 or SUS304 that the material of this metal substrate 40 can be selected model, perhaps aluminium sheet etc.
The area that this metal substrate 40 covers is greater than the bore of this through hole 205.The size that this metal substrate 40 covers the as required area size of electromagnetic shielding is specifically determined.
See also Fig. 4; the circuit board with electromagnetic armouring structure 100 that the circuit board with electromagnetic armouring structure 200 that the technical program the second embodiment provides and the first embodiment provide is roughly the same; its difference is, this has on the weld pad 212 of circuit board 200 of electromagnetic armouring structure and is formed with successively contact copper packing 214 and metal protective film 216.
This metal protective film 216 is formed on second 242 of this contact copper packing 214.This metal protective film 216 prevents from contacting copper packing 214 surfaces and is corroded oxidation and affects the conduction property that contacts copper packing 214 mainly for the protection of contact copper packing 214.The material of this metal protective film 216 can have antioxidant anticorrosive function and good metal or the alloy of electric conductivity for gold or nickel gold etc.This metal protective film 216 can be formed on second 242 of this contact copper packing 214 by electric plating method.Anti-welding cover layer 220 offers the through hole 225 of accommodating this weld pad 212, contact copper packing 214 and metal protective film 216.The gross thickness of this weld pad 212, contact copper packing 214 and metal protective film 216 greater than the degree of depth of this through hole 225 1/2 and less than the degree of depth of this through hole 225.Preferably, the gross thickness of this weld pad 212, contact copper packing 214 and metal protective film 216 be this anti-welding cover layer 220 thickness 2/3.In the present embodiment, the even thickness of this anti-welding cover layer 220, the gross thickness of this weld pad 212, contact copper packing 214 and metal protective film 216 greater than the thickness of this anti-welding cover layer 220 1/2 and less than the thickness of this anti-welding cover layer 220.Preferably, the gross thickness of this weld pad 212, contact copper packing 214 and metal protective film 216 be this anti-welding cover layer 220 thickness 2/3.
The thickness of this contact copper packing 214 is greater than the thickness of this weld pad 212, and the thickness of this metal protective film 216 is less than the thickness of this weld pad 212.This weld pad 212 is electrically connected with this metal substrate 240 by contact copper packing 214, metal protective film 216 and conducting resinl 230.
See also Fig. 5, the circuit board with electromagnetic armouring structure 100 that the circuit board with electromagnetic armouring structure 300 that the technical program the 3rd embodiment provides and the first embodiment provide is roughly the same, its difference is, this second 342 of contact copper packing 314 with circuit board 300 of electromagnetic armouring structure is male and fomale(M﹠F).For example this second 342 can be concavo-convex alternate waveform or serrated-surface.The shapes such as this waveform of second 342 or zigzag can adopt the method for laser ablation to form.The design of the shapes such as this waveform or zigzag can increase second 342 surface area, thereby increases this second 342 adhesion with conducting resinl 330, improves the reliability that is electrically connected between contact copper packing 314 and the conducting resinl 330.Certainly, also can form the uniform metal protective film (not shown) of a layer thickness on second of this concaveconvex shape 342.
Be understandable that when this weld pad when being square, the cross section of this anti-welding tectal through hole also can correspondence be set to square.The shape of the cross section of this anti-welding tectal through hole is corresponding with the shape of this weld pad.In addition, this number with the weld pad on the circuit board of electromagnetic armouring structure can determine according to the number in the zone of its concrete needs shielding, and namely this number with the weld pad on the circuit board of electromagnetic armouring structure can be more than one.All be formed with the contact copper packing on each weld pad, the contact copper packing on each weld pad is connected with a metal substrate by conducting resinl.
With respect to prior art, in the circuit board with electromagnetic armouring structure of the technical program, owing to be formed with the contact copper packing on its weld pad, weld pad and the gross thickness that contacts copper packing greater than the degree of depth (perhaps anti-welding tectal thickness) of through hole 1/2 and less than the degree of depth (perhaps anti-welding tectal thickness) of through hole; Perhaps be formed with contact copper packing and metal protective film on its weld pad, the gross thickness of weld pad, contact copper packing and metal protective film greater than the degree of depth of through hole 1/2 and less than the degree of depth of through hole; Therefore; need the volume of filled conductive glue to reduce in the anti-welding tectal through hole; and need the height of this partial through holes of filled conductive glue to reduce; thereby so that conducting resinl in the pressing filling process, can fully fill up this through hole and with contact copper packing or metal protective film and have good electrical contact; and then improve the anti-electromagnetic interference capability of this circuit board, promote the signal transmitting quality of this circuit board.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to the technical conceive of the technical program, and all these change the protection range that all should belong to the technical program claim with distortion.
Claims (10)
1. circuit board with electromagnetic armouring structure, it comprises the outer-layer circuit layer that is arranged on circuit board one side, anti-welding cover layer, conducting resinl and metal substrate, this outer-layer circuit layer has weld pad, be formed with the contact copper packing on this weld pad, this anti-welding cover layer is fitted on this outer-layer circuit layer and is provided with the through hole of accommodating this weld pad and contact copper packing, this weld pad and the gross thickness that contacts copper packing greater than the degree of depth of this through hole 1/2 and less than the degree of depth of this through hole, this metal substrate is arranged on this anti-welding cover layer away from a side of this outer-layer circuit layer and covers this through hole, this conducting resinl passes and fully fills up this through hole and is connected between this contact copper packing and this metal substrate, and this weld pad is electrically connected with this metal substrate by this contact copper packing and conducting resinl.
2. the circuit board with electromagnetic armouring structure as claimed in claim 1, it is characterized in that, this weld pad has upper surface, this contact copper packing has relative first surface and second, the first surface of this contact copper packing and the upper surface of weld pad are fitted, the area of the first surface of this contact copper packing equates that with the area of the upper surface of this weld pad second area of this contact copper packing is less than the area of the upper surface of this weld pad.
3. the circuit board with electromagnetic armouring structure as claimed in claim 2, it is characterized in that, this contact second of copper packing in the distance of the outer contour of the upper surface of the outer contour of the projection of the upper surface of this weld pad and this weld pad greater than 0 μ m and less than or equal to 100 μ m.
4. the circuit board with electromagnetic armouring structure as claimed in claim 1, it is characterized in that, this weld pad has upper surface, this contact copper packing has relative first surface and second, the first surface of this contact copper packing and the upper surface of weld pad are fitted, the first surface of this contact copper packing and second area are less than the area of the upper surface of this weld pad, and this area of second equals the area of this first surface.
5. the circuit board with electromagnetic armouring structure as claimed in claim 4 is characterized in that, the distance of the outer contour of the outer contour of the first surface of this contact copper packing and the upper surface of this weld pad is greater than 0 μ m and less than or equal to 100 μ m.
6. such as the described circuit board with electromagnetic armouring structure of any one among the claim 2-5, it is characterized in that second of this contact copper packing is male and fomale(M﹠F).
7. the circuit board with electromagnetic armouring structure as claimed in claim 1 is characterized in that, this weld pad and the gross thickness that contacts copper packing are 2/3 of the degree of depth of this through hole.
8. circuit board with electromagnetic armouring structure; it comprises the outer-layer circuit layer that is arranged on circuit board one side; anti-welding cover layer; conducting resinl and metal substrate; this outer-layer circuit layer has weld pad; be formed with successively contact copper packing and metal protective film on this weld pad; this anti-welding cover layer is fitted on this outer-layer circuit layer and is provided with accommodates this weld pad; the through hole of contact copper packing and metal protective film; this weld pad; the gross thickness of contact copper packing and metal protective film greater than the degree of depth of this through hole 1/2 and less than the degree of depth of this through hole; this metal substrate is arranged on this anti-welding cover layer away from a side of this outer-layer circuit layer and covers this through hole; this conducting resinl pass and fully fill up this through hole and be connected in this metal protective film and this metal substrate between, this weld pad by this contact copper packing; metal protective film and conducting resinl are electrically connected with this metal substrate.
9. the circuit board with electromagnetic armouring structure as claimed in claim 8 is characterized in that, the thickness of this contact copper packing is greater than the thickness of this weld pad, and the thickness of this metal protective film is less than the thickness of this weld pad.
10. circuit board with electromagnetic armouring structure, it comprises the outer-layer circuit layer that is arranged on circuit board one side, anti-welding cover layer, conducting resinl and metal substrate, this outer-layer circuit layer has weld pad, be formed with the contact copper packing on this weld pad, this anti-welding cover layer is fitted on this outer-layer circuit layer and is provided with the through hole of accommodating this weld pad and contact copper packing, this anti-welding tectal even thickness, this weld pad and the gross thickness that contacts copper packing greater than this anti-welding tectal thickness 1/2 and less than this anti-welding tectal thickness, this metal substrate is arranged on this anti-welding cover layer away from a side of this outer-layer circuit layer and covers this through hole, this conducting resinl passes and fully fills up this through hole and is connected between this contact copper packing and this metal substrate, and this weld pad is electrically connected with this metal substrate by this contact copper packing and conducting resinl.
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| CN 201010134630 CN102209428B (en) | 2010-03-29 | 2010-03-29 | Circuit board with electromagnetic shielding structure |
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| CN 201010134630 CN102209428B (en) | 2010-03-29 | 2010-03-29 | Circuit board with electromagnetic shielding structure |
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| CN102209428B true CN102209428B (en) | 2013-03-06 |
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| CN104284060B (en) * | 2013-07-12 | 2019-07-02 | 鸿富锦精密工业（深圳）有限公司 | Camera mould group |
| CN106976188A (en) * | 2016-01-18 | 2017-07-25 | 深圳市海德讯科技有限公司 | Thermal transfer conducting resinl pads forming method in a kind of high-accuracy mould |
| CN109219329B (en) * | 2017-06-30 | 2021-02-09 | 庆鼎精密电子（淮安）有限公司 | Method for manufacturing circuit board |
| CN111312078B (en) * | 2020-03-05 | 2022-03-08 | 武汉华星光电半导体显示技术有限公司 | Display panel and side bonding method thereof |
| TWI782482B (en) * | 2021-04-13 | 2022-11-01 | 群光電子股份有限公司 | Electronic module |
| CN113707433B (en) * | 2021-10-28 | 2021-12-21 | 广东力王高新科技股份有限公司 | Miniaturized planar transformer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1960595A (en) * | 2005-11-02 | 2007-05-09 | 比亚迪股份有限公司 | Flexible circuit board with structure for shielding electromagnetic wave |
| CN201332571Y (en) * | 2008-12-25 | 2009-10-21 | 广州力加电子有限公司 | Super-thin screened film capable of changing circuit impedance and circuit board |
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| JP2008300803A (en) * | 2007-06-04 | 2008-12-11 | Toshiba Corp | Flexible board and electronic apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1960595A (en) * | 2005-11-02 | 2007-05-09 | 比亚迪股份有限公司 | Flexible circuit board with structure for shielding electromagnetic wave |
| CN201332571Y (en) * | 2008-12-25 | 2009-10-21 | 广州力加电子有限公司 | Super-thin screened film capable of changing circuit impedance and circuit board |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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Effective date of registration: 20170307 Address after: Guangdong, Shenzhen Province, Fuyong Town, Tong Tong Industrial Zone, factory 5, building 1, building Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |